Laminating platform heating equipment

Abstract

The utility model relates to the technical field of glass and screen fitting, and discloses fitting platform heating equipment which comprises a fitting platform deck, a cushion pad is arranged on the upper surface of the fitting platform deck, a mounting hole is formed in the fitting platform deck, a through hole is formed in the cushion pad, a fixing assembly is arranged on the side wall of the cushion pad, and the fixing assembly is arranged on the side wall of the cushion pad. The fixing assembly comprises a first mounting block, one side wall of the first mounting block is fixedly connected to the side wall of the buffer pad, a fixing plate is fixedly connected to the lower surface of the first mounting block, a first clamping block is fixedly connected to the lower surface of the fixing plate, a second mounting plate is arranged on the lower surface of the first clamping block, and a fixing sleeve is fixedly connected to the upper surface of the second mounting plate. According to the utility model, the problem of indentation of a laminated product can be prevented by adding the buffer pad on the laminating platform deck, the effect of conveniently detaching and replacing the buffer pad is achieved by installing the clamping block I on the side wall of the buffer pad and matching the clamping block I with the clamping block II, and the indentation after lamination is reduced by the structure.

Description

Technical Field

[0001] The utility model relates to the technical field of glass and screen lamination, in particular to lamination platform heating equipment. Background Art

[0002] In the TFT-LCD display industry, the quality of the bonding between CG glass and the screen directly impacts the performance and appearance of display products. As the demand for display quality in electronic devices continues to increase, the precision and stability of the bonding process have become crucial. As a key piece of equipment for achieving a tight bond between CG glass and the screen, the bonding platform plays a crucial role in the entire production process. The continuous development and innovation of its technology aims to meet market demand for high-quality display products, improve production efficiency, and reduce production costs.

[0003] Existing laminating platforms typically consist of a load platform, a positioning device, a pressure-applying system, and a drive unit. The load platform is used to position the CG glass and screen, while the positioning device ensures their precise positioning during the lamination process. The pressure-applying system mechanically or pneumatically applies a certain amount of pressure to the lamination area to achieve a tight fit. The drive unit is responsible for transporting the laminated product to the next process.

[0004] In the existing technology, due to the single structure of the bonding platform, indentations are easily formed on the product surface after the CG glass is bonded to the screen, which greatly affects the quality of the product. Therefore, a bonding platform heating device is proposed to solve the above problem. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a bonding platform heating device, which aims to improve the problem that the bonding platform in the existing technology has a single structure, and after the CG glass is bonded to the screen, indentations are easily formed on the product surface, which greatly affects the quality of the product.

[0006] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0007] The laminating platform heating device comprises a laminating platform, a cushion pad is provided on the upper surface of the laminating platform, a mounting hole is provided inside the laminating platform, a through hole is provided inside the cushion pad, and a fixing component is provided on the side wall of the cushion pad;

[0008] The fixing assembly includes a mounting block 1, one side wall of the mounting block is fixedly connected to the side wall of the buffer pad, a fixing plate is fixedly connected to a lower surface of the mounting block, a clamping block 1 is fixedly connected to a lower surface of the fixing plate, a mounting plate 2 is provided on a lower surface of the clamping block, a fixing sleeve is fixedly connected to an upper surface of the mounting plate 2, a clamping block 2 is rotatably connected inside the fixing sleeve, a fixing block is fixedly connected to a side wall of the clamping block 2, and a spring is provided on the side wall of the clamping block 2;

[0009] As a further description of the above technical solution:

[0010] A heating rod is provided inside the laminating platform, and a controller is fixedly connected to the side wall of the laminating platform;

[0011] As a further description of the above technical solution:

[0012] The second side wall of the mounting plate is fixedly connected to the side wall of the laminating platform, and the one side wall of the clamping block is slidably connected to the inside of the second clamping block;

[0013] As a further description of the above technical solution:

[0014] One end of the spring is fixedly connected to the lower surface of the fixing block, and the other end of the spring is fixedly connected to the upper surface of the second mounting plate;

[0015] As a further description of the above technical solution:

[0016] One end of the heating rod is fixedly connected to the inside of the controller;

[0017] As a further description of the above technical solution:

[0018] The laminating platform is provided with thermal insulation cotton inside, and the thermal insulation cotton is made of ceramic fiber;

[0019] As a further description of the above technical solution:

[0020] A heat conducting plate is provided inside the laminating platform, and a hole is opened inside the heat conducting plate;

[0021] As a further description of the above technical solution:

[0022] The heat conducting plate is located above the heating rod and is made of aluminum.

[0023] The utility model has the following beneficial effects:

[0024] 1. In the present invention, a buffer pad is added to the bonding platform to prevent the problem of indentation on the product after bonding. By installing a clamping block 1 on the side wall of the buffer pad and cooperating with the clamping block 2, the buffer pad can be easily disassembled and replaced. This solves the problem that due to the single bonding platform structure of some bonding platforms, indentations are easily generated on the product surface after the CG glass is bonded to the screen, which greatly affects the quality of the product. The above structure reduces the occurrence of indentations after bonding.

[0025] 2. In the present invention, by installing a heating rod inside the bonding platform, and then cooperating with the heat conduction plate, the bonding platform can be quickly heated to reduce the adsorption of gas on the surface of the material, thereby reducing the risk of bubbles appearing on the product after bonding, which affects the final effect of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a three-dimensional schematic diagram of the laminating platform heating device proposed in the present invention;

[0027] Figure 2 This is a schematic diagram of the structure inside the bonding platform of the bonding platform heating device proposed in the present invention;

[0028] Figure 3 This is a structural schematic diagram of the clamping block 1 of the laminating platform heating device proposed in the present invention.

[0029] Legend:

[0030] 1. Laminating platform; 2. Cushion pad; 3. Mounting hole; 4. Through hole; 5. Mounting block 1; 6. Fixing plate; 7. Clamping block 1; 8. Mounting plate 2; 9. Fixing sleeve; 10. Clamping block 2; 11. Fixing block; 12. Spring; 13. Heating rod; 14. Controller; 15. Insulation cotton; 16. Heat conducting plate; 17. Hole. DETAILED DESCRIPTION

[0031] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] Reference Figure 1 and Figure 3The utility model provides an embodiment: a bonding platform heating device, comprising a bonding platform 1, a cushion pad 2 is provided on the upper surface of the bonding platform 1, the cushion pad 2 can play a cushioning role during the bonding process, effectively prevent the product from having indentations after bonding, and greatly improve the quality of the product. A mounting hole 3 is provided inside the bonding platform 1, and the mounting hole 3 can be used to install other auxiliary equipment or arrange circuits, etc., which provides convenience for the functional expansion of the equipment. A through hole 4 is provided inside the cushion pad 2, and the through hole 4 can play a ventilation role. A fixing component is provided on the side wall of the cushion pad 2, and the fixing component includes a mounting block 5. The side wall of the mounting block 5 is fixedly connected to the side wall of the cushion pad 2, and the mounting block 5 provides an installation foundation for the subsequent fixed structure. A fixing plate 6 is fixedly connected to the lower surface of the mounting block 5, and the fixing plate 6 plays a role of connection and reinforcement, making the fixed structure more stable. A clamping block 7 is fixedly connected to the lower surface of the fixing plate 6, and the clamping block 7 cooperates with the clamping block 2 10 to fix the cushion pad 2. The lower surface of the block 1 7 is provided with a mounting plate 2 8, which provides a mounting position for other components and also plays a supporting and fixing role. The upper surface of the mounting plate 2 8 is fixedly connected with a fixing sleeve 9, which provides rotational support for the block 2 10. The fixing sleeve 9 is rotatably connected to the inside of the fixing sleeve 9. The block 2 10 fixes the buffer pad 2 by cooperating with the block 1 7 and can be easily disassembled and replaced. The side wall of the block 2 10 is fixedly connected with a fixing block 11, which is used to connect the spring 12 to ensure the stable position of the spring 12. The side wall of the block 2 10 is provided with a spring 12, which can provide elastic force to make the connection between the block 2 10 and the block 1 7 tighter. At the same time, the block 2 10 can also be easily separated from the block 1 7 during disassembly. The side wall of the mounting plate 2 8 is fixedly connected to the side wall of the fitting platform 1 to ensure the stable position of the entire fixed assembly, thereby ensuring the fixing effect of the buffer pad 2. The side wall of the card block 1 7 is slidably connected to the inside of the card block 2 10. One end of the spring 12 is fixedly connected to the lower surface of the fixed block 11, and the other end of the spring 12 is fixedly connected to the upper surface of the mounting plate 2 8. The elastic action of the spring 12 further enhances the connection stability between the card block 1 7 and the card block 2 10.

[0033] When the device is used, first, the first block 7 on the side wall of the buffer pad 2 is engaged with the second block 10. During the engagement process, the first block 7 squeezes the second block 10. The first block 7, as an important component for fixing the buffer pad 2, cooperates with the second block 10 to achieve a firm fixation of the buffer pad 2. The squeezing of the second block 10 by the first block 7 causes the spring 12 to be squeezed and contracted. The spring 12 plays a key elastic role in this process. When the first block 7 squeezes the second block 10, the spring 12 is compressed and generates a reverse elastic force, thereby tightly clamping the first block 7 to the side wall of the second block 10, achieving a stable fixation effect and ensuring that the buffer pad 2 will not shift during the fitting process. The buffer pad 2 is made of polyurethane, which has good elasticity. During the bonding process, the elasticity of the cushioning pad 2 can play a key cushioning role. When pressure acts on the product during the bonding process, the cushioning pad 2 can effectively absorb and disperse the pressure, which can not only ensure the cushioning effect and reduce the direct pressure impact on the product, but also reduce the generation of indentations, greatly improving the bonding quality and appearance quality of the product.

[0034] Reference Figure 1 and Figure 2 , a heating rod 13 is provided inside the bonding platform 1. The heating rod 13 serves as a heating source and can generate heat to provide the required temperature conditions for the bonding process. Through the heating effect of the heating rod 13, the bonding platform 1 can reach a suitable working temperature, thereby promoting the improvement of the bonding effect. A controller 14 is fixedly connected to the side wall of the bonding platform 1. The controller 14 can accurately control the heating rod 13 and adjust the power and heating time of the heating rod 13, thereby achieving precise control of the temperature of the bonding platform 1 to meet the needs of different bonding processes. One end of the heating rod 13 is fixedly connected to the inside of the controller 14 to ensure that the connection between the heating rod 13 and the controller 14 is stable and reliable, and to ensure that the controller 14 can effectively control the heating rod 13. The bonding platform 1 is provided with thermal insulation cotton 15, which is made of ceramic fiber, which has excellent thermal insulation performance. The thermal insulation cotton 15 can effectively reduce the loss of heat to the surrounding environment, improve the utilization rate of heat, and reduce energy consumption. At the same time, the thermal insulation cotton 15 can also maintain the temperature of the bonding platform 1 stable, ensuring that the bonding process is carried out under stable temperature conditions, thereby improving the bonding quality. The bonding platform 1 is provided with a heat conducting plate 16, which has holes 17 inside. The holes 17 can play a certain role in heat dissipation and ventilation, and can also reduce the weight of the heat conducting plate 16. The heat conducting plate 16 is located above the heating rod 13. The heat conducting plate 16 is made of aluminum, which has good thermal conductivity. The heat conducting plate 16 can quickly conduct the heat generated by the heating rod 13 to the upper surface of the bonding platform 1, making the temperature distribution of the bonding platform 1 more uniform and improving the efficiency and quality of bonding.

[0035] After installing the buffer pad 2, by starting the controller 14, the controller 14 can accurately control the start and stop of the heating rod 13, as well as adjust the heating power and time of the heating rod 13, so that the heating rod 13 starts to heat the bonding platform 1. The heat generated by the heating rod 13 will be transferred to the heat conducting plate 16. The heat conducting plate 16 has good thermal conductivity and can quickly and evenly guide the heat generated by the heating rod 13 to the surface of the bonding platform 1. The holes 17 allow hot air to flow more easily, thereby accelerating the heat transfer speed inside the heat conducting plate 16 and improving the heating efficiency. The heat conducting plate 16 then guides the heat to the surface of the bonding platform 1 and begins heating. When the bonding platform 1 is heated to the appropriate temperature, the temperature of the surface of the material to be bonded can be increased, which enhances the adhesion between the material and the glue, allowing the glue to better adhere to the surface of the material, reducing gaps and bubbles caused by insufficient adhesion, and improving the bonding quality. After placing the screen and CG glass, the upper platform of the device is pressed down and the pressure is maintained in the vacuum chamber for a period of time to ensure that the glue fully fills the bonding gap, further improving the tightness and stability of the bonding. After the bonding is completed, the product is removed.

[0036] Working principle: When using the device for work, first, the block 17 on the side wall of the buffer pad 2 is engaged with the block 2 10. During the engagement process, the block 17 squeezes the block 2 10, causing the spring 12 to be squeezed and contracted, thereby clamping the block 17 tightly to the side wall of the block 2 10, so as to achieve a fixing effect. After the buffer pad 2 is installed, the controller 14 is started to make the heating rod 13 start to heat the bonding carrier 1. The heat generated by the heating rod 13 will be transferred to the heat conducting plate 16, and the hot air can be further heated through the hole 17. It is easy to flow, thereby accelerating the heat transfer speed inside the heat conducting plate 16, and then the heat conducting plate 16 guides the heat to the surface of the bonding platform 1 to start heating. When the bonding platform 1 is heated to a suitable temperature, the screen and CG glass are placed, the upper platform of the device is pressed down, and the pressure is maintained in the vacuum chamber for a period of time. After the bonding is completed, the product is taken out. During the bonding process, the pressure used will be evenly distributed on the buffer pad 2, thereby reducing the generation of indentations. The buffer pad 2 is made of polyurethane and has good elasticity, which can not only ensure the buffering effect but also reduce the generation of indentations.

[0037] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A bonding platform heating device, comprising a bonding platform (1), characterized in that: A buffer pad (2) is provided on the upper surface of the laminating platform (1), a mounting hole (3) is provided inside the laminating platform (1), a through hole (4) is provided inside the buffer pad (2), and a fixing component is provided on the side wall of the buffer pad (2); The fixing assembly comprises a mounting block (5), the side wall of the mounting block (5) is fixedly connected to the side wall of the buffer pad (2), the lower surface of the mounting block (5) is fixedly connected to a fixing plate (6), the lower surface of the fixing plate (6) is fixedly connected to a clamping block (7), the lower surface of the clamping block (7) is provided with a mounting plate (8), the upper surface of the mounting plate (8) is fixedly connected to a fixing sleeve (9), the interior of the fixing sleeve (9) is rotatably connected to a clamping block (10), the side wall of the clamping block (10) is fixedly connected to a fixing block (11), and the side wall of the clamping block (10) is provided with a spring (12).

2. The laminating platform heating device according to claim 1, characterized in that: A heating rod (13) is provided inside the laminating platform (1), and a controller (14) is fixedly connected to the side wall of the laminating platform (1).

3. The lamination platform heating device according to claim 1, characterized in that: The side wall of the second mounting plate (8) is fixedly connected to the side wall of the bonding platform (1), and the side wall of the first clamping block (7) is slidably connected to the inside of the second clamping block (10).

4. The lamination platform heating device according to claim 1, characterized in that: One end of the spring (12) is fixedly connected to the lower surface of the fixed block (11), and the other end of the spring (12) is fixedly connected to the upper surface of the second mounting plate (8).

5. The laminating platform heating device according to claim 2, characterized in that: One end of the heating rod (13) is fixedly connected to the inside of the controller (14).

6. The laminating platform heating device according to claim 2, characterized in that: The laminating platform (1) is provided with heat-insulating cotton (15) inside, and the heat-insulating cotton (15) is made of ceramic fiber.

7. The laminating platform heating device according to claim 2, characterized in that: A heat conducting plate (16) is provided inside the laminating platform (1), and a hole (17) is provided inside the heat conducting plate (16).

8. The laminating platform heating device according to claim 7, characterized in that: The heat conducting plate (16) is located above the heating rod (13), and the heat conducting plate (16) is made of aluminum.

Images