Three-order motion chip positioning mechanism

Abstract

The utility model discloses a three-order motion chip positioning mechanism, which comprises a substrate, a vibrator arranged at the front side of the bottom of the substrate, a probe mounting rack movably arranged above the substrate, and a probe group arranged on the probe mounting rack, wherein carrier tape grooves are formed in the top of the substrate along the length direction of the substrate at equal intervals. According to the mechanism, high-precision positioning and simultaneous detection of multiple chips are achieved, accurate vertical movement of the probe mounting rack can be achieved through the design of the driving mechanism and the combination of the linear bearing and the transmission lead screw, multiple sets of carrier tape grooves formed in the substrate are matched with the elaborately-designed probe set, the multiple chips can be detected at the same time, the requirement of large-scale production is met, and the production efficiency is improved. The design of the chip protection plate and the chip positioning plate effectively prevents the accidental damage to the chip in the detection process, the design of the mutual pushing strong magnets realizes the floating support of the probe group, the influence of external vibration on the detection precision is effectively reduced, and the reliability of a high-precision measurement result is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a three-order motion chip positioning mechanism. Background Art

[0002] In the semiconductor manufacturing industry, precise chip positioning and inspection are critical to ensuring product quality. Existing chip positioning mechanisms typically use mechanical clamping or vacuum suction to secure the chip, then utilize precision mechanical structures and motor drive systems to achieve multi-dimensional chip movement. During inspection, a probe is typically used to contact the chip for electrical performance testing, while an optical system is used for visual inspection.

[0003] However, these existing technologies have some obvious shortcomings. First, positioning accuracy is often difficult to achieve at the micron level, affecting the accuracy of subsequent testing and processing. Second, it is difficult to quickly adjust and adapt to chips of different sizes and types, which reduces production efficiency. In addition, during the positioning and detection process, physical damage to the chip is likely to occur, increasing the defective rate. At the same time, many operations require manual intervention, which is not only inefficient but also prone to human errors. During high-precision detection, external vibrations can seriously affect the accuracy of the measurement results. Finally, only a single or a small number of chips can be detected at a time, which cannot meet the needs of large-scale production.

[0004] Therefore, there is an urgent need for a new chip positioning mechanism that can achieve high-precision positioning, simultaneous multi-chip detection, effective chip protection, suppress the impact of external vibration, and has high automation and flexible adaptability to meet the stringent requirements of the modern semiconductor manufacturing industry. Utility Model Content

[0005] The purpose of the present invention is to provide a three-stage motion chip positioning mechanism to solve the problems existing in the prior art mentioned in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions: a three-stage motion chip positioning mechanism, comprising:

[0007] A substrate, wherein the top of the substrate is provided with tape carrier slots equidistantly along the length of the substrate;

[0008] a vibrator mounted on the bottom front side of the base plate;

[0009] a probe mounting frame, movably arranged above the substrate;

[0010] A probe assembly is mounted on the probe mounting frame;

[0011] a driving mechanism, disposed on the base plate, adapted to drive the probe mounting frame to move vertically;

[0012] A carrier tape is movable in the carrier tape slot, and a plurality of chip slots are evenly spaced on the top of the carrier tape;

[0013] A chip protection plate is fixed on the top of the substrate;

[0014] The chip positioning plate is fixed on the top of the substrate and is arranged on the inner side of the chip protection plate.

[0015] Preferably, the driving mechanism includes:

[0016] A linear bearing fixing block is fixed to the bottom of the base plate, and the linear bearing fixing block is arranged on the rear side of the vibrator;

[0017] Two sets of linear bearings are fixed at intervals on the bottom of the linear bearing fixing block;

[0018] a motor substrate, located below the substrate, with a motor mounted on the bottom of the motor substrate;

[0019] A ball screw nut fixing block is fixed to the bottom of the linear bearing fixing block. The ball screw nut fixing block is located between the two sets of linear bearings, and a ball screw nut is installed at the bottom of the ball screw nut fixing block;

[0020] Two sets of linear optical axes are respectively provided on the inner sides of the two sets of linear bearings with clearance fit, the bottoms of the linear optical axes are fixedly connected to the motor base plate, and the upper ends of the linear optical axes pass through the linear bearing fixing blocks and the base plate;

[0021] A transmission screw, the lower end of which is fixedly connected to the motor shaft of the motor, and the transmission screw is connected to the inner side of the ball screw nut through a threaded structure;

[0022] The top frame is fixedly connected to the tops of the two groups of linear optical axes, and the top frame is fixed to the bottom of the probe mounting frame.

[0023] Preferably, a plurality of groups of carrier cover plates are fixedly connected to the top of the base plate, and the carrier cover plates are arranged above the carrier slots.

[0024] Preferably, a first mutually pushing strong magnet is fixedly provided on the top of the chip positioning plate, and a second mutually pushing strong magnet is fixedly provided on the bottom of the top frame. The upper and lower positions of the first mutually pushing strong magnet and the second mutually pushing strong magnet correspond to each other, and the side where the first mutually pushing strong magnet and the second mutually pushing strong magnet are close to each other is set to the same pole.

[0025] Preferably, the inner wall of the chip protection plate is integrally connected with several groups of partitions at equal distances along its own length extension direction, and the chip positioning plate is provided with several groups of notches at equal distances on one side close to the partition. The inner side of the chip protection plate is formed with several groups of detection limit areas by several groups of the partitions and the chip positioning plates, and the positions of the several groups of notches correspond to the several groups of detection limit areas.

[0026] Preferably, the probe set includes:

[0027] A connecting frame, fixedly connected to the probe mounting frame;

[0028] A plurality of groups of probes are fixedly plugged into the connecting frame, and the plurality of groups of probes are connected to the plurality of groups of chip slots by movably passing through the plurality of groups of notches and the plurality of groups of detection limit areas.

[0029] Preferably, a position detection switch is installed on the ball screw nut fixing block, and a detection probe is installed on the top of the motor base plate. The detection probe moves through the ball screw nut, and the position detection switch is suitable for detecting the position of the detection probe.

[0030] Compared with the prior art, the beneficial effects of the present invention are:

[0031] 1) First, this mechanism achieves high-precision positioning and simultaneous multi-chip detection. The drive mechanism design, combined with linear bearings and transmission screws, enables precise vertical movement of the probe mounting frame. The multiple sets of tape slots provided on the substrate, combined with the carefully designed probe group, enable simultaneous detection of multiple chips, significantly improving detection efficiency and meeting the needs of large-scale production.

[0032] 2) Secondly, this mechanism excels in chip protection and vibration suppression. The chip protection plate and chip positioning plate design effectively prevent accidental damage to the chip during testing. The mutually pushing strong magnet design achieves floating support for the probe group, effectively reducing the impact of external vibration on detection accuracy and ensuring the reliability of high-precision measurement results.

[0033] 3) Finally, this mechanism is highly automated and flexible. The entire positioning and detection process can be automated, reducing manual intervention and improving production efficiency and consistency. The use of carrier tape allows the mechanism to flexibly adapt to chips of different sizes and types. The design of the position detection switch and detection probe realizes precise control and feedback of the probe position, further improving the accuracy of positioning and detection. The modular structural design not only makes the entire mechanism compact and space-saving, but also facilitates daily maintenance and upgrades.

[0034] In summary, the three-order motion chip positioning mechanism of the utility model effectively solves the problems existing in traditional chip positioning detection through innovative structural design and functional integration, and provides a high-precision, high-efficiency and high-reliability chip positioning solution for the semiconductor manufacturing industry, which has important practical value and broad application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is an axonometric diagram of a three-stage motion chip positioning mechanism of the utility model;

[0036] Figure 2 This is another axonometric view of a three-stage motion chip positioning mechanism of the present invention;

[0037] Figure 3 This is a schematic diagram of the partial structure of the first mutual pushing strong magnet of a three-order motion chip positioning mechanism of the present invention;

[0038] Figure 4 This is a schematic diagram of the structure of a probe group of a three-stage motion chip positioning mechanism of the present invention;

[0039] Figure 5 This is a schematic structural diagram of a chip protection plate and a chip positioning plate of a three-stage motion chip positioning mechanism of the present invention;

[0040] Figure 6 This is a schematic diagram of the local structure of the probe of a three-order motion chip positioning mechanism of the present invention;

[0041] Figure 7 This is a structural schematic diagram of a chip installed in a chip slot of a three-stage motion chip positioning mechanism of the present invention.

[0042] In the picture:

[0043] 1. Base plate; 2. Vibrator; 3. Linear bearing fixing block; 4. Ball screw nut fixing block; 5. Motor; 6. Motor base plate; 7. Linear bearing; 8. Ball screw nut; 9. Linear optical axis; 10. Transmission screw; 11. Top frame; 12. Probe mounting frame; 13. Drive mechanism; 14. Probe group; 15. Carrier; 16. Chip protection plate; 17. Chip positioning plate; 18. Carrier cover; 19. First mutual pushing strong magnet; 20. Second mutual pushing strong magnet; 21. Partition; 22. Notch; 23. Detection limit area; 24. Carrier slot; 25. Connecting frame; 26. Probe; 27. Position detection switch; 28. Detection probe; 29. ​​Chip slot. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0045] In the description of the utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of the utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0046] In the description of the utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc. should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0047] See also Figure 1-7 The utility model provides a technical solution: a three-stage motion chip positioning mechanism, comprising:

[0048] The substrate 1 has tape carrier slots 24 formed in the top of the substrate 1 at equal intervals along its length.

[0049] The vibrator 2 is mounted on the bottom front side of the base plate 1;

[0050] A probe mounting frame 12 is movably arranged above the substrate 1;

[0051] The probe assembly 14 is mounted on the probe mounting frame 12;

[0052] A driving mechanism 13 is provided on the base plate 1 and is adapted to drive the probe mounting frame 12 to move vertically;

[0053] The carrier tape 15 is movable in the carrier tape slot 24. A plurality of chip slots 29 are evenly spaced on the top of the carrier tape 15.

[0054] The chip protection plate 16 is fixed on the top of the substrate 1;

[0055] The chip positioning plate 17 is fixed to the top of the substrate 1 , and is disposed inside the chip protection plate 16 .

[0056] Specifically, refer to the appendix of the manual. Figure 7 The chip slot 29 is used to place the chip workpiece. The several chip slots 29 on the top of the carrier tape 15 realize the parallel processing capability of multiple chips. This design greatly improves the detection efficiency, supports continuous production, reduces the chip loading and unloading time, and the precise arrangement of the carrier tape slots 24 ensures the consistency and accuracy of chip positioning.

[0057] Specifically, the vibrator 2 installed on the front bottom side of the substrate 1 provides controllable micro-vibration, which helps to accurately position the chip on the carrier 15 and reduce positioning errors caused by factors such as electrostatic adsorption. The vibration can also help remove tiny impurities and improve the cleanliness of the detection environment.

[0058] Specifically, the probe mounting frame 12 is movably arranged above the substrate 1, allowing the probe group 14 to perform precise vertical movement. This design realizes precise contact and testing of the chip, improves the accuracy and repeatability of the detection, and the movable setting enables the probe group 14 to adapt to chips of different thicknesses, increasing the scope of application of the equipment.

[0059] Specifically, this mechanism achieves high-precision positioning and simultaneous detection of multiple chips. Through the design of the driving mechanism 13, combined with the linear bearing 7 and the transmission screw 10, the precise vertical movement of the probe mounting frame 12 can be achieved. The multiple sets of chip slots 29 are set up, and the carefully designed probe group 14 enables multiple chips to be detected at the same time, greatly improving the detection efficiency and meeting the needs of large-scale production.

[0060] Specifically, this mechanism performs well in protecting chips and suppressing vibrations. The design of the chip protection plate 16 and the chip positioning plate 17 effectively prevents accidental damage to the chip during the detection process. The design of the mutually pushing strong magnets realizes the floating support of the probe group 14, effectively reducing the impact of external vibrations on the detection accuracy and ensuring the reliability of high-precision measurement results.

[0061] In some embodiments, the driving mechanism 13 includes:

[0062] The linear bearing fixing block 3 is fixed to the bottom of the base plate 1 and is arranged on the rear side of the vibrator 2;

[0063] Two sets of linear bearings 7 are fixed at intervals on the bottom of the linear bearing fixing block 3;

[0064] The motor substrate 6 is located below the substrate 1, and the motor 5 is installed at the bottom of the motor substrate 6;

[0065] The ball screw nut fixing block 4 is fixed to the bottom of the linear bearing fixing block 3. The ball screw nut fixing block 4 is located between the two sets of linear bearings 7, and a ball screw nut 8 is installed at the bottom of the ball screw nut fixing block 4;

[0066] Two sets of linear optical axes 9 are respectively provided on the inner sides of the two sets of linear bearings 7 with clearance fit. The bottom of the linear optical axis 9 is fixedly connected to the motor base plate 6, and the upper end of the linear optical axis 9 passes through the linear bearing fixing block 3 and the base plate 1.

[0067] The transmission screw 10 has its lower end fixedly connected to the motor shaft of the motor 5, and the transmission screw 10 is connected to the inner side of the ball screw nut 8 through a threaded structure;

[0068] The top frame 11 is fixedly connected to the tops of the two sets of linear optical axes 9 , and the top frame 11 is fixed to the bottom of the probe mounting frame 12 .

[0069] Specifically, the linear bearing fixing block 3 fixed to the bottom of the base plate 1 provides stable support for the entire drive mechanism 13, and the linear bearing 7 provides a stable vertical motion guide for the linear optical axis 9. This design significantly reduces lateral deviation and improves positioning accuracy and movement smoothness. The ball screw nut fixing block 4 fixed to the bottom of the linear bearing fixing block 3 provides a stable installation position for the ball screw nut 8. The precise fit between the ball screw nut 8 and the transmission screw 10 realizes high-precision conversion from rotational motion to linear motion. When in use, the transmission screw 10 is driven to rotate by the motor 5, thereby realizing the synchronous lifting and lowering motion of the motor base plate 6, the linear optical axis 9, the top frame 11, the probe mounting frame 12 and the probe group 14 through the action of the ball screw nut 8, and the precise processing and fit of the transmission screw 10 allow high-precision position adjustment to meet the high-precision detection requirements. The use of the top frame 11 also simplifies the replacement and maintenance process of the probe mounting frame 12.

[0070] In some embodiments, a plurality of tape carrier cover plates 18 are fixedly connected to the top of the substrate 1 , and the tape carrier cover plates 18 are disposed above the tape carrier slots 24 .

[0071] Specifically, refer to the appendix of the manual. Figure 1 The design of the carrier cover 18 provides effective protection for the carrier slot 24. The carrier cover 18 can also prevent the carrier tape 15 from jumping or shifting during movement, which helps maintain a constant environment in the carrier slot 24 and improve the stability and reliability of detection.

[0072] In some embodiments, refer to the attached specification. Figure 3-4A first mutually pushing strong magnet 19 is fixed on the top of the chip positioning plate 17, and a second mutually pushing strong magnet 20 is fixed on the bottom of the top frame 11. The upper and lower positions of the first mutually pushing strong magnet 19 and the second mutually pushing strong magnet 20 correspond to each other, and the side where the first mutually pushing strong magnet 19 and the second mutually pushing strong magnet 20 are close to each other is set to the same pole.

[0073] Specifically, the two sets of magnets are set to the same pole on the side close to each other, creating a magnetic buffer zone. This magnetic floating support design significantly reduces the impact of external vibration on detection accuracy. At the same time, the magnetic buffer allows the probe group 14 to have slight adaptive adjustments when contacting the chip, reducing potential damage to the chip. Moreover, this non-contact buffer mechanism reduces mechanical wear and improves the service life of the equipment.

[0074] In some embodiments, refer to the attached specification. Figure 5 The inner wall of the chip protection plate 16 is equidistantly connected with several groups of partitions 21 along its own length extension direction, and the chip positioning plate 17 is equidistantly provided with several groups of notches 22 on the side close to the partition 21. The inner side of the chip protection plate 16 is formed with several groups of detection limit areas 23 through several groups of partitions 21 and the chip positioning plate 17, and the positions of the several groups of notches 22 correspond to the positions of the several groups of detection limit areas 23.

[0075] Specifically, several groups of notches 22 and several groups of detection limit areas 23 create independent detection spaces for multiple chips. This design prevents interference between adjacent chips and improves the accuracy and reliability of detection. The partition 21 also helps to maintain a constant environment in each detection area and improve the consistency of the test. Several groups of notches 22 equidistantly opened on the chip positioning plate 17 correspond to the positions of the detection limit areas 23. This design not only accurately defines the position of the chip, but also provides a contact channel for the probe.

[0076] In some embodiments, refer to the attached specification. Figure 6-7 , probe set 14 includes:

[0077] The connecting frame 25 is fixedly connected to the probe mounting frame 12;

[0078] A plurality of probes 26 are fixedly plugged into the connecting frame 25 . The plurality of probes 26 are connected to the plurality of chip slots 29 by moving through the plurality of notches 22 and the plurality of detection limit areas 23 .

[0079] Specifically, during detection, several groups of probes 26 correspond to several groups of chip pin positions in several groups of chip slots 29 directly below the probe group 14. This design realizes the simultaneous and accurate detection of multiple chips, greatly improving the detection efficiency. The parallel design of multiple groups of probes 26 not only improves the detection speed, but also allows more complex multi-point testing, thereby enhancing the detection capability.

[0080] In some embodiments, a position detection switch 27 is installed on the ball screw nut fixing block 4, and a detection probe 28 is installed on the top of the motor substrate 6. The detection probe 28 passes through the ball screw nut 8 by movement, and the position detection switch 27 is suitable for detecting the position of the detection probe 28.

[0081] Specifically, the position detection switch 27 installed on the ball screw nut fixing block 4 can accurately detect the position of the detection probe 28. This design realizes real-time monitoring and feedback of the position of the probe group 14, greatly improving the accuracy and reliability of the detection. The position detection system allows automatic calibration and position compensation to ensure the accuracy stability in long-term use. This design also provides a basis for automated operation and rapid response to abnormal situations, thereby improving the intelligence level and safety of the equipment.

[0082] Specifically, this mechanism has a high degree of automation and flexible adaptability. The entire positioning and detection process can be automated, reducing manual intervention and improving production efficiency and consistency. The use of carrier tape 15 allows the mechanism to flexibly adapt to chips of different sizes and types. The design of the position detection switch 27 and the detection probe 28 realizes precise control and feedback of the position of the probe 26, further improving the accuracy of positioning and detection. The modular structural design not only makes the entire mechanism compact and saves space, but also facilitates daily maintenance and upgrades.

[0083] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A three-stage motion chip positioning mechanism, characterized in that: include: A substrate (1), wherein the top of the substrate (1) is provided with tape carrier grooves (24) at equal intervals along the length direction thereof; a vibrator (2) mounted on the bottom front side of the base plate (1); a probe mounting frame (12) movably arranged above the substrate (1); A probe assembly (14) is mounted on the probe mounting frame (12); A driving mechanism (13) is provided on the substrate (1), and the driving mechanism (13) is suitable for driving the probe mounting frame (12) to move vertically; A carrier tape (15) is movable in the carrier tape slot (24), and a plurality of chip slots (29) are equidistantly provided on the top of the carrier tape (15); A chip protection plate (16) is fixed on the top of the substrate (1); A chip positioning plate (17) is fixed on the top of the substrate (1), and the chip positioning plate (17) is arranged on the inner side of the chip protection plate (16).

2. The three-stage motion chip positioning mechanism according to claim 1, characterized in that: The driving mechanism (13) comprises: A linear bearing fixing block (3) is fixed to the bottom of the base plate (1), and the linear bearing fixing block (3) is arranged on the rear side of the vibrator (2); Two sets of linear bearings (7) are fixed at intervals on the bottom of the linear bearing fixing block (3); a motor substrate (6) located below the substrate (1), with a motor (5) mounted on the bottom of the motor substrate (6); A ball screw nut fixing block (4) is fixed to the bottom of the linear bearing fixing block (3), the ball screw nut fixing block (4) is located between the two sets of linear bearings (7), and a ball screw nut (8) is installed at the bottom of the ball screw nut fixing block (4); Two sets of linear optical axes (9) are respectively provided on the inner sides of the two sets of linear bearings (7) with clearance fit, the bottoms of the linear optical axes (9) are fixedly connected to the motor base plate (6), and the upper ends of the linear optical axes (9) pass through the linear bearing fixing block (3) and the base plate (1); A transmission screw (10), the lower end of which is fixedly connected to the motor shaft of the motor (5), and the transmission screw (10) is connected to the inner side of the ball screw nut (8) through a threaded structure; The top frame (11) is fixedly connected to the tops of the two groups of linear optical axes (9), and the top frame (11) is fixed to the bottom of the probe mounting frame (12).

3. The three-stage motion chip positioning mechanism according to claim 1, characterized in that: A plurality of groups of carrier cover plates (18) are fixedly connected to the top of the substrate (1), and the carrier cover plates (18) are arranged above the carrier slots (24).

4. The three-stage motion chip positioning mechanism according to claim 2, characterized in that: A first mutually pushing strong magnet (19) is fixedly provided on the top of the chip positioning plate (17), and a second mutually pushing strong magnet (20) is fixedly provided on the bottom of the top frame (11). The upper and lower positions of the first mutually pushing strong magnet (19) and the second mutually pushing strong magnet (20) correspond to each other, and the sides of the first mutually pushing strong magnet (19) and the second mutually pushing strong magnet (20) that are close to each other are set to have the same pole.

5. The three-stage motion chip positioning mechanism according to claim 1, characterized in that: The inner wall of the chip protection plate (16) is integrally connected with a plurality of groups of partitions (21) at equal intervals along its own length extension direction, and the chip positioning plate (17) is provided with a plurality of groups of notches (22) at equal intervals on one side close to the partition (21). The inner side of the chip protection plate (16) is formed with a plurality of groups of detection limit areas (23) through the plurality of groups of the partitions (21) and the chip positioning plate (17), and the positions of the plurality of groups of the notches (22) correspond to the positions of the plurality of groups of the detection limit areas (23).

6. The three-stage motion chip positioning mechanism according to claim 5, characterized in that: The probe group (14) includes: A connecting frame (25) is fixedly connected to the probe mounting frame (12); A plurality of groups of probes (26) are fixedly plugged into the connecting frame (25), and the plurality of groups of probes (26) are connected to the plurality of groups of chip slots (29) by moving through the plurality of groups of notches (22) and the plurality of groups of detection limit areas (23).

7. The three-stage motion chip positioning mechanism according to claim 2, characterized in that: A position detection switch (27) is installed on the ball screw nut fixing block (4), and a detection probe (28) is installed on the top of the motor base plate (6). The detection probe (28) passes through the ball screw nut (8) by movement, and the position detection switch (27) is suitable for detecting the position of the detection probe (28).

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