Computer case structure

Abstract

The utility model discloses a computer case structure, which belongs to the technical field of computer cases, and comprises a case main body, the front end and the rear end of the case main body are respectively provided with a ventilation opening and a side frame, a heat dissipation side plate is detachably connected in the case main body, the heat dissipation side plate comprises a heat conduction substrate, a plurality of heat dissipation fins are fixedly arranged on the heat conduction substrate, and heat conduction pipes are arranged in the heat dissipation fins in a penetrating manner. In addition, a heat conduction connecting piece connected with the heat conduction pipe is arranged on the heat conduction substrate. According to the technical scheme, the two ventilation openings allowing air to flow form an air channel capable of taking away heat, meanwhile, the structural form can also facilitate dustproof treatment, the heat dissipation fins can communicate with the inner space and the outer space, and internal high temperature can be efficiently led out with a larger heat dissipation area; the heat conduction connecting piece is in direct contact with the high-calorific-value element in the case main body, so that heat can be efficiently transferred to the heat dissipation fins through the heat conduction pipe, and heat accumulation is not easy to occur in the case.

Description

Technical Field

[0001] The utility model relates to the technical field of computer cases, in particular to a computer case structure. Background Art

[0002] An independent computer unit is the basic practical unit of computing power, and the chassis, as the skeleton of the computer, has an important impact on whether the internal electrical components can fully exert their computing power.

[0003] The utility model patent with announcement number CN214846577U provides a computer chassis structure, in which the slider in the sliding mechanism can drive the folding plate in the dustproof mechanism to realize the opening and closing sliding of the folding plate, solving the problem of the protective plate requiring disassembly and installation in the prior art. The threaded fastening rod in the fastening mechanism can fix the specific opening and closing position of the folding plate. When the temperature inside the host is too high, the side panel can be partially opened for effective heat dissipation.

[0004] Whether the computing power can be fully utilized depends on the heat dissipation performance of the chassis. In the above structure, when the internal temperature of the host is too high, the side panels can be partially opened to effectively dissipate heat. Although this measure improves the heat dissipation efficiency, it also exposes the internal electrical components directly to the air. If the computer needs to operate at high load for a long time, its internal electrical components will also be in the air for a long time. Under the action of static electricity, dust will easily accumulate on the internal structure, affecting heat dissipation, requiring frequent cleaning. Therefore, a computer chassis structure is proposed to address the above problems. Utility Model Content

[0005] The technical problem to be solved by the present invention is to provide a computer case structure. The computer case, like an ordinary case, has only two vents that allow air flow, which can facilitate dust-proof treatment. At the same time, the heat dissipation side panels can significantly improve the heat dissipation efficiency without generating openings and gaps. Specifically, the heat dissipation fins can connect the internal and external spaces, and efficiently conduct the internal high temperature with a larger heat dissipation area. In addition, the thermal connector is in direct contact with the high-heat-generating components in the case body, and can efficiently transfer heat to the heat dissipation fins through the heat pipe. The combined effect of the above measures can significantly increase the heat dissipation area, improve the heat dissipation efficiency, and can perform additional heat conduction in the high-heat area to ensure that heat accumulation is not easy to occur inside. It solves the technical problem in the prior art that in order to improve the heat dissipation efficiency, the dust and dust resistance level of the case is reduced, and dust is easily accumulated on the internal structure, affecting heat dissipation, and it needs to be frequently cleaned.

[0006] The technical solution adopted by the embodiment of the present application to solve the technical problem is:

[0007] A computer case structure includes a case body, with ventilation openings at both the front and rear ends, and a ventilation fan group is provided in the front ventilation opening, and a side frame, which is sealed and connected to both sides of the case body, and has a heat dissipation side plate detachably connected thereto, wherein the heat dissipation side plate includes a heat conductive substrate, a plurality of heat dissipation fins are fixedly provided on the heat conductive substrate, and heat conductive pipes are passed through the heat dissipation fins. In addition, a heat conductive connector connected to the heat conductive pipe is provided on the heat conductive substrate, and the heat conductive connector is in contact with a high-heat-generating component in the case body to conduct heat away.

[0008] Through the above-mentioned structural form, the two vents that allow air flow are opened to form an air duct that can take away heat. At the same time, this structural form can also facilitate dust-proof treatment. The heat dissipation side panels provided at the same time can significantly improve the heat dissipation efficiency without generating openings and gaps. Specifically, the heat dissipation fins can connect the internal and external spaces, and efficiently dissipate the internal high temperature with a larger heat dissipation area. In addition, the thermal connector is in direct contact with the high-heat-generating components in the chassis body, and can efficiently transfer heat to the heat dissipation fins through the heat pipe. The combined effect of the above measures can significantly increase the heat dissipation area, improve the heat dissipation efficiency, and can also carry out additional heat dissipation in the high-heat area to ensure that heat accumulation is not easy to occur inside.

[0009] In one possible implementation, the thermally conductive connector includes a thermally conductive block fixed on the inner wall of the thermally conductive substrate, a plurality of thermally conductive branch pipes are connected to the thermally conductive block, the ends of the thermally conductive branch pipes are connected to contact pieces, and the contact pieces are attached to high-heat-generating components in the chassis body.

[0010] Through the above-mentioned structural form, by fitting the contact sheet with the high-heat-generating components in the chassis body, the heat can be transferred to the heat branch pipe through the contact sheet, and then to the heat block, heat pipe, and heat sink fins in turn, which is more efficient than pure air heat conduction.

[0011] In one possible implementation, the outer ends of the heat sink fins extend out of the outer end surface of the heat conductive substrate, and a protective plate capable of covering all the heat sink fins is provided on the outside of the heat conductive substrate, and the inner wall of the protective plate is provided with a plurality of reinforcing ribs that do not contact the heat sink fins.

[0012] Through the above-mentioned structural form, the contact area between the heat dissipation fins and the external air can be increased, the heat dissipation efficiency can be improved, and the protective plate can protect the heat dissipation fins to prevent them from bending and deforming and affecting the heat dissipation efficiency. In addition, the reinforcing ribs can enhance the overall strength of the protective plate, so that it can play a better protective role.

[0013] In a possible implementation, the ventilation fan group includes a mounting bracket fixedly connected to the inner wall of the chassis body, and a heat dissipation fan is installed on the mounting bracket.

[0014] Through the above-mentioned structural form, when the cooling fan is working, it can drive the air flow to enter from the vents on the front side and flow into from the vents on the rear side, thereby taking away the hot air inside and playing a role in heat dissipation.

[0015] In a possible implementation, a clamping ring is fixedly provided on the front end surface of the chassis body around the vent, and a front dust cover is provided on the clamping sleeve of the clamping ring.

[0016] Through the above-mentioned structural form, the front dust cover can play a filtering role to prevent dust from entering the interior through the ventilation port, and the front dust cover can be detachably connected to the clamping ring, which can be easily disassembled and replaced.

[0017] In a possible implementation, the front dust cover includes a cover frame that is clamped to the clamping ring, and a first dust net is fixedly provided in the cover frame.

[0018] Through the above-mentioned structural form, the front dust cover and the clamping ring can be detachably connected by the cover frame, and the first dustproof net can filter and block the dust.

[0019] In a possible implementation, a snap-in slot plate is fixedly provided on the rear end surface of the chassis body around the vent, and a rear dustproof plate is inserted into the snap-in slot plate.

[0020] Through the above-mentioned structural form, the rear dustproof plate can play a filtering role to prevent dust from entering the interior through the ventilation port, and the rear dustproof plate can be detachably inserted in the card slot plate, which can be easily disassembled and replaced.

[0021] In a possible implementation, the rear dustproof plate includes a screen frame in close contact with the clamping slot plate, and a second dustproof screen is fixedly provided in the screen frame.

[0022] Through the above-mentioned structural form, the net frame can be used to achieve a tight connection between the rear dustproof plate and the card slot plate, thereby preventing dust from entering through the contact gap, and the second dustproof net can filter and block the dust.

[0023] In summary, the present invention has the following beneficial technical effects:

[0024] The two vents that allow air flow form an air duct that can carry away heat. At the same time, this structural form can also facilitate dust-proof treatment. The heat dissipation side panels provided at the same time can significantly improve the heat dissipation efficiency without creating openings and gaps. Specifically, the heat dissipation fins can connect the internal and external spaces, and efficiently dissipate the internal high temperature with a larger heat dissipation area. In addition, the thermal connector is in direct contact with the high-heat-generating components in the chassis body, and can efficiently transfer heat to the heat dissipation fins through the heat pipe. The combined effect of the above measures can significantly increase the heat dissipation area, improve the heat dissipation efficiency, and can also provide additional heat dissipation to the high-heat area, ensuring that heat accumulation is not likely to occur inside.

[0025] In addition, the front dust cover and the rear dust plate can respectively block the two ventilation ports to prevent dust from entering through the ventilation ports, and both of them are detachably connected to the chassis body, so they can be easily replaced and cleaned. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0027] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0028] Figure 2 This is a schematic diagram of the structure of the utility model;

[0029] Figure 3 This is a schematic diagram of the heat dissipation side plate structure of the present utility model;

[0030] Figure 4 It is a schematic diagram of the local structure of the utility model;

[0031] Figure 5 This is a schematic diagram of the protective plate structure of the present utility model.

[0032] In the figure: 1. Chassis body; 11. Ventilation port; 12. Snap ring; 13. Snap slot plate; 2. Side frame; 21. Protective plate; 211. Reinforcement rib; 3. Heat dissipation side plate; 31. Heat-conducting substrate; 32. Heat dissipation fins; 33. Heat-conducting pipe; 34. Heat-conducting connector; 341. Heat-conducting block; 342. Heat-conducting branch pipe; 343. Contact piece; 4. Ventilation fan assembly; 41. Mounting bracket; 42. Cooling fan; 5. Front dust cover; 51. Cover frame; 52. First dust net; 6. Rear dust cover; 61. Net frame; 62. Second dust net. DETAILED DESCRIPTION

[0033] The technical solution in the embodiments of the present application is to solve the problems of the above-mentioned background technology, and the overall idea is as follows:

[0034] like Figure 1 - Figure 3As shown, a computer case structure provided in this embodiment includes a case body 1, which is provided with vents 11 at both the front and rear ends, and a ventilation fan group 4 is provided in the front vents 11, and a side frame 2, which is tightly connected to both sides of the case body 1, and a heat dissipation side plate 3 is detachably connected thereto. Through the above-mentioned structural form, the two vents 11 that allow air flow are opened to form an air duct that can take away heat. At the same time, this structural form can also facilitate dust-proof treatment. At the same time, the heat dissipation side plate 3 set at the same time can significantly improve the heat dissipation efficiency without generating openings or gaps.

[0035] Specifically, the heat dissipation side plate 3 includes a heat-conducting substrate 31, on which a plurality of heat dissipation fins 32 are fixed, and heat-conducting pipes 33 are passed through the heat dissipation fins 32. In addition, a heat-conducting connector 34 connected to the heat-conducting pipe 33 is provided on the heat-conducting substrate 31, and the heat-conducting connector 34 is in contact with the high-heat-generating components in the chassis body 1 to conduct heat out. In the above-mentioned structural form, the heat dissipation fins 32 can connect the internal and external spaces, and efficiently conduct the internal high temperature with a larger heat dissipation area. In addition, the heat-conducting connector 34 is in direct contact with the high-heat-generating components in the chassis body 1, and can efficiently transfer heat to the heat dissipation fins 32 through the heat-conducting pipe 33. The combined effect of the above-mentioned measures can significantly increase the heat dissipation area, improve the heat dissipation efficiency, and can perform additional heat conduction in the high-heat area to ensure that heat accumulation is not easy to occur inside.

[0036] like Figure 2 、 Figure 3 、 Figure 5 As shown, the heat-conducting connector 34 includes a heat-conducting block 341 fixed on the inner wall of the heat-conducting substrate 31, and a plurality of heat-conducting branch pipes 342 are connected to the heat-conducting block 341. The ends of the heat-conducting branch pipes 342 are connected to contact pieces 343, and the contact pieces 343 are attached to the high-heat-generating components in the chassis body 1. Through the above-mentioned structural form, the contact pieces 343 are attached to the high-heat-generating components in the chassis body 1, so that heat can be transferred to the heat-conducting branch pipes 342 through the contact pieces 343, and then transferred to the heat-conducting block 341, the heat-conducting pipes 33, and the heat dissipation fins 32 in sequence, which is more efficient than pure air heat conduction.

[0037] In addition, the outer ends of the heat dissipation fins 32 extend out of the outer end surface of the heat-conducting substrate 31. At the same time, a protective plate 21 is provided on the outside of the heat-conducting substrate 31 to cover all the heat dissipation fins 32, and the inner wall of the protective plate 21 is provided with a plurality of reinforcing ribs 211 that do not contact the heat dissipation fins 32. Through the above-mentioned structural form, the contact area between the heat dissipation fins 32 and the external air can be increased, and the heat dissipation efficiency can be improved. The protective plate 21 can protect the heat dissipation fins 32 to prevent them from bending and deforming and affecting the heat dissipation efficiency. In addition, the reinforcing ribs 211 can enhance the overall strength of the protective plate 21, so that it can play a better protective role.

[0038] like Figure 4 As shown, the ventilation fan group 4 includes a mounting bracket 41 fixedly connected to the inner wall of the chassis body 1, and a cooling fan 42 is installed on the mounting bracket 41. Through the above-mentioned structural form, when the cooling fan 42 is working, it can drive the airflow to enter from the front vent 11 and flow into from the rear vent 11, thereby taking away the internal hot air and playing a heat dissipation role.

[0039] like Figure 4 As shown, a snap ring 12 is fixedly provided on the front face of the chassis body 1 around the vent 11, and a front dust cover 5 is provided on the snap ring 12. Through the above-mentioned structural form, the front dust cover 5 can play a filtering role to prevent dust from entering the interior through the vent 11, and the front dust cover 5 can be detachably connected to the snap ring 12, which can be easily disassembled and replaced.

[0040] Among them, the front dust cover 5 includes a cover frame 51 that is clamped with the clamping ring 12, and a first dust net 52 is fixedly arranged in the cover frame 51. Through the above-mentioned structural form, the cover frame 51 can be used to realize the detachable connection between the front dust cover 5 and the clamping ring 12, and the first dust net 52 can filter and block the dust.

[0041] like Figure 4 As shown, a snap-in slot plate 13 is fixedly provided on the rear end face of the chassis body 1 around the vent 11, and a rear dustproof plate 6 is inserted in the snap-in slot plate 13. Through the above-mentioned structural form, the rear dustproof plate 6 can play a filtering role to prevent dust from entering the interior from the vent 11, and the rear dustproof plate 6 can be detachably inserted in the snap-in slot plate 13, which can be easily disassembled and replaced.

[0042] Among them, the rear dustproof plate 6 includes a mesh frame 61 that is in close contact with the snap-in slot plate 13, and a second dustproof net 62 is fixedly arranged in the mesh frame 61. Through the above-mentioned structural form, the mesh frame 61 can be used to achieve a close connection between the rear dustproof plate 6 and the snap-in slot plate 13, thereby preventing dust from entering through the contact gap, and the second dustproof net 62 plays a role in filtering and blocking dust.

[0043] The use principle and use process of this utility model:

[0044] The two vents 11 that allow air flow form an air duct that can take away heat. At the same time, this structural form can also facilitate dust-proof treatment. The heat dissipation side panels 3 set at the same time can significantly improve the heat dissipation efficiency without generating openings and gaps. Specifically, the heat dissipation fins 32 can connect the internal and external spaces, and efficiently conduct the internal high temperature with a larger heat dissipation area. In addition, the thermal connector 34 is in direct contact with the high-heat-generating components in the chassis body 1, and can efficiently transfer heat to the heat dissipation fins 32 through the heat pipe 33. The combined effect of the above measures can significantly increase the heat dissipation area, improve the heat dissipation efficiency, and can perform additional heat conduction in the high-heat area to ensure that heat accumulation is not easy to occur inside.

[0045] In addition, the front dust cover 5 and the rear dust plate 6 can respectively block the two ventilation ports 11 to prevent dust from entering through the ventilation ports 11, and both of the above are detachably connected to the chassis body 1, so they can be easily replaced and cleaned.

[0046] Finally, it should be noted that the above embodiments are merely examples for the purpose of illustrating the present invention and are not intended to limit the embodiments. Those skilled in the art will readily appreciate that other variations or modifications based on the above description are possible. It is not necessary and impossible to provide an exhaustive list of all possible embodiments. However, any obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A computer chassis structure, characterized in that: include: The chassis body (1) is provided with ventilation openings (11) at both the front and rear ends, and a ventilation fan group (4) is provided in the front ventilation opening (11); Side frames (2) are tightly connected to both sides of the chassis body (1), and are detachably connected to heat dissipation side panels (3); The heat dissipation side plate (3) includes a heat-conducting substrate (31), a plurality of heat dissipation fins (32) are fixedly provided on the heat-conducting substrate (31), and heat-conducting pipes (33) are passed through the heat-conducting fins (32). In addition, a heat-conducting connector (34) connected to the heat-conducting pipe (33) is provided on the heat-conducting substrate (31), and the heat-conducting connector (34) is in contact with a high-heat-generating component in the chassis body (1) to conduct heat away.

2. A computer case structure according to claim 1, characterized in that: The heat-conducting connector (34) comprises a heat-conducting block (341) fixed on the inner wall of the heat-conducting substrate (31); a plurality of heat-conducting branch pipes (342) are connected to the heat-conducting block (341); the ends of the heat-conducting branch pipes (342) are connected to contact pieces (343); and the contact pieces (343) are attached to high-heat-generating components in the chassis body (1).

3. The computer case structure according to claim 1, wherein: The outer ends of the heat dissipation fins (32) extend out of the outer end surface of the heat-conducting substrate (31); and a protective plate (21) capable of covering all the heat dissipation fins (32) is provided on the outside of the heat-conducting substrate (31), and the inner wall of the protective plate (21) is provided with a plurality of reinforcing ribs (211) that do not contact the heat dissipation fins (32).

4. The computer case structure according to claim 1, wherein: The ventilation fan group (4) comprises a mounting bracket (41) fixedly connected to the inner wall of the chassis body (1), and a heat dissipation fan (42) is mounted on the mounting bracket (41).

5. The computer case structure according to claim 1, wherein: A clamping ring (12) is fixedly provided on the front face of the chassis body (1) around the vent (11), and a front dust cover (5) is provided on the clamping ring (12).

6. The computer case structure according to claim 5, wherein: The front dust cover (5) comprises a cover frame (51) clamped with a clamping ring (12), and a first dust net (52) is fixedly arranged in the cover frame (51).

7. The computer case structure according to claim 1, wherein: A clamping slot plate (13) is fixedly provided on the rear end surface of the chassis body (1) around the vent (11), and a rear dustproof plate (6) is inserted into the clamping slot plate (13).

8. The computer case structure according to claim 7, wherein: The rear dustproof plate (6) comprises a mesh frame (61) in close contact with the clamping slot plate (13), and a second dustproof net (62) is fixedly arranged in the mesh frame (61).

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