High-capacity low-impedance vehicle-gauge-level chip capacitor

Abstract

The utility model discloses a high-capacity low-impedance vehicle gauge level chip capacitor, which comprises a main body, one side of the outer surface of the main body is fixedly connected with a clamping box, one side of the inner wall of the clamping box is fixedly connected with a telescopic rod, and one side of the outer surface of the telescopic rod is provided with a spring; the other end of the telescopic rod is fixedly connected with a clamping plate, and one end of the spring is fixedly connected with the clamping box. According to the high-capacity low-impedance vehicle-gauge-level chip capacitor, through the arrangement of the clamping plate, the telescopic rod and the spring, when the capacitor needs to be disassembled or assembled, tools such as tweezers can be used, one end of each tool such as the tweezers is tightly attached to the clamping plate and pressed downwards, the telescopic rod can be used for stretching out and drawing back, and the tools such as the tweezers can reach the bottommost part; and then through the counter-acting force of the spring, the clamping plate can rebound, so that the purposes of clamping tools such as tweezers and fastening are achieved, the capacitor can be clamped more conveniently, and a worker can install the capacitor conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of chip capacitors, and in particular to automotive-grade chip capacitors with high capacity and low impedance. Background Art

[0002] Chip capacitors are a type of capacitor material. The full name of chip capacitors is multilayer (laminate, chip) chip ceramic capacitors, also known as chip capacitors and chip capacitance. There are two ways to express chip capacitors, one is in inches and the other is in millimeters. Its appearance is made of ceramic, but there is more than one type. It is also divided into glass capacitors, oil-paper capacitors, electrolytic capacitors, etc. The ceramic chip capacitors commonly referred to are MLCCs, that is, multilayer ceramic chip capacitors. Multilayer ceramic capacitors are made of parallel layers of ceramic materials and electrode materials.

[0003] Current chip electrolytic capacitors are inconvenient to install. Due to the small size of the capacitor itself, welding is usually used to fix the capacitor after production. Once the capacitor is damaged and needs to be replaced, the smooth surface is not convenient for removal with tweezers or other clamps, so easy-to-clamp chip capacitors are needed. In addition, the current capacitor surface does not have a protective effect and is easily broken after impact or collision. Therefore, it is necessary to design automotive-grade chip capacitors with high capacity and low impedance. Utility Model Content

[0004] The main purpose of the present invention is to provide a high-capacity, low-impedance automotive-grade chip capacitor, which can effectively solve the problems in the background technology.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A high-capacity, low-impedance automotive-grade chip capacitor includes a main body, a card box is fixedly connected to one side of the outer surface of the main body, a telescopic rod is fixedly connected to one side of the inner wall of the card box, and a spring is provided on one side of the outer surface of the telescopic rod; the other end of the telescopic rod is fixedly connected to a splint, one end of the spring is fixedly connected to the card box, and the other end of the spring is fixedly connected to the splint.

[0007] In order to facilitate installation, as a high-capacity, low-impedance automotive-grade chip capacitor of the utility model, a fixing plate is fixedly connected to one side of the upper surface of the main body, and a through hole is opened on one side of the outer surface of the fixing plate.

[0008] In order to achieve the purpose of conductivity, as a high-capacity, low-impedance automotive-grade chip capacitor of the utility model, a positioning hole is opened on one side of the main body, and an inner electrode is fixedly connected inside the positioning hole.

[0009] In order to achieve the purpose of convenient connection, as a high-capacity, low-impedance automotive-grade chip capacitor of the utility model, one side of the outer surface of the main body is fixedly connected to an external electrode.

[0010] In order to facilitate wiring, as the high-capacity, low-impedance automotive-grade chip capacitor of the present invention, the outer surface of the outer electrode is fixedly connected to a barrier layer, and the outer surface of the barrier layer is fixedly connected to a terminal.

[0011] In order to achieve the purpose of protection, as a high-capacity, low-impedance automotive-grade chip capacitor of the utility model, the outer surface of the main body is coated with polyurethane, and the outer surface of the polyurethane is fixedly connected with polyamide resin.

[0012] In order to achieve the purpose of buffering, as the automotive-grade chip capacitor with high capacity and low impedance of the utility model, the outer surface of the polyamide resin is fixedly connected with a buffer layer, and the material of the buffer layer is sponge.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. In the utility model, through the setting of the splint, telescopic rod and spring, when it is necessary to remove or install the capacitor, tweezers or other tools can be used. One end of the tweezers or other tools is pressed against the splint and pressed downward. The telescopic rod can be used to extend and retract so that the tweezers or other tools can reach the bottom. Then, the reaction force of the spring can make the splint rebound, thereby supporting the tweezers or other tools and achieving the purpose of tightening. It is more convenient to clamp the capacitor and it is convenient for the staff to install it.

[0015] 2. In the present invention, polyurethane, polyamide resin and a buffer layer are provided. Polyurethane is used to protect the internal components of the capacitor and reduce the impact of vibration and impact on the capacitor. Polyamide resin is used to increase the overall strength of the capacitor and reduce external physical damage. The buffer layer is provided to absorb external impact force through foam and reduce impact damage to the capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a front view structural diagram of the utility model;

[0017] Figure 2 This is a schematic diagram of the card box structure of the present utility model;

[0018] Figure 3 This is a schematic diagram of the buffer layer structure of the present utility model;

[0019] Figure 4 It is a schematic diagram of the main structure of the utility model.

[0020] In the figure: 1. Main body; 2. Card box; 3. Telescopic rod; 4. Spring; 5. Clamp; 6. Fixing plate; 7. Through hole; 8. Positioning hole; 9. Inner electrode; 10. Outer electrode; 11. Barrier layer; 12. Terminal; 13. Polyurethane; 14. Polyamide resin; 15. Buffer layer. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] like Figure 1-4 As shown, the high-capacity, low-impedance automotive-grade chip capacitor includes a main body 1, a card box 2 is fixedly connected to one side of the outer surface of the main body 1, a telescopic rod 3 is fixedly connected to one side of the inner wall of the card box 2, and a spring 4 is provided on one side of the outer surface of the telescopic rod 3;

[0023] In this embodiment, the other end of the telescopic rod 3 is fixedly connected to the clamping plate 5 , one end of the spring 4 is fixedly connected to the card box 2 , and the other end of the spring 4 is fixedly connected to the clamping plate 5 .

[0024] During specific use, when it is necessary to disassemble or install the capacitor, you can use tools such as tweezers, press one end of the tool such as tweezers against the clamping plate 5, and press downward. The telescopic rod 3 can be used to extend and retract so that the tweezers and other tools can reach the bottom. Then, through the reaction force of the spring 4, the clamping plate 5 can rebound, thereby supporting the tweezers and other tools and achieving the purpose of tightening. It is more convenient to clamp the capacitor and it is convenient for the staff to install it.

[0025] In this embodiment, a fixing plate 6 is fixedly connected to one side of the upper surface of the main body 1 , and a through hole 7 is formed on one side of the outer surface of the fixing plate 6 .

[0026] During specific use, the fixing plate 6 can also be directly clamped at the same time, and the permeability of the through hole 7 is utilized to make the clamping of tools such as tweezers more secure.

[0027] In this embodiment, a positioning hole 8 is opened on one side of the main body 1 , and an inner electrode 9 is fixedly connected inside the positioning hole 8 .

[0028] During specific use, the inner electrode 9 can be conveniently fixed through the positioning hole 8, which has the effect of convenient installation.

[0029] In this embodiment, an external electrode 10 is fixedly connected to one side of the outer surface of the main body 1 .

[0030] During specific use, the use of the external electrode 10 provides electrical conductivity, which facilitates the power supply effect of the capacitor.

[0031] In this embodiment, the outer surface of the external electrode 10 is fixedly connected to the barrier layer 11 , and the outer surface of the barrier layer 11 is fixedly connected to the terminal 12 .

[0032] During specific use, the barrier layer 11 is used to wrap the external electrode 10, which has a certain protective effect and prevents the external electrode 10 from being exposed. The capacitor can be easily installed and fixed through the terminal 12, which is convenient for welding on the circuit board.

[0033] In this embodiment, the outer surface of the main body 1 is coated with polyurethane 13 , and the outer surface of the polyurethane 13 is fixedly connected with a polyamide resin 14 .

[0034] In specific use, polyurethane 13 is used to protect the internal components of the capacitor and reduce the impact of vibration and impact on the capacitor. Polyamide resin 14 is used to increase the overall strength of the capacitor and reduce external physical damage.

[0035] In this embodiment, a buffer layer 15 is fixedly connected to the outer surface of the polyamide resin 14 , and the material of the buffer layer 15 is sponge.

[0036] During specific use, the buffer layer 15 is provided to absorb external impact force through foam, thereby reducing impact damage to the capacitor.

[0037] Working principle: When it is necessary to disassemble or install the capacitor, you can use tools such as tweezers, press one end of the tool such as tweezers against the clamping plate 5, and press downward. The telescopic rod 3 can be used to extend and retract so that the tweezers and other tools can reach the bottom. Then, the reaction force of the spring 4 can make the clamping plate 5 rebound, thereby supporting the tweezers and other tools to achieve the purpose of tightening. It is more convenient to clamp the capacitor and facilitate the staff to install it. At the same time, the fixing plate 6 can be directly clamped, and the permeability of the through hole 7 can make the tweezers and other tools more firmly clamped. The inner electrode 9 can be conveniently fixed through the positioning hole 8. The invention has the effect of being easy to install. Through the use of the external electrode 10, it has conductivity, which facilitates the power-on effect of the capacitor. The barrier layer 11 is used to wrap the external electrode 10, which has a certain protective effect and prevents the external electrode 10 from being exposed. The capacitor is conveniently installed and fixed through the terminal 12, and is convenient for welding on the circuit board. Polyurethane 13 is used to protect the internal components of the capacitor and reduce the impact of vibration and impact on the capacitor. Polyamide resin 14 is used to increase the overall strength of the capacitor and reduce external physical damage. The setting of the buffer layer 15 is used to absorb external impact force through foam to reduce impact damage to the capacitor.

[0038] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A high-capacity, low-impedance automotive-grade chip capacitor, comprising a main body (1), characterized in that: A card box (2) is fixedly connected to one side of the outer surface of the main body (1), a telescopic rod (3) is fixedly connected to one side of the inner wall of the card box (2), and a spring (4) is provided on one side of the outer surface of the telescopic rod (3); The other end of the telescopic rod (3) is fixedly connected to a clamping plate (5), one end of the spring (4) is fixedly connected to the card box (2), and the other end of the spring (4) is fixedly connected to the clamping plate (5).

2. The high-capacity, low-impedance automotive-grade chip capacitor according to claim 1, characterized in that: A fixing plate (6) is fixedly connected to one side of the upper surface of the main body (1), and a through hole (7) is provided on one side of the outer surface of the fixing plate (6).

3. The high-capacity, low-impedance automotive-grade chip capacitor according to claim 1, characterized in that: A positioning hole (8) is provided on one side of the main body (1), and an inner electrode (9) is fixedly connected inside the positioning hole (8).

4. The high-capacity, low-impedance automotive-grade chip capacitor according to claim 1, characterized in that: An external electrode (10) is fixedly connected to one side of the outer surface of the main body (1).

5. The high-capacity, low-impedance automotive-grade chip capacitor according to claim 4, characterized in that: The outer surface of the outer electrode (10) is fixedly connected to a barrier layer (11), and the outer surface of the barrier layer (11) is fixedly connected to a terminal (12).

6. The high-capacity, low-impedance automotive-grade chip capacitor according to claim 1, characterized in that: The outer surface of the main body (1) is coated with polyurethane (13), and the outer surface of the polyurethane (13) is fixedly connected with a polyamide resin (14).

7. The high-capacity, low-impedance automotive-grade chip capacitor according to claim 6, characterized in that: A buffer layer (15) is fixedly connected to the outer surface of the polyamide resin (14), and the material of the buffer layer (15) is sponge.

Images