Adjusting device and semiconductor device

Abstract

An adjusting device and a semiconductor device, the adjusting device is used for adjusting the position of a base, and the base comprises a wafer bearing disc used for being arranged in a cavity; the bearing part is located at the bottom of the wafer bearing disc, and the bearing part penetrates through the bottom of the cavity; the adjusting device comprises a lifting unit which is connected with the bottom of the bearing part and is used for enabling the wafer bearing disc to ascend or descend; and the horizontal unit is used for being connected with the bearing part of the base and adjusting the horizontal position of the wafer bearing disc. A lifting unit in the adjusting device is connected with the bottom of the bearing part, when the adjusting device is adopted to adjust the position of the base, the vertical position of the wafer bearing disc in the cavity is adjusted through the lifting unit, a horizontal unit of the adjusting device is connected with the bearing part, and the horizontal position of the wafer bearing disc is adjusted through the horizontal unit.

Description

Technical Field

[0001] The embodiments of the utility model relate to the field of semiconductor equipment, and in particular to an adjusting device and a semiconductor device. Background Art

[0002] In the semiconductor manufacturing process, wafer processing is a critical process that involves a variety of precision semiconductor equipment. In particular, in plasma etching, chemical vapor deposition (CVD) or physical vapor deposition (PVD) processes, wafers need to be processed in a reaction chamber.

[0003] Currently, most semiconductor equipment manufacturers bolt the pedestal directly into the chamber to support the wafer. While this method provides the necessary stability, it also introduces operational limitations. This is particularly true when using gases with different properties for jet processing. Because the pedestal's fixed position prevents adjustment of the distance between the nozzle and the wafer, it doesn't meet the optimal jet distance requirements for various gases.

[0004] Due to limitations in the pedestal mounting method, when the nozzle-to-wafer distance cannot be optimized based on the characteristics of different gases, processing efficiency and the quality of the process results may be affected. In addition, if the pedestal is not mounted level, the distance from the nozzle will be inconsistent, affecting process stability and repeatability. Utility Model Content

[0005] The problem solved by the embodiments of the present invention is to provide an adjusting device and a semiconductor device for adjusting the vertical position and the horizontal position of a base in a cavity.

[0006] In order to solve the above problems, an embodiment of the present invention provides an adjustment device for adjusting the position of a base, wherein the base includes: a wafer carrier plate for being arranged in a cavity; a supporting portion located at the bottom of the wafer carrier plate, and the supporting portion passes through the bottom of the cavity; the adjustment device includes: a lifting unit, the output end of which is used to be connected to the bottom of the supporting portion for raising or lowering the wafer carrier plate; and a horizontal unit for being connected to the supporting portion of the base for adjusting the horizontal position of the wafer carrier plate.

[0007] Optionally, the lifting unit includes: a motor, which includes an output shaft; a screw, fixedly connected to the output shaft of the motor; a rotating member, located on the screw, for rotating with the screw, and moving vertically when the screw rotates; a connecting seat, fixed to the rotating member, and used to be fixedly connected to the supporting part.

[0008] Optionally, the rotating member includes: a thread located inside the rotating member and rotatably connected to the lead screw; and a step surface located on the outer surface of the rotating member, the step surface abutting against the bottom of the connecting seat.

[0009] Optionally, the adjusting device further includes: a linear guide rail, which is arranged in a vertical direction; a slider, which is slidably arranged on the linear guide rail and is fixed to the connecting seat; the connecting seat is slidably arranged in the linear guide rail; the adjusting device further includes: an upper mechanical limit, which is arranged on the linear guide rail and is used to limit the upper limit position of the connecting seat; a lower mechanical limit, which is arranged on the linear guide rail and is located below the upper mechanical limit, and is used to limit the lower limit position of the connecting seat.

[0010] Optionally, both the upper mechanical limit and the lower mechanical limit include protrusions.

[0011] Optionally, the adjusting device also includes: an upper limit sensor, which is arranged on the moving path of the connecting seat and is located below the upper mechanical limit; a lower limit sensor, which is arranged on the moving path of the connecting seat and is located above the upper mechanical limit; a controller, which is connected to the upper limit sensor, the lower limit sensor and the motor, and is used to stop the motor from rotating when the connecting seat passes through the upper limit sensor or the lower limit sensor.

[0012] Optionally, the lifting unit further includes: a bearing seat, which is located between the rotating member and the output end of the motor in the vertical direction, wherein a bearing is provided in the bearing seat, wherein the inner ring of the bearing is fixed to the lead screw, and the outer ring of the bearing is fixed to the bearing seat.

[0013] Optionally, the horizontal unit is located at the bottom of the cavity, and the horizontal unit includes: a base, arranged at the bottom of the cavity, the base having a through hole for the supporting part to pass through, and the through hole is in contact with the side wall of the supporting part; a plurality of leveling structures, arranged at intervals on the base, and abutting the leveling structures against the bottom of the cavity, for adjusting the horizontal position of the base.

[0014] Optionally, the leveling structure is arranged on the edge of the base, and the leveling structure includes: a leveling screw, which passes through the base and abuts against the bottom of the cavity; a fixing nut, which is rotatably arranged on the leveling screw; and a fixing screw, which is arranged on the leveling screw.

[0015] Optionally, the horizontal unit further includes: a scale line provided on the surface of the base; and an indicator arrow provided on the leveling screw.

[0016] The present invention also provides a semiconductor device, comprising: a cavity; a base, the base comprising: a wafer carrier plate, used to be arranged in the cavity; a supporting portion, located at the bottom of the wafer carrier plate, and the supporting portion passes through the bottom of the cavity; an adjusting device, comprising the lifting unit, connected to the bottom of the supporting portion, used to raise or lower the wafer carrier plate; comprising a horizontal unit, connected to the supporting portion of the base, used to adjust the horizontal position of the wafer carrier plate; a nozzle, located in the cavity and arranged at the top of the cavity, used to spray gas onto the wafer carrier plate.

[0017] Optionally, a connecting structure extending radially is provided at the bottom of the side wall of the supporting portion; and the semiconductor device further comprises: a bellows, which is vertically provided between the connecting structure and the cavity.

[0018] Compared with the prior art, the technical solution of the embodiment of the utility model has the following advantages:

[0019] The adjustment device provided by the embodiment of the present utility model is used to adjust the position of the base, and the base includes: a wafer carrier plate, which is used to be set in a cavity; a supporting part, which is located at the bottom of the wafer carrier plate, and the supporting part passes through the bottom of the cavity; the adjustment device includes: a lifting unit, which is connected to the bottom of the supporting part, and is used to raise or lower the wafer carrier plate; a horizontal unit, which is used to be connected to the supporting part of the base, and is used to adjust the horizontal position of the wafer carrier plate. The lifting unit in the adjustment device is connected to the bottom of the supporting part. When the adjustment device is used to adjust the position of the base, the vertical position of the wafer carrier plate in the cavity is adjusted by the lifting unit. The horizontal unit of the adjustment device is connected to the supporting part, and the horizontal position of the wafer carrier plate is adjusted by the horizontal unit.

[0020] The semiconductor device provided by the embodiment of the present invention includes: a cavity; a base, the base including: a wafer carrier, which is used to be arranged in the cavity; a supporting portion, which is located at the bottom of the wafer carrier, and the supporting portion passes through the bottom of the cavity; an adjusting device, the lifting unit is connected to the bottom of the supporting portion, and is used to raise or lower the wafer carrier; a horizontal unit is connected to the supporting portion of the base, and is used to adjust the horizontal position of the wafer carrier; a nozzle is located in the cavity and is arranged at the top of the cavity, and is used to spray gas onto the wafer carrier. In the adjusting device of the embodiment of the present invention, the lifting unit is connected to the bottom of the supporting portion. When the adjusting device is used to adjust the position of the base, the vertical position of the wafer carrier in the cavity is adjusted by the lifting unit. The horizontal unit of the adjusting device is connected to the supporting portion, and the horizontal position of the wafer carrier is adjusted by the horizontal unit. During processing in the chamber, the wafer carrier's horizontal position is adjusted by adjusting the horizontal unit in the adjustment device, ensuring that the distance between the wafer carrier and each nozzle is consistent. Furthermore, if the chamber is not level due to an uneven site or the flatness of the wafers being processed is poor, the horizontal position of the wafer carrier can also be adjusted by the horizontal unit to ensure that the distance between the wafer carrier and each nozzle is consistent. Furthermore, the lifting mechanism in the adjustment device can be adjusted to achieve the optimal distance between the wafer carrier and the nozzles based on the characteristics of different gases, thereby improving processing efficiency and process quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural diagram of the regulating device in the utility model;

[0022] Figure 2 It is a structural diagram of the base in the utility model;

[0023] Figure 3 This is a schematic diagram of the structure in which the adjusting device and the base are assembled together in the utility model;

[0024] Figure 4 It is a schematic diagram of the scale lines and indicating arrows of the horizontal unit in the present utility model;

[0025] Figure 5 It is a structural schematic diagram of the semiconductor device of the utility model;

[0026] Figure 6 yes Figure 5 Cross-sectional view at AA in the middle without horizontal adjustment;

[0027] Figure 7 yes Figure 5 Cross-sectional view at AA in the horizontal adjustment state. DETAILED DESCRIPTION

[0028] As we know from the background, due to the limitations of the susceptor mounting method in the chamber, when the nozzle-to-wafer distance cannot be optimized according to the characteristics of different gases, it may affect processing efficiency and the quality of the process results. In addition, if the susceptor is not installed level, the distance from the nozzle will be inconsistent, affecting the stability and repeatability of the process.

[0029] In order to solve the technical problem, the semiconductor device provided by the embodiment of the present invention includes: a cavity; a base, the base includes: a wafer carrier, which is used to be arranged in the cavity; a supporting part, which is located at the bottom of the wafer carrier, and the supporting part passes through the bottom of the cavity; an adjusting device, the lifting unit is connected to the bottom of the supporting part, and is used to raise or lower the wafer carrier; a horizontal unit is connected to the supporting part of the base, and is used to adjust the horizontal position of the wafer carrier; a nozzle is located in the cavity and is arranged at the top of the cavity, and is used to spray gas to the wafer carrier. In the adjusting device of the embodiment of the present invention, the lifting unit is connected to the bottom of the supporting part. When the adjusting device is used to adjust the position of the base, the vertical position of the wafer carrier in the cavity is adjusted by the lifting unit. The horizontal unit of the adjusting device is connected to the supporting part, and the horizontal position of the wafer carrier is adjusted by the horizontal unit. During processing in the chamber, the wafer carrier's horizontal position is adjusted by adjusting the horizontal unit in the adjustment device, ensuring that the distance between the wafer carrier and each nozzle is consistent. Furthermore, if the chamber is not level due to an uneven site or the flatness of the wafers being processed is poor, the horizontal position of the wafer carrier can also be adjusted by the horizontal unit to ensure that the distance between the wafer carrier and each nozzle is consistent. Furthermore, the lifting mechanism in the adjustment device can be adjusted to achieve the optimal distance between the wafer carrier and the nozzles based on the characteristics of different gases, thereby improving processing efficiency and process quality.

[0030] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0031] Figure 1 It is a structural diagram of the regulating device in the utility model; Figure 2 It is a structural diagram of the base in the utility model; Figure 3 It is a structural schematic diagram of the adjustment device and the base assembled together in the utility model.

[0032] An adjusting device is provided for adjusting the position of a base 100, wherein the base 100 comprises: a wafer carrier 101 for being arranged in a cavity; a supporting portion 102 located at the bottom of the wafer carrier 101, and the supporting portion 102 passes through the bottom of the cavity; the adjusting device comprises: a lifting unit (not shown in the figure) for being connected to the bottom of the supporting portion 102 for raising or lowering the wafer carrier 101; and a horizontal unit (not shown in the figure) for being connected to the supporting portion 102 of the base 100 for adjusting the horizontal position of the wafer carrier 101.

[0033] The output end of the lifting unit in the adjusting device of the embodiment of the present invention is connected to the bottom of the supporting part 102. When the adjusting device is used to adjust the position of the base 100, the vertical position of the wafer carrier 101 in the cavity is adjusted by the lifting unit. The horizontal unit of the adjusting device is connected to the supporting part 102, and the horizontal position of the wafer carrier 101 is adjusted by the horizontal unit.

[0034] The wafer carrier 101 supports the wafer during processing, providing a stable support surface to ensure the wafer is properly positioned during processing. A support portion 102 is located at the bottom of the wafer carrier 101 and extends through the bottom of the cavity, allowing it to connect to an adjustment mechanism. When the adjustment mechanism changes the position of the support portion 102, the position of the wafer carrier 101 also changes, achieving precise adjustment.

[0035] In this embodiment, the wafer carrier 101 can accommodate wafers of a specific size to meet the processing requirements of the wafers. The supporting portion 102 passes through the bottom of the cavity and is connected to the lifting unit.

[0036] The lifting unit includes: a motor 201, which includes an output shaft; a screw 202, which is fixedly connected to the output shaft of the motor 201; a rotating member 203, which is located on the screw 202 and is used to rotate with the screw 202, and when the screw 202 rotates, the rotating member 203 moves in the vertical direction; a connecting seat 204, which is fixed to the rotating member 203 and is used to be fixedly connected to the supporting part 102.

[0037] The motor 201 serves as a power source, and the output shaft of the motor 201 is fixedly connected to the screw 202, so that the rotational force is transmitted from the output shaft to the screw 202. Through the interaction between the fine threads on the screw 202 and the rotating part 203, the rotational motion of the motor 201 can be converted into the vertical linear motion of the rotating part 203 on the screw 202. When the connecting seat 204 and the rotating part 203 are fixed, the connecting seat 204 also realizes vertical linear motion.

[0038] Specifically, the motor 201 includes a servo motor 201, and the lead screw 202 includes a ball screw 202. During operation, the servo motor 201 and the ball screw 202 cooperate to achieve low friction, high positioning accuracy, and fast linear motion response of the rotating member 203.

[0039] In this embodiment, the rotating member 203 includes: an internal thread (not shown in the figure), which is located inside the rotating member 203 and is used to be rotatably connected to the lead screw 202. Specifically, the thread in the rotating member 203 is a T-type internal thread. Compared with ordinary triangular threads, the T-type internal thread has a wider tooth shape and a larger tooth angle, so that the contact area of ​​the T-type thread is larger, which can better reduce stress concentration, so that the T-type thread can withstand higher axial loads, which is beneficial for high torque and heavy load applications. In addition, the T-type thread also has a self-locking function to prevent the thread from rotating due to load when the motor 201 is not working.

[0040] It should also be noted that the rotating member 203 includes a stepped surface located on its outer surface, which abuts the bottom of the connecting seat 204. The stepped surface of the rotating member 203 abuts the bottom of the connecting seat 204, thereby increasing the contact area between the rotating member 203 and the connecting seat 204 and achieving surface contact. This helps to improve the load stability between the rotating member 203 and the connecting seat 204, thereby ensuring more stable force transmission.

[0041] In this embodiment, the connecting seat 204 is fixedly connected to the rotating member 203. When the lifting unit is working, the vertical transmission of the rotating member 203 is transmitted to the connecting seat 204 under the condition that the connecting seat 204 and the rotating member 203 are fixedly combined, thereby pushing the supporting part 102 to rise and fall in the vertical direction.

[0042] Specifically, the connecting seat 204 is fixedly connected to the bottom of the supporting portion 102 , so that the connecting seat 204 and the supporting portion 102 move synchronously.

[0043] In this embodiment, the bottom of the connection base 204 is fixedly connected to the rotating member 203, and the top of the connection base 204 is fixedly connected to the bottom of the base 100. The connection base 204 is used to transmit the vertical displacement of the rotating member 203 to the bottom of the base 100. The connection base 204 becomes a key node for transmitting motion and bearing force, which helps to ensure the accuracy of wafer lifting.

[0044] As an example, the connecting seat 204 is provided with a through hole, and the through hole is used to be sleeved on the outer diameter of the rotating member 203 , and the bottom of the connecting seat 204 is fixedly connected to the step surface of the rotating member 203 .

[0045] The lifting unit further includes a coupling 205 fixedly connected to the output shaft of the motor 201, and a lead screw 202 fixedly connected to the coupling 205. The fixed connection between the coupling 205 and the output shaft of the motor 201, and the fixed connection between the lead screw 202 and the coupling 205, ensures that the rotational power provided by the motor 201 is stably transmitted to the lead screw 202, reducing mechanical errors during the power transmission process, facilitating improved precision in the ascent and descent of the rotating member 203, and enhancing the operating efficiency and stability of the entire lifting unit.

[0046] The adjusting device also includes: a linear guide rail 400 (such as Figure 5 ), the linear guide rail 400 is arranged in the vertical direction; a slider (not shown) is slidably arranged on the linear guide rail 400 and is fixed to the connecting base 204. The linear guide rail 400 is arranged in the vertical direction, providing a vertical guide path, restricting the slider from sliding smoothly in the vertical direction within the linear guide rail 400, thereby restricting the connecting base 204 from sliding smoothly in the vertical direction. This arrangement can effectively reduce the displacement of the connecting base 204 from the vertical direction due to mechanical vibration or operational error, thereby achieving precise vertical position control of the base 100.

[0047] The adjustment device also includes: an upper mechanical limit 401, which is arranged on the linear guide rail 400 and is used to limit the upper limit position of the connecting seat 204; a lower mechanical limit 402, which is arranged on the linear guide rail 400 and is located below the upper mechanical limit 401, and is used to limit the lower limit position of the connecting seat 204.

[0048] The upper and lower mechanical stops 401, 402 serve as safety features within the lifting unit, primarily defining the upper and lower limit positions of the connector 204 on the linear guide 400. This ensures that the connector 204 is positioned within a safe and predetermined operating range, preventing damage to the equipment or operational anomalies caused by the rotating member 203 exceeding its designed travel. Thus, the physical constraints provided by the upper and lower mechanical stops 401, 402 mitigate risks associated with exceeding the limit positions during operation of the lifting unit.

[0049] In this embodiment, the upper mechanical stop 401 and the lower mechanical stop 402 both include cylindrical protrusions. When the connecting base 204 moves to the upper mechanical stop 401 or the lower mechanical stop 402, the connecting base 204 abuts against the cylindrical protrusions, causing the connecting base 204 to stop moving.

[0050] It should be noted that both the upper mechanical stop 401 and the lower mechanical stop 402 are provided on the linear guide 400 and are located on the extension line of the motion trajectory of the connecting base 204, ensuring that the upper mechanical stop 401 and the lower mechanical stop 402 can prevent the movement of the connecting base 204. Specifically, the upper mechanical stop 401 is located at the end of the linear guide 400 close to the cavity; the lower mechanical stop 402 is located at the end of the linear guide 400 close to the motor 201.

[0051] The adjusting device also includes: an upper limit sensor 403, which is arranged on the moving path of the connecting seat 204 and is located below the upper mechanical limit 401; a lower limit sensor 404, which is arranged on the moving path of the connecting seat 204 and is located above the upper mechanical limit 401; a controller, which is connected to the upper limit sensor 403, the lower limit sensor 404 and the motor 201, and is used to stop the motor 201 from rotating when the connecting seat 204 passes through the upper limit sensor 403 or the lower limit sensor 404.

[0052] By providing an upper limit sensor 403 and a lower limit sensor 404 along the movement path of the connector 204, and located on different sides of the mechanical limit, when the connector 204 passes near the upper limit sensor 403 or the lower limit sensor 404, the upper limit sensor 403 or the lower limit sensor 404 can detect the connector 204, thereby sending a stop signal to the controller to stop the rotation of the motor 201. The controller controls the upper limit sensor 403 and the lower limit sensor 404 to ensure that the vertical movement of the wafer carrier 101 is strictly limited.

[0053] It should be noted that the upper mechanical limit 401 and the lower mechanical limit 402 are provided to physically block excessive movement of the connector 204. This is a passive safety measure used to prevent equipment damage when the electronic control fails. The upper limit sensor 403 and the lower limit sensor 404 provide an active safety control mechanism. When the connector 204 is detected passing by, a control signal is sent to the controller, causing the controller to decelerate and stop the movement of the motor 201 in a timely manner. This allows the connector 204 to stop moving before reaching the upper mechanical limit 401 and the lower mechanical limit 402, greatly reducing the impact and loss of the equipment caused by the collision of the connector 204 with the upper and lower limit limits.

[0054] The lifting unit also includes: a bearing seat 206, which is located between the rotating member 203 and the output end of the motor 201 in the vertical direction. A bearing is provided in the bearing seat 206, the inner ring of the bearing is fixed to the screw 202, and the outer ring of the bearing is fixed to the bearing seat 206.

[0055] The bearing seat 206 is arranged in the vertical direction between the output end of the motor 201 and the rotating part 203, wherein the bearing in the bearing seat 206 is fixedly connected to the screw 202 through its inner ring, and the outer ring is fixed to the bearing seat 206, effectively supporting the middle part of the screw 202 to prevent it from bending or vibrating during rotation, thereby providing necessary mechanical support and reducing friction when the screw 202 moves, which is conducive to maintaining the stability and processing accuracy of the wafer carrier.

[0056] In this embodiment, the horizontal unit is located at the bottom of the cavity, and the horizontal unit includes: a base 301, which is arranged at the bottom of the cavity, and the base 301 has a through hole for the supporting part 102 to pass through, and the through hole is in contact with the side wall of the supporting part 102; a plurality of leveling structures 302, which are arranged at intervals on the base 301, and the leveling structures 302 are in contact with the bottom of the cavity, for adjusting the horizontal position of the base 100.

[0057] The horizontal unit works in coordination with the base 301 and multiple leveling structures 302 to adjust the base 100 during wafer processing, thereby compensating for imbalances caused by installation or the environment, so that the wafer carrier 101 is in a horizontal position, and the vertical distance between each nozzle and the wafer carrier 101 is consistent, which is beneficial to improving the uniformity of thin film deposition when performing chemical vapor deposition or physical vapor deposition.

[0058] refer to Figure 6 and Figure 7 , which shows a schematic diagram of the horizontal unit adjusting the horizontal position of the base 100. Specifically, Figure 6 This is a cross-sectional view when the level is not adjusted. Figure 7 It is a cross-sectional view in a horizontal adjustment state. Specifically, the through hole of the base 301 is configured to allow the supporting portion 102 to pass through and is in close contact with the side wall of the supporting portion 102. The contact here provides a force point for radially adjusting the supporting portion 102. A plurality of leveling structures 302 are set on the base 301, and each leveling structure 302 is in direct contact with the bottom of the cavity. One or more leveling structures 302 change the distance between the base 301 and the bottom of the cavity, thereby changing the horizontal state of the base 301. Then, the through hole of the base 301 provides a radial force to the supporting portion 102 through contact with the side wall of the supporting portion 102, so that the supporting portion 102 deflects slightly relative to the connecting seat 204, so that the wafer carrier 101 above the supporting portion 102 is horizontal. It should be noted that, in this embodiment, it is considered that when the wafer carrier 101 is horizontal, the vertical distance between the wafer carrier 101 and each nozzle is consistent.

[0059] It should be noted that the bottom of the base 301 is fixedly connected to the linear guide 400. Because the base 301 is fixed to the cavity via the leveling structure 302, the linear guide 400 is fixed to the cavity via the fixed connection with the bottom of the base 301, thereby ensuring the stability of the guide during vertical movement and eliminating the guide deviation that may be caused by installation errors or external vibrations, thereby ensuring the accuracy of the adjustment device.

[0060] It should be noted that the leveling structure 302 is located at the edge of the base 301. The leveling structure 302 is set at the edge of the base 301 so that the adjustment force provided by the leveling structure 302 can be more evenly distributed over the entire area of ​​the base 301, which helps to fine-tune the tilt and horizontal state of the base 301.

[0061] As an example, the number of the leveling structures 302 is three. In other embodiments, the number of the leveling structures 302 can be more than three.

[0062] In this embodiment, the leveling structure 302 is arranged on the edge of the base 301, and the leveling structure 302 includes: a leveling screw 302a, which passes through the base 301 and abuts against the bottom of the cavity; a fixing nut 302b, which is rotatably set on the leveling screw 302a; and a fixing screw 302c, which is set on the leveling screw 302a.

[0063] During leveling, first loosen fixing nut 302b and fixing screw 302c to release the pre-fixed state. Because leveling screw 302a directly passes through base 301 and abuts the bottom of the cavity, rotating leveling screw 302a fine-tunes the distance between base 301 and the cavity bottom. By adjusting the distance between base 301 and the cavity bottom at multiple points, base 301 is kept horizontal. Fixing nut 302b and fixing screw 302c lock the position of leveling screw 302a after adjustment, ensuring the stability of the leveling state and preventing displacement or change during subsequent processing.

[0064] refer to Figure 4 The leveling unit also includes: scale lines 303 disposed on the surface of the base 301; and an indicator arrow 304 disposed on the leveling screw 302a. The scale lines 303 disposed on the surface of the base 301 provide a visual quantitative adjustment reference, enabling the operator to accurately read and adjust the position of the base 301. The indicator arrow 304, disposed on the leveling screw 302a, points directly to the scale lines 303, providing the operator with a clear indication of the current position of the leveling screw 302a. This configuration allows each adjustment step during the fine-tuning process to be accurately recorded and reproduced, ensuring the accuracy of the leveling operation and promoting user-friendliness.

[0065] As an example, on the scale lines 303 on the surface of the base 301 , each scale mark represents a certain physical displacement, for example, each scale mark represents a movement of 0.1 mm.

[0066] Combine Figures 1 to 4 ,refer to Figures 5 to 7 The present invention also provides a semiconductor device. The semiconductor device includes: a cavity 500; a base 100, wherein the base 100 includes: a wafer carrier 101 for being disposed in the cavity 500; a supporting portion 102 located at the bottom of the wafer carrier 101 and extending through the bottom of the cavity 500; an adjustment device including a lifting unit connected to the bottom of the supporting portion 102 for raising or lowering the wafer carrier 101; a leveling unit connected to the supporting portion 102 of the base 100 for adjusting the horizontal position of the wafer carrier 101; and a nozzle 600 located in the cavity 500 and disposed at the top of the cavity 500 for spraying gas toward the wafer carrier 101.

[0067] The adjustment device of the semiconductor equipment in the present invention is used to adjust the position of the wafer carrier 101 in the chamber 500 to adapt to different process requirements, especially when performing plasma etching and chemical vapor deposition, to ensure the uniformity and efficiency of the process. Specifically, the adjustment device includes a lifting unit and a horizontal unit, wherein the lifting unit is connected to the supporting portion 102 of the wafer carrier 101 through its bottom to achieve the rise or fall of the wafer carrier 101, so that the distance between the wafer carrier 101 and the nozzle 600 located at the top of the chamber 500 is adjusted according to the injection requirements of different gases, thereby optimizing the processing effect. The horizontal unit is connected to the supporting portion 102 of the base 100 and is responsible for adjusting the horizontal position of the wafer carrier 101. By precisely controlling the horizontal position of the wafer carrier 101, it is possible to ensure that the distance between the wafer surface and each nozzle 600 remains consistent during the processing process. In particular, in the case of tilt caused by the unevenness of the chamber 500 or the site itself, it can also be compensated by adjusting the horizontal unit to ensure the position accuracy of the wafer and the consistency of the injection effect during the processing. The coordinated work of the lifting unit and the horizontal unit not only improves the processing efficiency, but also significantly improves the process quality.

[0068] The cavity 500 provides a closed or semi-closed space, which can effectively isolate the external environment, protect the wafer from external contamination, and provide a reaction chamber for a vapor deposition process or a plasma etching process.

[0069] In this embodiment, the cavity 500 is equipped with a gas flow, pressure control and temperature control system to enable the internal environment of the cavity 500, such as gas pressure, gas composition and temperature, to be precisely controlled.

[0070] The wafer carrier 101 is a structure for supporting the wafer during processing, and is used to provide a stable support surface to ensure that the wafer is in a proper position during the process.

[0071] The supporting part 102 is located at the bottom of the wafer carrier plate 101, and it passes through the bottom of the cavity 500, so that the supporting part 102 can be connected to the adjustment device. When the adjustment device drives the height or horizontal position of the supporting part 102 to change, the height and horizontal position of the wafer carrier plate 101 also change accordingly to achieve precise adjustment.

[0072] In this embodiment, a radially extending connecting structure is provided at the bottom of the sidewall of the supporting portion 102, and the semiconductor structure further includes a bellows 700 vertically disposed between the connecting structure and the cavity 500. The bellows 700 serves as a sealing element and is vertically disposed between the connecting structure and the cavity 500. Thus, when the lifting unit adjusts the height of the wafer carrier 101, the bellows 700 can cope with the spatial changes caused by the movement of the base 100. This can avoid sealing failure caused by the movement of the base 100 and achieve the purpose of maintaining vacuum or air pressure control within the cavity 500.

[0073] Specifically, such as Figure 7 As shown, the bellows 700 includes a tube body 701, a first fixing member 702 located at the upper end of the tube body 701, and a second fixing member 703 located at the lower end of the tube body 701. The first fixing member 702 is fixedly connected to the bottom of the cavity 500, and the second fixing member 703 is fixedly connected to the connection structure at the bottom of the supporting portion 102.

[0074] In this embodiment, the supporting portion 102 passes through the bellows 700 , so that the bellows 700 can not only perform a sealing function but also allow the supporting portion 102 to be raised and lowered.

[0075] Specifically, the tube body 701 has annular corrugations and can be bent and stretched without affecting its inner diameter.

[0076] The nozzle 600 is disposed at the top of the cavity 500 to achieve uniform and controllable gas distribution, which helps the gas to evenly cover the entire wafer surface.

[0077] In this embodiment, there are multiple nozzles 600, each corresponding to the wafer carrier 101 in the chamber 500. The multiple nozzles 600 facilitate uniform reception of the gas ejected from the nozzles 600 across all regions of the wafer. The position of each nozzle 600 corresponds to a wafer on the wafer carrier 101, ensuring uniform distribution and effective application of the process gas.

[0078] Although the present invention is disclosed as above, it is not limited thereto. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope defined by the claims.

Claims

1. An adjusting device for adjusting the position of a base, characterized in that: The base includes: a wafer carrier plate, which is used to be arranged in the cavity; a supporting portion, which is located at the bottom of the wafer carrier plate and passes through the bottom of the cavity; The regulating device comprises: A lifting unit, the output end of which is used to connect to the bottom of the supporting portion, and is used to raise or lower the wafer carrier. The lifting unit includes: a motor, the motor including an output shaft; a screw fixedly connected to the output shaft of the motor; a rotating member located on the screw and used to rotate with the screw, and the rotating member moves in the vertical direction when the screw rotates; a connecting seat, fixed to the rotating member and used to be fixedly connected to the supporting portion; A horizontal unit is used to connect with the supporting part of the base and to adjust the horizontal position of the wafer carrier. The horizontal unit is located at the bottom of the cavity. The horizontal unit includes: a base, which is arranged at the bottom of the cavity, and the base has a through hole for the supporting part to pass through, and the through hole is in contact with the side wall of the supporting part; a plurality of leveling structures are arranged at intervals on the base, and the leveling structures abut against the bottom of the cavity to adjust the horizontal position of the base.

2. The adjustment device according to claim 1, characterized in that The rotating member comprises: a thread, located inside the rotating member and rotatably connected to the lead screw; The step surface is located on the outer surface of the rotating member, and the step surface abuts against the bottom of the connecting seat.

3. The adjustment device according to claim 1, characterized in that The regulating device further comprises: A linear guide rail, wherein the linear guide rail is arranged along the vertical direction; A slider is slidably arranged on the linear guide rail, and the slider is fixed to the connecting seat; The connecting seat is slidably arranged in the linear guide rail; The regulating device further comprises: An upper mechanical limiter is provided on the linear guide rail and is used to define the upper limit position of the connecting seat; a lower mechanical limiter is provided on the linear guide rail and is located below the upper mechanical limiter and is used to define the lower limit position of the connecting seat.

4. The adjustment device according to claim 3, characterized in that The upper mechanical limit and the lower mechanical limit both include protrusions.

5. The adjustment device according to claim 3, characterized in that The regulating device further comprises: An upper limit sensor is provided on the moving path of the connecting seat and is located below the upper mechanical limit; a lower limit sensor, arranged on the moving path of the connecting seat and located above the upper mechanical limit; The controller is connected to the upper limit sensor, the lower limit sensor and the motor, and is used to stop the motor from rotating when the connecting seat passes through the upper limit sensor or the lower limit sensor.

6. The adjustment device according to claim 1, characterized in that The lifting unit further comprises: The bearing seat is located between the rotating member and the output end of the motor in the vertical direction. A bearing is provided in the bearing seat. The inner ring of the bearing is fixed to the lead screw, and the outer ring of the bearing is fixed to the bearing seat.

7. The adjustment device according to claim 1, characterized in that The leveling structure is arranged at the edge of the base, and the leveling structure includes: a leveling screw passing through the base and abutting against the bottom of the cavity; Fix the nut and turn it to set it on the leveling screw; Fixing screw, set on the leveling screw.

8. The adjustment device according to claim 7, characterized in that The horizontal unit further includes: scale lines, provided on the surface of the base; An indicator arrow is provided on the leveling screw.

9. A semiconductor device, characterized in that: include: cavity; The base comprises: a wafer carrier plate, which is used to be arranged in the cavity; a supporting portion, which is located at the bottom of the wafer carrier plate and passes through the bottom of the cavity; The adjusting device according to any one of claims 1 to 8, comprising the lifting unit connected to the bottom of the supporting portion, for raising or lowering the wafer carrier; and comprising a horizontal unit connected to the supporting portion of the base, for adjusting the horizontal position of the wafer carrier; The nozzle is located in the cavity and is arranged on the top of the cavity, and is used for spraying gas toward the wafer carrier.

10. The semiconductor device according to claim 9, wherein The bottom of the side wall of the supporting portion is provided with a connecting structure extending in the radial direction; The semiconductor device further includes a bellows disposed vertically between the connection structure and the cavity.

Images