High-power IGBT parallel power module packaging structure

Abstract

The utility model relates to the technical field of high-power IGBT (Insulated Gate Bipolar Translator) parallel power module packaging, in particular to a high-power IGBT parallel power module packaging structure, which is provided with a fixing mechanism and a mounting mechanism, so that a certain individual damaged module can be conveniently disassembled and assembled in the packaging process of a high-power IGBT parallel power module, and the packaging efficiency of the high-power IGBT parallel power module is improved. Therefore, daily maintenance and replacement are facilitated; comprising a packaging mechanism; the packaging machine further comprises multiple sets of pressing mechanisms, multiple sets of fixing mechanisms and multiple sets of mounting mechanisms, the multiple sets of pressing mechanisms are installed on the packaging mechanism, the multiple sets of fixing mechanisms are installed on the packaging mechanism, and the multiple sets of mounting mechanisms are installed on the packaging mechanism. The packaging mechanism carries out packaging, the pressing mechanism carries out wire pressing, the fixing mechanism carries out fixing and quick dismounting, and the mounting mechanism carries out module mounting.

Description

Technical Field

[0001] The utility model relates to the technical field of high-power IGBT parallel power module packaging, in particular to a high-power IGBT parallel power module packaging structure. Background Art

[0002] IGBT parallel power module is an important technology in the field of power electronics, which is used to solve the problem that a single IGBT cannot meet higher power requirements.

[0003] In the existing high-power IGBT parallel power module packaging structure, for example, a high-power IGBT parallel power module packaging structure disclosed in the utility model patent application number 201220504969.9 can simply, conveniently and accurately realize the combined connection of the module top cover, shell and bottom plate. The design of the rounded corner structure in the shell can disperse the stress generated by the shell during the manufacturing process to a limited extent, effectively solving the pressure distribution and pressure balance problems of the module in the use environment. The design of the groove on the shell can place a pressure equalizing pad to play a role in balancing the pressure.

[0004] However, during the use of high-power IGBT parallel power module packaging, it is difficult to disassemble and assemble the module when it is damaged and needs to be repaired or replaced. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a high-power IGBT parallel power module packaging structure that is convenient for disassembling and assembling a single damaged module during the packaging process of the high-power IGBT parallel power module by setting a fixing mechanism and an installation mechanism, thereby facilitating daily maintenance and replacement.

[0006] The utility model discloses a high-power IGBT parallel power module packaging structure, comprising a packaging mechanism; further comprising multiple groups of pressing mechanisms, multiple groups of fixing mechanisms and multiple groups of mounting mechanisms, wherein the multiple groups of pressing mechanisms are mounted on the packaging mechanism, the multiple groups of fixing mechanisms are mounted on the packaging mechanism, and the multiple groups of mounting mechanisms are mounted on the packaging mechanism;

[0007] The packaging mechanism performs packaging, the pressing mechanism performs wire pressing, the fixing mechanism performs quick-release fixing, and the installation mechanism performs module installation; the module is installed by the installation mechanism, the installation mechanism is convenient for disassembly and assembly by the fixing mechanism, the module wiring harness is pressed by the pressing mechanism, and the module is packaged by the packaging mechanism, so that during the packaging process of the high-power IGBT parallel power module, a single damaged module can be conveniently disassembled and assembled, thereby facilitating daily maintenance and replacement.

[0008] Preferably, the packaging mechanism includes a bottom box and a cover plate, the cover plate is mounted on the upper end of the bottom box, and a plurality of arc grooves are provided on the bottom box; the bottom box is closed by the cover plate, and the wiring harness is guided by the arc grooves.

[0009] Preferably, the clamping mechanism includes a bridge block, which is slidably installed in arc groove 1, and arc groove 2 is provided on the bridge block; the wiring harness is clamped and limited by the bridge block cooperating with arc groove 2.

[0010] Preferably, the fixing mechanism includes two groups of slide blocks, clamping blocks, sliding columns and springs. The two groups of slide blocks are installed in the base box, the clamping blocks are rotatably installed in the base box, the sliding columns are slidably installed on the two groups of slide blocks, and the sliding columns are connected to the clamping blocks through springs; the sliding columns are tightened by the springs so that the clamping blocks fix the installation mechanism.

[0011] Preferably, the mounting mechanism includes a mounting plate and multiple groups of fixing holes. The mounting plate is placed in the bottom box, and the multiple groups of fixing holes are installed on the mounting plate; the module is fixed to the mounting plate through the fixing holes.

[0012] Compared with the prior art, the beneficial effects of the present invention are: the module is installed through the installation mechanism, the installation mechanism is facilitated to be disassembled and assembled through the fixing mechanism, the module wiring harness is compressed through the clamping mechanism, and the module is encapsulated through the encapsulation mechanism, so that during the packaging process of the high-power IGBT parallel power module, a single damaged module can be easily disassembled and assembled, thereby facilitating daily maintenance and replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is an axonometric structural diagram of the present utility model;

[0014] Figure 2 This is a front-view cross-sectional axonometric structural diagram of the present invention;

[0015] Figure 3 This is an axonometric enlarged structural diagram of the installation mechanism of the utility model;

[0016] Figure 4 This is an axonometric enlarged structural diagram of the clamping mechanism of the utility model;

[0017] Figure 5 The fixing mechanism of the utility model is Figure 2 A schematic diagram of the axonometric structure of the front section of the middle A part;

[0018] Markings in the accompanying drawings: 1. Packaging mechanism; 11. Base box; 12. Cover plate; 13. Arc groove 1; 2. Pressing mechanism; 21. Bridge block; 22. Arc groove 2; 3. Fixing mechanism; 31. Slide block; 32. Clamping block; 33. Slide column; 34. Spring; 4. Installation mechanism; 41. Installation plate; 42. Fixing hole. DETAILED DESCRIPTION

[0019] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention. Example

[0020] like Figures 1 to 5 As shown, a high-power IGBT parallel power module packaging structure includes a packaging mechanism 1, multiple sets of pressing mechanisms 2, multiple sets of fixing mechanisms 3 and multiple sets of mounting mechanisms 4. The multiple sets of pressing mechanisms 2 are installed on the packaging mechanism 1, the multiple sets of fixing mechanisms 3 are installed on the packaging mechanism 1, and the multiple sets of mounting mechanisms 4 are installed on the packaging mechanism 1;

[0021] The packaging mechanism 1 performs packaging, the pressing mechanism 2 performs line pressing, the fixing mechanism 3 performs fast fixing and disassembly, and the installation mechanism 4 installs the module;

[0022] The packaging mechanism 1 includes a bottom box 11 and a cover plate 12. The cover plate 12 is mounted on the upper end of the bottom box 11. The bottom box 11 is provided with a plurality of arc grooves 13.

[0023] The pressing mechanism 2 includes a bridge block 21, which is slidably mounted in the arc groove 13, and an arc groove 22 is provided on the bridge block 21;

[0024] The fixing mechanism 3 includes two sets of slide blocks 31, a clamping block 32, a slide post 33 and a spring 34. The two sets of slide blocks 31 are installed in the bottom box 11, the clamping block 32 is rotatably installed in the bottom box 11, and the slide post 33 is slidably installed on the two sets of slide blocks 31. The slide post 33 is connected to the clamping block 32 through the spring 34.

[0025] The mounting mechanism 4 includes a mounting plate 41 and a plurality of sets of fixing holes 42 . The mounting plate 41 is placed in the bottom box 11 , and the plurality of sets of fixing holes 42 are mounted on the mounting plate 41 .

[0026] The module is fixed to the mounting plate 41 through the fixing hole 42, the sliding column 33 is tightened by the spring 34 to fix the clamping block 32 to the mounting plate 41, the wiring harness is compressed and limited by the bridge block 21 and the arc groove 2 22, the bottom box 11 is closed by the cover plate 12, and the wiring harness is guided by the arc groove 1 13, so that during the packaging process of the high-power IGBT parallel power module, a single damaged module can be easily disassembled and assembled, thereby facilitating daily maintenance and replacement.

[0027] like Figures 1 to 5As shown, the utility model is a high-power IGBT parallel power module packaging structure. When working, the module is fixed on the mounting plate 41 through the fixing hole 42, the sliding column 33 is tightened by the spring 34 to fix the clamping block 32 to the mounting plate 41, the wiring harness is compressed and limited by the bridge block 21 and the arc groove 22, the bottom box 11 is closed by the cover plate 12, and the wiring harness is guided by the arc groove 13.

[0028] The main function achieved by the utility model is: during the high-power IGBT parallel power module packaging process, by setting a fixing mechanism and an installation mechanism, a single damaged module can be easily disassembled and assembled during the high-power IGBT parallel power module packaging process, thereby facilitating daily maintenance and replacement.

[0029] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A high-power IGBT parallel power module packaging structure, comprising a packaging mechanism (1); characterized in that: It also includes multiple sets of pressing mechanisms (2), multiple sets of fixing mechanisms (3) and multiple sets of mounting mechanisms (4), wherein the multiple sets of pressing mechanisms (2) are mounted on the packaging mechanism (1), the multiple sets of fixing mechanisms (3) are mounted on the packaging mechanism (1), and the multiple sets of mounting mechanisms (4) are mounted on the packaging mechanism (1); The packaging mechanism (1) performs packaging, the pressing mechanism (2) performs line pressing, the fixing mechanism (3) performs fast fixing and disassembly, and the installation mechanism (4) installs the module.

2. A high-power IGBT parallel power module packaging structure according to claim 1, characterized in that: The packaging mechanism (1) comprises a bottom box (11) and a cover plate (12), wherein the cover plate (12) is mounted on the upper end of the bottom box (11), and a plurality of arc grooves (13) are provided on the bottom box (11).

3. A high-power IGBT parallel power module packaging structure as claimed in claim 2, characterized in that: The pressing mechanism (2) comprises a bridge block (21), the bridge block (21) is slidably mounted in the first arc groove (13), and the bridge block (21) is provided with a second arc groove (22).

4. A high-power IGBT parallel power module packaging structure as claimed in claim 2, characterized in that: The fixing mechanism (3) comprises two sets of slide blocks (31), a clamping block (32), a slide post (33) and a spring (34). The two sets of slide blocks (31) are installed in the bottom box (11), the clamping block (32) is rotatably installed in the bottom box (11), the slide post (33) is slidably installed on the two sets of slide blocks (31), and the slide post (33) is connected to the clamping block (32) through the spring (34).

5. The high-power IGBT parallel power module packaging structure according to claim 2, characterized in that: The mounting mechanism (4) comprises a mounting plate (41) and a plurality of groups of fixing holes (42). The mounting plate (41) is placed in the bottom box (11), and the plurality of groups of fixing holes (42) are mounted on the mounting plate (41).

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