Ear clip type Bluetooth earphone antenna based on laser etching processing

Through laser engraving processing technology, the radiation components and electronic components of the Bluetooth headphone antenna are connected, and the circuit board is protected by buffer components, which solves the problem of large space and easy damage in the ear-clip Bluetooth headphones, and realizes the miniaturization and durability of the headphones.

CN223297037UActive Publication Date: 2025-09-02SHENZHEN MEES HI TECH CO LTD
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Patent Information

Application Number
CN202421836656.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-31
Publication Date
2025-09-02
Estimated Expiration
2034-07-31

AI Technical Summary

Technical Problem

The existing Bluetooth headset antenna takes up a large space in the ear clip Bluetooth headset, is cumbersome to assemble, and is susceptible to damage, and the existing technology has not effectively solved it.

Method used

The laser engraving processing technology is used to connect radiation components and electronic components to reduce circuits, and the circuit board is protected by buffer components. The radiation components and electronic components are connected through laser engraving circuits. The buffer components are set to reduce the circuit space occupied and protect the circuit board.

Benefits of technology

It realizes the miniaturized design and convenient assembly of ear clip Bluetooth headsets, while extending the service life of the headset and reducing the risk of circuit board damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an ear clip type Bluetooth earphone antenna based on laser etching processing, which comprises a circuit board and a circuit board, the circuit board is provided with a circuit assembly, the circuit assembly comprises a radiating element and an electronic part, the radiating element and the electronic part are both fixedly connected on the circuit board, the surface of the circuit board is provided with a laser etching circuit, the circuit board is provided with a mounting hole, and the mounting hole is provided with a mounting hole. A fixing rod is movably connected in the mounting hole, a fixing assembly is arranged at one end of the fixing rod and used for fixing the circuit board, a fixing plate is movably connected to the other end of the fixing rod, a buffer assembly is arranged on the fixing plate, a limiting plate is fixedly connected to the middle of the fixing rod, and the circuit board is located above the limiting plate. The Bluetooth headset has the advantages that various electronic parts are connected through the laser etching circuit, so that the number of circuits in the Bluetooth headset is reduced, the antenna is more convenient to assemble, the buffer assembly is arranged, the Bluetooth headset is prevented from falling off to cause damage to the circuit board, and the service life of the Bluetooth headset is prolonged.
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Description

Technical Field

[0001] The utility model belongs to the technical field of Bluetooth earphones, and in particular relates to an ear-clip type Bluetooth earphone antenna based on laser engraving processing. Background Art

[0002] Bluetooth headsets are popular among users due to their convenience and compactness, and their use is becoming increasingly widespread. However, using headsets for a long time can easily cause damage to the ears. You need to pay attention to the volume and usage time when using them. In addition, it is easy to lose hearing the sounds on the road when wearing headsets while walking or riding. For this reason, clip-on Bluetooth headsets came into being.

[0003] However, there are some problems with the existing technology: most of the existing Bluetooth headset antennas use wires to connect various components, and the earplugs of ear clip-on Bluetooth headsets are small and have little internal space. The wires take up too much internal space of the headset, which also makes the assembly of the Bluetooth headset antenna more complicated. Therefore, we propose an ear clip-on Bluetooth headset antenna based on laser engraving processing. Utility Model Content

[0004] In response to the problems existing in the existing technology, the purpose of this utility model is to provide an ear-clip type Bluetooth headset antenna based on laser engraving processing, which connects various electronic components through laser engraving circuits, thereby reducing the circuits in the Bluetooth headset and making the antenna assembly more convenient.

[0005] The utility model is implemented as follows: an ear-clip type Bluetooth headset antenna based on laser engraving processing includes a circuit board, a circuit component is arranged on the circuit board, a mounting hole is opened on the circuit board, a fixing rod is movably connected in the mounting hole, a fixing component is arranged at one end of the fixing rod, the fixing component is used to fix the circuit board, the other end of the fixing rod is movably connected to a fixing plate, a buffer component is arranged on the fixing plate, a limit plate is fixedly connected to the middle of the fixing rod, and the circuit board is located above the limit plate.

[0006] Optionally, the circuit assembly includes a radiation element and an electronic component, and the radiation element and the electronic component are fixedly connected to a circuit board. A laser engraved circuit is provided on the surface of the circuit board, and the laser engraved circuit is used to connect the radiation element and the electronic component.

[0007] Optionally, the fixing assembly includes a clamping block, the upper end of the clamping block is fixedly connected to a rotating shaft, a groove is opened on the side of the fixing rod, and the clamping block is rotatably connected in the groove through the rotating shaft.

[0008] Optionally, the clamping block is triangular in shape, and a first spring is fixedly connected to one side of the clamping block, and the first spring is fixedly connected to the groove of the fixing rod.

[0009] Optionally, the buffer assembly includes a buffer column, which is fixedly connected to the upper end of the fixed plate, the upper end of the buffer column is open, the inner wall of the buffer column is fixedly connected to a second spring, the second spring is fixedly connected to a buffer block, and the buffer block is fixedly connected to the fixed rod.

[0010] Optionally, a wire hole is opened in the middle of the fixing plate, and the wire hole is used to connect external lines.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] 1. The utility model connects the radiation element and various electronic components through laser engraving circuits, reducing internal circuits, making the assembly of Bluetooth headset antenna more convenient, while reducing the internal space occupied by the headset, making the headset more compact.

[0013] 2. The utility model is provided with a buffer component. When the Bluetooth headset falls, the second spring in the buffer component will buffer the circuit board, reducing the impact force on the circuit board to protect the antenna from damage and extend the service life of the Bluetooth headset.

[0014] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram provided by the utility model;

[0016] Figure 2 This is a schematic diagram of a circuit board provided by the utility model;

[0017] Figure 3 It is a schematic diagram of the fixing plate provided by the utility model;

[0018] Figure 4 This is a cross-sectional view of the buffer column provided by the utility model;

[0019] Figure 5 This is a cross-sectional view of the fixing rod provided by the utility model;

[0020] Figure 6 The utility model provides Figure 5 A magnified schematic diagram of .

[0021] In the figure: 1. Circuit board; 2. Circuit assembly; 201. Radiating element; 202. Electronic component; 203. Laser engraved circuit; 3. Fixing assembly; 301. Block; 302. Rotating shaft; 303. First spring; 4. Fixing plate; 5. Buffer assembly; 501. Buffer column; 502. Second spring; 503. Buffer block; 6. Limiting plate; 7. Wire hole; 8. Fixing rod. DETAILED DESCRIPTION

[0022] In order to further understand the content, features and effects of the present invention, the following embodiments are given as examples and described in detail with reference to the accompanying drawings.

[0023] like Figures 1 to 6 As shown, an embodiment of the present invention provides an ear-clip type Bluetooth headset antenna based on laser engraving processing, including a circuit board 1, which is circular and made of plastic material. The main function of the circuit board 1 is to fix various parts.

[0024] A circuit assembly 2 is provided on the circuit board 1. The circuit assembly 2 includes a radiation element 201 and an electronic component 202. The radiation element 201 and the electronic component 202 are fixedly connected to the circuit board 1. A laser engraved circuit 203 is provided on the surface of the circuit board 1. The laser engraved circuit 203 is used to connect the radiation element 201 and the electronic component 202.

[0025] The radiating element 201 is the main part of the antenna, responsible for transmitting and receiving electromagnetic waves. The radiating element 201 can be linear (such as a dipole antenna) or planar (such as a patch antenna). The specific shape and size depend on the required operating frequency and the design requirements of the antenna. The electronic component 202 is used to process various signals. The radiating element 201 and the electronic component 202 are directly fixed on the circuit board 1 and then connected through the laser-engraved circuit 203, which greatly reduces the use of wires and reduces the demand for internal space in the headphones.

[0026] A mounting hole is provided on the circuit board 1, and a fixing rod 8 is movably connected in the mounting hole. A fixing component 3 is provided at one end of the fixing rod 8. The fixing component 3 is used to fix the circuit board 1. The fixing component 3 includes a clamping block 301. The upper end of the clamping block 301 is fixedly connected to a rotating shaft 302. A groove is provided on the side of the fixing rod 8. The clamping block 301 is rotatably connected in the groove through the rotating shaft 302. The clamping block 301 is triangular in shape. A first spring 303 is fixedly connected to one side of the clamping block 301. The first spring 303 is fixedly connected to the groove of the fixing rod 8. A limiting plate 6 is also fixedly connected to the middle of the fixing rod 8, and the circuit board 1 is located above the limiting plate 6.

[0027] After aligning the mounting holes on the circuit board 1 with the fixing rod 8, press the circuit board 1 downward, and the circuit board 1 will apply a thrust to the clamping block 301, causing the clamping block 301 to compress the first spring 303 and retract into the fixing rod 8. When the circuit board 1 moves to the limit plate 6, it can no longer move downward. At this time, the clamping block 301 is no longer subject to the thrust of the circuit board 1, and is thus moved outward by the rebound force of the first spring 303, thereby fixing the circuit board 1 on the fixing rod 8.

[0028] The other end of the fixed rod 8 is movably connected to the fixed plate 4, and a buffer assembly 5 is provided on the fixed plate 4. The buffer assembly 5 includes a buffer column 501, which is fixedly connected to the upper end of the fixed plate 4. The upper end of the buffer column 501 is open, and the inner wall of the buffer column 501 is fixedly connected to the second spring 502, and the second spring 502 is fixedly connected to the buffer block 503, and the buffer block 503 is fixedly connected to the fixed rod 8.

[0029] When the Bluetooth headset falls, the circuit board 1 will be subjected to the impact force, causing the circuit board 1 to move, thereby driving the fixing rod 8 to move, and the fixing rod 8 then drives the buffer block 503 to move. The buffer block 503 will compress the second spring 502, so that the second spring 502 will offset the impact force, thereby protecting the circuit board 1 from damage and extending the service life of the Bluetooth headset.

[0030] A wire hole 7 is provided in the middle of the fixing plate 4 and is used for connecting external circuits.

[0031] The working principle of this utility model is as follows:

[0032] The utility model reduces the space occupied by the circuit inside the Bluetooth headset by fixing the radiation element 201 and the electronic component 202 on the circuit board 1, and then setting a laser engraved circuit 203 on the circuit board 1 to connect the radiation element 201 and the electronic component 202. At the same time, a buffer component 5 is set on the support structure of the antenna. When the Bluetooth headset falls and is impacted, the second spring 502 can offset the impact force, thereby avoiding damage to the circuit board 1 caused by the impact force and extending the service life of the Bluetooth headset.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An ear clip type Bluetooth headset antenna based on laser engraving, comprising a circuit board (1), characterized in that: The circuit board (1) is provided with a circuit assembly (2), a mounting hole is provided on the circuit board (1), a fixing rod (8) is movably connected in the mounting hole, a fixing assembly (3) is provided at one end of the fixing rod (8), the fixing assembly (3) is used to fix the circuit board (1), the other end of the fixing rod (8) is movably connected to a fixing plate (4), a buffer assembly (5) is provided on the fixing plate (4), the middle part of the fixing rod (8) is fixedly connected to a limiting plate (6), and the circuit board (1) is located above the limiting plate (6).

2. The ear clip type Bluetooth headset antenna based on laser engraving according to claim 1, characterized in that: The circuit assembly (2) comprises a radiation element (201) and an electronic component (202); the radiation element (201) and the electronic component (202) are both fixedly connected to a circuit board (1); a laser engraving circuit (203) is provided on the surface of the circuit board (1); the laser engraving circuit (203) is used to connect the radiation element (201) and the electronic component (202).

3. The ear clip type Bluetooth headset antenna based on laser engraving according to claim 1, characterized in that: The fixing assembly (3) comprises a clamping block (301), the upper end of the clamping block (301) is fixedly connected to a rotating shaft (302), a groove is provided on the side of the fixing rod (8), and the clamping block (301) is rotatably connected in the groove via the rotating shaft (302).

4. The ear clip type Bluetooth headset antenna based on laser engraving processing according to claim 3, characterized in that: The clamping block (301) is triangular in shape, and a first spring (303) is fixedly connected to one side of the clamping block (301), and the first spring (303) is fixedly connected in a groove of the fixing rod (8).

5. The ear clip type Bluetooth headset antenna based on laser engraving according to claim 1, characterized in that: The buffer assembly (5) comprises a buffer column (501), the buffer column (501) is fixedly connected to the upper end of the fixed plate (4), the upper end of the buffer column (501) is open, the inner wall of the buffer column (501) is fixedly connected to a second spring (502), the second spring (502) is fixedly connected to a buffer block (503), and the buffer block (503) is fixedly connected to the fixed rod (8).

6. The ear clip type Bluetooth headset antenna based on laser engraving according to claim 1, characterized in that: A wire hole (7) is provided in the middle of the fixing plate (4), and the wire hole (7) is used for connecting an external circuit.