Laser assembly

Abstract

The utility model relates to the technical field of optical communication, and provides a laser assembly, which comprises a laser chip, a tube socket, a light splitting structure used for splitting laser emitted by the laser chip into multiple paths of light, and a photoelectric detector chip used for receiving one path of light, the laser chip, the light splitting structure and the photoelectric detector chip are sequentially arranged, and the laser chip, the light splitting structure and the photoelectric detector chip are arranged on the tube base. According to the laser assembly of the utility model, one path of laser emitted by the laser chip is split to the photoelectric detector chip through the light splitting structure, so that the real-time monitoring of the optical power in the tube socket can be realized, and compared with the traditional mode that a peripheral module carries out monitoring and then carries out current control adjustment, the structure is simplified, and the cost is reduced. And the monitoring stability is improved, and the monitoring cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communications, in particular to a laser component. Background Art

[0002] Traditional laser components are generally packaged in a TO (Transistor Outline) format, which features a simple structure and low cost. For high-power laser chips that only emit light in the forward direction, the package assembly consists of a socket, a cap, a laser chip, and a heat sink. The laser beam is output directly through an optical window, and the assembly cannot monitor the optical power in real time. It can only be used under fixed operating current conditions. If the laser component power changes, it cannot be adjusted accordingly. For applications that require precise control of the laser output power, a peripheral module is required for monitoring and then current control and adjustment. This complicates the structure, reduces stability, and increases cost. Furthermore, traditional laser components are also unable to control the temperature of the laser chip. Due to the characteristics of the laser chip, it varies greatly with the application environment temperature. The optimal operating environment temperature is room temperature, so it is not suitable for extreme operating environment temperature conditions. Utility Model Content

[0003] The purpose of the present invention is to provide a laser assembly that can at least solve some of the defects in the prior art.

[0004] To achieve the above-mentioned purpose, an embodiment of the present invention provides the following technical solution: a laser assembly, comprising a laser chip and a tube holder, and also comprising a splitting structure for splitting the laser emitted by the laser chip into multiple light paths and a photodetector chip for receiving one of the light paths, wherein the laser chip, the splitting structure and the photodetector chip are arranged in sequence, and the laser chip, the splitting structure and the photodetector chip are arranged on the tube holder.

[0005] Furthermore, another path of light is emitted from the top surface of the light splitting structure, and this path of light is perpendicular to the laser light emitted by the laser chip.

[0006] Furthermore, the spectroscopic structure is in the shape of a quadrangular pyramid, and one of the relative inclined surfaces of the spectroscopic structure is arranged between the laser chip and the photodetector chip. A portion of the laser light emitted by the laser chip is reflected by the inclined surface close to the laser chip and another portion of the laser light is transmitted through the inclined surface close to the laser chip. The laser light transmitted through the inclined surface close to the laser chip is then transmitted through the inclined surface close to the photodetector chip and is emitted to the photodetector chip.

[0007] Furthermore, the reflectivity of the inclined surface close to the laser chip is between 93% and 97%, and the transmittance is between 7% and 3%.

[0008] Furthermore, the inclined surface close to the laser chip is an inclined surface with an angle of 43° to 47°, and the inclined surface close to the photodetector chip is an inclined surface with an angle of 78° to 82°.

[0009] Furthermore, the light splitting structure is a light splitting prism, and the refractive index of the light splitting prism is between 1.48 and 1.54.

[0010] Furthermore, it also includes a temperature adjustment control unit for adjusting the working environment temperature of the laser chip.

[0011] Furthermore, the tube seat is also provided with a positive electrode pad and a negative electrode pad of the laser chip, and the laser chip is electrically connected to the positive electrode pad and the negative electrode pad via connecting wires.

[0012] Furthermore, the tube seat is also provided with a positive electrode pad and a negative electrode pad of a photodetector chip, and the photodetector chip is electrically connected to the positive electrode pad and the negative electrode pad via connecting wires.

[0013] Furthermore, it also includes a tube cap for covering the tube base, and the tube cap has a light outlet for emitting another light.

[0014] Compared with the existing technology, the beneficial effect of the present invention is: a laser component, which uses a splitter structure to split the laser emitted by the laser chip into a path of light to the photodetector chip, so that real-time monitoring of the optical power can be achieved in the tube holder. Compared with the traditional method of monitoring with a peripheral module and then controlling and adjusting the current, it not only simplifies the structure, but also improves the monitoring stability and reduces the monitoring cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic diagram of the structure of a traditional laser assembly;

[0016] Figure 2 for Figure 1 Schematic diagram of the internal structure;

[0017] Figure 3 A schematic structural diagram of a laser assembly provided in an embodiment of the present utility model;

[0018] Figure 4 A schematic diagram of the pin layout of a laser assembly provided in an embodiment of the present utility model;

[0019] Figure 5 A schematic diagram of the internal structure of a laser assembly provided in an embodiment of the present utility model;

[0020] Figure 6 for Figure 5 Schematic diagram of a bird's-eye view;

[0021] Figure 7 A schematic diagram of the optical path of a laser assembly provided in an embodiment of the present utility model;

[0022] In the accompanying drawings:

[0023] 101-tube base; 102-tube cap; 103-laser chip; 104-heat sink; 105-negative electrode pin; 106-positive electrode pin; 107-gold wire;

[0024] 201-tube base; 202-tube cap; 203-heat sink; 204-laser chip; 205-photodetector chip; 206-spectrometric structure; 207-thermistor; 208-substrate; 209-semiconductor cooler; 210-negative pin of thermistor; 211-positive pin of thermistor; 212-negative pin of the laser chip; 213-positive pin of the laser chip; 214-positive pin of the photodetector; 215-negative pin of the photodetector; 216-positive pin of the semiconductor cooler; 217-negative pin of the semiconductor cooler; 218-soldering pad of the thermistor; 219-negative soldering pad of the substrate; 220-positive soldering pad of the substrate; 221-positive soldering pad of the photodetector chip; 222-negative soldering pad of the photodetector chip; 301-first inclined plane; 302-second inclined plane. DETAILED DESCRIPTION

[0025] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] See also Figures 3 to 7, an embodiment of the utility model provides a laser component, including a laser chip 204, a splitting structure 206 for splitting the laser emitted by the laser chip 204 into multiple paths of light, and a photodetector chip 205 for receiving one of the paths of light, wherein the laser chip 204, the splitting structure 206 and the photodetector chip 205 are arranged in sequence. In this embodiment, the laser emitted by the laser chip 204 is split into one path of light to the photodetector chip 205 through the splitting structure 206, so that real-time monitoring of the optical power can be achieved within the tube seat 201. Compared with the traditional method of monitoring by a peripheral module and then performing current control and adjustment, it simplifies the structure, improves the monitoring stability, and reduces the monitoring cost. Specifically, the TO-packaged laser component shown in this embodiment has made great changes in structure compared to the existing TO-packaged laser components, and the internal design structure is completely different. Existing laser components such as Figure 1 and Figure 2As shown, it consists of a tube base 101, a tube cap 102, a laser chip 103 and a heat sink 104. The laser chip 103 and the heat sink 104 are mounted on the vertical surface of the tube base by eutectic welding. The direction of the laser beam is the same as that of the tube cap 102, and the laser beam is output directly through the tube cap. The tube base of a traditional laser component is provided with three pins, one of which is a ground pin, and the other two on the left and right are the laser positive pin 106 and the negative pin 105. The laser chip 103 is connected to the positive pin 106 and the negative pin 105 by gold wire. For this existing laser component, it is impossible to monitor the optical power in real time and can only be used under fixed operating current conditions. If the power of the laser component changes, it cannot be adjusted accordingly. For applications that require precise control of the laser output power, an external module is required for monitoring and then current control and adjustment. This makes the structure complicated, the stability will deteriorate, and the cost is also high. Therefore, to address this technical problem, this embodiment significantly alters the internal structure of the laser assembly. First, a beam splitter structure 206 and a photodetector chip 205 are introduced. These are positioned sequentially with the laser chip 204 along one of the optical paths. The beam splitter structure 206 can split the laser light emitted by the laser chip 204 into multiple light paths. This embodiment illustrates two light paths: one path can be emitted from the top surface of the beam splitter structure 206 as laser output, perpendicular to the laser light emitted by the laser chip 204. The other path transmits through the beam splitter structure 206 and reaches the photodetector chip 205, enabling real-time monitoring of optical power. This embodiment not only cleverly designs the beam splitter structure 206 to split light into multiple paths to achieve different functions, but also reconfigures the positional relationship between the laser chip 204, the beam splitter structure 206, and the photodetector chip 205 on the base 201, making the entire laser assembly both compact and capable of achieving multiple functions. This laser assembly is particularly designed for packaging a high-power laser chip 204 that only emits light in the forward direction. Compared to traditional laser assemblies, the entire assembly still belongs to the TO package form.

[0027] See also Figure 5 、 Figure 6 and Figure 7, the light splitting structure 206 is in the shape of a quadrangular pyramid, and one of the relative inclined surfaces of the light splitting structure 206 is arranged between the laser chip 204 and the photodetector chip 205. A part of the laser light emitted by the laser chip 204 is reflected by the inclined surface close to the laser chip 204 and another part of the laser light is transmitted through the inclined surface close to the laser chip 204. The laser light transmitted through the inclined surface close to the laser chip 204 is then transmitted through the inclined surface close to the photodetector chip 205 and is emitted to the photodetector chip 205. In this embodiment, the shape of the light splitting structure 206 is a quadrangular pyramid, and for the quadrangular pyramid, one of the relative inclined surfaces is arranged between the laser chip 204 and the photodetector chip 205. For the convenience of description, the inclined surface close to the laser chip 204 is defined as the first inclined surface 301, and the inclined surface close to the photodetector chip 205 is defined as the second inclined surface 302. As Figure 7 As shown, after the laser light emitted by the laser chip 204 passes through the first bevel 301, a portion is reflected and output as laser light, while the remaining portion transmits through the spectrometer structure 206 and out through the second bevel 302, where it is received by the photodetector chip 205. Reflection and transmission can be achieved by simply designing the reflectivity and transmittance of the first bevel 301 and the second bevel 302. Preferably, the reflectivity of the bevel near the laser chip 204 is between 93% and 97%, and the transmittance is between 7% and 3%. Preferably, the reflectivity of the first bevel 301 is 95% and the transmittance is 5%, which can be used to coat the first bevel 301. The second bevel 302 is coated with an antireflection coating, preferably with a transmittance greater than 98%. Preferably, the spectrometer structure 206 is located in the center of the tube base 201, aligned with the light output waveguide of the laser chip 204. The laser chip 204, the spectrometer structure 206, and the photodetector chip 205 are located on the central axis of the tube base 201.

[0028] To further optimize the above solution, please refer to Figure 7 The inclined surface close to the laser chip 204 is inclined at a degree between 43° and 47°, and the inclined surface close to the photodetector chip 205 is inclined at a degree between 78° and 82°. In this embodiment, the first inclined surface 301 is preferably inclined at a degree of 45°, with an included angle α, and the second inclined surface 302 is preferably inclined at a degree of 80°, with an included angle β.

[0029] To further optimize the above solution, please refer to Figure 5 and Figure 7 The light splitting structure 206 is a light splitting prism, and the refractive index of the light splitting prism is between 1.48 and 1.54. Preferably, the refractive index of the light splitting prism is 1.51.

[0030] See also Figures 3 to 7The tube base 201 is also provided with positive and negative electrode pads for the laser chip 204, which are electrically connected to the positive and negative electrode pads via connecting wires. The tube base 201 is also provided with positive and negative electrode pads for the photodetector chip 205, which are electrically connected to the positive and negative electrode pads via connecting wires. In this embodiment, the connecting wires are gold wires. The number of gold wire bonds is not limited, but preferably 3 to 5.

[0031] See also Figures 3 to 7 The assembly further includes a cap 202 for covering the tube base 201. The cap 202 has a light outlet for emitting another path of light. In this embodiment, the top of the cap 202 is provided with a light outlet, which is provided with a window or lens for emitting the vertical light split by the light splitting structure 206, thereby achieving laser output.

[0032] See also Figures 3 to 7 This assembly also includes a temperature control unit for adjusting the operating environment temperature of the laser chip 204. In this embodiment, the temperature control unit allows for real-time adjustment of the operating environment temperature, resolving the problem that conventional laser assemblies cannot control the temperature of the laser chip 204 and are not suitable for extreme ambient temperatures.

[0033] As an optimization solution of the embodiment of the utility model, please refer to FIG. Figures 3 to 7 The tube base 201 is also provided with a temperature monitoring component for monitoring the operating environment temperature of the laser chip 204. In this embodiment, the temperature monitoring component can monitor the operating environment temperature of the laser chip 204 in real time. The monitored temperature can be fed back to the temperature control component, which can adjust the operating environment temperature based on the monitored temperature.

[0034] For details on the temperature monitoring components mentioned above, please refer to Figure Figures 3 to 7 , which can use a thermistor 207, which is located on one side of the laser chip 204. In this embodiment, the thermistor 207 is located next to the laser chip 204. When the laser chip 204 is operating, it generates heat, which can be sensed by the thermistor 207. The temperature control unit can make adjustments after receiving feedback from the thermistor 207. The adjustment here is not limited to lowering the temperature. When certain operating conditions require increasing the temperature to meet the operating conditions of the laser chip 204, corresponding components can also be used to increase the temperature. Of course, in addition to using the thermistor 207 to sense temperature, other existing temperature sensors can also be used, and this embodiment does not limit this.

[0035] To refine the above temperature adjustment control, please refer to Figure Figures 3 to 7The temperature control unit includes a semiconductor cooler 209. The laser chip 204 is located on one side of the cold surface of the semiconductor cooler 209. The hot surface of the semiconductor cooler 209 is located on the tube base 201. The temperature monitoring unit is electrically connected to the semiconductor cooler 209. In this embodiment, the temperature control method can be implemented using the semiconductor cooler 209. The semiconductor cooler 209 can adjust the operating environment temperature of the laser chip 204 to stabilize it at an appropriate temperature, thereby achieving temperature control of the laser chip 204 and effectively improving the maximum operating environment temperature range of the laser component. Preferably, the semiconductor cooling capacity parameter is 1.5W, and the extreme operating ambient temperature range can be as high as 85°C and as low as -40°C. When the ambient temperature is 85°C, the semiconductor cooler 209 cools the laser chip 204 to a lower temperature, such as 45°C, which can effectively reduce the impact of the high temperature environment on the characteristics of the laser chip 204. Similarly, when the ambient temperature is -40°C, the semiconductor cooler 209 can reversely apply power to heat the laser chip 204 to increase the temperature, which can also reduce the impact of the low temperature environment on the characteristics of the laser chip 204. Preferably, the power of the laser chip 204 is 70mW, and the saturation power of the photodetector is 3mW.

[0036] To further optimize the above solution, please refer to Figures 3 to 7A heat sink 203 is provided on one side of the cold surface of the semiconductor cooler 209, and the laser chip 204 is mounted on the heat sink 203. A substrate 208 is also provided between the cold surface and the heat sink 203. The substrate 208 and the heat sink 203 are made of the same material. Both the substrate 208 and the heat sink 203 are made of aluminum nitride, which has a thermal conductivity of 150 to 190 W / m·K. An AuSn solder layer is provided on the heat sink 203 for eutectic bonding with the laser chip 204. In this embodiment, the hot surface of the semiconductor cooler 209 is attached to the tube base 201 using conductive silver glue. The substrate 208 is also attached to the cold surface of the semiconductor cooler 209 using conductive silver glue. The beam splitter, the photodetector chip 205, and the thermistor 207 are also attached to the substrate 208 using conductive silver glue. The laser chip 204 is first attached to the heat sink 203 using eutectic soldering, and the heat sink 203 is then attached to the substrate 208 using conductive silver glue. The laser chip 204 is eutectically bonded to the heat sink 203 using a eutectic soldering process. The upper surface of the heat sink 203 is pre-patterned with a gold-tin solder pattern that matches the size of the laser chip 204. The substrate 208 is provided with mounting areas for the photodetector chip 205, the thermistor 207, and the beam splitter, as well as areas for positive and negative electrode pad patterns. Preferably, the substrate 208 is provided with a mounting area for the photodetector chip 205, the thermistor 207, the beam splitter prism 206, the laser chip 204 and the heat sink 203, as well as a positive and negative electrode pad pattern area of ​​each component, specifically a thermistor pad 218, a positive electrode pad 220 and a negative electrode pad 219 of the laser chip 204, and a positive electrode pad 221 and a negative electrode pad 222 of the photodetector chip 205; the laser chip 204, the photodetector chip 205 and the thermistor 207 are electrically connected to the corresponding positive and negative electrode pad pattern areas on the substrate 208 through a gold wire bonding process, and the semiconductor cooler 209 and the substrate 208 pads are electrically connected to the tube seat 201 through a gold wire bonding process. The corresponding pins are electrically connected. Specifically, the back of the laser chip 204 is the negative electrode, which has been connected to the negative electrode pad corresponding to the heat sink through eutectic welding. It needs to be connected to the corresponding negative electrode pad 219 on the substrate 208, with 3-5 gold wire bondings. The front of the laser chip 204 is the positive electrode pad, which is connected to the corresponding positive electrode pad 220 on the substrate 208, with 3-5 gold wire bondings. Then, the laser negative electrode pad 219 on the substrate 208 is connected to the laser negative electrode pin 212 corresponding to the tube holder 201, and the positive electrode pad 220 on the substrate 208 is connected to the laser positive electrode pin 213 corresponding to the tube holder 201, with 3 gold wire bondings. Other components are connected by gold wire bonding in the same way.

[0037] See also Figures 3 to 7The temperature monitoring component, temperature control component, laser chip 204, and photodetector chip 205 each have two pins, each extending through the tube base and away from the tube base. In this embodiment, compared to the three pins of a traditional laser assembly, this structure has eight pins, a completely different structure. Preferably, the tube base 201 is provided with eight pins: the positive and negative pins 213 and 212 of the laser chip, the positive and negative pins 216 and 217 of the semiconductor cooler, the positive and negative pins 211 and 210 of the thermistor, and the positive and negative pins 214 and 215 of the photodetector. These pins are distributed in the center area and have varying lengths. The number and location of the pins are adapted to the packaging structure. If only the function of monitoring optical power modulation is implemented, only four pins are required, corresponding to the positive and negative terminals of the laser and the positive and negative terminals of the photodetector. The tube cap 202 is sealed and secured to the tube base 201 using a resistance welding process.

[0038] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A laser assembly comprising a laser chip and a base, characterized in that: It also includes a splitting structure for splitting the laser emitted by the laser chip into multiple light paths and a photodetector chip for receiving one of the light paths. The laser chip, the splitting structure and the photodetector chip are arranged in sequence, and the laser chip, the splitting structure and the photodetector chip are arranged on the tube seat.

2. A laser assembly according to claim 1, characterized in that: Another path of light is emitted from the top surface of the light splitting structure, and this path of light is perpendicular to the laser light emitted by the laser chip.

3. A laser assembly according to claim 1, characterized in that: The spectroscopic structure is in the shape of a quadrangular pyramid, and one of the opposing inclined surfaces of the spectroscopic structure is arranged between the laser chip and the photodetector chip. A portion of the laser light emitted by the laser chip is reflected by the inclined surface close to the laser chip, and another portion of the laser light is transmitted through the inclined surface close to the laser chip. The laser light transmitted through the inclined surface close to the laser chip is then transmitted through the inclined surface close to the photodetector chip and is emitted to the photodetector chip.

4. A laser assembly according to claim 3, characterized in that: The reflectivity of the inclined surface close to the laser chip is between 93% and 97%, and the transmittance is between 7% and 3%.

5. A laser assembly according to claim 3, characterized in that: The inclined surface close to the laser chip is an inclined surface with an angle of 43° to 47°, and the inclined surface close to the photodetector chip is an inclined surface with an angle of 78° to 82°.

6. A laser assembly according to claim 3, characterized in that: The light splitting structure is a light splitting prism, and the refractive index of the light splitting prism is between 1.48 and 1.

54.

7. A laser assembly according to claim 1, characterized in that: It also includes a temperature adjustment control for adjusting the working environment temperature of the laser chip.

8. The laser assembly according to claim 1, wherein: The tube seat is also provided with a positive electrode pad and a negative electrode pad of the laser chip, and the laser chip is electrically connected to the positive electrode pad and the negative electrode pad through connecting wires.

9. The laser assembly according to claim 1, wherein: The tube seat is also provided with a positive electrode pad and a negative electrode pad of a photodetector chip, and the photodetector chip is electrically connected to the positive electrode pad and the negative electrode pad via connecting wires.

10. The laser assembly according to claim 1, wherein: It also includes a tube cap for covering the tube base, and the tube cap has a light outlet for emitting another light.

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