Circuit board pressing and typesetting structure
By using the structural design of the bearing disc, cover body, circuit board unit, first and second pressure equalization plate during the circuit board pressing process, the problem of warping of the circuit board during the circuit board pressing process is solved, and the flatness of the circuit board and the reliability of assembly are achieved.
Patent Information
- Application Number
- CN202422487481.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-10-15
AI Technical Summary
The circuit board is prone to unexpected bending deformation during the pressing process, resulting in uneven board surfaces and affecting electronic manufacturing and assembly.
The structural design of the bearing disk, cover body, circuit board unit, first pressure equalization plate and second pressure equalization plate is adopted. By uniformly applying pressure and heat, the flatness of each layer of the circuit board is ensured and warping is avoided.
Effectively avoid the circuit board warping during the pressing process, ensuring the smooth progress of electronic manufacturing and assembly.
Smart Images
Figure CN223297805U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of printed circuit boards, and in particular to a circuit board pressing and layout structure. Background Art
[0002] During the production of circuit boards, the multi-layer inner core board and the prepreg are first fused to form a pre-arranged board, and then the pre-arranged board and copper foil are laid out. Finally, a laminating device is used to press the laid-out pre-arranged board and copper foil to form a multi-layer circuit board.
[0003] However, during the lamination process, the circuit board may undergo unexpected bending deformation, resulting in an uneven surface of the circuit board, such as a wavy or curved surface of the circuit board, which affects electronic manufacturing and assembly. Utility Model Content
[0004] Based on this, it is necessary to provide a circuit board pressing layout structure to address the problem that the circuit board is easily bent and deformed during the pressing process.
[0005] A circuit board pressing and typesetting structure, comprising:
[0006] A carrier plate and a cover body, wherein the carrier plate and the cover body are opposite to each other and spaced apart;
[0007] A circuit board unit is provided between the carrier plate and the cover, and first pressure equalizing plates are provided on opposite sides of the circuit board unit;
[0008] A second voltage balancing plate is provided between the first voltage balancing plate and the adjacent circuit board unit.
[0009] In one embodiment, the circuit board unit includes a first outer layer board, a pre-arrangement board and a second outer layer board, the first outer layer board, the pre-arrangement board and the second outer layer board are stacked, the second equalizing plate is arranged between the first outer layer board and the adjacent first equalizing plate, and the second equalizing plate is arranged between the second outer layer board and the adjacent first equalizing plate.
[0010] In one embodiment, the area of the second pressure equalizing plate is equal to the area of the first outer plate and the area of the second outer plate; or, the area of the second pressure equalizing plate is greater than the area of the first outer plate and the area of the second outer plate.
[0011] In one embodiment, the first outer layer board is copper foil, and the second outer layer board is copper foil.
[0012] In one embodiment, the first pressure balancing plate is a steel plate.
[0013] In one embodiment, the second pressure balancing plate is an aluminum plate.
[0014] In one embodiment, the thickness of the second pressure balancing plate is 1 mm to 3 mm.
[0015] In one embodiment, there are at least two circuit board units, all of which are stacked, one first voltage equalizing plate is provided between two adjacent circuit board units, one first voltage equalizing plate is provided between the supporting plate and the adjacent circuit board units, and one first voltage equalizing plate is provided between the cover body and the adjacent circuit board units.
[0016] In one embodiment, kraft paper is provided between the carrying tray and the adjacent first pressure equalizing plate.
[0017] In one embodiment, kraft paper is provided between the cover and the adjacent first pressure equalizing plate.
[0018] In the above-mentioned circuit board pressing and layout structure, when pressing, pressure acts on the carrier plate and the cover body, and the pressure acts on the layers of the circuit board unit through the first equalizing plate and the second equalizing plate, so that the layers of the circuit board unit are pressed together. Since the first equalizing plate is provided on the opposite sides of each circuit board unit, the circuit board unit can be evenly stressed and heated during pressing, ensuring the flatness between the circuit board units and avoiding the phenomenon of warping of the circuit board units. In addition, a second equalizing plate is provided between each first equalizing plate and the adjacent circuit board unit, so that the pressure on the first equalizing plate can be evenly distributed on the second equalizing plate, further improving the flatness of the circuit board unit, avoiding the phenomenon of warping of the circuit board unit, and avoiding the impact on the manufacturing and assembly of electronics. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is an exploded view of a circuit board pressing and layout structure according to an embodiment of the present application.
[0020] Description of Figure Numbers:
[0021] 10. Carrying plate; 20. Cover; 30. Circuit board unit; 31. First outer layer board; 32. Pre-arrangement board; 33. Second outer layer board; 40. First equalizing plate; 50. Second equalizing plate; 60. Kraft paper. DETAILED DESCRIPTION
[0022] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.
[0023] See Figure 1 , Figure 1 An exploded view of a circuit board press layout structure according to an embodiment of the present application is shown. The circuit board press layout structure according to an embodiment of the present application includes a carrier plate 10, a cover 20, a circuit board unit 30, a first equalizing plate 40, and a second equalizing plate 50. The carrier plate 10 and the cover 20 are spaced apart along a first direction, with S representing the first direction.
[0024] Optionally, the carrier plate 10 is a steel basin, and the cover 20 is a steel cover. This allows the carrier plate 10 and cover 20 to maintain sufficient strength and creep resistance. Specifically, they are less likely to deform or warp even under long-term stress at high temperatures, and offer strong resistance to thermal expansion and contraction, pressure shock, and corrosion, effectively extending the service life of the press-fit assembly. Of course, in other embodiments, the carrier plate 10 and cover 20 may be made of other materials, and are not limited to this.
[0025] Optionally, the first pressure balancing plate 40 is a steel plate. Of course, in other embodiments, the first pressure balancing plate 40 may also be made of other materials.
[0026] In one embodiment, see Figure 1 , Figure 1 The figure shows an exploded view of the circuit board press layout structure according to one embodiment of the present application. At least one circuit board unit 30 is provided, and all circuit board units 30 are arranged between the carrier tray 10 and the cover 20 along a first direction. It is understood that if only one circuit board unit 30 is provided, one circuit board unit 30 is provided between the carrier tray 10 and the cover 20; if two or more circuit board units 30 are provided, all circuit board units 30 are provided between the carrier tray 10 and the cover 20, and all circuit board units 30 are stacked along the first direction.
[0027] Further, see Figure 1 , Figure 1 The exploded view of the circuit board pressing and layout structure according to one embodiment of the present application is shown. A first voltage balancing plate 40 is provided on opposite sides of each circuit board unit 30 , and a second voltage balancing plate 50 is provided between the first voltage balancing plate 40 and the adjacent circuit board unit 30 .
[0028] It can be understood that the opposite sides of the circuit board unit 30 refer to the two sides of the circuit board unit 30 facing the carrier tray 10 and the cover 20 .
[0029] In the above-mentioned circuit board pressing and layout structure, when pressing, pressure is applied to the carrier plate 10 and the cover body 20, and the pressure is applied to each layer of the circuit board unit 30 through the first equalizing plate 40 and the second equalizing plate 50, so that the layers of the circuit board unit 30 are pressed together. Since the first equalizing plate 40 is provided on the opposite sides of each circuit board unit 30, the circuit board unit 30 can be evenly stressed and heated during pressing, ensuring the flatness between the circuit board units 30 and avoiding the circuit board units 30 from warping. In addition, a second equalizing plate 50 is provided between each first equalizing plate 40 and the adjacent circuit board unit 30, so that the pressure on the first equalizing plate 40 can be evenly distributed on the second equalizing plate 50, further improving the flatness of the circuit board unit 30, avoiding the circuit board unit 30 from warping, and preventing the manufacturing and assembly of electronics from being affected.
[0030] In one embodiment, the second pressure balancing plate 50 is an aluminum plate. It should be noted that different series and models of aluminum plates have different stiffnesses, which have different effects on the flatness of the circuit board unit 30. During the actual pressing process, different series and models of aluminum plates can be selected according to actual needs, and no specific limitation is made here.
[0031] In one embodiment, the thickness of the second pressure balancing plate 50 is 1 mm to 3 mm. Optionally, the thickness of the second pressure balancing plate 50 is 2 mm. It should be noted that different thicknesses of the second pressure balancing plate 50 will also affect the pressing effect of the circuit board unit 30. Therefore, in this embodiment, a second pressure balancing plate 50 with a thickness of 1 mm to 3 mm is used. This can better disperse the pressure, improve the flatness of the circuit board unit 30, and avoid warping of the circuit board unit 30.
[0032] In one embodiment, see Figure 1 , Figure 1 An exploded view of a circuit board press layout structure according to one embodiment of the present application is shown. At least two circuit board units 30 are provided, and all circuit board units 30 are stacked along a first direction. A first voltage balancing plate 40 is provided between two adjacent circuit board units 30. It is understood that the first voltage balancing plate 40 is shared between two adjacent circuit board units 30.
[0033] It should be noted that, see Figure 1 , Figure 1An exploded view of the circuit board press-fit layout structure of an embodiment of the present application is shown. If there are two circuit board units 30, the press-fit layout structure is: the first equalizing plate 40, the second equalizing plate 50, the circuit board unit 30, the second equalizing plate 50, the first equalizing plate 40, the second equalizing plate 50, the circuit board unit 30, the second equalizing plate 50, and the first equalizing plate 40 are stacked along the first direction. If there are three circuit board units 30, the press-fit layout structure is: the first equalizing plate 40, the second equalizing plate 50, the circuit board unit 30, the second equalizing plate 50, the first equalizing plate 40, the second equalizing plate 50, the circuit board unit 30, the second equalizing plate 50, the first equalizing plate 40, the second equalizing plate 50, the circuit board unit 30, the second equalizing plate 50, the first equalizing plate 40, the second equalizing plate 50, the circuit board unit 30, the second equalizing plate 50, and the first equalizing plate 40 are stacked along the first direction. If there are four or more circuit board units 30, layout can be performed in the above manner, which will not be repeated here.
[0034] In addition, the number of the first voltage equalizing plate 40 between the carrier tray 10 and the adjacent circuit board unit 30 is one, and the number of the first voltage equalizing plate 40 between the cover body 20 and the adjacent circuit board unit 30 is also one.
[0035] In one embodiment, see Figure 1 , Figure 1 An exploded view of the circuit board press layout structure according to one embodiment of the present application is shown. The circuit board unit 30 includes a first outer layer board 31, a pre-layout board 32, and a second outer layer board 33. The first outer layer board 31, pre-layout board 32, and second outer layer board 33 are stacked along a first direction. A second equalizing plate 50 is provided between the first outer layer board 31 and the adjacent first equalizing plate 40, and between the second outer layer board 33 and the adjacent first equalizing plate 40.
[0036] Optionally, the first outer layer board 31 is copper foil, and the second outer layer board 33 is copper foil. It is understandable that the circuit board is a double-sided copper foil structure. Copper foil, as a metal material, has high electrical conductivity, so copper foil is used in the conductive layer of the PCB circuit. By using different layers of copper foil, complex circuit designs can be achieved to meet the needs of various electronic products. At the same time, copper foil is also corrosion-resistant, preventing the circuit board from being eroded and corroded by the external environment. Especially in high temperature and high humidity environments, copper foil can give full play to its own corrosion resistance, thereby ensuring the stability and reliability of the circuit board. In addition, copper foil also has heat dissipation properties. In some electronic products that need to run for a long time, the circuit of the circuit board may generate too much heat. While copper foil serves as the conductive layer of the circuit, it can also act as a heat dissipation layer to help the circuit dissipate heat.
[0037] In one embodiment, see Figure 1 , Figure 1An exploded view of the circuit board press-fit layout structure of one embodiment of the present application is shown. The area of the second pressure-equalizing plate 50 is equal to the area of the first outer layer board 31 and the area of the second outer layer board 33. It is understood that the second pressure-equalizing plate 50 can completely cover the circuit board unit 30. This ensures the reliability of the press-fit and prevents warping of the circuit board unit 30.
[0038] Of course, in other embodiments, the area of the second pressure balancing plate 50 may also be larger than the area of the first outer plate 31 and the area of the second outer plate 33 .
[0039] In one embodiment, see Figure 1 , Figure 1 An exploded view of the circuit board press layout structure according to one embodiment of the present application is shown. Kraft paper 60 is placed between the carrier plate 10 and the adjacent first equalizing plate 40. Kraft paper 60 has a low density, which helps cushion the pressure. It also has good uniformity, ensuring uniform pressure on the first equalizing plate 40. Furthermore, kraft paper 60 reduces heat transfer.
[0040] In one embodiment, see Figure 1 , Figure 1 An exploded view of the circuit board press-fit layout structure according to one embodiment of the present application is shown. Kraft paper 60 is placed between the cover 20 and the adjacent first pressure-equalizing plate 40. Kraft paper 60 has a low density, which helps cushion pressure. It also has good uniformity, ensuring uniform pressure on the first pressure-equalizing plate 40. Furthermore, kraft paper 60 reduces heat transfer.
[0041] The circuit board pressing and layout structure of this embodiment includes a carrier plate 10, a cover body 20, a circuit board unit 30, a first equalizing plate 40 and a second equalizing plate 50. During pressing, pressure acts on the carrier plate 10 and the cover body 20, and the pressure acts on the layers of the circuit board unit 30 through the first equalizing plate 40 and the second equalizing plate 50, so that the layers of the circuit board unit 30 are pressed together. Since the first equalizing plate 40 is provided on the opposite sides of each circuit board unit 30, the circuit board unit 30 can be evenly stressed and heated during pressing, ensuring the flatness between the circuit board units 30 and avoiding the circuit board units 30 from warping. In addition, a second equalizing plate 50 is provided between each first equalizing plate 40 and the adjacent circuit board unit 30, so that the pressure on the first equalizing plate 40 can be evenly distributed on the second equalizing plate 50, further improving the flatness of the circuit board unit 30, avoiding the circuit board unit 30 from warping, and avoiding affecting the manufacturing and assembly of electronics.
[0042] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.
[0043] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.
[0044] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.
[0045] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0046] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.
[0047] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0048] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.
Claims
1. A circuit board pressing and typesetting structure, characterized in that: include: A carrier plate and a cover body, wherein the carrier plate and the cover body are opposite to each other and spaced apart; A circuit board unit is provided between the carrier plate and the cover, and first pressure equalizing plates are provided on opposite sides of the circuit board unit; A second voltage balancing plate is provided between the first voltage balancing plate and the adjacent circuit board unit.
2. The circuit board pressing and layout structure according to claim 1, characterized in that: The circuit board unit includes a first outer layer board, a pre-arrangement board and a second outer layer board. The first outer layer board, the pre-arrangement board and the second outer layer board are stacked. The second equalizing plate is arranged between the first outer layer board and the adjacent first equalizing plate. The second equalizing plate is arranged between the second outer layer board and the adjacent first equalizing plate.
3. The circuit board pressing and layout structure according to claim 2, characterized in that: The area of the second pressure equalizing plate is equal to the area of the first outer plate and the area of the second outer plate; Alternatively, the area of the second pressure equalizing plate is larger than the area of the first outer plate and the area of the second outer plate.
4. The circuit board pressing and layout structure according to claim 2, characterized in that: The first outer layer board is copper foil, and the second outer layer board is copper foil.
5. The circuit board pressing and layout structure according to claim 1, characterized in that: The first pressure balancing plate is a steel plate.
6. The circuit board pressing and layout structure according to claim 1, characterized in that: The second pressure balancing plate is an aluminum plate.
7. The circuit board pressing and layout structure according to claim 1, characterized in that: The thickness of the second pressure balancing plate is 1 mm to 3 mm.
8. The circuit board pressing and layout structure according to any one of claims 1 to 7, characterized in that: There are at least two circuit board units, all of which are stacked, one first voltage equalizing plate is provided between two adjacent circuit board units, one first voltage equalizing plate is provided between the carrying plate and the adjacent circuit board units, and one first voltage equalizing plate is provided between the cover body and the adjacent circuit board units.
9. The circuit board pressing and layout structure according to any one of claims 1 to 7, characterized in that: Kraft paper is provided between the carrying tray and the adjacent first pressure equalizing plate.
10. The circuit board pressing and layout structure according to any one of claims 1 to 7, characterized in that: Kraft paper is provided between the cover and the adjacent first pressure equalizing plate.