Semiconductor type gas sensor

Abstract

The utility model discloses a semiconductor type gas sensor which comprises a base, a protective cover, a bottom cover, a sensor chip installed on the base and an installation mechanism installed on the bottom cover, the base is installed on the inner bottom wall of the bottom cover, a spacing cavity is reserved between the base and the inner side wall of the bottom cover, and the protective cover is detachably connected with the bottom cover; according to the semiconductor type gas sensor, the elastic piece and the plug pin in the mounting mechanism are matched with the protective cover and the bottom cover, so that the protective cover and the bottom cover are locked and mounted, internal components of the semiconductor type gas sensor are protected, meanwhile, the protective cover and the bottom cover are convenient to disassemble, and the safety of the semiconductor type gas sensor is improved. Furthermore, internal components of the semiconductor type gas sensor can be conveniently maintained and replaced; the explosion-proof net is detachably mounted on the protective cover, so that the explosion-proof net is convenient to clean; the protective cover is more stably mounted through the sealing gasket, so that the stability of the semiconductor type gas sensor is improved.

Description

Technical Field

[0001] The utility model belongs to the field of sensors, and in particular relates to a semiconductor gas sensor. Background Art

[0002] Semiconductor gas sensors are gas sensors that use semiconductor gas sensitive elements as sensitive elements. They are the most common gas sensors and are widely used in combustible gas leak detection devices in homes and factories. They are suitable for the detection of methane, liquefied gas, hydrogen, etc. Semiconductor gas sensors can be divided into surface-controlled and volume-controlled types according to whether the interaction between the semiconductor and the gas is on its surface or inside. According to the physical properties of the semiconductor changes, they can be divided into resistance and non-resistance types. Resistance-type semiconductor gas sensors use the change in the resistance of the semiconductor when it contacts the gas to detect the composition or concentration of the gas, while non-resistance-type semiconductor gas sensors detect the gas directly or indirectly based on the adsorption and reaction of the gas, causing certain properties of the semiconductor to change.

[0003] Generally, existing semiconductor gas sensors are equipped with a protective shell to protect the components inside the sensor. Most of the existing protective shells are installed with screws. When the components inside the sensor need to be repaired or replaced, the screws need to be unscrewed. The whole process is cumbersome and time-consuming, which greatly reduces the efficiency of maintenance work. Utility Model Content

[0004] The purpose of the present invention is to solve the problems raised in the background technology and to provide a semiconductor gas sensor.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] The utility model proposes a semiconductor gas sensor, comprising a base, a protective cover and a bottom cover, a sensor chip mounted on the base, and a mounting mechanism mounted on the bottom cover, wherein:

[0007] The base is mounted on the inner bottom wall of the bottom cover, and a spacer cavity is left between the base and the inner side wall of the bottom cover. The protective cover is detachably connected to the bottom cover, and the protective cover is inserted into the spacer cavity and matched with the bottom cover to protect the interior of the semiconductor gas sensor.

[0008] The mounting mechanism includes at least one arc-shaped plate, a latch and an elastic member. The arc-shaped plate is connected to the outer side wall of the bottom cover through the elastic member. The latch is installed on the inner side wall of the arc-shaped plate. The side wall of the bottom cover and the outer side wall of the base are respectively provided with a first through hole and a second through hole corresponding to each other, and the side wall of the protective cover is provided with a third through hole corresponding to the first through hole and the second through hole respectively, and the position of each through hole corresponds to the latch. The latch is inserted into each through hole to lock the protective cover and the bottom cover.

[0009] Preferably, the sensor chip includes a substrate, a heating electrode, a test electrode, a heating resistor and a sensitive layer, the heating electrode and the test electrode are respectively installed on both sides of the substrate, the heating resistor is installed on the side of the substrate away from the test electrode, and one end of the heating electrode is embedded in the heating resistor, the sensitive layer is installed on the side of the substrate away from the heating electrode, and one end of the test electrode is embedded in the sensitive layer.

[0010] Preferably, the semiconductor gas sensor further comprises a terminal mounted on the base and corresponding to each electrode one-to-one, and the terminal extends from the top of the base to the bottom of the base, and each electrode is connected to the terminal one-to-one via a wire.

[0011] Preferably, the curvature of the arc-shaped plate is consistent with the curvature of the bottom cover, and the outer diameter of the latch is smaller than the aperture of each through hole.

[0012] Preferably, a mounting opening is provided on the protective cover, and an explosion-proof net is threadedly connected to the mounting opening.

[0013] Preferably, sealing gaskets are installed on the outer side wall of the protective cover and the inner side wall of the bottom cover.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] This semiconductor gas sensor uses elastic parts and latches in the installation mechanism to cooperate with the protective cover and the bottom cover to achieve locking installation between the protective cover and the bottom cover, thereby protecting the internal components of the semiconductor gas sensor. It also facilitates the disassembly between the protective cover and the bottom cover, thereby facilitating the repair and replacement of the internal components of the semiconductor gas sensor; the explosion-proof net is installed on the protective cover in a detachable manner, which is convenient for cleaning the explosion-proof net; the sealing gasket makes the installation of the protective cover more stable, thereby improving the stability of the semiconductor gas sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the assembly of the semiconductor gas sensor of the present invention;

[0017] Figure 2 This is a schematic diagram of the structure of the installation mechanism of the utility model;

[0018] Figure 3 It is a partial schematic diagram of the semiconductor gas sensor of the present utility model;

[0019] Figure 4 This is a schematic diagram of the sensor chip of the utility model from a first perspective;

[0020] Figure 5 This is a schematic diagram of the sensor chip of the present invention from a second perspective. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0022] It should be noted that when a component is referred to as being "connected" to another component, it may be directly connected to the other component or there may be an intermediate component. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0023] like Figure 1-5 As shown, a semiconductor gas sensor includes: a base 1, a protective cover 2 and a bottom cover 3, a sensor chip 5 mounted on the base 1, and a mounting mechanism 4 mounted on the bottom cover 3, wherein:

[0024] The base 1 is mounted on the inner bottom wall of the bottom cover 3, and a spacer cavity is left between the base 1 and the inner side wall of the bottom cover 3. The protective cover 2 is detachably connected to the bottom cover 3, and the protective cover 2 is inserted into the spacer cavity and cooperates with the bottom cover 3 to protect the interior of the semiconductor gas sensor.

[0025] The mounting mechanism 4 includes at least one curved plate 41, a latch 42 and an elastic member 43. The curved plate 41 is connected to the outer side wall of the bottom cover 3 through the elastic member 43. The latch 42 is installed on the inner side wall of the curved plate 41. The side wall of the bottom cover 3 and the outer side wall of the base 1 are respectively provided with a first through hole 44 and a second through hole 45 corresponding to each other, and the side wall of the protective cover 2 is provided with a third through hole 46 corresponding to the first through hole 44 and the second through hole 45 respectively, and the position of each through hole corresponds to the latch 42. The latch 42 is inserted into each through hole to lock the protective cover 2 and the bottom cover 3.

[0026] It should be noted that the protective cover 2 and the bottom cover 3 are both cylindrical structures and have an opening. The base 1 is fixedly mounted at the center of the inner bottom wall of the bottom cover 3. In this embodiment, the base 1 includes a first cylindrical disk and a second cylindrical disk. The second cylindrical disk is fixedly mounted on the top of the first cylindrical disk, and the radius of the first cylindrical disk is greater than the radius of the second cylindrical disk. The first cylindrical disk is fixedly mounted at the center of the inner bottom wall of the bottom cover 3. A spacer cavity is left between the base 1 and the inner side wall of the bottom cover 3, that is, a spacer cavity is left between the outer side wall of the first cylindrical disk and the inner side wall of the bottom cover 3. The protective cover 2 is inserted into the spacer cavity, and the protective cover 2 and the bottom cover 3 are locked by the mounting mechanism 4 to achieve fixation between the protective cover 2 and the bottom cover 3.

[0027] In this embodiment, the number of the arc-shaped plates 41 in the mounting mechanism 4 is two, and the two arc-shaped plates 41 are arranged opposite to each other, and are fixedly connected to the outer side wall of the bottom cover 3 through elastic members 43, wherein the elastic members 43 can be springs or elastic blocks, etc. In this embodiment, the number of elastic members 43 fixedly installed on each arc-shaped plate 41 is four (the four elastic members 43 are evenly distributed on the inner side wall of the arc-shaped plate 41, and the other end of the elastic member 43 is fixedly connected to the outer side wall of the bottom cover 3. The number of elastic members 43 is not limited and can be set according to actual needs), and the number of latches 42 is also not limited. In this embodiment, each arc-shaped plate 41 is fixed Three latches 42 are installed, and the three latches 42 are evenly distributed on the curved plate 41; the number of the first through holes 44, the second through holes 45 and the third through holes 46 is not limited. In this embodiment, the number of each through hole corresponds to the number of the latches 42, and the number of each through hole is six, that is, there are six groups of through holes. When the protective cover 2 is inserted into the spacer cavity, each group of through holes contains the first through hole 44, the second through hole 45 and the third through hole 46 that are relatively corresponding. The first through hole 44, the third through hole 46 and the second through hole 45 in each group of through holes are distributed sequentially from the outside to the inside. The three latches 42 on each curved plate 41 correspond to the three groups of through holes respectively.

[0028] In the initial state, each elastic member 43 is at its original length, and each latch 42 is inserted into the corresponding set of through-holes, locking the protective cover 2 and the bottom cover 3. When removal is required, the two curved plates 41 are simply pulled outward, driving each latch 42 outward until they are clear of the corresponding through-holes (at this point, each elastic member 43 is in its extended state, as shown in the accompanying drawings). The protective cover 2 is then removed from the compartment. The arrangement of the elastic members 43 ensures that the curved plates 41 remain connected to the outer wall of the bottom cover 3, preventing it from detaching, thereby facilitating ease of use. The coordination between the mounting mechanism 4 and the protective cover 2 and bottom cover 3 facilitates installation and removal of the protective cover 2, and thus facilitates repair and replacement of components within the semiconductor gas sensor.

[0029] In one embodiment, the sensor chip 5 includes a substrate 51, a heating electrode 52, a test electrode 53, a heating resistor 54 and a sensitive layer 55. The heating electrode 52 and the test electrode 53 are respectively installed on both sides of the substrate 51, the heating resistor 54 is installed on the side of the substrate 51 away from the test electrode 53, and one end of the heating electrode 52 is embedded in the heating resistor 54. The sensitive layer 55 is installed on the side of the substrate 51 away from the heating electrode 52, and one end of the test electrode 53 is embedded in the sensitive layer 55.

[0030] In this embodiment, the number of heating electrodes 52 and testing electrodes 53 is two, and the heating electrodes 52 and testing electrodes 53 are respectively fixedly mounted on the top and bottom surfaces of the substrate 51. The heating resistor 54 is fixedly mounted on the top surface of the substrate 51, and one end of the two heating electrodes 52 is embedded in the heating resistor 54. The sensitive layer 55 is fixedly mounted on the bottom surface of the substrate 51, and one end of the two testing electrodes 53 is embedded in the inside of the sensitive layer 55.

[0031] In one embodiment, the semiconductor gas sensor further includes a terminal 7 mounted on the base 1 and corresponding to each electrode one by one, and the terminal extends from the top of the base 1 to the bottom of the base 1 , and each electrode is connected to the terminal 7 one by one through a wire 8 .

[0032] In this embodiment, there are four terminals 7, which are fixedly mounted on the base 1 and extend from the top of the second cylindrical disk in the base 1 to the bottom of the bottom cover 3. The ends of the two heating electrodes 52 away from the heating resistor 54 are respectively connected to two of the terminals 7 through wires 8 (the wires 8 and the electrodes and the terminals 7 can be fixed by welding), and the ends of the two test electrodes 53 away from the sensitive layer 55 are connected to the other two terminals 7 through wires 8.

[0033] In one embodiment, the curvature of the arc-shaped plate 41 is consistent with the curvature of the bottom cover 3 , and the outer diameter of the latch 42 is smaller than the diameter of each through hole.

[0034] Since the curvature of the arc-shaped plate 41 is consistent with the curvature of the bottom cover 3 , it is convenient for each latch 42 to be inserted into each group of corresponding through holes for fixation.

[0035] In one embodiment, a mounting opening is provided on the protective cover 2 , and an explosion-proof net 6 is threadedly connected to the mounting opening.

[0036] The explosion-proof net 6 is threadedly mounted on the protective cover 2, which is convenient for installation and disassembly of the protective cover 2 and further convenient for cleaning.

[0037] In one embodiment, sealing gaskets are installed on both the outer side wall of the protective cover 2 and the inner side wall of the bottom cover 3 .

[0038] In order to improve the installation stability between the protective cover 2 and the bottom cover 3, sealing gaskets are fixedly installed on the outer wall of the protective cover 2 and the inner wall of the bottom cover 3. The sealing gaskets are used to fill and tighten the gap between the protective cover 2 and the bottom cover 3 to increase friction and prevent the protective cover 2 from shaking.

[0039] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0040] The above-described embodiments merely represent specific and detailed examples of the present application and should not be construed as limiting the scope of the patent application. It should be noted that a person skilled in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A semiconductor gas sensor, characterized in that: The semiconductor gas sensor comprises a base (1), a protective cover (2), and a bottom cover (3), a sensor chip (5) mounted on the base (1), and a mounting mechanism (4) mounted on the bottom cover (3), wherein: The base (1) is mounted on the inner bottom wall of the bottom cover (3), and a spacer cavity is left between the base and the inner side wall of the bottom cover (3); the protective cover (2) and the bottom cover (3) are detachably connected, and the protective cover (2) is inserted into the spacer cavity and matched with the bottom cover (3) to achieve protection of the interior of the semiconductor gas sensor; The mounting mechanism (4) comprises at least one arc-shaped plate (41), a latch (42) and an elastic member (43), wherein the arc-shaped plate (41) is connected to the outer side wall of the bottom cover (3) via the elastic member (43), and the latch (42) is mounted on the inner side wall of the arc-shaped plate (41), and a first through hole (44) and a second through hole (45) corresponding to each other are respectively provided on the side wall of the bottom cover (3) and the outer side wall of the base (1), and a third through hole (46) corresponding to the first through hole (44) and the second through hole (45) is respectively provided on the side wall of the protective cover (2), and the position of each through hole corresponds to the latch (42), and the latch (42) is inserted into each through hole so that the protective cover (2) and the bottom cover (3) are locked.

2. The semiconductor gas sensor according to claim 1, wherein: The sensor chip (5) comprises a substrate (51), a heating electrode (52), a test electrode (53), a heating resistor (54) and a sensitive layer (55), wherein the heating electrode (52) and the test electrode (53) are respectively mounted on both sides of the substrate (51), the heating resistor (54) is mounted on a side of the substrate (51) away from the test electrode (53), and one end of the heating electrode (52) is embedded in the heating resistor (54), and the sensitive layer (55) is mounted on a side of the substrate (51) away from the heating electrode (52), and one end of the test electrode (53) is embedded in the sensitive layer (55).

3. The semiconductor gas sensor according to claim 2, wherein: The semiconductor gas sensor further comprises a terminal (7) mounted on the base (1) and corresponding to each electrode, and the terminal extends from the top of the base (1) to the bottom of the base (1), and each electrode is connected to the terminal (7) one by one via a wire (8).

4. The semiconductor gas sensor according to claim 1, wherein: The curvature of the arc-shaped plate (41) is consistent with the curvature of the bottom cover (3), and the outer diameter of the latch (42) is smaller than the aperture of each through hole.

5. The semiconductor gas sensor according to claim 1, wherein: The protective cover (2) is provided with a mounting opening, and an explosion-proof net (6) is threadedly connected to the mounting opening.

6. The semiconductor gas sensor according to claim 1, wherein: The outer side wall of the protective cover (2) and the inner side wall of the bottom cover (3) are both installed with sealing gaskets.

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