Condensation type light emitting diode
By designing the packaging structure of the light-concentrating light-emitting diode, using the combination of a reflective film and thermal columns, the problem of insufficient brightness of the existing light-emitting diodes is solved, and the brightness improvement and heat dissipation effect are achieved to meet the needs of strong lighting.
Patent Information
- Application Number
- CN202422457508.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-10-11
AI Technical Summary
The brightness of existing light emitting diodes is limited and cannot meet the needs of strong lighting.
A light-concentrating light-emitting diode is designed. Through a combined structure of the packaging shell, limit disc, limit sheet, reflective film and packaging adhesive layer, the reflective film is used to perform light reflection and light transmittance of the packaging adhesive layer, combined with the heat dissipation performance of the thermal column, improve brightness and prevent overheating.
It achieves improved diode brightness and better heat dissipation performance, and can provide strong lighting for a long time to prevent diode overheating and damage.
Smart Images
Figure CN223297995U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of diodes, in particular to a focusing light emitting diode. Background Art
[0002] Light-emitting diodes, abbreviated as LEDs, are diodes made of compounds of gallium (Ga) and arsenic (As), phosphorus (P), nitrogen (N), and indium (In). When electrons and holes recombine, they can radiate visible light, so they can be used to make light-emitting elements. Light-emitting diodes are a type of semiconductor component, initially used as indicator lights, display panels, etc. With the emergence of white light LEDs, they are also used for lighting.
[0003] Currently, the application of light-emitting diodes is becoming more and more common, and people's requirements for light-emitting diodes are also getting higher and higher. Due to the limited brightness of the diodes, some existing light-emitting diodes cannot meet the demand for strong lighting. Therefore, a focusing light-emitting diode is proposed to address the above problem. Utility Model Content
[0004] The purpose of the utility model is to provide a focusing light emitting diode to solve the problem that some existing light emitting diodes cannot meet the demand for strong lighting.
[0005] To achieve the above objectives, the present invention provides the following technical solutions:
[0006] A concentrating light-emitting diode comprises a packaging shell and a limiting disk, wherein a first gap is provided in the middle position of the lower half of the packaging shell, the inner side of the packaging shell is fixedly connected to the limiting disk, the middle position of the limiting disk is provided with a second gap, a crystal source is fixedly connected to the top middle position of the limiting disk, the limiting plate and the first limiting block are fixedly connected in the limiting groove of the limiting disk, the bottom of the limiting plate is fixedly connected to the first limiting block, the bottom of the first limiting block is fixedly connected to the first thermally conductive column, the first limiting hole of the packaging shell is fixedly connected to the second limiting block and the second thermally conductive column, the relatively outer side of the second limiting block is fixedly connected to the second thermally conductive column, the second limiting hole of the packaging shell is fixedly connected to the third limiting block and the third thermally conductive column, the relatively outer side of the third limiting block is fixedly connected to the third thermally conductive column, the inner side of the packaging shell is fixedly connected to a reflective film, and the inner side of the reflective film is fixedly connected to the packaging glue layer.
[0007] Preferably, the upper half of the packaging shell is provided with a plurality of first limiting holes and a second limiting holes, the first limiting holes of the packaging shell are all located below the second limiting holes, the lower half of the packaging shell is provided with a plurality of accommodating grooves, the diameters of the first gap and the second gap are the same, and pins are provided at the bottom of the crystal source.
[0008] Preferably, the limiting plate is provided with a plurality of limiting grooves, the limiting plate and the upper half of the first limiting block are both located in the limiting grooves of the limiting plate, the lower half of the first limiting block and the first thermally conductive column are both located in the accommodating groove of the packaging shell, and the limiting plate, the first limiting block and the first thermally conductive column all have good thermal conductivity.
[0009] Preferably, the second limit block, the second thermally conductive column, the third limit block and the third thermally conductive column are all hexagonal column structures, the second limit block, the second thermally conductive column, the third limit block and the third thermally conductive column all have good thermal conductivity, and the relative inner sides of the second limit block and the third limit block are both curved surfaces.
[0010] Preferably, the outer side of the reflective film is fixedly connected to the second limit block and the third limit block, the bottom of the packaging glue layer is fixedly connected to the limit plate, the crystal source and the limit plate, the reflective film is reflective, and the packaging glue layer is light-transmissive.
[0011] Compared with the prior art, the beneficial effects of the present invention are:
[0012] In the utility model, by providing a packaging shell, a limiting plate, a limiting piece reflective film and a packaging adhesive layer, the device supports the reflective film through the curved groove of the packaging shell, reflects light through the reflective film, and the packaging adhesive layer is light-transmissive, which can achieve a focusing effect, thereby improving the brightness of the diode. At the same time, the diode has better heat dissipation performance, which can prevent the diode from being damaged due to overheating, and can enable the diode to provide strong lighting for a long time. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the overall structure of the utility model;
[0014] Figure 2 This is a cross-sectional view of the overall structure of the utility model;
[0015] Figure 3 This is a cross-sectional view of the packaging shell structure of the utility model;
[0016] Figure 4 This is a cross-sectional view of the limit plate structure of the utility model;
[0017] Figure 5 This is a schematic structural diagram of the first heat-conducting column of the utility model;
[0018] Figure 6 This is a schematic structural diagram of the second heat-conducting column of the utility model;
[0019] Figure 7 This is a schematic structural diagram of the third heat-conducting column of the utility model.
[0020] In the figure: 1. packaging shell; 2. first gap; 3. limiting plate; 4. second gap; 5. crystal source; 6. limiting plate; 7. first limiting block; 8. first thermal conductive column; 9. second limiting block; 10. second thermal conductive column; 11. third limiting block; 12. third thermal conductive column; 13. reflective film; 14. packaging adhesive layer. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0022] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.
[0023] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this utility model.
[0024] See also Figure 1-7 , the utility model provides a technical solution:
[0025] A concentrating light-emitting diode comprises an encapsulating shell 1 and a limiting plate 3. A first gap 2 is provided in the middle of the lower half of the encapsulating shell 1. The inner side of the encapsulating shell 1 is fixedly connected to the limiting plate 3. A second gap 4 is provided in the middle of the limiting plate 3. A crystal source 5 is fixedly connected to the middle of the top of the limiting plate 3. A limiting plate 6 and a first limiting block 7 are fixedly connected in the limiting groove of the limiting plate 3. The bottom of the limiting plate 6 is fixedly connected to the first limiting block 7. The bottom of the first limiting block 7 is fixedly connected to The first thermally conductive column 8 and the first limiting hole of the packaging shell 1 are fixedly connected to the second limiting block 9 and the second thermally conductive column 10, the relatively outer side of the second limiting block 9 is fixedly connected to the second thermally conductive column 10, the second limiting hole of the packaging shell 1 is fixedly connected to the third limiting block 11 and the third thermally conductive column 12, the relatively outer side of the third limiting block 11 is fixedly connected to the third thermally conductive column 12, the inner side of the packaging shell 1 is fixedly connected to the reflective film 13, and the inner side of the reflective film 13 is fixedly connected to the packaging glue layer 14.
[0026] The upper half of the packaging shell 1 is provided with a plurality of first limiting holes and a second limiting holes, the first limiting holes of the packaging shell 1 are all located below the second limiting holes, the lower half of the packaging shell 1 is provided with a plurality of accommodating grooves, the first gap 2 and the second gap 4 have the same diameter, and pins are provided at the bottom of the crystal source 5, the first gap 2 and the second gap 4 can accommodate the pins at the bottom of the crystal source 5, so that the pins of the crystal source 5 are protruded, which is convenient for connecting the pins when the device is used; the limiting disk 3 is provided with a plurality of limiting grooves, the limiting piece 6 and the upper half of the first limiting block 7 are both located in the limiting grooves of the limiting disk 3, the lower half of the first limiting block 7 and the first thermal conductive column 8 are both located in the accommodating groove of the packaging shell 1, the limiting piece 6, the first limiting block 7 and the first thermal conductive column 8 are The columns 8 all have good thermal conductivity, which can enhance the heat dissipation at the bottom; the second limit block 9, the second thermally conductive column 10, the third limit block 11 and the third thermally conductive column 12 are all hexagonal column structures, and the second limit block 9, the second thermally conductive column 10, the third limit block 11 and the third thermally conductive column 12 all have good thermal conductivity. The relative inner sides of the second limit block 9 and the third limit block 11 are curved surfaces, which can enhance the side heat dissipation; the outer side of the reflective film 13 is fixedly connected to the second limit block 9 and the third limit block 11, and the bottom of the encapsulation glue layer 14 is fixedly connected to the limit disk 3, the crystal source 5, and the limit plate 6. The reflective film 13 is reflective and the encapsulation glue layer 14 is light-transmitting, which can make the device focus light and improve the brightness of the device.
[0027] Workflow: Check whether all components are intact before use. If they are intact, the device can be assembled. The packaging shell 1, the limiting plate 3, the crystal source 5 and the reflective film 13 of the device are all independent components. The limiting piece 6, the first limiting block 7 and the first heat-conducting column 8 of the device are integrated components. The second limiting block 9 and the second heat-conducting column 10, the third limiting block 11 and the third heat-conducting column 12 of the device are all integrated components. When encapsulating the diode, first remove the multiple second limiting blocks 9 and the second heat-conducting columns 10 from the inner of the packaging shell 1 in sequence. Insert the first limiting hole from the side, insert the multiple third limiting blocks 11 and the third heat-conducting column 12 into the second limiting hole from the inner side of the packaging shell 1 in turn, and then stick the reflective film 13 on the inner side of the packaging shell 1. The outer side of the reflective film 13 is sticky, and the reflective film 13 can be adhered to the inner side of the packaging shell 1. Then insert the multiple first heat-conducting columns 8 into the limiting groove of the limiting disk 3 from top to bottom in turn, the limiting piece 6 and the upper half of the first limiting block 7 are both located in the limiting groove of the limiting disk 3, and the limiting disk 3 is placed in the packaging shell 1. The first limiting block The lower half of 7 and the first heat-conducting column 8 are both located in the receiving groove of the packaging shell 1. Then, the crystal source 5 is placed in the middle position of the top of the limiting plate 3, and the packaging glue is poured into the inner side of the packaging shell 1. After the packaging glue is cooled and fixed, a packaging glue layer 14 is formed. The packaging glue layer 14 is respectively adhered to the packaging shell 1, the limiting plate 3, the crystal source 5, the limiting plate 6, and the reflective film 13, so that the various components of the device cannot move relative to each other, and the diode packaging can be completed relatively quickly; the device supports the reflective film 13 through the curved groove of the packaging shell 1. The reflective film 13 reflects light, and the encapsulation glue layer 14 is light-transmissive, so that a focusing effect can be achieved, thereby improving the brightness of the diode. At the same time, heat is dissipated through the first gap 2 and the second gap 4. The bottom heat dissipation is enhanced by the limiting piece 6, the first limiting block 7 and the first heat-conducting column 8. The side heat dissipation is enhanced by the second limiting block 9, the second heat-conducting column 10, the third limiting block 11 and the third heat-conducting column 12, so that the diode has better heat dissipation performance, can prevent the diode from being damaged due to overheating, and can enable the diode to be illuminated strongly for a long time.
[0028] Any matters not described in detail in this specification are prior art known to those skilled in the art. Standard parts used in this utility model are commercially available, and special-shaped parts can be customized according to the description in the specification and the accompanying drawings. The specific connection methods of each part are all conventional means such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts, and equipment are all conventional models in the prior art, and the circuit connections use conventional connection methods in the prior art, which will not be described in detail here.
[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A concentrating light emitting diode, comprising a package shell (1) and a limiting plate (3), characterized in that: A first gap (2) is provided in the middle of the lower half of the packaging shell (1), a limiting plate (3) is fixedly connected to the inner side of the packaging shell (1), a second gap (4) is provided in the middle of the limiting plate (3), a crystal source (5) is fixedly connected to the middle of the top of the limiting plate (3), a limiting plate (6) and a first limiting block (7) are fixedly connected in the limiting groove of the limiting plate (3), the bottom of the limiting plate (6) is fixedly connected to the first limiting block (7), the bottom of the first limiting block (7) is fixedly connected to the first heat conducting column (8), and the packaging shell (1) is fixedly connected to the bottom of the limiting plate (6). A second limiting block (9) and a second heat-conducting column (10) are fixedly connected in the first limiting hole of the packaging shell (1), and the second heat-conducting column (10) is fixedly connected to the relative outer side of the second limiting block (9). A third limiting block (11) and a third heat-conducting column (12) are fixedly connected in the second limiting hole of the packaging shell (1), and the third heat-conducting column (12) is fixedly connected to the relative outer side of the third limiting block (11). A reflective film (13) is fixedly connected to the inner side of the packaging shell (1), and a packaging glue layer (14) is fixedly connected to the inner side of the reflective film (13).
2. A concentrating light emitting diode according to claim 1, characterized in that: The upper half of the packaging shell (1) is provided with a plurality of first limiting holes and a second limiting hole, the first limiting holes of the packaging shell (1) are all located below the second limiting holes, the lower half of the packaging shell (1) is provided with a plurality of accommodating grooves, the first gap (2) and the second gap (4) have the same diameter, and a pin is provided at the bottom of the crystal source (5).
3. The concentrating light emitting diode according to claim 1, characterized in that: The limiting plate (3) is provided with a plurality of limiting grooves, the limiting piece (6) and the upper half of the first limiting block (7) are both located in the limiting grooves of the limiting plate (3), the lower half of the first limiting block (7) and the first heat-conducting column (8) are both located in the receiving groove of the packaging shell (1), and the limiting piece (6), the first limiting block (7) and the first heat-conducting column (8) all have good thermal conductivity.
4. The concentrating light emitting diode according to claim 1, characterized in that: The second limiting block (9), the second heat-conducting column (10), the third limiting block (11) and the third heat-conducting column (12) are all hexagonal column structures, the second limiting block (9), the second heat-conducting column (10), the third limiting block (11) and the third heat-conducting column (12) all have good thermal conductivity, and the relative inner sides of the second limiting block (9) and the third limiting block (11) are both curved surfaces.
5. The concentrating light emitting diode according to claim 1, characterized in that: The outer side of the reflective film (13) is fixedly connected to the second limit block (9) and the third limit block (11); the bottom of the encapsulating adhesive layer (14) is fixedly connected to the limit plate (3), the crystal source (5), and the limit plate (6); the reflective film (13) is reflective, and the encapsulating adhesive layer (14) is light-transmissive.