Display TOP lamp bead device and light-emitting module

Abstract

The utility model discloses a lamp bead device for displaying TOP and a light-emitting module, and relates to the technical field of semiconductor devices, the lamp bead device comprises an LED support, the LED support comprises a base and a fence extending from the edge of the base, the fence is enclosed on the base to form an accommodating space, and an LED chip is arranged on the base in the accommodating space; the positive electrode of the LED chip is connected to the positive electrode pin through a wire in a bonding manner; the negative electrode of the LED chip is connected to the negative electrode pin through a wire in a bonding manner; and the compact film layer is formed on at least part of the surfaces, in contact with the base and / or the enclosure, of the positive electrode pin and the negative electrode pin in a coating manner. The utility model aims to improve the sealing performance between the metal pin and the LED support in the display TOP lamp bead device, thereby reducing the possibility of water vapor invasion, and improving the structural sealing performance of the display TOP lamp bead device.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, and specifically to a display TOP lamp bead device and a light-emitting module. Background Art

[0002] With the widespread application of display technology, the application of LED display devices, the key components of display screens, has become more important. In particular, as display screens develop towards high viewing angles, high brightness, and high reliability, higher requirements are placed on LED display devices, that is, higher viewing angles, higher brightness, and higher reliability are required of the lamp beads, which are more in line with the requirements for outdoor scenes.

[0003] Existing display TOP lamp bead devices usually use TOP stamping injection molding brackets as LED brackets. The LED bracket is divided into two sides. The front side is composed of PPA and the metal pins after stamping as the functional area of ​​the lamp bead. The PPA part is formed into a fence (bowl cup) through injection molding to protect the functional area. The back side consists of PPA and metal pins, and the metal pins are bent and exposed; the front functional area uses silver glue or insulating glue to fix the chip in the functional area, and then the wires are welded to the chip electrodes and the functional area to form an electrical connection between the chip and the functional area. The bracket is sealed with glue through a dispensing process, and then blanked into display TOP lamp bead devices.

[0004] However, due to the material difference between the LED bracket and the metal pin, there will inevitably be a gap between the two. And since the metal pin is a stamping part, its surface is relatively flat, which easily leads to water vapor invading from the gap between the metal pin and the LED bracket, thereby reducing the service life of the display TOP lamp bead device. Utility Model Content

[0005] In response to the shortcomings of the existing technology, the purpose of the present invention is to provide a display TOP lamp bead device and a light-emitting module, aiming to improve the sealing between the metal pins and the LED bracket in the display TOP lamp bead device, thereby reducing the possibility of water vapor intrusion and improving the structural sealing of the display TOP lamp bead device.

[0006] The first aspect of the present invention is to provide a TOP display lamp bead device, the lamp bead device comprising:

[0007] An LED bracket, comprising a base and a fence extending from an edge of the base, wherein the fence is enclosed on the base to form an accommodating space, and an LED chip is arranged on the base in the accommodating space;

[0008] A positive electrode pin, to which the positive electrode of the LED chip is connected via wire bonding;

[0009] A cathode pin, to which the cathode of the LED chip is connected via wire bonding;

[0010] And a dense film layer, the coating is formed on at least a portion of the surface of the positive pin and the negative pin that contacts the base and / or the enclosure.

[0011] According to one aspect of the above technical solution, the positive pin and the negative pin each include a bonding portion for connecting the LED chip, a stretching portion and a pad portion for a circuit board, and the stretching portion is connected between the bonding portion and the pad portion.

[0012] According to one aspect of the above technical solution, the bonding portion extends into the accommodating space and is located on the base, the pad portion extends out of the LED bracket and is exposed outside the base, and the stretching portion is connected between the bonding portion and the pad portion, and is wrapped by the base and the enclosure.

[0013] According to one aspect of the above technical solution, the positive electrode pin and the negative electrode pin are both fixed to the LED bracket by injection molding.

[0014] According to one aspect of the above technical solution, the stretching portion includes a first sub-stretching portion, a second sub-stretching portion and a third sub-stretching portion, the third sub-stretching portion is connected between the first sub-stretching portion and the second sub-stretching portion, and the first sub-stretching portion and the second sub-stretching portion respectively transitionally connect the bonding portion and the pad portion.

[0015] According to one aspect of the above technical solution, the dense film layer is formed on both sides of at least one sub-stretching portion in the stretching portion by coating, so as to contact the base and the enclosure respectively.

[0016] According to one aspect of the above technical solution, the dense film layer is continuously formed on both sides of the first sub-stretching portion, the second sub-stretching portion and the third sub-stretching portion by coating, so as to contact the base and the enclosure respectively.

[0017] According to one aspect of the above technical solution, the thickness of the dense film layer is 300 μm-500 μm.

[0018] According to one aspect of the above technical solution, the LED chip includes a first LED chip, a second LED chip and a third LED chip, and the first LED chip, the second LED chip and the third LED chip emit different colors;

[0019] Any one of the positive electrode pin and the negative electrode pin is a common electrode pin, and the other is a polarity pin, including a first pin, a second pin and a third pin;

[0020] One end of the first LED chip, the second LED chip and the third LED chip are all connected to the common pin, and the other ends are connected to the first pin, the second pin and the third pin respectively.

[0021] The second aspect of the present invention is to provide a light-emitting module, including the display TOP lamp bead device described in the above technical solution.

[0022] Compared with the prior art, the display TOP lamp bead device and light-emitting module shown in the present invention have the following beneficial effects:

[0023] The LED bracket in the lamp bead device includes a base and a fence, which form an accommodating space. The LED chip is arranged in the accommodating space and is located on the base. The LED chip is bonded to the positive pin and the negative pin respectively through wires. At least part of the surface of the positive pin and the negative pin is coated to form a dense film layer. When the positive pin and the negative pin are injected into the LED bracket, they can contact the base and / or the fence through the dense film layer on the positive pin and the negative pin, thereby sealing the gap between the positive pin, the negative pin and the LED bracket, making it difficult for water vapor to invade, thereby improving the sealing of the lamp bead device and ensuring the service life of the lamp bead device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 This is a schematic diagram showing the structure of a TOP lamp bead device shown in one embodiment of the present invention;

[0026] Figure 2 This is a schematic structural diagram showing the positive electrode pin and dense film layer in a TOP lamp bead device according to one embodiment of the present invention;

[0027] Figure 3 This is a partial structural diagram showing a TOP lamp bead device in one embodiment of the present invention;

[0028] Description of Figure Numbers:

[0029] LED bracket 10, base 11, enclosure 12, accommodating space 13, LED chip 20, positive pin 31, bonding part 311, stretching part 312, first sub-stretching part 312a, second sub-stretching part 312b, third sub-stretching part 312c, pad part 313, negative pin 32, first pin 321, second pin 322, third pin 323, wire 40, dense film layer 50, transparent encapsulation layer 60. DETAILED DESCRIPTION

[0030] To make the objectives, features, and advantages of the present invention more readily apparent, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The accompanying drawings illustrate several embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are intended only to describe specific embodiments and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0032] Example 1

[0033] See also Figure 1 - Figure 3 The first embodiment of the present invention provides a TOP lamp bead device. The lamp bead device shown in this embodiment includes an LED bracket 10, which includes a base 11 and a fence 12 extending from the edge of the base 11, commonly known as a bowl cup, thereby enclosing a receiving space 13 on the base 11. The LED chip 20 is arranged in the receiving space 13 and is located above the base 11. In the receiving space 13, a transparent encapsulation layer 60 is provided on the inner side of the fence 12. The transparent encapsulation layer 60 is usually formed by filling glue in the receiving space 13 and fixing it, which is used to protect the front of the lamp bead device.

[0034] The LED chips 20 disposed on the base 11 within the accommodating space 13 include a first LED chip, a second LED chip, and a third LED chip, such as an R-LED chip, a G-LED chip, and a B-LED chip, which are configured to emit red, green, and blue light, respectively. The base 11 of the LED holder has an adhesive portion for securing the LED chips. The first, second, and third LED chips are each secured to the base 11 via the adhesive portion, such as silver glue.

[0035] The first, second, and third LED chips are bonded to the positive and negative pins 31 and 32 of the lamp bead device via wires 40. Both the positive and negative pins 31 and 32 are stamped metal parts. The positive pin 31 is a common-pole pin, of which there is one, while the negative pins 32 are polarized pins, of which there are three: a first pin 321, a second pin 322, and a third pin 323. The positive electrodes of the first, second, and third LED chips are bonded to the bonding portion 311 of the positive pin 31 via wires 40, while the negative electrodes of the first, second, and third LED chips are bonded to the bonding portions 311 of the first, second, and third pins 323, respectively, via wires 40.

[0036] Specifically, the positive electrode pin 31 and the negative electrode pin 32 are both metal structures, usually made of copper metal. This is because copper has good electrical conductivity, ductility and corrosion resistance, and is relatively chemically stable.

[0037] In this embodiment, since the structures of the first pin 321, second pin 322, and third pin 323 of the positive pin 31 and the negative pin 32 are substantially identical, the structure of the metal pin used for electrical connection shown in this embodiment is described in detail using the positive pin 31 as an example. The positive pin 31 is formed on the LED bracket 10 by injection molding and includes a bonding portion 311, a stretched portion 312, and a pad portion 313. The bonding portion 311 is used to connect to the LED chip via a wire 40. The pad portion 313 extends from the LED bracket 10 and is exposed outside the base 11 for soldering and fixing to the circuit board. The stretched portion 312 is connected between the bonding portion 311 and the pad portion 313 and is surrounded by the base 11 and the enclosure 12. This increases the length of the positive pin 31, thereby increasing the contact area between the positive pin 31 and the LED bracket 10, thereby lengthening the intrusion path of water vapor from the positive pin 31 to the LED bracket 10.

[0038] More specifically, in this embodiment, in order to further extend the intrusion path of water vapor from between the positive pin 31 and the LED bracket 10, the stretching portion 312 of the positive pin 31 is provided with multiple sub-stretching portions, including a first sub-stretching portion 312a, a second sub-stretching portion 312b and a third sub-stretching portion 312c, wherein the first sub-stretching portion 312a is transitionally connected to the bonding portion 311 on the base 11, and the second sub-stretching portion 312b is transitionally connected to the pad portion 313 exposed outside the base 11. The so-called transition connection is a smooth arc connection, and the third sub-stretching portion 312c is connected between the first sub-stretching portion 312a and the second sub-stretching portion 312b.

[0039] It should be noted that the orientations of the first sub-stretching portion 312a and the second sub-stretching portion 312b at both ends of the third sub-stretching portion 312c can be the same or different, depending on the form of the positive pin 31. For example, when the positive pin 31 is an inner pin, that is, the form shown in this embodiment, the first sub-stretching portion 312a and the second sub-stretching portion 312b at both ends of the third sub-stretching portion 312c have the same orientation, both facing the inner side of the LED bracket 10. When the positive pin 31 is an outer pin, the orientations of the first sub-stretching portion 312a and the second sub-stretching portion 312b at both ends of the third sub-stretching portion 312c are opposite to each other, specifically, the first sub-stretching portion 312a faces the inner side of the LED bracket 10, while the second sub-stretching portion 312b faces the outer side of the LED bracket 10.

[0040] The above illustrates the structure of the first pin 321, the second pin 322, and the third pin 323 of the positive pin 31 and the negative pin 32 in this embodiment by taking the positive pin 31 as an example. This can effectively increase the length of the metal pin and extend the intrusion path of water vapor from the gap between the metal pin and the LED bracket 10, thereby improving the sealing of the lamp bead device.

[0041] However, since the LED bracket 10 is made of PPA material, and the positive pin 31 and the negative pin 32 are both metal pins, there is a material difference between the two, which inevitably results in a gap between the positive pin 31 and the negative pin 32 when they are provided on the LED bracket 10 by injection molding. In order to further improve the sealing between the positive pin 31, the negative pin 32 and the LED bracket 10 in this embodiment, a coating is performed on the outer side of the positive pin 31 and the negative pin 32 to form a dense film layer 50, so that the dense film layer 50 can block the gap between the positive pin 31, the negative pin 32 and the LED bracket 10, thereby improving the sealing.

[0042] For example, still taking the positive pin 31 as an example, in this embodiment, the dense film layer 50 is respectively formed on the inner and outer sides of the positive pin 31, so that the dense film layers 50 on both sides are respectively in contact with the inner base 11 and the outer enclosure 12, thereby eliminating the gap between the positive pin 31 and the base 11 and the enclosure 12, so that water vapor cannot invade from between the positive pin 31 and the LED bracket 10, thereby improving the sealing.

[0043] It should also be noted that the dense film layer 50 formed on both sides of the positive pin 31 shown in this embodiment is continuously formed on both sides of the first sub-stretching portion 312a, the second sub-stretching portion 312b and the third sub-stretching portion 312c, respectively. The formation length of the dense film layer 50 is equal to or basically equal to the length of the stretching portion, so the dense film layer 50 can fit into the stretching portion of the specific structural form in the positive pin 31 to improve the sealing.

[0044] In this embodiment, the dense film layer 50 is formed by CVD coating, for example, SiO2 material, and its thickness is 400μm. The dense film layer 50 formed on both sides of the stretching part is 800μm in total, which can effectively seal the gap between the two sides of the stretching part and the base 11 and the enclosure 12.

[0045] Of course, the thickness of the dense film layer 50 should not be too thin or too thick. If the dense film layer 50 is too thin, good sealing cannot be guaranteed. If the dense film layer 50 is too thick, the structural stability of the metal pins on the LED bracket 10 cannot be guaranteed. The thickness can be selected between 300μm-500μm.

[0046] Compared with the prior art, the display TOP lamp bead device shown in this embodiment has the following beneficial effects:

[0047] The LED bracket 10 in the lamp bead device includes a base 11 and a fence 12, which enclose a accommodating space 13. The LED chip is arranged in the accommodating space 13 and is located on the base 11. The LED chip is bonded to the positive pin 31 and the negative pin 32 respectively through a wire 40. At least part of the surface of the positive pin 31 and the negative pin 32 is coated to form a dense film layer 50. When the positive pin 31 and the negative pin 32 are injected onto the LED bracket 10, they can contact the base 11 and / or the fence 12 through the dense film layer 50 on the positive pin 31 and the negative pin 32, thereby sealing the gap between the positive pin 31, the negative pin 32 and the LED bracket 10, making it difficult for water vapor to invade, thereby improving the sealing of the lamp bead device and ensuring the service life of the lamp bead device.

[0048] Example 2

[0049] The second embodiment of the present invention also provides a TOP display lamp bead device. The structure of the lamp bead device shown in this embodiment is basically similar to that of the lamp bead device shown in the first embodiment, except that:

[0050] In this embodiment, the dense film layer is only formed on the outside of the positive pin and the negative pin by CVD coating, that is, it is formed between the positive pin, the negative pin and the enclosure. The setting of the dense film layer improves the sealing between the positive pin, the negative pin and the enclosure, and the sealing of the lamp bead device can be improved. This is because water vapor usually invades from the side of the lamp bead device. By ensuring that the side of the lamp bead device has good sealing, it can also prevent water vapor from invading, which can mainly reduce the use of coating materials and appropriately reduce production costs.

[0051] Example 3

[0052] The third embodiment of the present utility model provides a light-emitting module, which includes the display TOP lamp bead device shown in any of the above embodiments, and also includes a circuit board, etc. The positive pin and the negative pin in the display TOP lamp bead device exposed at one end of the LED bracket are bonded to the solder joint of the circuit board, thereby completing the electrical connection between the display TOP lamp bead device and the circuit board.

[0053] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0054] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A TOP lamp bead device, characterized in that: The lamp bead device includes: An LED bracket, comprising a base and a fence extending from an edge of the base, wherein the fence is enclosed on the base to form an accommodating space, and an LED chip is arranged on the base in the accommodating space; A positive electrode pin, to which the positive electrode of the LED chip is connected via wire bonding; A cathode pin, to which the cathode of the LED chip is connected via wire bonding; And a dense film layer, the coating is formed on at least a portion of the surface of the positive pin and the negative pin that contacts the base and / or the enclosure.

2. The display TOP lamp bead device according to claim 1, characterized in that: The positive electrode pin and the negative electrode pin each include a bonding portion for connecting an LED chip, a stretching portion, and a pad portion for a circuit board, wherein the stretching portion is connected between the bonding portion and the pad portion.

3. The display TOP lamp bead device according to claim 2, characterized in that: The bonding portion extends into the accommodating space and is located on the base, the pad portion extends out of the LED bracket and is exposed outside the base, and the stretching portion is connected between the bonding portion and the pad portion and is wrapped by the base and the enclosure.

4. The display TOP lamp bead device according to claim 3, characterized in that: The positive electrode pin and the negative electrode pin are both fixed on the LED bracket by injection molding.

5. The display TOP lamp bead device according to claim 3, characterized in that: The stretching portion includes a first sub-stretching portion, a second sub-stretching portion and a third sub-stretching portion. The third sub-stretching portion is connected between the first sub-stretching portion and the second sub-stretching portion. The first sub-stretching portion and the second sub-stretching portion are transitionally connected to the bonding portion and the pad portion respectively.

6. The display TOP lamp bead device according to claim 5, characterized in that: The dense film layers are formed on both sides of at least one sub-stretching portion in the stretching portion by coating, so as to be in contact with the base and the enclosure respectively.

7. The display TOP lamp bead device according to claim 6, characterized in that: The dense film layer is continuously formed on both sides of the first sub-stretching portion, the second sub-stretching portion and the third sub-stretching portion by coating, so as to contact the base and the enclosure respectively.

8. The display TOP lamp bead device according to any one of claims 1 to 7, characterized in that: The thickness of the dense film layer is 300 μm-500 μm.

9. The display TOP lamp bead device according to claim 8, characterized in that: The LED chips include a first LED chip, a second LED chip, and a third LED chip, and the first LED chip, the second LED chip, and the third LED chip emit light of different colors; Any one of the positive electrode pin and the negative electrode pin is a common electrode pin, and the other is a polarity pin, including a first pin, a second pin and a third pin; One end of the first LED chip, the second LED chip and the third LED chip are all connected to the common pin, and the other ends are connected to the first pin, the second pin and the third pin respectively.

10. A light emitting module, characterized in that: The device comprises a display TOP lamp bead device as described in any one of claims 1 to 9.

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