Heat dissipation type diamond grinding disc

Abstract

The utility model belongs to the technical field of diamond grinding discs, and particularly relates to a heat dissipation type diamond grinding disc which comprises a base body, an annular face and a semicircular concave groove in the middle of the annular face, a mounting groove fixed to an angle grinder is formed in the middle of the semicircular concave groove, and a grinding block is welded to the annular face. The grinding blocks comprise the first grinding blocks and the second grinding blocks, the first grinding blocks and the second grinding blocks are annularly arrayed on the annular face and are arranged in a staggered mode, the width of the first grinding blocks is larger than that of the second grinding blocks, the first grinding blocks are provided with two first grooves, the second grinding blocks are provided with a second groove, and the first grooves are communicated with the second grooves. The second groove is located between the two first grooves; the diamond grinding blocks with different widths are arranged on the base body, the grooves with different positions are formed in the base body, the grooves can play a role in heat dissipation and auxiliary chip removal of the grinding blocks, the diamond grinding blocks can mutually cover a grinding area due to the fact that the positions of the grooves are different, the grinding quality is guaranteed, and repeated grinding operation is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of diamond grinding discs, and in particular relates to a heat dissipation type diamond grinding disc. Background Art

[0002] Diamond grinding disc is a kind of grinding tool. It is a processing tool made of diamond as abrasive and combined with composite materials. It is fixed on the joint of the grinder and is used for grinding. It can perform special-shaped processing on materials such as stone, ceramics, glass, and floor tiles. During the processing, the diamond grinding disc rubs against the material being ground to generate a large amount of heat and debris. The debris will affect the grinding quality, and the heat accumulation will affect the life of the diamond grinding disc. Utility Model Content

[0003] In response to the problems in the existing technology, the utility model provides a heat-dissipating diamond grinding sheet. By arranging diamond grinding blocks of different widths on the base and opening grooves at different positions on the diamond grinding blocks of different widths, the grooves can dissipate heat for the module and assist in chip removal. At the same time, different diamond grinding blocks have different groove positions, and different diamond grinding blocks can cover each other's grinding areas, thereby ensuring grinding quality and avoiding repeated grinding operations.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0005] The heat dissipation diamond grinding disc is characterized by:

[0006] The base comprises an annular surface and a semicircular concave groove in the middle of the annular surface, wherein a mounting groove for fixing the angle grinder is provided in the middle of the semicircular concave groove, and a grinding block is welded on the annular surface;

[0007] The grinding block includes a first grinding block and a second grinding block, wherein the first grinding block and the second grinding block are arranged in a ring array on an annular surface, the first grinding block and the second grinding block are arranged alternately, the width of the first grinding block is greater than that of the second grinding block, two first grooves are formed on the first grinding block, and a second groove is formed on the second grinding block, and the second groove is located between the two first grooves.

[0008] The first grinding block and the second grinding block will generate a lot of heat during the grinding process. The grinding block is large in size and the heat dissipation in the central part is relatively slow. Two first grooves are opened on the wider first grinding block. The first grooves can not only dissipate heat for the first grinding block, but also assist in chip removal, and timely discharge the debris generated in the grinding process; the second groove has the same function as the first groove, but the second grinding block is thinner than the first grinding block, and the contact area with the raw material to be ground is smaller, and the heat generated is smaller than the first grinding block, so only one second groove is opened. At the same time, the second groove is different from the first groove in position. The grinding area of ​​the second grinding block can cover the first groove area of ​​the first grinding block, and the grinding area of ​​the first grinding block can cover the second groove area of ​​the second grinding block. The mutual covering can make the grinding effect better and reduce dead angles.

[0009] Preferably, the gap formed by the first grinding block and the second grinding block is a chip groove, and the width of the chip groove gradually increases from the inside to the outside.

[0010] Preferably, the bottom surfaces of the first groove and the second groove are both arc-shaped.

[0011] Preferably, the second groove is provided in the middle of the second grinding block, and the first groove divides the first grinding block into three equal parts in length.

[0012] Preferably, an arc-shaped heat conduction groove is provided on the back side of the annular surface, and heat dissipation fins are clamped in the heat conduction groove, and the heat dissipation fins are arc-shaped.

[0013] Preferably, there are 3-5 temperature conducting grooves.

[0014] The beneficial effects of the present invention are as follows: grinding blocks of different widths are welded on the base in an annular array, and the first grinding block and the second grinding block are used together. The first groove and the second groove play a role in heat dissipation and auxiliary chip removal for the grinding blocks. The first grinding block with a larger width accumulates more heat and dissipates heat more slowly. Two first grooves are provided to uniformly dissipate heat for the first grinding block. The second grinding block is thinner and the heat accumulation is not as serious as the first grinding block. A second groove is provided to dissipate heat and remove chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic diagram of the structure of the heat dissipation diamond grinding disc in the embodiment;

[0016] Figure 2 for Figure 1 Schematic diagram of the enlarged structure of part A;

[0017] Figure 3 Schematic diagram of the top view of the heat dissipation diamond grinding disc in the embodiment;

[0018] Figure 4 Schematic diagram of the axial structure of the heat dissipation diamond grinding disc in the embodiment;

[0019] Figure 5 Schematic diagram of the explosion structure of the heat dissipation diamond grinding disc in the embodiment;

[0020] In the figure: 1. Base; 101. Annular surface; 102. Semicircular recessed groove; 103. Mounting groove; 2. Grinding block; 201. First grinding block; 202. Second grinding block; 203. First groove; 204. Second groove; 3. Chip removal groove; 4. Thermal conduction groove; 5. Heat dissipation fin. DETAILED DESCRIPTION

[0021] To make the objectives, technical solutions, and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are merely illustrative and are not intended to limit the scope of the present invention. Furthermore, descriptions of known structures and technologies are omitted in the following description to avoid unnecessary confusion regarding the concepts of the present invention.

[0022] Specific implementation examples Figure 1 、 2 , 3, 4 and 5, the heat dissipation type diamond grinding disc is characterized by: comprising

[0023] The base 1 includes an annular surface 101 and a semicircular recessed groove 102 in the middle of the annular surface 101. A mounting groove 103 for fixing the angle grinder is provided in the middle of the semicircular recessed groove 102. A grinding block is welded to the annular surface 101.

[0024] The grinding block 2 includes a first grinding block 201 and a second grinding block 202. The first grinding block 201 and the second grinding block 202 are arranged in a ring array on the annular surface 101. The first grinding block 201 and the second grinding block 202 are staggered. The first grinding block 201 is wider than the second grinding block 202. Two first grooves 203 are formed on the first grinding block 201, and a second groove 204 is formed on the second grinding block 202. The second groove 204 is located between the two first grooves 203.

[0025] like Figure 1 、 2 As shown in FIG3 , the gap formed by the first grinding block 201 and the second grinding block 202 is a chip groove 3 , and the width of the chip groove 3 gradually increases from the inside to the outside.

[0026] like Figure 1 、 2 As shown in FIG3 , the bottom surfaces of the first groove 203 and the second groove 204 are both arc-shaped.

[0027] like Figure 1 、 2As shown in FIG3 , the second groove 204 is provided in the middle of the second grinding block 202 , and the first groove 203 divides the first grinding block 201 into three equal parts in length.

[0028] like Figure 1 、 2 As shown in Figures 3, 4 and 5, an arc-shaped heat conduction groove 4 is provided on the back of the annular surface 101, and a heat dissipation fin 5 is clamped in the heat conduction groove 4, and the heat dissipation fin 5 is arc-shaped.

[0029] like Figure 4 and 5 As shown, there are 3-5 temperature conducting grooves 4 .

[0030] Working principle: When in use, the diamond grinding wheel is fixed on the angle grinder through the mounting slot, the angle grinder is started to drive the diamond grinding wheel to rotate, and the grinding block 2 is brought close to the raw material to be ground. The first grinding block 201 and the second grinding block 202 rotate to contact the raw material for grinding. During the grinding process, friction generates a large amount of heat. Part of the heat is transferred to the air through the outer surfaces of the first grinding block 201 and the second grinding block 202, and part of the heat is dissipated through the collective 1. The first groove 203 and the second groove 204 assist in heat dissipation and chip removal for the grinding block 3, which can increase the contact area with the air to achieve the effect of improving the heat dissipation efficiency, and at the same time discharge the debris generated by grinding; the heat conduction groove 4 and the heat dissipation fins 5 cooperate to transfer the heat in the base 1 to the air faster, thereby improving the heat dissipation efficiency.

[0031] It should be understood that the above-described specific embodiments of the present invention are merely illustrative of or explanation of the principles of the present invention and do not constitute limitations of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention shall be included within the scope of protection of the present invention. In addition, the appended claims of the present invention are intended to cover all variations and modifications that fall within the scope and metes and bounds of the appended claims, or equivalents thereof.

Claims

1. Heat dissipation diamond grinding disc, characterized by: include A base (1) comprises an annular surface (101) and a semicircular recessed groove (102) in the middle of the annular surface (101); a mounting groove (103) for fixing to an angle grinder is provided in the middle of the semicircular recessed groove (102); and a grinding block is welded to the annular surface (101); The grinding block comprises a first grinding block (201) and a second grinding block (202), wherein the first grinding block (201) and the second grinding block (202) are arranged in an annular array on an annular surface (101), the first grinding block (201) and the second grinding block (202) are arranged in an alternating manner, the first grinding block (201) is wider than the second grinding block (202), two first grooves (203) are provided on the first grinding block (201), and a second groove (204) is provided on the second grinding block (202), and the second groove (204) is located between the two first grooves (203).

2. The heat dissipation diamond grinding disc according to claim 1, characterized in that: The gap formed by the first grinding block (201) and the second grinding block (202) is a chip removal groove (3), and the width of the chip removal groove (3) gradually increases from the inside to the outside.

3. The heat dissipation diamond grinding disc according to claim 1, characterized in that: The bottom surfaces of the first groove (203) and the second groove (204) are both arc-shaped.

4. The heat dissipation diamond grinding disc according to claim 1, characterized in that: The second groove (204) is arranged in the middle of the second grinding block (202), and the first groove (203) divides the first grinding block (201) into three equal parts in length.

5. The heat dissipation diamond grinding disc according to claim 1, characterized in that: An arc-shaped heat conduction groove (4) is provided on the back of the annular surface (101), and a heat dissipation fin (5) is clamped in the heat conduction groove (4), and the heat dissipation fin (5) is arc-shaped.

6. The heat dissipation diamond grinding disc according to claim 5, characterized in that: The number of the temperature conducting grooves (4) is 3-5.

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