Environmental detection optical transceiver assembly

Abstract

The utility model discloses an environment detection optical transmit-receive assembly, comprising an upper shell, a lower shell spliced with the upper shell, and a substrate installed between the upper shell and the lower shell, the upper shell is provided with a heat dissipation component, the heat dissipation component comprises a communication port arranged in the upper shell, and support plates symmetrically arranged at the inner side of the communication port, the semiconductor chilling plate is detachably arranged at the top of the supporting plate, and one end of the semiconductor chilling plate abuts against the top face of the base plate; symmetrically distributed fixing holes are formed in the semiconductor chilling plate, and a protection part is arranged on the upper shell; the protection part comprises a maintenance plate hinged to the top of the upper shell, a fixing block arranged at the bottom of the maintenance plate, and a fixing groove formed in the top of the upper shell and used for the fixing block to be inserted. The beneficial effects of the utility model are that through the designed heat dissipation component, the heat dissipation performance of the substrate during working is increased, the maintenance frequency of the substrate is reduced, and the service life is prolonged.

Description

Technical Field

[0001] The utility model belongs to the technical field of optical transceiver components, and in particular relates to an optical transceiver component for environmental detection. Background Art

[0002] Optical transceivers can convert optical signals into electrical signals and vice versa. This conversion process is particularly important in environmental monitoring. Optical sensors, as a key part of optical transceivers, can detect various parameters in the environment based on changes in light absorption, scattering or emission.

[0003] The optical transceiver component and fiber optic cable module with announcement number CN209590344U discloses a substrate, a light receiving subassembly, and multiple light transmitting subassemblies; the light receiving subassembly is arranged on the substrate, and the multiple light transmitting subassemblies are connected to the substrate, wherein the multiple light transmitting subassemblies are staggered.

[0004] The base plate is installed between the upper shell and the lower shell, and heat is dissipated through the gap between the base plate and the upper shell. The heat dissipation effect is poor, which increases the frequency of maintenance. Utility Model Content

[0005] The purpose of the utility model is to provide an optical transceiver component for environmental detection, which can improve the heat dissipation performance of a substrate and reduce the frequency of maintenance.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an environmental detection optical transceiver assembly, comprising an upper shell, a lower shell spliced ​​and connected to the upper shell, and a substrate installed between the upper shell and the lower shell, wherein a heat dissipation component is provided on the upper shell, and the heat dissipation component includes a connecting port opened inside the upper shell, a support plate symmetrically arranged on the inner side of the connecting port, and a semiconductor refrigeration plate detachably arranged on the top of the support plate, and one end of the semiconductor refrigeration plate abuts against the top surface of the substrate.

[0007] Preferably, symmetrically distributed fixing holes are provided inside the semiconductor refrigeration plate, and a protective component is provided on the upper shell.

[0008] Preferably, the protective component includes a maintenance plate hinged to the top of the upper shell, a fixed block arranged at the bottom of the maintenance plate, a fixing groove opened at the top of the upper shell for inserting the fixed block, a telescopic spring symmetrically arranged on the inner side of the fixing groove, and a clip arranged at one end of the telescopic spring and capable of abutting against the fixed block.

[0009] Preferably, the clip is a trapezoidal structure, and the fixing block is a rectangular parallelepiped structure.

[0010] Preferably, a fixing handle is installed on the top of the maintenance plate, and the longitudinal section of the fixing handle is "T"-shaped.

[0011] Preferably, a connecting plate, a fixer, and a light receiving subassembly are installed on the top of the substrate, and a light emitting subassembly is installed on the connecting plate.

[0012] Preferably, it further comprises a reinforcing plate for fixing the upper shell and the lower shell, and the reinforcing plate has two through holes formed inside.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] Through the designed heat dissipation components, the heat dissipation performance of the substrate is increased during operation, the frequency of substrate maintenance is reduced, and the service life is extended. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram of the utility model;

[0016] Figure 2 This is a schematic diagram of the front view structure of the substrate of the present invention;

[0017] Figure 3 This is a schematic diagram of the top shell structure of the utility model;

[0018] Figure 4 For the utility model Figure 3 Schematic diagram of the enlarged structure of the E region;

[0019] Figure 5 This is a schematic diagram of the structure of the semiconductor refrigeration sheet of the utility model;

[0020] In the figure: 1. Upper shell; 11. Connecting port; 12. Support plate; 13. Fixing slot; 2. Maintenance plate; 21. Fixing handle; 22. Fixing block; 3. Base plate; 31. Connecting plate; 32. Light emitting subassembly; 33. Fixer; 4. Lower shell; 5. Reinforcement plate; 6. Semiconductor cooling plate; 61. Fixing hole; 7. Telescopic spring; 8. Clip. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] Example 1

[0023] See also Figure 1 、 Figure 2 、 Figure 3 and Figure 5, which is the first embodiment of the utility model, which provides an environmental detection optical transceiver component, including an upper shell 1 and a lower shell 4 spliced ​​with the upper shell 1. After the upper shell 1 and the lower shell 4 are spliced ​​together, a cavity for accommodating the substrate 3 is left. The substrate 3 is installed between the upper shell 1 and the lower shell 4, thereby realizing the addition of the substrate 3. The added substrate 3 increases the convenience of use. A heat dissipation component is provided on the upper shell 1, which includes a connecting port 11 opened inside the upper shell 1, thereby realizing the opening of the connecting port 11, a support plate 12 symmetrically arranged on the inner side of the connecting port 11, thereby realizing the addition of the support plate 12, and a semiconductor refrigeration plate 6 arranged on the top of the support plate 12 is disassembled and assembled. The support plate 12 increases the support for the semiconductor refrigeration plate 6, and one end of the semiconductor refrigeration plate 6 abuts against the top surface of the substrate 3. Through the contact between the semiconductor refrigeration plate 6 and the substrate 3, the heat dissipation performance of the substrate 3 during operation is increased, the frequency of maintenance of the substrate 3 is reduced, and the service life is extended.

[0024] In this embodiment, preferably, symmetrically distributed fixing holes 61 are opened inside the semiconductor refrigeration plate 6, so that the opening of the fixing holes 61 is realized, and it is convenient to increase the stability of the splicing of the semiconductor refrigeration plate 6 and the support plate 12 through the cooperation of the screws and the fixing holes 61.

[0025] In this embodiment, preferably, a connecting plate 31, a fixture 33, and a light receiving subassembly are installed on the top of the substrate 3, realizing the addition of the connecting plate 31, the fixture 33, and the light receiving subassembly, and a light emitting subassembly 32 is installed on the connecting plate 31, and support for the light emitting subassembly 32 is increased by the connecting plate 31. The light emitting subassembly 32 and the light receiving subassembly may include a transmitting circuit and a receiving circuit for transmitting electronic signals, more specifically, processing the timing or other protocol aspects of the electronic signal corresponding to the optical signal.

[0026] In this embodiment, preferably, a reinforcing plate 5 is further included to fix the upper shell 1 and the lower shell 4, and two through-holes are provided inside the reinforcing plate 5. The cooperation between the reinforcing plate 5 and the screws improves the stability of the splicing of the upper shell 1 and the lower shell 4.

[0027] Example 2

[0028] See also Figure 1-Figure 5 , which is the second embodiment of the present utility model, is based on the previous embodiment, except that:

[0029] The upper shell 1 is provided with a protective component, which includes a maintenance plate 2 hinged to the top of the upper shell 1, a fixed block 22 arranged at the bottom of the maintenance plate 2, which realizes the addition of the fixed block 22, a fixed groove 13 for inserting the fixed block 22 at the top of the upper shell 1, which realizes the opening of the fixed groove 13, and a telescopic spring 7 symmetrically arranged on the inner side of the fixed groove 13, which realizes the addition of the telescopic spring 7. A clip 8 is provided at one end of the telescopic spring 7 and can abut against the fixed block 22. When maintenance is required, the maintenance plate 2 is opened to expose the semiconductor refrigeration sheet 6 to the outside. When protecting, cover the maintenance plate 2, insert the fixing block 22 into the fixing groove 13, and squeeze the clip 8 when the fixing block 22 is inserted. After the clip 8 is squeezed, the telescopic spring 7 is compressed. After the telescopic spring 7 is compressed, it resets, driving the two clips 8 to clamp on the fixing block 22, so as to better play the protective performance; the clip 8 is a trapezoidal structure, and the fixing block 22 is a rectangular parallelepiped structure, which better realizes the cooperation between the clip 8 and the fixing block 22; a fixing handle 21 is installed on the top of the maintenance plate 2, which increases the convenience of opening the maintenance plate 2 through the fixing handle 21, and the longitudinal section of the fixing handle 21 is "T"-shaped.

[0030] It should be noted that the specific structure and working principle of the substrate 3, connecting plate 31, optical transmitting subassembly 32, fixture 33, and optical receiving subassembly in this application have been disclosed in the optical transceiver assembly and optical fiber cable module with announcement number CN209590344U.

[0031] The working principle and usage process of the utility model: When in use, install the substrate 3 on the lower shell 4, pick up the upper shell 1, and use the reinforcement plate 5 and screws to make the upper shell 1 and the lower shell 4 firmly spliced, and place the environmental detection optical transceiver component in the detection area to realize environmental detection.

[0032] Although the embodiments of the present invention have been shown and described, please refer to the detailed description above. It will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An optical transceiver assembly for environmental detection, characterized in that: The invention comprises an upper shell (1), a lower shell (4) spliced ​​and connected to the upper shell (1), and a base plate (3) installed between the upper shell (1) and the lower shell (4). The upper shell (1) is provided with a heat dissipation component, which comprises a communication port (11) opened inside the upper shell (1), a support plate (12) symmetrically arranged inside the communication port (11), and a semiconductor cooling plate (6) detachably arranged on the top of the support plate (12), wherein one end of the semiconductor cooling plate (6) abuts against the top surface of the base plate (3).

2. The optical transceiver assembly for environmental detection according to claim 1, characterized in that: The interior of the semiconductor refrigeration plate (6) is provided with symmetrically distributed fixing holes (61), and the upper shell (1) is provided with a protective component.

3. The optical transceiver assembly for environmental detection according to claim 2, characterized in that: The protective component comprises a maintenance plate (2) hinged to the top of the upper shell (1), a fixing block (22) arranged at the bottom of the maintenance plate (2), a fixing groove (13) provided at the top of the upper shell (1) for inserting the fixing block (22), a telescopic spring (7) symmetrically arranged on the inner side of the fixing groove (13), and a clip (8) arranged at one end of the telescopic spring (7) and capable of abutting against the fixing block (22).

4. The optical transceiver assembly for environmental detection according to claim 3, characterized in that: The clip (8) is a trapezoidal structure, and the fixing block (22) is a rectangular parallelepiped structure.

5. The optical transceiver assembly for environmental detection according to claim 3, characterized in that: A fixing handle (21) is installed on the top of the maintenance plate (2), and the longitudinal section of the fixing handle (21) is "T"-shaped.

6. The optical transceiver assembly for environmental detection according to claim 1, characterized in that: A connecting plate (31), a fixer (33), and a light receiving subassembly are installed on the top of the base plate (3), and a light emitting subassembly (32) is installed on the connecting plate (31).

7. The optical transceiver assembly for environmental detection according to claim 1, characterized in that: It also includes a reinforcing plate (5) for fixing the upper shell (1) and the lower shell (4), and two through-holes are provided inside the reinforcing plate (5).

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