Chip capacitor testing device
By designing a test device for the introduction plate and conductive plate, the lossless screening and recycling of chip capacitors is realized, the problem of difficulty in lossless screening of chip capacitors is solved, and the testing efficiency and resource utilization are improved.
Patent Information
- Application Number
- CN202422391655.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2034-09-29
AI Technical Summary
In the prior art, chip capacitors are difficult to be screened without loss after reliability test, resulting in difficulty in removing welding on PCB boards, resulting in waste.
A test device including an introduction plate, a PCB plate and a conductive plate is designed. The introduction plate is provided with an introduction hole. The conductive plate is elastically connected to the conductive member through an elastic member. The conductive member extends into the introduction hole and contacts the patch capacitor to realize current conduction and avoid welding.
The lossless screening and recycling of chip capacitors is realized, which reduces contact poor results due to external forces such as vibration, and improves testing efficiency and resource utilization.
Smart Images
Figure CN223308305U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of capacitor production and manufacturing, and in particular to a testing device for chip capacitors. Background Art
[0002] Multilayer ceramic capacitors (MLCCs), also known as chip capacitors, are known as the "rice of the electronics industry" and are widely used in automotive electronics, electrical control, power grid frequency modulation, instrumentation, aerospace, and other fields. MLCCs offer advantages such as high capacitance, small size, low cost, and high reliability. As the passive electronic component with the largest market share, they have become a key focus for technological innovation requiring breakthroughs in key technologies.
[0003] In order to ensure the reliability of the quality of multilayer ceramic capacitors and meet industry standards and specifications, reliability testing is often required for multilayer ceramic capacitors. Reliability testing includes HALT testing (Highly Accelerated Life Testing), high temperature testing, high humidity testing, high voltage testing, and thermal shock testing. In all of the above test items, the MLCC patches need to be soldered on the PCB board through a reflow oven. After the MLCC is tested, MLCCs with poor performance can be screened out and MLCCs with better performance can be retained. However, MLCCs that meet the performance test requirements are difficult to remove due to the soldered ends, making them difficult to recycle and resulting in a lot of waste. Utility Model Content
[0004] The present application provides a testing device for chip capacitors to solve the technical problem that chip capacitors are difficult to be non-destructively screened.
[0005] In a first aspect, an embodiment of the present application provides a test device for a chip capacitor, the test device comprising an import plate, a PCB board and a conductive plate. The import plate comprises a first surface and a second surface arranged opposite to each other, and the import plate is provided with a first import hole passing through the first surface and the second surface. The PCB board is arranged on the first surface, and the PCB board comprises a third surface facing the import plate, and the third surface is provided with a plurality of conductive circuits. The conductive plate is arranged on the second surface and is electrically connected to the plurality of conductive circuits, and the conductive plate comprises a main board, a conductive member and an elastic member, the conductive member is elastically electrically connected to the main board through the elastic member, and the elastic member is arranged facing the import plate. Wherein, the first import hole is constructed to accommodate a chip capacitor, the conductive member partially extends into the first import hole, and abuts against the chip capacitor.
[0006] In some embodiments, the testing device further includes a clamping portion, the clamping portion including a first clamping plate and a second clamping plate, the first clamping plate being disposed on a surface of the PCB facing away from the lead-in plate, and the second clamping plate being disposed on a surface of the conductive plate facing away from the lead-in plate. The first clamping plate includes a first connector and a second connector at each end, the first connector being hingedly connected to one end of the second clamping plate, and the second connector being detachably connected to the other end of the second clamping plate.
[0007] In some embodiments, the clamping portion further comprises a plurality of first insulating supports, which are attached to a side of the second clamping plate facing the conductive plate. A first spacing space is provided between two adjacent first insulating supports, and the conductive member is provided in the first spacing space.
[0008] In some embodiments, the elastic member includes a spring, which is sleeved on the conductive member. The mainboard has a second inlet hole, and the spring is partially disposed in the second inlet hole. The conductive member has a first end away from the mainboard, and the elastic member abuts between the first end and the mainboard, and the first end abuts the chip capacitor.
[0009] In some embodiments, the second connecting member includes a bolt and a nut, the bolt being connected to the surface of the first clamping plate facing the second clamping plate. The second clamping plate is provided with a first mounting hole, the bolt being passed through the first mounting hole and connected to the nut.
[0010] In some embodiments, the PCB further comprises a first positioning post disposed on the third surface and electrically connected to the conductive circuit. The lead-in plate further defines a first positioning hole extending through the first and second surfaces, and the conductive plate defines a second positioning hole. The first positioning post is sequentially disposed through the first and second positioning holes to electrically connect to the mainboard.
[0011] In some embodiments, the conductive plate further comprises a plurality of second insulating supports, the plurality of second insulating supports being disposed on a surface of the main board facing the lead-in plate, a second spacing space being disposed between adjacent second insulating supports, and the first lead-in hole being disposed in the second spacing space.
[0012] In some embodiments, the conductive member further includes a first abutting member disposed at the first end and abutting against the chip capacitor. The conductive member further includes a second end disposed opposite the first end and a second abutting member disposed at the second end and abutting against the mainboard.
[0013] In some embodiments, the PCB further includes a second positioning post disposed on the third surface. The lead-in plate further defines a third positioning hole extending through the first and second surfaces. The conductive plate further defines a fourth positioning hole, wherein the projection of the third positioning hole coincides with the projection of the fourth positioning hole along the direction from the conductive plate to the lead-in plate. The second positioning post is sequentially disposed through the third and fourth positioning holes, extending out of the fourth positioning hole.
[0014] In some embodiments, a first receiving groove is provided at the ends of the two clamping plates, a first clip is provided in the first receiving groove, and along the direction from the conductive plate to the introduction plate, the first connecting member has a third end and a fourth end relatively arranged, the fourth end is connected to the first clamping plate, a first clip hole is provided at the third end, the third end portion is received in the first receiving groove, and the first clip is clipped into the first clip hole.
[0015] Different from the prior art, the present application provides a test device for chip capacitors, which includes an import plate, a PCB board and a conductive plate. The import plate is provided with a first import hole, the first import hole accommodates the chip capacitor, the PCB board includes a number of conductive circuits, and the conductive plate is electrically connected to the number of conductive circuits. The conductive member in the conductive plate is elastically electrically connected to the mainboard through an elastic member, and the conductive member partially extends into the first import hole and abuts against the chip capacitor to achieve current conduction of the entire test device. In the above process, there is no need to solder the chip capacitor to the PCB board, and the integrity of the chip capacitor is maintained during recycling. The tested chip capacitor can be recycled repeatedly, achieving the purpose of non-destructive screening. The elastic member can provide appropriate contact pressure between the conductive member and the chip capacitor, reducing poor contact caused by external forces such as vibration and movement. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is a schematic diagram of the structure of some test devices provided in the embodiments of the present application;
[0017] Figure 2 It is a schematic structural diagram of some introduction plates provided in the embodiments of the present application;
[0018] Figure 3 This is a schematic diagram of the structure of some PCB boards provided in the embodiments of the present application;
[0019] Figure 4 Schematic diagram of the structure of some conductive plates provided in the embodiments of the present application;
[0020] Figure 5 Schematic diagram of the cross-sectional structure of some test devices provided in the embodiments of the present application;
[0021] Figure 6 This embodiment of the present application provides Figure 5 A magnified schematic diagram of point A in the middle;
[0022] Figure 7 This is a schematic diagram of a structure in which some elastic members are sleeved on conductive members according to an embodiment of the present application;
[0023] Figure 8 is a schematic diagram of the structure of some test devices provided in the embodiments of the present application;
[0024] Figure 9 It is a schematic structural diagram of some clamping parts provided in the embodiments of the present application;
[0025] Figure 10 Schematic diagram of the structure of some second splints provided in the embodiments of the present application;
[0026] Figure 11 Schematic diagram of the structure of some first splints and first connecting members provided in the embodiments of the present application;
[0027] Figure 12 This is a schematic structural diagram of some second connecting members provided in the embodiments of the present application.
[0028] Description of reference numerals:
[0029] 100. Testing device;
[0030] 10. Introducing plate; 11. First surface; 12. Second surface; 13. First introducing hole; 14. First positioning hole; 15. Third positioning hole;
[0031] 20. PCB board; 21. third surface; 211. conductive circuit; 22. first positioning post; 23. second positioning post;
[0032] 30. Conductive plate; 31. Main board; 311. Second inlet hole; 32. Conductive member; 321. First end portion; 322. Second end portion; 323. First abutting member; 324. Second abutting member; 33. Elastic member; 34. Second positioning hole; 35. Fourth positioning hole; 36. Second insulating support member; 37. Second spacing space;
[0033] 40. Clamping portion; 41. First clamping plate; 411. First fixing platform; 4111. First fixing hole; 412. Second fixing platform; 4121. Second fixing hole; 42. Second clamping plate; 421. First receiving groove; 422. First buckle; 423. First mounting hole; 43. First connecting member; 431. Third end portion; 4311. First clamping hole; 432. Fourth end portion; 44. Second connecting member; 441. Bolt; 442. Nut; 443. First fixing member; 444. Second fixing member; 45. First insulating support member; 46. First spacing space;
[0034] 200. Chip capacitors. DETAILED DESCRIPTION
[0035] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.
[0036] In the description of the embodiments of this application, the technical terms "first," "second," etc. are used only to distinguish different objects and should not be understood to indicate or imply relative importance or to implicitly indicate the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "several" means more than one, unless otherwise specifically defined.
[0037] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.
[0038] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive with other embodiments. Furthermore, the technical features described below in the different embodiments of the present application may be combined with each other as long as they do not conflict with each other.
[0039] In the first aspect, the present invention provides a test device 100 for a chip capacitor. Figure 1 The testing device 100 includes an introduction plate 10, a PCB board 20 and a conductive plate 30. The introduction plate 10 is arranged between the PCB board 20 and the conductive plate 30. The PCB board 20 can be electrically connected to the conductive plate 30.
[0040] For the above-mentioned introduction plate 10, please refer to Figure 2The introduction plate 10 has good insulation performance and is made of insulating materials, such as acrylic, glass fiber, rubber, etc. Along the thickness direction of the introduction plate 10, the introduction plate 10 includes a first surface 11 and a second surface 12 arranged opposite to each other, and the introduction plate 10 is provided with a first introduction hole 13 passing through the first surface 11 and the second surface 12. A plurality of first introduction holes 13 can be provided, and a plurality of first introduction holes 13 can be arranged in order on the introduction plate 10. The first introduction hole 13 is constructed to accommodate the chip capacitor 200. The inner diameter of the first introduction hole 13 is larger than the length of the top diagonal of the chip capacitor 200. The chip capacitor 200 can easily enter the first introduction hole 13 and can be conveniently taken out for recycling.
[0041] For the above PCB board 20, please refer to Figure 3 The printed circuit board (PCB) 20 supports electronic components and provides electrical connections. It is mounted on the first surface 11 of the lead-in board 10. The PCB 20 includes a third surface 21 facing the lead-in board 10. This third surface 21 is provided with a plurality of conductive traces 211, which connect different electronic components together and enable current to flow through the circuit.
[0042] For the above conductive plate 30, please refer to Figure 1 、 Figure 2 and Figure 4 The conductive plate 30 is disposed on the second surface 12 of the lead-in plate 10 and is electrically connected to a plurality of conductive lines 211. The conductive plate 30 includes a main plate 31, a conductive member 32, and an elastic member 33. The main plate 31 is the main body of the conductive plate 30 and is made of a conductive metal material, such as tin, aluminum, silver, copper, etc. Figure 5 and Figure 6 , the conductive member 32 is elastically electrically connected to the main board 31 through the elastic member 33, and the elastic member 33 is arranged facing the introduction plate 10. The conductive member 32 can be adaptively extended into or out of the first introduction hole 13 according to the size of the chip capacitor 200. The conductive member 32 needs to abut against the chip capacitor 200 to achieve line connectivity between the chip capacitor 200 and the PCB board 20 and the conductive plate 30. For example, when the length of the chip capacitor 200 is greater than the thickness of the introduction plate 10, after the chip capacitor 200 enters the first introduction hole 13, a small part will be exposed from the first introduction hole 13, and the conductive member 32 will abut against the chip capacitor 200 outside the first introduction hole 13. When the length of the chip capacitor 200 is less than the thickness of the introduction plate 10, the chip capacitor 200 is completely set in the first introduction hole 13, and the conductive member 32 partially extends into the first introduction hole 13 and abuts against the chip capacitor 200.
[0043] The elastic force of the elastic member 33 can be selected and adjusted according to the design requirements, so as to provide appropriate contact pressure between the conductive member 32 and the chip capacitor 200, which can ensure good electrical contact without damaging the chip capacitor 200 due to excessive voltage. The elasticity of the elastic member 33 can also keep the end of the conductive member 32 in contact with the chip capacitor 200, effectively reducing the phenomenon of poor contact caused by vibration, movement or other external forces. If there are manufacturing or installation errors in the conductive member 32 or the chip capacitor 200, the elastic deformation ability of the elastic member 33 can also compensate for these errors to a certain extent, so that the two always maintain good contact and ensure stable contact of the current.
[0044] In some embodiments, please refer to Figure 4 and Figure 7 The elastic member 33 includes a spring, which is sleeved on the conductive member 32. The main board 31 is provided with a second introduction hole 311, and the spring is partially provided in the second introduction hole 311, or the spring abuts against the surface of the main board 31 facing the introduction plate 10, and the conductive member 32 and the spring can move up and down in the second introduction hole 311. The conductive member 32 has a first end 321 away from the main board 31, and the spring abuts between the first end 321 and the main board 31, which can provide the conductive member 32 with an elastic force toward the introduction plate 10, so that the first end 321 abuts against the chip capacitor 200. Among them, along the thickness direction of the conductive plate 30, the projection of the second introduction hole 311 and the projection of the first introduction hole 13 are both distributed on the conductive line 211, so as to realize the electrical connection between the main board 31, the conductive member 32, the chip capacitor 200 and the conductive line 211. The spring sleeve is mounted on the conductive member 32 to provide appropriate contact pressure between the conductive member 32 and the chip capacitor 200, thereby ensuring good electrical contact and reducing poor contact caused by external factors such as vibration and movement.
[0045] For further information, please refer to Figure 6 and Figure 7 The conductive member 32 also includes a first abutting member 323, which is arranged at the first end 321 and abuts against the chip capacitor 200. The conductive member 32 also includes a second end 322 arranged opposite to the first end 321 and a second abutting member 324, which is arranged at the second end 322 and abuts against the mainboard 31. The first abutting member 323 and the second abutting member 324 can ensure close contact between the conductive member 32 and the mainboard 31 and the chip capacitor 200, reduce poor contact caused by factors such as vibration and temperature changes, and ensure stable current transmission. By increasing the contact area and pressure, the electrical connectivity between the first abutting member 323 and the chip capacitor 200, and the second abutting member 324 and the mainboard 31 is improved.
[0046] Please refer to Figure 5 and Figure 6When the chip capacitor 200 is placed in the first introduction hole 13, one end of the chip capacitor 200 is electrically connected to the conductive circuit 211, and the other end is electrically connected to the conductive member 32. Since the conductive plate 30 is electrically connected to the conductive circuit 211 on the PCB board 20, and the conductive member 32 is elastically electrically connected to the mainboard 31, the current conduction of the chip capacitor 200 in the test device 100 is realized. Compared with the traditional chip capacitor 200 test device 100, there is no need to solder the chip capacitor 200 on the PCB board 20 through a reflow oven, which saves a lot of manpower, material resources and time. Some inspections require a large number of chip capacitors 200. After the test is completed, for the chip capacitors 200 that meet the performance requirements, the chip capacitors 200 can be directly taken out of the first introduction hole 13 and recycled.
[0047] The embodiment of the present application provides a test device 100 for a chip capacitor, which includes an introduction plate 10, a PCB board 20 and a conductive plate 30. The introduction plate 10 is provided with a first introduction hole 13, the first introduction hole 13 accommodates the chip capacitor 200, the PCB board 20 includes a plurality of conductive lines 211, and the conductive plate 30 is electrically connected to the plurality of conductive lines 211. The conductive member 32 in the conductive plate 30 is elastically electrically connected to the main board 31 through an elastic member 33. The conductive member 32 partially extends into the first introduction hole 13 and abuts against the chip capacitor 200 to achieve current conduction of the entire test device 100. In the above process, there is no need to solder the chip capacitor 200 to the PCB board 20, and the integrity of the chip capacitor 200 is maintained during recycling, achieving the purpose of non-destructive screening. The elastic member 33 can provide appropriate contact pressure between the conductive member 32 and the chip capacitor 200, reducing the poor contact phenomenon caused by external forces such as vibration and movement.
[0048] In some embodiments, please refer to Figure 8 The test device 100 further includes a clamping portion 40, which includes a first clamping plate 41 and a second clamping plate 42. The first clamping plate 41 is disposed on the surface of the PCB board 20 away from the introduction plate 10, and the second clamping plate 42 is disposed on the surface of the conductive plate 30 away from the introduction plate 10. Figure 9 The first clamping plate 41 includes a first connector 43 and a second connector 44 at each end. The first connector 43 is hinged to one end of the second clamping plate 42, and the second connector 44 is detachably connected to the other end of the second clamping plate 42. The clamping portion 40 ensures the relative position of the PCB and the conductive plate 30 is stable. This is particularly important during testing, when the precise positional relationship between the PCB 20 and the conductive plate 30 needs to be maintained. The securing effect of the first and second clamping plates 41 and 42 reduces relative movement or misalignment between the PCB 20 and the conductive plate 30.
[0049] The first connecting member 43 is hinged to one end of the second clamping plate 42, so that the clamping portion 40 can be easily opened and closed during installation. Figures 9 to 11 A first receiving groove 421 is provided at the end of the second clamping plate 42, and a first clip 422 is provided in the first receiving groove 421. Along the direction from the conductive plate 30 to the introduction plate 10, the first connecting member 43 has a third end 431 and a fourth end 432 arranged opposite to each other. The fourth end 432 is connected to the first clamping plate 41, and a first clip hole 4311 is provided at the third end 431. The third end 431 is partially received in the first receiving groove 421, and the first clip 422 is clipped into the first clip hole 4311.
[0050] When the PCB board 20, the conductive plate 30 need to be replaced or repaired, or the chip capacitor 200 needs to be placed in the first lead-in hole 13, the second connector 44 is detachably connected to the other end of the second clamping plate 42, making it easy to remove the clamping part 40, thereby improving the efficiency of the test device 100 and saving time. For example, please refer to Figure 9 and Figure 12 The second connecting member 44 includes a bolt 441 and a nut 442. The bolt 441 is connected to the surface of the first clamping plate 41 facing the second clamping plate 42. Figure 10 and Figure 11 The bolt 441 is connected to one end of the first clamping plate 41 and has a first fixing member 443 and a second fixing member 444. The first clamping plate 41 is installed with a first fixing platform 411 and a second fixing platform 412. Along the width direction of the first clamping plate 41, the first fixing platform 411 has a first fixing hole 4111, and the second fixing platform 412 has a second fixing hole 4121. The first fixing member 443 can be inserted into the first fixing hole 4111 to connect with the first fixing platform 411, and the second fixing member 444 can be inserted into the second fixing hole 4121 to connect with the second fixing platform 412. The second clamping plate 42 has a first mounting hole 423. The bolt 441 is inserted into the first mounting hole 423 and is threadedly connected to the nut 442, so that the bolt 441 is firmly connected to the first clamping plate 41 and the disassembly and installation between the first clamping plate 41 and the bolt 441 are convenient. The nut 442 can be a hexagonal nut, a square nut, a round nut, a wing nut, etc.
[0051] For further information, please refer to Figure 8 and Figure 9The clamping portion 40 also includes a plurality of first insulating support members 45, which may be made of non-conductive rubber material. The plurality of first insulating support members 45 are fitted on the side of the second clamping plate 42 facing the conductive plate 30. The plurality of first insulating support members 45 can separate the conductive plate 30 from the second clamping plate 42, reducing the risk of short circuit that may be caused by direct contact between the second clamping plate 42 and the conductive plate 30. A first spacing space 46 is provided between two adjacent first insulating support members 45, and the conductive member 32 is provided in the first spacing space 46. The provision of the first spacing space 46 can reduce the squeezing of the conductive member 32 by the second clamping plate 42, so that the conductive member 32 can move flexibly up and down in the first spacing space 46. The chip capacitor 200 may generate heat when being tested. The first spacing space 46 allows air to flow around the conductive member 32, taking away some of the heat and maintaining the normal operation of the test device 100.
[0052] In some embodiments, please refer to Figure 3 The PCB board 20 further includes a first positioning post 22, which is disposed on the third surface 21 and electrically connected to the conductive circuit 211. The first positioning post 22 is made of a conductive metal, such as copper, iron, aluminum, etc. Figure 2 and Figure 4 The lead-in plate 10 further defines a first positioning hole 14 extending through the first surface 11 and the second surface 12, and the conductive plate 30 defines a second positioning hole 34. The first positioning post 22 is sequentially inserted through the first positioning hole 14 and the second positioning hole 34 and electrically connected to the mainboard 31. The first positioning post 22, the first positioning hole 14, and the second positioning hole 34 cooperate to precisely position the PCB 20, lead-in plate 10, and the conductive plate 30 during assembly, enabling each component to be quickly and accurately installed in the correct position, minimizing misalignment or offset. After the first positioning post 22 is electrically connected to the conductive circuit 211 and then to the mainboard 31, it enables current and signal transmission, improving the overall conductivity of the test device 100.
[0053] For further information, please refer to Figures 2 to 4The PCB board 20 also includes a second positioning post 23, which is disposed on the third surface 21. The lead-in plate 10 also defines a third positioning hole 15 extending through the first surface 11 and the second surface 12. The conductive plate 30 also defines a fourth positioning hole 35. Along the direction from the conductive plate 30 to the lead-in plate 10, the projection of the third positioning hole 15 coincides with the projection of the fourth positioning hole 35. The second positioning post 23 is sequentially disposed through the third positioning hole 15 and the fourth positioning hole 35, extending out of the fourth positioning hole 35. The second positioning post 23 further facilitates precise positioning during the assembly process of the PCB board 20, the lead-in plate 10, and the conductive plate 30. Multiple second positioning posts 23 may be provided. To reduce interference with the conductive circuit 211, the second positioning posts 23 may be disposed on all four sides of the PCB.
[0054] In some embodiments, please refer to Figure 4 and Figure 5 The conductive plate 30 also includes a plurality of second insulating supports 36, and the plurality of second insulating supports 36 are arranged on the surface of the main board 31 facing the introduction plate 10. The second insulating supports 36 can be made of rubber. The second insulating supports 36 have a certain elasticity to resist external pressure and stress, reduce deformation of the main board 31 and the introduction plate 10, and the second insulating supports 36 can provide a certain rigid support to maintain the shape and position of the main board 31. A second spacing space 37 is provided between two adjacent second insulating supports 36, and the first introduction hole 13 is provided in the second spacing space 37. The second spacing space 37 provides space for the conductive member 32 to move up and down, and the second spacing space 37 can promote air flow between the main board 31 and the introduction plate 10, which helps to dissipate heat.
[0055] It should be noted that the preferred embodiments of the present invention are given in the specification and drawings of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments do not serve as additional limitations on the content of the present invention. The purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. In addition, the above-mentioned technical features continue to be combined with each other to form various embodiments not listed above, which are all considered to be within the scope of the description of the present invention; further, it is obvious to those skilled in the art that improvements or changes can be made based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to the present invention.
Claims
1. A chip capacitor testing device, characterized in that: include: An introduction plate includes a first surface and a second surface disposed opposite to each other, wherein the introduction plate is provided with a first introduction hole penetrating through the first surface and the second surface; A PCB board is disposed on the first surface, the PCB board including a third surface facing the lead-in board, the third surface being provided with a plurality of conductive circuits; a conductive plate disposed on the second surface and electrically connected to the plurality of conductive lines, the conductive plate comprising a main board, a conductive member, and an elastic member, the conductive member being elastically electrically connected to the main board via the elastic member, and the elastic member being disposed facing the lead-in plate; The first introduction hole is configured to accommodate a chip capacitor, and the conductive member partially extends beyond the first introduction hole and abuts against the chip capacitor.
2. The testing device according to claim 1, wherein: The testing device further includes a clamping portion, the clamping portion including a first clamping plate and a second clamping plate, the first clamping plate being disposed on a surface of the PCB facing away from the lead-in plate, and the second clamping plate being disposed on a surface of the conductive plate facing away from the lead-in plate; Both ends of the first splint include a first connecting member and a second connecting member. The first connecting member is hinged to one end of the second splint, and the second connecting member is detachably connected to the other end of the second splint.
3. The testing device according to claim 2, characterized in that The clamping portion further includes a plurality of first insulating support members, which are attached to a side of the second clamping plate facing the conductive plate; A first spacing space is provided between two adjacent first insulating support members, and the conductive member is provided in the first spacing space.
4. The testing device according to claim 1, wherein: The elastic member includes a spring, and the spring is sleeved on the conductive member; The mainboard is provided with a second introduction hole, the spring portion is arranged in the second introduction hole, the conductive member has a first end away from the mainboard, the elastic member abuts between the first end and the mainboard, and the first end abuts against the chip capacitor.
5. The testing device according to claim 2, characterized in that: The second connecting member includes a bolt and a nut, and the bolt is connected to the surface of the first clamping plate facing the second clamping plate; The second clamping plate is provided with a first mounting hole, and the bolt is passed through the first mounting hole and connected with the nut.
6. The testing device according to claim 1, wherein: The PCB board further includes a first positioning post, which is disposed on the third surface and electrically connected to the conductive circuit; The introduction plate is further provided with a first positioning hole penetrating the first surface and the second surface, the conductive plate is provided with a second positioning hole, and the first positioning column is sequentially passed through the first positioning hole and the second positioning hole to be electrically connected to the main board.
7. The testing device according to claim 1, characterized in that The conductive plate further comprises a plurality of second insulating support members, wherein the plurality of second insulating support members are arranged on a surface of the main board facing the lead-in board; A second spacing space is provided between two adjacent second insulating support members, and the first introduction hole is provided in the second spacing space.
8. The testing device according to claim 4, characterized in that The conductive member further includes a first abutting member, which is disposed at the first end portion and abuts against the chip capacitor; The conductive member further includes a second end portion disposed opposite to the first end portion and a second abutting member, wherein the second abutting member is disposed at the second end portion and abuts against the mainboard.
9. The testing device according to claim 1, wherein: The PCB board further includes a second positioning post, and the second positioning post is arranged on the third surface; The introduction plate is further provided with a third positioning hole passing through the first surface and the second surface, and the conductive plate is further provided with a fourth positioning hole. Along the direction from the conductive plate to the introduction plate, the projection of the third positioning hole coincides with the projection of the fourth positioning hole. The second positioning column is sequentially passed through the third positioning hole and the fourth positioning hole, and the second positioning column extends out of the fourth positioning hole.
10. The testing device according to claim 2, characterized in that: The ends of the two clamping plates are provided with a first receiving groove, and a first clip is provided in the first receiving groove. Along the direction from the conductive plate to the introduction plate, the first connecting member has a third end and a fourth end that are relatively arranged. The fourth end is connected to the first clamping plate, and a first clip hole is provided at the third end. The third end portion is received in the first receiving groove, and the first clip is clipped into the first clip hole.