Surface mount type EEL laser module

Abstract

The utility model relates to the technical field of semiconductor luminescence, and discloses a surface mount type EEL laser module. The EEL laser module includes a first substrate, a second substrate, and an EEL light emitting chip. The second substrate is vertically arranged on the first substrate. The EEL light-emitting chip is arranged on the side face of the second substrate. The EEL light-emitting chip comprises a light outlet, the light outlet is formed in the side away from the first substrate, and the optical axis of light emitted by the light outlet is perpendicular to the first substrate. According to the EEL laser module, the first substrate and the second substrate which are perpendicular to each other and electrically connected are arranged, the EEL light-emitting chip is attached to the second substrate, the optical axis of the light outlet is adjusted to be perpendicular to the first substrate from being parallel to light emitting of the first substrate, the light emitting direction is changed, and vertical light emitting of the EEL laser module is achieved. The optical system is simple, small in size, low in production cost, high in light energy utilization rate and easy in optical design.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting, and in particular relates to a patch type EEL laser module. Background Art

[0002] Semiconductor light sources are widely used in various lighting equipment, detection equipment, lidar systems, and various electronic devices due to their advantages such as small size, low power consumption, long service life, and high brightness. Currently, the most common light sources include edge-emitting lasers (EELs), vertical-cavity surface-emitting lasers (VCSELs), solid-state lasers, and fiber lasers.

[0003] A structure in which the resonator is formed parallel to the semiconductor substrate and light is emitted from the cleaved side is generally referred to as an edge-emitting laser (EEL laser). Examples of these lasers include DFB, DBR, and FB lasers. On the other hand, lasers that emit light perpendicular to the semiconductor substrate surface are called surface-emitting lasers (SEL), such as VCSEL lasers. Compared to VCSEL lasers, EEL lasers offer advantages such as simpler manufacturing, higher emission power, and a wider range of applications. Figure 3 Schematic diagram of light emission of the EEL light emitting chip 3 . The EEL light emitting chip 3 emits light from the side and the far-field light spot 6 is an elliptical light spot.

[0004] Many application scenarios require the EEL laser to emit light vertically. The existing technology usually changes the light emission direction by changing the installation direction of the EEL laser. Specifically, the substrate with the EEL light-emitting chip is fixed to the side wall of the package copper tube. During installation, the copper tube is installed vertically so that the side of the EEL laser faces upward to meet the requirement of vertical light emission. The existing problem is that the vertical installation takes up a large space, has poor stability, and low precision, which cannot meet the requirements of the application scenario. At the same time, the side-emitting EEL laser cannot be directly added with a lens for optical shaping due to the limitation of the side space; although the space can be increased by adding a pad to increase the height of the light outlet 31 at the bottom, and then a lens can be added, such a setting has the problems of large system volume, high production cost, and large light loss at the bottom edge of the light outlet.

[0005] Prior art - Chinese patent CN219498481U describes an EEL laser module. The EEL laser module includes an EEL light-emitting chip and a prism module disposed on one side of the light-emitting surface of the EEL light-emitting chip. The prism module includes at least one prism, which has a first optical interface close to the EEL light-emitting chip for inputting light and a second optical interface facing away from the EEL light-emitting chip for outputting light. The first and second optical interfaces are flat or curved surfaces that form a predetermined angle with the optical axis of the EEL light-emitting chip.

[0006] The patented EEL chip's emitted light is deflected by the prism module at a predetermined angle to the substrate, thereby changing the direction of the light emitted by the EEL chip. However, the addition of the prism module complicates the system, increasing its size and production costs. Furthermore, the bottom edge of the emitted light near the substrate is absorbed by the substrate, resulting in significant light energy loss.

[0007] Based on the above, the current problem to be solved is to provide an EEL laser module with a small size, simple system, high light energy utilization, and a surface-mount vertical semiconductor substrate for light output. Utility Model Content

[0008] The purpose of the utility model is to provide a patch-type EEL laser module, aiming to solve the problems of the prior art of vertical light-emitting EEL laser modules, such as complex systems, large sizes, large light energy loss, and high production costs.

[0009] The utility model is implemented as follows: a patch type EEL laser module, comprising:

[0010] a first substrate;

[0011] a second substrate, which is vertically arranged on the first substrate;

[0012] An EEL light-emitting chip is arranged on the side of the second substrate; the EEL light-emitting chip includes a light outlet, which is arranged on the side of the second substrate away from the first substrate, and the optical axis of the light emitted by the light outlet is perpendicular to the first substrate.

[0013] Furthermore, it also includes gold wires, which are used to electrically connect the EEL light-emitting chip and the second substrate; the first substrate is electrically connected to the second substrate.

[0014] Furthermore, the upper surface of the first substrate includes a first conductive metal surface; the side surface of the second substrate includes a second conductive metal surface, and the EEL light-emitting chip is provided on the second conductive metal surface; the first conductive metal surface is connected to the second conductive metal surface.

[0015] Furthermore, the first substrate and the second substrate are integrally formed, or the first substrate and the second substrate are independently formed and then assembled.

[0016] Furthermore, a lens is provided on the first substrate, and the lens covers the second substrate and the EEL light-emitting chip.

[0017] Compared with the prior art, the SMD EEL laser module provided by the present invention has the following beneficial effects:

[0018] By providing a first substrate 1 and a second substrate 2 that are electrically connected and perpendicular to each other, and attaching an EEL light-emitting chip 3 to the second substrate 2, the present invention adjusts the optical axis of the light outlet 31 from being parallel to the first substrate 1 to being perpendicular to the first substrate 1, thereby changing the light output direction. Compared to existing technologies, this achieves light output direction deflection without the need for an additional prism module, resulting in a simpler optical system, a smaller size, and lower production costs.

[0019] At the same time, the EEL light-emitting chip 3 that emits light from the front has enough space to set a lens, which is conducive to optical shaping and easy optical design; and the light output angle is not limited, the emitted light will not be blocked by the substrate, and the light energy utilization rate is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the three-dimensional structure of the patch-type EEL laser module provided by the present invention;

[0021] Figure 2 This is a front view of the SMD EEL laser module provided by the utility model;

[0022] Figure 3 is a top view of an EEL laser module provided by the prior art;

[0023] In the figure: 1-first substrate; 11-first conductive metal surface; 2-second substrate; 21-second conductive metal surface; 3-EEL light-emitting chip; 31-light outlet; 4-gold wire. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0025] The implementation of the present invention is described in detail below with reference to specific embodiments.

[0026] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this utility model, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating directions or positional relationships, they are based on the directions or positional relationships shown in the drawings. This is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0027] Reference Figure 1-2The figure shows a preferred embodiment of the present invention.

[0028] Reference Figure 1-2 The surface-mount EEL laser module includes a first substrate 1, a second substrate 2, and an EEL light-emitting chip 3. The second substrate 2 is used to fix the EEL light-emitting chip 3 and is vertically arranged on the first substrate 1. Preferably, the second substrate 2 is arranged in the middle of the upper surface of the first substrate 1 to facilitate optical design.

[0029] The EEL light-emitting chip 3 is disposed on the side of the second substrate 2, that is, on the surface of the second substrate 2 perpendicular to the upper surface of the first substrate 1. The EEL light-emitting chip 3 includes a light outlet 31, which is disposed on the side facing away from the first substrate 1. The optical axis of the light emitted by the light outlet 31 is perpendicular to the first substrate 1, achieving frontal light emission. A gold wire 4 is also provided for electrically connecting the EEL light-emitting chip 3 to the second substrate 2. The first substrate 1 is electrically connected to the second substrate 2. The present invention achieves adjustment of the light emission direction from the side to the front by providing a first substrate 1 and a second substrate 2 that are electrically connected perpendicular to each other and attaching the EEL light-emitting chip 3 to the second substrate 2. The front-emitting EEL light-emitting chip 3 has sufficient space to set a lens for optical shaping, facilitating optical design. The bottom edge light of the light emitted by the existing edge-emitting EEL light-emitting chip is limited, and part of the light energy is absorbed by the substrate. The divergence angle of the light emitted by the present invention is not restricted, and the light energy utilization rate is higher.

[0030] Furthermore, a first conductive metal surface 11 is provided on the upper surface of the first substrate 1. A second conductive metal surface 21 is provided on the side of the second substrate 2 on which the EEL light-emitting chip 3 is provided. The EEL light-emitting chip 3 is disposed on the second conductive metal surface 21. The first conductive metal surface 11 is connected to the second conductive metal surface 21. Insulating grooves are provided on each of the first conductive metal surface 11 and the second conductive metal surface 21 to isolate the metal surfaces connected to the positive and negative electrodes.

[0031] Methods for combining the first substrate 1 and the second substrate 2: 1. Integrally forming the first substrate 1 and the second substrate 2. 2. Separately forming the first substrate 1 and the second substrate 2, and then vertically securing the first substrate 1 to the second substrate 2. The second method requires higher precision in manufacturing and placement.

[0032] To achieve a desired optical effect, a lens can be provided on the first substrate 1. The lens covers the second substrate 2 and the EEL light-emitting chip 3. Through optical design of the lens, a desired divergence angle and spot shape can be achieved, thereby realizing an optical shaping effect. The front-facing light output of this utility model facilitates integration of optical lenses.

[0033] This does not limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A surface mount EEL laser module, characterized in that: include: a first substrate (1); A second substrate (2) is arranged vertically on the first substrate (1); An EEL light-emitting chip (3) is provided on a side of the second substrate (2); the EEL light-emitting chip (3) comprises a light outlet (31), the light outlet (31) is provided on a side of the second substrate (2) facing away from the first substrate (1), and the optical axis of light emitted by the light outlet (31) is perpendicular to the first substrate (1).

2. The EEL laser module according to claim 1, characterized in that: It also includes a gold wire (4), which is used to electrically connect the EEL light-emitting chip (3) and the second substrate (2); the first substrate (1) is electrically connected to the second substrate (2).

3. The EEL laser module according to claim 1, wherein: The upper surface of the first substrate (1) includes a first conductive metal surface (11); the side surface of the second substrate (2) includes a second conductive metal surface (21), and the EEL light-emitting chip (3) is provided on the second conductive metal surface (21); the first conductive metal surface (11) is connected to the second conductive metal surface (21).

4. The EEL laser module according to claim 1, characterized in that: The first substrate (1) and the second substrate (2) are integrally formed, or the first substrate (1) and the second substrate (2) are independently formed and then assembled.

5. The EEL laser module according to claim 1, wherein: A lens is provided on the first substrate (1), and the lens covers the second substrate (2) and the EEL light-emitting chip (3).

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