Capacitance heat insulation controller circuit board

Abstract

The utility model belongs to the technical field of circuit boards, and particularly discloses a capacitor heat insulation controller circuit board which comprises a circuit board body, a capacitor body is arranged at the top of the circuit board body, and a heat insulation assembly is arranged at the bottom of the capacitor body. The heat insulation assembly comprises heat insulation blocks, the number of the heat insulation blocks is two, each heat insulation block is composed of a ceramic fiber layer, a middle layer and a heat insulation layer, a plurality of protruding blocks are arranged at the top of the ceramic fiber layer and evenly distributed along the axis of the ceramic fiber layer, and a plurality of air flow holes are formed in the middle layer. Through holes are formed in the ceramic fiber layer, the middle layer and the heat insulation layer, two pins are arranged at the bottom of the capacitor body, and the protruding blocks, the middle layer and the heat insulation layer are connected through glue in a bonding mode. The problems of performance reduction such as capacitance value change and leakage current increase caused by over-high temperature are reduced, and the normal working performance of the capacitor body is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and more specifically, to a controller circuit board with capacitor insulation. Background Art

[0002] In today's era of rapid electronic technology advancement, controller circuit boards, as core components of various electronic devices, are crucial for their performance and reliability. With the continuous miniaturization, integration, and high-power development of electronic devices, the density of electronic components on circuit boards is increasing, and the heat generated during operation is also increasing dramatically. Capacitors, as one of the most widely used and important components on controller circuit boards, play a key role in the stable operation of the entire electronic device.

[0003] However, in practical applications, capacitors often face the challenge of heat. On the one hand, the capacitor itself generates a certain amount of heat during operation due to factors such as dielectric loss and equivalent series resistance. On the other hand, heat generated by other electronic components on the circuit board and heat from the surrounding environment is also transferred to the capacitor through thermal conduction and radiation. If the capacitor is not effectively insulated, excessively high temperatures can lead to performance degradation, such as capacitance changes and increased leakage current, and even shorten the capacitor's service life, seriously affecting the reliability and stability of the electronic equipment. Utility Model Content

[0004] In order to solve the above problems, the present application provides a controller circuit board with capacitor insulation.

[0005] The present application provides a capacitor insulation controller circuit board that adopts the following technical solution:

[0006] A controller circuit board with capacitor insulation includes a circuit board body, a capacitor body is provided on the top of the circuit board body, and a heat insulation component is provided on the bottom of the capacitor body;

[0007] The thermal insulation component includes two thermal insulation blocks. Each thermal insulation block consists of a ceramic fiber layer, an intermediate layer and an insulation layer. A plurality of protrusions are provided on the top of the ceramic fiber layer. The plurality of protrusions are evenly distributed along the axis of the ceramic fiber layer. A plurality of air flow holes are opened inside the intermediate layer.

[0008] Through the above technical solution, the operating temperature of the capacitor body is reduced, and the performance degradation problems such as capacitance value change and leakage current increase caused by excessive temperature are reduced, thereby ensuring the normal working performance of the capacitor body.

[0009] Furthermore, through holes are provided inside the ceramic fiber layer, the middle layer and the thermal insulation layer, and two pins are provided at the bottom of the capacitor body.

[0010] Furthermore, the bumps, the middle layer and the heat insulation layer are connected by adhesive bonding.

[0011] Furthermore, an electronic component is provided on the top of the circuit board body, and two pins are plugged into corresponding through holes.

[0012] Furthermore, the plurality of bumps are in contact with the bottom of the capacitor body, and a groove is provided inside the middle layer.

[0013] Furthermore, an inflatable structure is provided inside the tank body, and the interior of the inflatable structure is filled with gas.

[0014] Through the above technical solution, the gas in the inflatable structure usually has a low thermal conductivity and can effectively prevent the conduction of heat. When the capacitor body heats up, the inflatable structure can reduce the transfer of heat to the circuit board body, thereby enhancing the thermal insulation effect of the entire insulation assembly.

[0015] Furthermore, the cross-sections of the multiple bumps are semicircular, and the multiple bumps are made of alumina ceramics.

[0016] Furthermore, after the plurality of bumps come into contact with the capacitor body, gaps are formed between the plurality of bumps and the ceramic fiber layer.

[0017] Through the above technical solution, multiple bumps have good thermal conductivity and high temperature resistance. When the capacitor body heats up, the bumps can quickly conduct heat to the ceramic fiber layer. At the same time, since the cross-section of the bump is semicircular, a gap is formed between the bump and the ceramic fiber layer after contacting the capacitor body. This gap can serve as a channel for air circulation, further promoting heat dissipation.

[0018] In summary, this application includes at least one of the following beneficial technical effects:

[0019] (1) The present invention reduces the operating temperature of the capacitor body through effective heat insulation measures, reduces performance degradation problems such as capacitance value changes and leakage current increases caused by excessive temperature, and ensures the normal working performance of the capacitor body;

[0020] (2) The multiple bumps of the present invention have good thermal conductivity and high temperature resistance. When the capacitor body heats up, the bumps can quickly conduct the heat to the ceramic fiber layer. At the same time, since the cross-section of the bump is semicircular, a gap is formed between the bump and the ceramic fiber layer after contacting the capacitor body. This gap can serve as a channel for air circulation, further promoting heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 It is a partial diagram of the utility model;

[0023] Figure 3 This is a schematic diagram of the pin and through-hole connection structure of the present invention;

[0024] Figure 4 This is a structural diagram of the thermal insulation block of the present utility model;

[0025] Figure 5 This is a schematic diagram of the connection structure between the intermediate layer and the inflatable structure of the present invention.

[0026] Explanation of the accompanying symbols: 1. Circuit board body; 2. Electronic component; 3. Capacitor body; 4. Pin; 5. Insulation block; 6. Bump; 7. Through hole; 8. Ceramic fiber layer; 9. Middle layer; 10. Air flow hole; 11. Insulation layer; 12. Inflatable structure. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application; it is obvious that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0028] Example 1

[0029] Reference Figure 1-Figure 5 A controller circuit board with capacitor insulation includes a circuit board body 1, a capacitor body 3 is provided on the top of the circuit board body 1, and a thermal insulation component is provided on the bottom of the capacitor body 3;

[0030] The thermal insulation assembly includes two thermal insulation blocks 5. Each thermal insulation block 5 is composed of a ceramic fiber layer 8, an intermediate layer 9 and an insulation layer 11. A plurality of protrusions 6 are provided on the top of the ceramic fiber layer 8. The plurality of protrusions 6 are evenly distributed along the axis of the ceramic fiber layer 8. A plurality of air flow holes 10 are opened inside the intermediate layer 9.

[0031] When the capacitor body 3 is working, it will generate heat due to dielectric loss and equivalent series resistance, etc. At the same time, the heat generated by other electronic components 2 on the circuit board and the heat of the surrounding environment may be transferred to the capacitor body 3 through heat conduction, heat radiation, etc.

[0032] The thermal insulation component at the bottom of the capacitor body 3 begins to work. The ceramic fiber layer 8 in the thermal insulation block 5 has excellent thermal insulation performance and can block most of the heat conduction. The multiple bumps 6 on the top of the ceramic fiber layer 8 are evenly distributed, which increases the contact area with the bottom of the capacitor body 3, making the heat transfer more dispersed and reducing the risk of local overheating.

[0033] The multiple air holes 10 inside the middle layer 9 form an air circulation channel. When the heat generated by the capacitor body 3 and the surrounding environment is transferred to the insulation block 5, the air in the air holes 10 rises due to the heat, generating natural convection. This natural convection accelerates the dissipation of heat. At the same time, the presence of air also blocks the transfer of heat to the circuit board body 1 to a certain extent.

[0034] The heat insulation layer 11 further enhances the heat insulation effect, prevents excessive heat from being transferred to the circuit board body 1 , and protects other electronic components 2 on the circuit board.

[0035] Through effective heat insulation measures, the operating temperature of the capacitor body 3 is reduced, and performance degradation problems such as capacitance value change and leakage current increase caused by excessive temperature are reduced, thereby ensuring the normal working performance of the capacitor body 3.

[0036] Reference Figure 3-Figure 5 The ceramic fiber layer 8, the middle layer 9 and the thermal insulation layer 11 are all provided with through holes 7. Two pins 4 are provided at the bottom of the capacitor body 3. The bumps 6, the middle layer 9 and the thermal insulation layer 11 are connected by adhesive bonding. The cross-section of the multiple bumps 6 is semicircular. The multiple bumps 6 are made of alumina ceramic. After the multiple bumps 6 come into contact with the capacitor body 3, gaps are formed between them and the ceramic fiber layer 8.

[0037] The through holes 7 opened inside the ceramic fiber layer 8, the middle layer 9 and the insulation layer 11 further enhance the heat insulation and heat dissipation effects. These through holes 7 can increase the surface area of ​​each layer so that heat can be dissipated more quickly. At the same time, the through holes 7 may also promote air circulation to a certain extent and enhance natural convection heat dissipation.

[0038] The multiple bumps 6 made of alumina ceramic have good thermal conductivity and high temperature resistance. When the capacitor body 3 heats up, the bumps 6 can quickly conduct the heat to the ceramic fiber layer 8. At the same time, since the cross-section of the bump 6 is semicircular, a gap is formed between the bump 6 and the ceramic fiber layer 8 after contacting the capacitor body 3. This gap can serve as a channel for air circulation, further promoting heat dissipation.

[0039] Example 2

[0040] Reference Figure 5 The plurality of bumps 6 are in contact with the bottom of the capacitor body 3 , a groove is provided inside the middle layer 9 , an inflatable structure 12 is provided inside the groove, and the inflatable structure 12 is filled with gas.

[0041] The gas in the inflatable structure 12 usually has a low thermal conductivity and can effectively prevent heat conduction. When the capacitor body 3 generates heat, the inflatable structure 12 can reduce the transfer of heat to the circuit board body 1, thereby enhancing the thermal insulation effect of the entire insulation assembly.

[0042] Working principle: When the capacitor body 3 is working, heat will be generated due to dielectric loss and equivalent series resistance. At the same time, the heat generated by other electronic components 2 on the circuit board and the heat of the surrounding environment may also be transferred to the capacitor body 3 through heat conduction, heat radiation and other methods. At this time, the thermal insulation component located at the bottom of the capacitor body 3 begins to play a role. The thermal insulation block 5 in the thermal insulation component is composed of a ceramic fiber layer 8, an intermediate layer 9 and a thermal insulation layer 11. The ceramic fiber layer 8 has excellent thermal insulation performance and can block most of the heat conduction. The multiple bumps 6 made of alumina ceramics are evenly distributed on the top. On the one hand, they increase the contact area with the bottom of the capacitor body 3, making the heat transfer more dispersed and reducing the risk of local overheating; on the other hand, when the capacitor body 3 heats up, the bumps 6 can quickly conduct the heat to the ceramic fiber layer 8. The cross-section of the bump 6 is semicircular. After contacting the capacitor body 3, a gap is formed between it and the ceramic fiber layer 8. This gap can be used as a channel for air circulation, further promoting heat dissipation. Multiple air holes 10 formed within intermediate layer 9 form air circulation channels. When heat generated by capacitor body 3 and the surrounding environment is transferred to thermal insulation block 5, the air in air holes 10 rises due to the heat, generating natural convection. This natural convection accelerates heat dissipation. At the same time, the presence of air also somewhat blocks the transfer of heat to circuit board body 1. Thermal insulation layer 11 further enhances the thermal insulation effect, preventing excessive heat from being transferred to circuit board body 1 and protecting other electronic components 2 on the circuit board.

[0043] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A controller circuit board with capacitor insulation, characterized in that: include: A circuit board body (1), wherein a capacitor body (3) is provided on the top of the circuit board body (1), and a heat insulation component is provided on the bottom of the capacitor body (3); A heat insulation component comprises a heat insulation block (5), wherein the number of the heat insulation blocks (5) is set to two, each of the heat insulation blocks (5) is composed of a ceramic fiber layer (8), an intermediate layer (9) and a heat insulation layer (11), a plurality of protrusions (6) are provided on the top of the ceramic fiber layer (8), and the plurality of protrusions (6) are evenly distributed along the axis of the ceramic fiber layer (8), and a plurality of air flow holes (10) are opened inside the intermediate layer (9).

2. The capacitor-insulated controller circuit board according to claim 1, characterized in that: Through holes (7) are provided inside the ceramic fiber layer (8), the middle layer (9) and the heat insulation layer (11), and two pins (4) are provided at the bottom of the capacitor body (3).

3. The capacitor-insulated controller circuit board according to claim 1, characterized in that: The convex block (6), the intermediate layer (9) and the heat insulating layer (11) are connected by adhesive bonding.

4. The capacitor-insulated controller circuit board according to claim 2, characterized in that: An electronic component (2) is provided on the top of the circuit board body (1), and the two pins (4) are distributed and plugged into corresponding through holes (7).

5. The capacitor-insulated controller circuit board according to claim 1, characterized in that: The plurality of protrusions (6) are in contact with the bottom of the capacitor body (3), and a groove is provided inside the middle layer (9).

6. The capacitor-insulated controller circuit board according to claim 5, characterized in that: An inflatable structure (12) is provided inside the tank body, and the interior of the inflatable structure (12) is filled with gas.

7. The capacitor-insulated controller circuit board according to claim 1, characterized in that: The cross sections of the plurality of protrusions (6) are semicircular, and the plurality of protrusions (6) are made of alumina ceramics.

8. The capacitor-insulated controller circuit board according to claim 1, characterized in that: After the plurality of protrusions (6) come into contact with the capacitor body (3), gaps are formed between the protrusions (6) and the ceramic fiber layer (8).

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