Translation type light sensing chip three-temperature sorting machine

Abstract

The utility model relates to a translation type light sensing chip three-temperature sorting machine, which relates to the field of three-temperature sorting machines and comprises a frame, and a Tray feeding module, an empty Tray module, an empty Tray module and three automatic Bin sorting modules are sequentially arranged on one side of the top of the frame. A high-precision feeding taking and placing module, a feeding shuttle car module, a testing head module, a discharging shuttle car module, a fixed Bin dividing module and a discharging taking and placing module are arranged on the other opposite side of the top of the frame, and an empty Tray carrying module, a camera pre-positioning module, a pre-warming module and a camera positioning module are arranged between the Tray feeding module and the feeding shuttle car module. And a refrigerating unit is arranged in the frame and below the pre-heating module. According to the utility model, the use cost can be reduced, the carrying precision can be improved, the chip can be positioned, the output efficiency can be improved, a light path system required by the light sensing chip test is integrated, the fogging problem of the light source, the lens and the chip under the low-temperature condition can be solved, and the accurate control of the temperature can be realized.

Description

Technical Field

[0001] The utility model relates to the field of three-temperature sorting machines, in particular to a translation type three-temperature sorting machine for photosensitive chips. Background Art

[0002] The three-temperature sorting machines currently available on the market are all for ordinary IC chips, and there are no three-temperature sorting machines for photosensitive chips (including CIS, TOF, lidar chips, etc.). With the use of automotive chips, three-temperature testing of photosensitive chips is required. There are currently some technical difficulties, especially in the low-temperature testing part. Ziyi's translational photosensitive chip three-temperature sorting machine has overcome these difficulties.

[0003] Existing IC three-temperature sorting machines, such as Figure 1 As shown in the figure, there are several disadvantages when targeting photosensitive chips: (1) high cost of replacement and inconvenient maintenance; (2) low pick-and-place accuracy, which can only adapt to the tolerance range of ±0.1mm; (3) mechanical guidance and positioning can easily cause product scratches and damage the chip; (4) the probe part cannot integrate the optical path structure; (5) under low temperature conditions, it is impossible to solve the fogging and low temperature resistance of the light source, lens, and chip itself; (6) the test station cannot reduce the chip temperature to the required test temperature.

[0004] The reasons for the above shortcomings are: (1) In the existing layout, there are two sets of loading and unloading shuttle modules and two sets of test head structures. Because the photosensitive chip probe part is expensive, occupies a large space, and has a low test cycle, this will increase the cost; (2) The existing synchronous belt structure has low accuracy without feedback; (3) The XY accuracy of pick-up and placement is low, and the height direction accuracy of the suction head is low. When the chip is placed in the pre-positioning module, the chip will collide with the side of the pre-positioning module, causing damage; (4) The existing test heads are all ordinary suction structures, which do not take into account the components required for photosensitive chip testing such as integrated light sources and lenses, and conventional components cannot be used under low temperature conditions. Special materials need to be used for high and low temperature environments; (5) Under low temperature conditions, the light source, lens and photosensitive chip surface will have the problem of fogging, which cannot be solved by the current three-temperature machine; (6) The current three-temperature machine's test station is cooled by cold air. This cooling method has two problems. First, the temperature can only be reduced to -30℃, which cannot meet the test requirements; second, this cooling method has the disadvantage of uneven temperature control. Utility Model Content

[0005] The purpose of this utility model is to provide a translational three-temperature sorting machine for photosensitive chips, reduce the use cost, improve the handling accuracy, chip positioning, improve the output efficiency, be compatible with a simple test board or a complete set of test machines, integrate the optical path system required for photosensitive chip testing, solve the fogging problem of the light source, lens, and chip itself under low temperature conditions, be able to perform low-temperature control on the test station, and achieve precise temperature control.

[0006] In order to achieve the above-mentioned purpose, the technical solution of the present invention provides a translational photosensitive chip three-temperature sorting machine, including a frame, on one side of the top of the frame are successively provided with a Tray loading module, an empty Tray out module, an empty Tray in module, and three automatic Bin modules, and the other side opposite to the top of the frame is provided with a high-precision loading and placing module, a loading shuttle module, a test head module, an unloading shuttle module, a fixed Bin module, and an unloading and placing module, an empty Tray transport module, a camera pre-positioning module, a pre-temperature module, and a camera positioning module are provided between the Tray loading module and the loading shuttle module, and a refrigeration unit is provided in the frame and below the pre-temperature module.

[0007] Preferably, a high-precision transmission mechanism is used in the moving parts of the high-precision loading and placing module and the loading shuttle module.

[0008] Preferably, for the light sensing chip, the probe part only uses a set of suction head and light source system, and the refrigerant sets and controls the temperature of the temperature control component through the refrigerant pipeline.

[0009] In summary, the present invention has the following beneficial technical effects:

[0010] The present invention can achieve: (1) a layout tailored to the characteristics of the test of the photosensitive chip, so that the customer has a low cost of use; (2) high-precision handling and chip positioning; (3) high UPH and high output efficiency; (4) the ability to connect to various test equipment, and can be compatible with a simple test board or a complete set of test machines; (5) the ability to integrate the optical path system required for the photosensitive chip test; (6) the ability to solve the fogging problem of the light source, lens, and chip itself under low temperature conditions; (7) the ability to perform low-temperature control on the test station and to achieve precise temperature control. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a top view schematic diagram of the prior art;

[0012] Figure 2 It is a structural diagram of the prior art;

[0013] Figure 3 This is a schematic diagram of the test head module structure in the prior art;

[0014] Figure 4 This is a schematic diagram of the partial structure of the test head module in the three-temperature sorting machine for translational photosensitive chips of this utility model. Figure 1 ;

[0015] Figure 5 This is a schematic diagram of the partial structure of the test head module in the three-temperature sorting machine for translational photosensitive chips of this utility model. Figure 2 ;

[0016] Figure 6 This is a schematic diagram of the high-precision loading and placing module structure of the utility model's translational photosensitive chip three-temperature sorting machine. Figure 1 ;

[0017] Figure 7 This is a schematic diagram of the high-precision loading and placing module structure of the utility model's translational photosensitive chip three-temperature sorting machine. Figure 2 ;

[0018] Figure 8 This is a schematic diagram of the partial structure of the test head module in the three-temperature sorting machine for translational photosensitive chips of this utility model. Figure 3 ;

[0019] Figure 9 This is a top view schematic diagram of the three-temperature sorting machine for translational photosensitive chips of the utility model;

[0020] Figure 10 This is a schematic diagram of the overall structure of the three-temperature translation type photosensitive chip sorting machine of the utility model;

[0021] Figure 11 This is a schematic diagram of the partial structure of the utility model's translational photosensitive chip three-temperature sorting machine Figure 1 ;

[0022] Figure 12 This is a schematic diagram of the partial structure of the test head module in the three-temperature sorting machine for translational photosensitive chips of this utility model. Figure 4 .

[0023] Reference numerals:

[0024] 1', loading and unloading shuttle module A; 2', testing module; 3', loading and unloading shuttle module B; 4', pre-positioning module; 5', loading and unloading module; 6', empty tray handling module; 7', fixed binning module; 8', unloading and unloading module; 9', tray loading module; 10', empty tray discharge module; 11', empty tray inlet module; 12', automatic binning module; 13', suction head system; 14', testing head module.

[0025] 1. Tray loading module; 2. Empty tray outflow module; 3. Empty tray inflow module; 4. Automatic binning module; 5. Empty tray handling module; 6. Camera pre-positioning module; 7. Pre-heating module; 8. Camera positioning module; 9. High-precision loading and unloading module; 10. Loading shuttle module; 11. Test head module; 12. Unloading shuttle module; 13. Fixed binning module; 14. Unloading and unloading module; 15. Frame; 16. Refrigeration unit; 17. Light source system; 18. Temperature control component; 19. Suction plate for sucking chip products; 20. Refrigerant pipeline; 21. Temperature control component; 22. Linear motor; 23. Test chamber; 24. Test station temperature control component. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] This embodiment is a translational, three-temperature sorting machine for optical chips, comprising a tray loading module 1, an empty tray discharge module 2, an empty tray inlet module 3, an automatic binning module 4, an empty tray transport module 5, a camera pre-positioning module 6, a pre-temperature module 7, a camera positioning module 8, a high-precision loading and placement module 9, a loading shuttle module 10, a test head module 11, an unloading shuttle module 12, a fixed binning module 13, an unloading and placement module 14, a frame 15, and a refrigeration unit 16.

[0028] Arranged on one side of the top of the frame 15 are a tray loading module 1, an empty tray discharge module 2, an empty tray inlet module 3, and three automatic binning modules 4. Arranged on the other side opposite the top of the frame 15 are a high-precision loading and placement module 9, a loading shuttle module 10, a test head module 11, an unloading shuttle module 12, a fixed binning module 13, and an unloading and placement module 14. An empty tray transport module 5, a camera pre-positioning module 6, a pre-heating module 7, and a camera positioning module 8 are provided between the tray loading module 1 and the loading shuttle module 10. A refrigeration unit 16 is provided within the frame 15 and below the pre-heating module 7.

[0029] The test head module 11 includes a test chamber 23, which houses a light source system 17, a temperature control assembly 18, and a suction plate 19 for sucking up chip products. Two refrigerant pipes 20 are vertically installed on both sides of the light source system 17. The bottom of the refrigerant pipes 20 connects to the top ends of the temperature control assembly 18. The high-precision loading and unloading module 9 is equipped with two linear motors 22.

[0030] The implementation principle of this utility model is as follows:

[0031] The tray loaded with photosensitive chips is transported to the designated location by the tray loading module 1, where it is positioned and clamped. The camera pre-positioning module 6 pre-positions the chips. The high-precision loading and placement module 9 picks up the chips from the tray and moves them to the camera positioning module 8 for precise positioning. After positioning, the chips are transferred to the pre-heating module 7 for preheating or pre-cooling. After pre-heating, the high-precision loading and placement module 9 picks up the chips from the pre-heating module 7 and transfers them to the loading shuttle module 10. The loading shuttle module 10 moves the chips to the loading position of the test head module 11. The test head module 11 picks up the chips from the loading shuttle module 10 and transfers them to the testing station for high-temperature or low-temperature testing. After the test is completed, the test head module 11 outputs the tested chips to the unloading shuttle module 12. The unloading shuttle module 12 transfers the chips to the unloading position. The unloading and placement module 14 places the chips into the designated tray based on the test results.

[0032] Among them, the empty tray transport module 5 transports the empty tray from the tray loading module 1 to the empty tray output module 2 for stacking and output; the empty tray can also be transported from the empty tray input module 3 to the automatic binning module 4.

[0033] The refrigeration unit 16 performs precise low-temperature control on the pre-heating module 7 , the loading shuttle module 10 , and the test head module 11 during the test process. Figure 11 The temperature control component of the middle test station can provide a lower temperature for the test part, which can reach below -45℃, far exceeding the traditional -30℃, and the temperature control is more uniform and precise.

[0034] Comparison analysis of traditional IC three-temperature sorting machine:

[0035] from Figure 7 and Figure 2 The contrast, Figure 8 As can be clearly seen from the enlarged view, the present invention has only one set of loading shuttle module 10 and unloading shuttle module 12, and only one set of fixture; there is also only one set of test head module 11, which reduces the cost of use for customers and improves maintainability.

[0036] High-precision transmission mechanisms are used in the moving parts of the loading and placing module and the loading shuttle module 10, and motion control algorithms are used to improve the picking and placing accuracy, so that the product will not be scratched when placed in the pre-positioning module.

[0037] from Figure 3 and Figure 4 From the comparison, it can be seen that the probe parts of the two devices are different. The traditional IC three-temperature sorting machine cannot integrate the structure of the optical path part, but the utility model can.

[0038] Compare the description of disadvantage (1) in the background technology:

[0039] like Figure 2 As shown, there are two sets of loading and unloading shuttle modules, the figure shows the loading and unloading shuttle module A and the loading and unloading shuttle module B. Each shuttle has two sets of fixtures, one for loading and the other for unloading. Figure 2 As shown in the figure, there are two sets of test head structures; the test head part of the traditional chip only has a suction head system, such as Figure 3 shown.

[0040] For the photosensitive chip, the probe part includes the light source system and the suction head system. Figure 3 As shown, in the layout of the traditional IC test and sorting machine, if the probe part of the photosensitive chip is arranged, it will take up a large space, be very inconvenient to maintain, and be costly.

[0041] In this utility model, for the light sensing chip, the probe part only uses a set of suction head and light source system. The refrigerant sets and controls the temperature of the temperature control component through the refrigerant pipe, thereby achieving temperature control of the product. Figure 5 shown.

[0042] Compare the description of disadvantage (2) in the background technology:

[0043] On existing IC three-temperature machines, the structure for handling chips is a synchronous belt mechanism, and there is no feedback element such as a magnetic scale in the horizontal direction. The result of this structure is low pick-and-place accuracy, which makes it less adaptable to products, especially photosensitive chips, which have high dimensional accuracy. This will cause scratches on the chips during the pick-and-place process. In this solution, in view of the high dimensional accuracy of photosensitive chips, a linear motor is used to drive the chip loading and handling mechanism, which ensures that the chip movement accuracy can be controlled within a certain range during the loading and placing process.

[0044] ±0.01mm, no scratches on the product during the pick-up and placement process.

[0045] Compare the description of disadvantage (3) in the background technology:

[0046] In existing IC three-temperature machines, chip positioning is performed mechanically by the pre-heating module 7. Because the pick-and-place mechanism uses a synchronous belt mechanism, the movement precision is low. When placing the chip into the positioning slot of the pre-heating module 7, it will inevitably cause scratches on the chip. While this impact is minimal for traditional packaged chips, it is more significant for photosensitive chips, and if edge chipping occurs, it can lead to product defects. Therefore, this solution implements three measures to address this issue. First, as mentioned above, a linear motor is used to drive the X and Y axes, achieving high movement precision. Second, before removing the material from the tray, the camera pre-positioning module 6 performs an initial positioning of the product in the tray, ensuring consistent precision when the suction head removes the material. Third, after removing the material, the camera positioning module 8 re-positions the product. The X and Y axes are calibrated based on the deviation values ​​captured by the camera, and then placed into the positioning slot of the pre-heating tray. This prevents scratches on the chip and thus damage to the chip.

[0047] Compare the description of disadvantage (4) in the background technology:

[0048] The existing IC three-temperature machine is only for ordinary chips, and the requirements for the probe part are only suction, temperature control and pressure application. However, the test for photosensitive chips requires an optical path system, which needs to be added. In this solution, the optical path system can be easily integrated into the probe part, such as Figure 4 shown.

[0049] Compare the description of disadvantage (5) in the background technology:

[0050] Existing IC three-temperature testers are designed for traditional chips, whose surfaces are plastic-encapsulated and less susceptible to fogging. A small amount of fogging does not affect testing. However, photosensitive chips, which often have glass-like components, are susceptible to fogging at low temperatures. If not properly addressed, this can affect light transmission and, consequently, test results. This solution utilizes an independent and sealed test chamber to control the dew point within it. Furthermore, low-dew-point dry air is blown onto the chip surface during testing, ensuring that the chip surface does not fog during testing.

[0051] Compare the description of disadvantage (6) in the background technology:

[0052] Existing IC three-temperature machines use only cold air to cool the lower cover of the test station. Under normal circumstances, the temperature can only be reduced to -30°C, and temperature control is not uniform. In this solution, not only does the cold air control the temperature, but the temperature of the lower cover of the test station is also controlled by refrigerant. This method not only ensures low temperature but also ensures temperature uniformity.

[0053] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. The three-temperature sorting machine for translational photosensitive chips is characterized by: The invention comprises a frame (15), wherein one side of the top of the frame (15) is provided with a tray loading module (1), an empty tray discharge module (2), an empty tray inlet module (3), and three automatic binning modules (4) in sequence; the other side opposite to the top of the frame (15) is provided with a high-precision loading and placing module (9), a loading shuttle module (10), a test head module (11), a unloading shuttle module (12), a fixed binning module (13), and an unloading and placing module (14); an empty tray transport module (5), a camera pre-positioning module (6), a pre-heating module (7), and a camera positioning module (8) are provided between the tray loading module (1) and the loading shuttle module (10); and a refrigeration unit (16) is provided in the frame (15) and below the pre-heating module (7).

2. The three-temperature sorting machine for translational photosensitive chips according to claim 1, characterized in that: High-precision transmission mechanisms are used in the moving parts of the high-precision loading and placing module (9) and the loading shuttle module (10).

3. The three-temperature sorting machine for translational photosensitive chips according to claim 1, characterized in that: For the photosensitive chip, the probe part only uses a set of suction heads and light source systems, and the refrigerant sets and controls the temperature of the temperature control component through the refrigerant pipeline.

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