Fingerprint identification module and layout structure thereof, and electronic equipment

Abstract

The utility model discloses a fingerprint identification module and a layout structure thereof, and an electronic device, and relates to the technical field of electronic devices, the fingerprint identification module comprises a lens cone, an accommodating space used for placing a chip is formed in the lens cone, and the layout structure of the fingerprint identification module comprises a plurality of fingerprint identification modules with the axis of the lens cone as a rotating shaft, the chip rotates relative to the lens cone until an arrangement included angle is formed between the rectangular long edge of the chip and the rectangular long edge of the accommodating space, and corner spaces for accommodating passive devices are respectively formed at opposite corner positions of the accommodating space. According to the utility model, the chip is rotated by taking the axis of the lens cone as the rotating shaft, the rectangular long edge of the chip is not parallel to the rectangular long edge forming the accommodating space in the lens cone, and the passive device is accommodated in one diagonal position of the accommodating space, so that the angular space of the accommodating space is fully utilized, and the beneficial effect of reducing the width of the lens cone is achieved; and a larger setting space is reserved for other accessories.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, and in particular to a fingerprint recognition module and a layout structure thereof, and electronic equipment. Background Art

[0002] At present, the performance requirements of fingerprint recognition modules in electronic devices are increasing, and the demand for miniaturization is becoming increasingly urgent, which poses challenges to the module structure design.

[0003] From the perspective of the structural design of an optical fingerprint module with a lens assembly, since each circular lens is installed within the through-hole wall of the lens barrel, this requires the through-hole wall to have a high degree of true roundness to ensure good concentricity between the lenses. This allows the lens to achieve high resolution and guarantee effective fingerprint imaging. To this end, the shape of the lens barrel manufactured using the injection molding process must avoid a large aspect ratio, and the center of the light hole should be as close as possible to the geometric center of the lens barrel shape. In addition, when the aspect ratio of the module is achieved, it is easier to assemble and layout the various components in the electronic device. Especially in mobile phones, appropriately reducing the width is more profitable, and reducing the width is a higher priority than reducing the length.

[0004] However, the existing module structure either has a large aspect ratio of the lens barrel, or the center of the light hole is not located at the geometric center of the lens barrel shape, or the lens barrel is relatively wide. In short, performance requirements and miniaturization requirements cannot be taken into account at the same time.

[0005] Therefore, how to achieve a balance between performance requirements and miniaturization requirements of the fingerprint recognition module is a technical problem faced by those skilled in the art. Utility Model Content

[0006] The purpose of the present utility model is to provide a fingerprint recognition module and its layout structure, as well as an electronic device, which at least solves the problem in the prior art that the optical fingerprint module structure with a lens assembly cannot meet both performance requirements and miniaturization requirements.

[0007] The above-mentioned purpose of the present invention can be achieved by adopting the following technical solutions:

[0008] The utility model provides a layout structure of a fingerprint recognition module, the fingerprint recognition module including a lens barrel, wherein a storage space for placing a chip is formed in the lens barrel. The layout structure of the fingerprint recognition module includes: with the axis of the lens barrel as the rotation axis, the chip is rotated relative to the lens barrel until an arrangement angle is formed between the long side of the rectangular chip and the long side of the rectangular storage space, and a pair of corner positions of the storage space respectively form an angular space for accommodating a passive device.

[0009] Preferably, an overall arrangement area capable of accommodating the chip and the passive device is formed in the accommodation space, and a first process safety distance is provided between an outer contour of the overall arrangement area and an inner contour of the accommodation space.

[0010] Specifically, when the width of the overall layout area is determined by the outer edge of the chip, the width of the accommodation space is determined by the first process safety distance, the layout angle, the length of the chip, and the width of the chip.

[0011] Preferably, wire bonding areas are respectively provided on the two rectangular short sides of the chip, and the first process safety distance is formed between the ends of the wire bonding areas and the inner contour of the accommodating space; a plurality of the passive devices are arranged side by side along the long side direction of the chip in each corner space, and a second process safety distance is provided between two adjacent passive devices, and a third process safety distance is provided between the passive devices in each corner space and the chip.

[0012] Specifically, when the width of the overall layout area is determined by the outer edge of the passive device, the width of the accommodating space is determined by the first process safety distance, the layout angle, the length of the chip, the width of the chip, the length of the passive device, the width of the passive device, the width of the wire bonding area of ​​the chip, and the distance between the outer end of the wire bonding area of ​​the chip and the outer end of the passive device along the direction of extension of the rectangular long side of the chip.

[0013] Preferably, a plurality of the passive devices are arranged side by side along the long side direction of the chip in each of the corner spaces, the first process safety distance is formed between the end of the passive device and the inner contour of the accommodating space, the second process safety distance is between two adjacent passive devices, and the third process safety distance is between the passive device and the chip in each of the corner spaces.

[0014] Further, when the width of the overall arrangement area is determined by the outer edge of the chip, the width of the overall arrangement area has a first value; when the width of the overall arrangement area is determined by the outer edge of the passive device, the width of the overall arrangement area has a second value; the minimum value of the width of the overall arrangement area is determined by the larger value of the first value or the second value.

[0015] Preferably, an optical element is provided in the lens barrel, and the geometric center of the optical element coincides with the geometric center of the chip.

[0016] Preferably, the passive components arranged in each of the corner spaces are centrally symmetrically arranged relative to the chip.

[0017] Preferably, two rectangular short sides of the chip respectively form wire bonding areas, and along the width direction of the chip, the wire bonding areas are provided with a plurality of pads arranged in parallel.

[0018] Another object of the present invention is to provide a fingerprint recognition module having the fingerprint recognition module layout structure as described above.

[0019] The present invention further provides an electronic device, comprising a display panel and the fingerprint recognition module as described above, wherein the fingerprint recognition module is arranged below the display panel.

[0020] The features and advantages of the present invention are as follows: the fingerprint recognition module provided by the present invention rotates the chip with the axis of the lens barrel as the rotation axis, the rectangular long side of the chip is arranged non-parallel to the rectangular long side of the accommodating space formed in the lens barrel, and the passive device is accommodated in one of the corner positions of the accommodating space, thereby making full use of the corner space of the accommodating space, thereby achieving the beneficial effect of reducing the width of the lens barrel and leaving more space for the installation of other accessories. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 This is a schematic diagram of the layout of the fingerprint recognition module provided in an embodiment of the present invention, in which the width of the overall arrangement area is determined by the outer edge of the passive device;

[0023] Figure 2 This is a schematic diagram of the layout of the overall arrangement area of ​​the fingerprint recognition module provided in an embodiment of the present invention, in a state where the width of the overall arrangement area is determined by the outer edge of the passive device;

[0024] Figure 3 This is a schematic diagram of the layout of the overall layout area of ​​the fingerprint recognition module provided in an embodiment of the present invention, in a state where the width of the overall layout area is determined by the outer edge of the chip;

[0025] Figure 4 This is a schematic diagram of the overall layout area of ​​the fingerprint recognition module provided in an embodiment of the present invention when the number of passive components is two;

[0026] Figure 5This is a schematic diagram of the overall layout area of ​​the fingerprint recognition module provided in an embodiment of the present invention when the number of passive components is three;

[0027] Figure 6 This is a schematic diagram of the layout of a fingerprint recognition module with better overall module performance and smaller lens barrel width in the prior art;

[0028] Figure 7 A flow chart for obtaining an optimal solution for the lens barrel width for the layout structure of the fingerprint recognition module provided in an embodiment of the present invention.

[0029] Description of Figure Numbers:

[0030] 100, lens barrel; 110, circular through hole;

[0031] 10. Accommodation space;

[0032] 20. Overall layout area;

[0033] 30. Corner space;

[0034] 1. Chip;

[0035] 2. Passive devices;

[0036] 3. Wire bonding area;

[0037] 4. Solder pad;

[0038] d1, first process safety distance; d2, second process safety distance; d3, third process safety distance; θ, layout angle. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0040] Implementation Method 1

[0041] like Figures 1 to 5As shown, the present invention provides a layout structure of a fingerprint recognition module, which includes a lens barrel 100, and a storage space 10 for placing a chip 1 is formed in the lens barrel 100. The layout structure of the fingerprint recognition module includes: with the axis of the lens barrel 100 as the rotation axis, the chip 1 is rotated relative to the lens barrel 100 until an arrangement angle θ is formed between its rectangular long side and the rectangular long side of the storage space 10, and a corner space 30 for accommodating a passive device 2 is formed at one of the corner positions of the storage space 10. The layout structure of the fingerprint recognition module provided by the present application is based on the prior art in which the rectangular long side of the chip 1 is parallel to the rectangular long side of the lens barrel 100. On the other hand, the chip 1 is rotated with the axis of the lens barrel 100 as the rotation axis, so that the rectangular long side of the chip 1 is not parallel to the rectangular long side of the storage space 10 formed in the lens barrel 100, and the passive device 2 is accommodated in one of the corner positions of the storage space 10, making full use of the corner space 30 of the storage space 10, thereby achieving the beneficial effect of reducing the width of the lens barrel 100 and leaving more space for other accessories.

[0042] Specifically, such as Figure 1 As shown, the geometric center of the chip 1 is arranged to coincide with the geometric center of the outer shape of the lens barrel 100, so as to minimize the width of the lens barrel 100 while taking into account the fingerprint recognition effect, thereby obtaining a larger installation space for other accessories such as batteries.

[0043] According to one embodiment of the present invention, an optical element is provided within the lens barrel 100, and the geometric center of the optical element is arranged to coincide with the geometric center of the chip 1. Specifically, the optical element has a circular shape and is assembled within the circular through hole 110 of the lens barrel 100. By aligning the geometric center of the optical element with the geometric center of the chip 1, the degree of coincidence between the geometric center of the optical element and the geometric center of the lens barrel 100 is ensured, thereby achieving a higher lens resolution capability and thus ensuring a better fingerprint imaging effect. The optical element includes a filter, a lens assembly consisting of multiple lenses, etc.

[0044] According to one embodiment of the present invention, an integral arrangement area 20 capable of accommodating the chip 1 and the passive device 2 is formed in the accommodation space 10, and a first process safety distance d1 is provided between the outer contour of the integral arrangement area 20 and the inner contour of the accommodation space 10. Specifically, Figure 1 As shown, the chip 1 and the passive device 2 are all located in the accommodating space 10 formed by the lens barrel 100. There is a first process safety distance d1 between the overall arrangement area 20 formed by the area where the chip 1 and the passive device 2 are located and the lens barrel 100. Due to construction process limitations, the first process safety distance d1 is not less than 0.2 mm.

[0045] According to one embodiment of the present invention, Figures 1 to 3As shown, wire bonding areas 3 are formed on the two short sides of the rectangular shape of chip 1. Multiple pads 4 are arranged in parallel along the width of chip 1 (the length of the short side of the rectangular shape of chip 1). Specifically, pads 4 are also provided on the circuit board. The pads 4 on the circuit board are bonded to the pads 4 on the wire bonding area 3 via wires to form pad pairs, thereby achieving electrical connection between chip 1 and the circuit board.

[0046] According to one embodiment of the present invention, when the width of the overall arrangement area 20 is determined by the outer edge of the chip 1, the width of the accommodation space 10 is determined by the first process safety distance d1, the arrangement angle θ, the length of the chip 1 (the length of the long side of the chip 1 rectangle), and the width of the chip 1 (the length of the short side of the chip 1 rectangle). Specifically, Figure 3 As shown, when the outer edge of the passive device 2 in the direction of the short side of the chip 1 rectangle is located within the outer edge of the wire bonding area 3 in the direction of the short side of the chip 1 rectangle, the width of the overall layout area 20 is determined by the outer edge of the chip 1. In this case, the outer edges of the wire bonding areas 3 on both sides of the chip 1 in the direction of the short side of the chip 1 rectangle are the width edges of the overall layout area 20. In this arrangement, the width of the accommodating space 10 is determined by the first process safety distance d1, the arrangement angle θ, the length of the chip 1 (the length of the long side of the chip 1 rectangle), and the width of the chip 1 (the length of the short side of the chip 1 rectangle).

[0047] According to a preferred embodiment of the present invention, wire bonding areas 3 are provided on the two short rectangular sides of the chip 1, and a first process safety distance d1 is formed between the end of the wire bonding area 3 and the inner contour of the accommodating space 10. At this time, the width of the overall layout area 20 is determined by the outer edge of the chip 1; a plurality of passive devices 2 are arranged side by side along the long side direction of the chip 1 in each corner space 30, and a second process safety distance d2 is provided between two adjacent passive devices 2, and a third process safety distance d3 is provided between the passive devices 2 in each corner space 30 and the chip 1. Specifically, the chip 1 is mounted and soldered on the circuit board through the passive devices 2 provided in each corner space 30, such as 1 to Figure 5 As shown, to achieve a stable connection between chip 1 and the circuit board while maintaining economic efficiency, two to four passive components 2 are typically provided. To minimize the width of the lens barrel 100, the length of the passive components 2 is parallel to the length of the chip 1 (the length of the long side of the rectangular chip 1). Multiple passive components 2 within the corner spaces 30 are arranged side by side along the long side of the chip 1, from the ends toward the center. When there is an even number of passive components 2, they are evenly distributed within each corner space 30. When there is an odd number of passive components 2, one corner space 30 contains an additional passive component 2, closer to the center of the chip 1.

[0048] According to a preferred embodiment of the present invention, the passive components 2 disposed in each corner space 30 are centrally symmetrically disposed relative to the chip 1. Specifically, Figures 1 to 4 As shown, the number of passive components 2 is set to an even number. The passive components 2 in each corner space 30 are arranged symmetrically with respect to the chip 1. The length direction of the passive components 2 is parallel to the length direction of the chip 1 (the length of the long side of the rectangular chip 1). The passive components 2 in each corner space 30 are arranged side by side along the long side of the chip 1, from the end of the chip 1 to the center. This ensures a stable connection between the chip 1 and the circuit board through symmetrical solder joints while also reducing the width of the lens barrel 100.

[0049] According to one embodiment of the present invention, when the width of the overall layout area 20 is determined by the outer edge of the passive device 2, the width of the accommodating space 10 is determined by the first process safety distance d1, the layout angle θ, the length of the chip 1 (the length of the long side of the chip 1 rectangle), the width of the chip 1 (the length of the short side of the chip 1 rectangle), the length of the passive device 2, the width of the passive device 2, the width of the wire bonding area 3 of the chip 1, and the distance between the outer end of the wire bonding area 3 of the chip 1 and the outer end of the passive device 2 along the direction of extension of the long side of the chip 1 rectangle. Specifically, as Figure 1 and Figure 2 As shown, when the outer edge of the passive device 2 in the direction of the short side of the chip 1 rectangle is located outside the outer edge of the wire bonding area 3 in the direction of the short side of the chip 1 rectangle, the width of the overall layout area 20 is determined by the outer edge of the passive device 2. In this case, the outer edge of the passive device 2 in the direction of the short side of the chip 1 rectangle is the width edge of the overall layout area 20. In this arrangement, the width of the accommodating space 10 is determined by the first process safety distance d1, the layout angle θ, the length of the chip 1 (the length of the long side of the chip 1 rectangle), the width of the chip 1 (the length of the short side of the chip 1 rectangle), the length of the passive device 2, the width of the wire bonding area 3 of the chip 1, and the distance between the outer end of the wire bonding area 3 of the chip 1 and the outer end of the passive device 2 along the direction of the long side of the chip 1 rectangle. The width of the wire bonding area 3 of the chip 1 in the direction of the long side of the chip 1 rectangle includes the main dimensions of the circuit board pad 4 and the safety distance between the circuit board pad 4 and the chip 1. Due to construction process limitations, the width of the wire bonding area 3 is no less than 0.3 mm.

[0050] According to a preferred embodiment of the present invention, Figure 1As shown, multiple passive components 2 are arranged side by side along the long side of the chip 1 within each corner space 30. A first process safety distance d1 is formed between the ends of the passive components 2 and the inner contour of the accommodation space 10. The width of the overall arrangement area 20 is determined by the outer edges of the passive components 2. A second process safety distance d2 is defined between adjacent passive components 2, and a third process safety distance d3 is defined between the passive components 2 and the chip 1 within each corner space 30. Due to construction process limitations, both the second process safety distance d2 and the third process safety distance d3 are no less than 0.2 mm.

[0051] According to one embodiment of the present invention, when the width of the overall arrangement area 20 is determined by the outer edge of the chip 1, the width of the overall arrangement area 20 has a first value; when the width of the overall arrangement area 20 is determined by the outer edge of the passive device 2, the width of the overall arrangement area 20 has a second value; the minimum value of the width of the overall arrangement area 20 is determined by the larger of the first value or the second value. Specifically, under the first value, second value, and minimum value of the width of the overall arrangement area 20, the width of the accommodating space 10 has a corresponding first determined value, second determined value, and minimum determined value.

[0052] When the width of the overall arrangement area 20 has a first value Y1, the width of the accommodation space 10 has a first determined value Y 10 :

[0053] Y1=Y 10 +2d1;

[0054] In the above formula, d1 is the first process safety distance d1, where,

[0055] Y 10 =N×cosθ+(M+2d)×sinθ;

[0056] In the above formula, N is the width of chip 1 (the length of the short side of the chip 1 rectangle), M is the length of chip 1 (the length of the long side of the chip 1 rectangle), d is the width of the wire bonding area 3, and θ is the layout angle θ.

[0057] When the width of the overall arrangement area 20 has a second value Y 20 When , the width of the accommodating space 10 has a second determined value Y2:

[0058] Y2=Y 20 +2d1;

[0059] In the above formula, d1 is the first process safety distance d1, where,

[0060] Y2=2×(D1+D2+D3); where

[0061] D1=(t-(d3+b)tanθ+2a+d2),

[0062]

[0063] In the above formula, D1, D2, and D3 represent the width segments as follows: Figure 2 As shown in the figure, d2 is the second process safety distance d2, d3 is the third process safety distance d3, a is the length of the passive device 2, b is the width of the passive device 2, N is the width of the chip 1 (the length of the short side of the rectangle of the chip 1), M is the length of the chip 1 (the length of the long side of the rectangle of the chip 1), d is the width of the wire bonding area 3, θ is the layout angle θ, and t is the distance between the outer end of the wire bonding area 3 of the chip 1 and the outer end of the passive device 2 along the extension direction of the long side of the rectangle of the chip 1.

[0064] When the width of the overall arrangement area 20 has the minimum value, the width of the accommodation space 10 has the minimum determination value Y min :

[0065] Y min =max{Y1,Y2}=max{Y 10 ,Y 20}+2d1;

[0066] By taking the larger value of the two cases as the minimum value of the width of the accommodating space 10, that is, the minimum value of the width of the lens barrel 100, the distance between the lens barrel 100 and the passive device 2 and the wire bonding area 3 of the chip 1 under this value simultaneously meets the first safety distance requirement, thereby avoiding interference between the lens barrel 100 and internal components.

[0067] The design process of the fingerprint recognition module layout structure provided by this application includes:

[0068] The size of the chip 1 is determined to be M×N (M≥N).

[0069] Determine the structural parameters, including the width d of the wire bonding area 3, the size a×b (a≥b) of the passive device 2, and the pairwise safety distances between components (first process safety distance d1, second process safety distance d2, and third process safety distance d3).

[0070] Determine the number of passive components 2 to be arranged in the lens barrel 100 COMP∈{2,3,4}; when the number of passive components 2 is 2, the layout of components in the lens barrel 100 is as follows: Figure 4 When the number of passive devices 2 is 3, the layout of components in the lens barrel 100 is as shown; Figure 5 When the number of passive devices 2 is 4, the layout of components in the lens barrel 100 is as shown; Figures 1 to 3 shown.

[0071] For reference Figure 6 As shown, it is obvious that when θ=0, when multiple passive devices 2 are arranged side by side on the same long side of the chip 1, better overall module performance and smaller lens barrel 100 width can be taken into account. At this time, the value of t (the distance between the outer end of the wire bonding area 3 of the chip 1 and the outer end of the passive device 2 along the extending direction of the rectangular long side of the chip 1) does not affect the width of the lens barrel 100. When θ=0, t=T (T is a non-negative real number). In this case, the minimum value of the width of the accommodating space 10 can be defined as Y min (0,T)=N+b+2d1.

[0072] The program (algorithm) can be used to find several (θ, t) combinations to make the minimum value Y of the width of the accommodation space 10 min (θ,t)<Y min (0,T), where θ>0, Y min (θ, t) = max{Y1(θ, t), Y2(θ, t)}; In fact, there is an array of (θ, t) that meets the conditions.

[0073] By continuing to iterate using the program (algorithm), we can find the (θ, t) combination with more significant or even the most significant beneficial effect.

[0074] The specific implementation of the above program (algorithm) can be found in Figure 7 As shown in the figure, in order to ensure the iteration effect, t_step and θ_step should not be too large. The recommended values ​​are t_step = 0.01 mm and θ_step = 0.1°.

[0075] Implementation Method 2

[0076] Another object of the present invention is to provide a fingerprint recognition module having the aforementioned fingerprint recognition module layout structure. By providing the aforementioned fingerprint recognition module layout structure, the fingerprint recognition module can achieve the technical effects achieved by the aforementioned fingerprint recognition module layout structure implementation. For details, please refer to the detailed description of the aforementioned implementation, which will not be repeated here.

[0077] Preferably, the length of the pad 4 of the passive device 2 is the size obtained by expanding the passive device 2 by 0.1mm on both sides along its length, and the distance between two adjacent passive devices 2 arranged side by side is not less than 0.2mm. For example, if the dimensions of the passive device 2 are 0.6mm×0.3mm, the dimensions of the pad 4 of the passive device 2 are 0.8mm×0.3mm, that is, the required layout dimensions of the passive device 2 are 0.8mm×0.3mm.

[0078] Implementation Method 3

[0079] The present invention also provides an electronic device comprising a display panel and a fingerprint recognition module as described above, wherein the fingerprint recognition module is disposed below the display panel. Specifically, the electronic device includes but is not limited to a mobile phone, a tablet, a computer, an in-vehicle terminal, etc., which is not limited in this application.

[0080] Based on the above description, the fingerprint recognition module provided in the embodiment of the present invention has the following beneficial effects:

[0081] The fingerprint recognition module provided in the embodiment of the present invention achieves the beneficial effect of reducing the width of the lens barrel 100 and leaving more space for the installation of other accessories by arranging the rectangular long side of the chip 1 non-parallel to the rectangular long side of the accommodating space 10 formed in the lens barrel 100 and accommodating the passive device 2 at one of the two corner positions of the accommodating space 10, and making full use of the corner space 30 of the accommodating space 10; and by arranging the geometric center of the optical element to coincide with the geometric center of the chip 1, the geometric center of the optical element is guaranteed to coincide with the geometric center of the outer shape of the lens barrel 100, thereby obtaining a higher lens resolution capability and thus ensuring a better fingerprint imaging effect; at the same time, the length direction of the passive device 2 is arranged parallel to the length direction of the chip 1 (the length of the rectangular long side of the chip 1), and the multiple passive devices 2 in the corner space 30 are arranged side by side along the long side direction of the chip 1 from the end of the chip 1 to the middle, so as to obtain a smaller width of the lens barrel 100 as possible.

[0082] The above are only several embodiments of the present invention. Those skilled in the art may make various changes or modifications to the embodiments of the present invention based on the contents disclosed in the application documents without departing from the spirit and scope of the present invention.

Claims

1. A layout structure of a fingerprint recognition module, the fingerprint recognition module comprising a lens barrel, wherein a receiving space for placing a chip is formed in the lens barrel, characterized in that: The layout structure of the fingerprint recognition module includes: with the axis of the lens barrel as the rotation axis, the chip is rotated relative to the lens barrel until an angle is formed between the long side of its rectangle and the long side of the rectangle of the accommodating space, and one pair of corner positions of the accommodating space respectively forms an angular space for accommodating passive components.

2. The layout structure of the fingerprint recognition module according to claim 1, characterized in that: An overall arrangement area capable of accommodating the chip and the passive device is formed in the accommodation space, and a first process safety distance is provided between an outer contour of the overall arrangement area and an inner contour of the accommodation space.

3. The layout structure of the fingerprint recognition module according to claim 2, characterized in that: When the width of the overall layout area is determined by the outer edge of the chip, the width of the accommodation space is determined by the first process safety distance, the layout angle, the length of the chip, and the width of the chip.

4. The layout structure of the fingerprint recognition module according to claim 2 or 3, characterized in that: Wire bonding areas are respectively provided on two rectangular short sides of the chip, and the first process safety distance is formed between the ends of the wire bonding areas and the inner contour of the accommodating space; In each corner space, a plurality of passive devices are arranged side by side along the long side direction of the chip, a second process safety distance is provided between two adjacent passive devices, and a third process safety distance is provided between the passive device and the chip in each corner space.

5. The layout structure of the fingerprint recognition module according to claim 2, characterized in that: When the width of the overall layout area is determined by the outer edge of the passive device, the width of the accommodating space is determined by the first process safety distance, the layout angle, the length of the chip, the width of the chip, the length of the passive device, the width of the passive device, the width of the wire bonding area of ​​the chip, and the distance between the outer end of the wire bonding area of ​​the chip and the outer end of the passive device along the direction of extension of the rectangular long side of the chip.

6. The layout structure of the fingerprint recognition module according to claim 2 or 5, characterized in that: In each of the corner spaces, a plurality of passive devices are arranged side by side along the long side direction of the chip, and the first process safety distance is formed between the end of the passive device and the inner contour of the accommodating space. There is a second process safety distance between two adjacent passive devices, and there is a third process safety distance between the passive device in each of the corner spaces and the chip.

7. The layout structure of the fingerprint recognition module according to claim 2, characterized in that: When the width of the overall arrangement area is determined by the outer edge of the chip, the width of the overall arrangement area has a first value; when the width of the overall arrangement area is determined by the outer edge of the passive device, the width of the overall arrangement area has a second value; The minimum value of the width of the overall arrangement area is determined by the larger value of the first value or the second value.

8. The layout structure of the fingerprint recognition module according to claim 1, characterized in that: An optical element is provided in the lens barrel, and the geometric center of the optical element coincides with the geometric center of the chip.

9. The layout structure of the fingerprint recognition module according to claim 1, characterized in that: The passive components arranged in each of the corner spaces are centrally symmetrically arranged relative to the chip.

10. The layout structure of the fingerprint recognition module according to claim 2, characterized in that: Two rectangular short sides of the chip respectively form wire bonding areas, and along the width direction of the chip, the wire bonding areas are provided with a plurality of pads arranged in parallel.

11. A fingerprint recognition module, characterized in that: The fingerprint recognition module has the layout structure of the fingerprint recognition module according to any one of claims 1 to 10.

12. An electronic device, characterized in that: The electronic device includes a display panel and the fingerprint recognition module according to claim 11, wherein the fingerprint recognition module is arranged below the display panel.

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