High-efficiency overclocking heat dissipation memory bank

Abstract

The utility model relates to the field of memory banks, in particular to an efficient overclocking heat dissipation memory bank which comprises a memory bank body, a bottom plate, a cover plate, a first heat conduction pad and a second heat conduction pad. In the using process of the memory bank body, heat on the memory bank body is more effectively conducted to the bottom plate and the cover plate which are made of metal materials through the first heat conduction pad and the second heat conduction pad and then dissipated to surrounding air through the bottom plate and the cover plate, and the surfaces of the bottom plate and the cover plate are provided with the grooves and the heat dissipation fins so that the surface areas of the bottom plate and the cover plate can be increased; therefore, the heat dissipation area is increased, the heat dissipation effect is improved, efficient heat dissipation of the memory bank body is achieved, stable operation of the memory bank body in a high-temperature environment is guaranteed, and the service life of the memory bank body is prolonged. And the first air holes and the second air holes are formed, so that air can directly blow the memory bank main body, heat on the memory bank main body is taken away, and the heat dissipation effect on the memory bank main body is further improved.

Description

Technical Field

[0001] The utility model relates to the field of memory bars, in particular to a memory bar with high efficiency overclocking and heat dissipation. Background Art

[0002] The memory stick is an indispensable component of the computer. The main feature is that the PU addresses the memory through the data bus, and the contents of the external memory must pass through the memory to function. The memory stick plays a role in buffering and data exchange by connecting the PU and other devices.

[0003] As memory modules become faster and faster, with higher frequencies, especially with computer users overclocking, heat dissipation becomes increasingly important. However, existing memory modules have limited heat dissipation performance, making them susceptible to burnout due to high temperatures and resulting in a shorter lifespan. Summary of the Invention

[0004] In view of the deficiencies in the above background technology, the present invention provides a memory stick with high efficiency in overclocking and heat dissipation.

[0005] The utility model adopts the following technical solutions:

[0006] A memory stick with high efficiency overclocking and heat dissipation, characterized in that the memory stick comprises:

[0007] Memory module body;

[0008] A bottom plate, the bottom plate being arranged on the left side of the memory bar body;

[0009] a cover plate, the cover plate being arranged on the right side of the memory bar body;

[0010] a first thermal pad, disposed between the bottom plate and the memory module body, with two sides of the first thermal pad adhered to the bottom plate and the memory module body respectively;

[0011] a second thermal pad, disposed between the cover plate and the memory module body, with two sides of the second thermal pad adhered to the cover plate and the memory module body respectively;

[0012] Wherein, the base plate and the cover plate are both made of metal, and the side surface of the base plate and the cover plate facing away from the memory bar body is provided with a plurality of inwardly concave grooves, and outwardly protruding heat dissipation fins are provided between adjacent grooves. The side surface of the base plate and the cover plate close to the memory bar body is provided with inwardly concave placement grooves, and the first thermal pad, the second thermal pad and the memory bar body are overlapped and placed in the two placement grooves. The top of the base plate and the cover plate are provided with a plurality of first air holes that penetrate into the memory bar body, and the top side surfaces of the base plate and the cover plate are provided with a plurality of second air holes, and the second air holes are connected to the first air holes.

[0013] As a further improvement, the bottom plate and the cover plate are both made of metal copper.

[0014] As a further improvement, the first thermal pad and the second thermal pad are both thermally conductive silicone pads.

[0015] As a further improvement, the base plate and the cover plate are detachably connected.

[0016] As a further improvement, the base plate and the cover plate are detachably connected via a fixing sleeve.

[0017] As a further improvement, a plurality of inwardly recessed fixing grooves are provided on the top of the side surface of the base plate and the cover plate facing away from the main body of the memory stick, and the fixing grooves are "L"-shaped. Fixed blocks are symmetrically provided on the inner wall of the fixing sleeve, and the fixed blocks are detachably arranged in the fixing grooves and can slide along the fixing grooves.

[0018] As a further improvement, raised limiting plates are symmetrically provided on both sides of the top of the base plate. In the assembled base plate and cover plate, the cover plate is mounted on the limiting plates.

[0019] As can be seen from the above description of the structure of the present invention, compared with the prior art, the present invention has the following advantages: During use of the memory stick body, the heat from the memory stick body is more effectively transferred to the metal base plate and cover plate via the first and second thermal pads, and then dissipated into the surrounding air via the base plate and cover plate. Grooves and heat dissipation fins are provided on the surfaces of the base plate and cover plate to increase the surface area of ​​the base plate and cover plate, thereby increasing the heat dissipation area and improving the heat dissipation effect, achieving efficient heat dissipation of the memory stick body, ensuring stable operation of the memory stick body in high-temperature environments, and extending the service life of the memory stick body. Furthermore, the provision of the first and second air vents allows air to blow directly through the memory stick body, removing heat from the memory stick body and further improving the heat dissipation effect of the memory stick body. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematic diagram of the three-dimensional structure of the base plate and cover plate.

[0021] Figure 2 Schematic diagram of the exploded structure of the base plate and the first thermal pad.

[0022] Figure 3 This is a schematic diagram of the exploded structure of the base plate, the first thermal pad, and the memory module body.

[0023] Figure 4 Schematic diagram of the exploded structure of the base plate, memory module body and second thermal pad.

[0024] Figure 5 This is a schematic diagram of the three-dimensional structure of the base plate, memory module body and second thermal pad.

[0025] Figure 6 Schematic diagram of the three-dimensional structure of the cover.

[0026] Figure 7 It is a schematic diagram of the three-dimensional structure of the base plate, cover plate and fixing sleeve.

[0027] Figure 8 It is a schematic diagram of the three-dimensional structure of the utility model. DETAILED DESCRIPTION

[0028] The specific implementation of the present utility model will be described below with reference to the accompanying drawings.

[0029] As attached Figure 3 、 Figure 5 and Figure 8 As shown, a memory stick with high efficiency in overclocking and heat dissipation includes a base plate 1 , a cover plate 2 , a first thermal pad 3 , a memory stick body 4 and a second thermal pad 5 .

[0030] As attached Figures 2 to 7As shown, a base plate 1 and a cover plate 2 are provided on the left and right sides of the memory stick body 4 respectively, and a first thermal pad 3 is provided between the base plate 1 and the memory stick body 4, and a second thermal pad 5 is provided between the cover plate 2 and the memory stick body 4. Specifically, the base plate 1 and the cover plate 2 are provided with an inwardly recessed placement groove a on the side surface close to the memory stick body 4, and the first thermal pad 3, the second thermal pad 5 and the memory stick body 4 are overlapped and placed in the two placement grooves a, and the first thermal pad 3 is respectively bonded to the base plate 1 and the memory stick body 4 on both sides, and the second thermal pad 5 is respectively bonded to the cover plate 2 and the memory stick body 4 on both sides. The thermal pad is a high-performance gap-filling thermal conductive material, which is mainly used for the transfer interface between electronic equipment and heat sinks or product housings. It has good viscosity, flexibility, good compression performance and excellent thermal conductivity. During use of the memory stick body 4, the heat from the memory stick body 4 is more efficiently transferred to the base plate 1 and cover plate 2 via the first thermal pad 3 and the second thermal pad 5. The heat is then dissipated into the surrounding air via the base plate 1 and the cover plate 2. Both the base plate 1 and the cover plate 2 are made of metal, specifically copper, which provides excellent thermal conductivity and ensures effective heat dissipation. The first thermal pad 3 and the second thermal pad 5 can be thermally conductive silicone pads. Thermally conductive silicone pads are a thermally conductive medium material synthesized using a special process using silicone as a base material and various additives such as metal oxides. In the industry, they are also known as thermal conductive silicone pads, thermal conductive silicone sheets, soft thermal pads, or thermal conductive silicone gaskets. These pads fill gaps, creating a thermal path between heat-generating and heat-dissipating areas, effectively improving heat transfer efficiency. They also provide insulation, shock absorption, and sealing, meeting the design requirements of miniaturized and ultra-thin devices. They are highly manufacturable and usable, and are available in a wide range of thicknesses, making them an excellent thermally conductive filling material.

[0031] It is worth mentioning that, as Figure 1 、 Figure 6 and Figure 8 As shown, the bottom plate 1 and cover plate 2 have a plurality of inwardly recessed grooves d on their surfaces facing away from the memory stick body 4. The provision of these grooves d increases the surface area of ​​the bottom plate 1 and cover plate 2, thereby increasing the heat dissipation area of ​​the bottom plate 1 and cover plate 2. This improves the heat dissipation effect, ensures the stable operation of the memory stick body 4 in high-temperature environments, and extends the service life of the memory stick body 4. Furthermore, outwardly protruding heat dissipation fins e are provided between adjacent grooves d. The heat dissipation fins e provided on the bottom plate 1 and cover plate 2 also serve to increase the surface area, i.e., the heat dissipation area, of the bottom plate 1 and cover plate 2, promoting rapid heat dissipation from the bottom plate 1 and cover plate 2, thereby improving the heat dissipation effect on the memory stick body 4.

[0032] In addition, as attached Figure 2 、 Figure 6 and Figure 8As shown, the tops of the base plate 1 and the cover plate 2 are each provided with a plurality of first air holes b that penetrate into the memory stick body 4, and the top sides of the base plate 1 and the cover plate 2 are each provided with a plurality of second air holes c, which are connected to the first air holes b. The setting of the first air holes b and the second air holes c can improve the ventilation and heat dissipation effect of the memory stick body 4. Specifically, the wind blown out by the cooling fan in the computer host can directly blow the memory stick body 4 through the first air holes b and the second air holes c, taking away the heat on the memory stick body 4, and further improving the heat dissipation effect of the memory stick body 4.

[0033] In addition, as attached Figure 1 、 Figure 6 、 Figure 7 and Figure 8 As shown, the base plate 1 and the cover plate 2 are detachably connected. Specifically, the base plate 1 and the cover plate 2 are detachably connected via a fixing sleeve 6, wherein a plurality of inwardly recessed fixing grooves f are provided on the top of the surface of the base plate 1 and the cover plate 2 facing away from the memory stick body 4. The fixing grooves f are "L"-shaped, and fixing blocks 61 are symmetrically provided on the inner wall of the fixing sleeve 6. When assembling the base plate 1 and the cover plate 2, the base plate 1 and the cover plate 2 are overlapped, and then the fixing sleeve 6 is put on the top of the base plate 1 and the cover plate 2. The size of the fixing sleeve 6 is slightly smaller than the sum of the thicknesses of the base plate 1 and the cover plate 2. The base plate 1 and the cover plate 2 are pressed together by the fixing sleeve 6, and the friction between the fixing sleeve 6 and the base plate 1 and the cover plate 2 can reduce the risk of the fixing sleeve 6 falling off; at the same time, the fixing block 61 slides along the fixing groove f during the process, and the inner wall of the fixing groove f has a limiting effect on the outer surface of the fixing block 61, which can further reduce the risk of the fixing sleeve 6 falling off from the top of the base plate 1 and the cover plate 2 during use, thereby ensuring the assembly firmness of the base plate 1 and the cover plate 2. When the memory bar main body 4 fails, the fixing sleeve 6 can be slid and removed, the base plate 1 and the cover plate 2 can be disassembled, and reinstalled on the new memory bar main body 4 for use, saving costs. Further, as shown in the attached Figure 2 and Figure 7 As shown, raised limit plates 11 are symmetrically provided on both sides of the top of the base plate 1. In the assembled base plate 1 and cover plate, the cover plate 2 is mounted on the limit plates 11. The setting of the limit plates 11 can, on the one hand, play an effective positioning role in the overlap of the cover plate 2 and the base plate 1, thereby facilitating the rapid overlapping assembly of the cover plate 2 and the base plate 1; on the other hand, it can enhance the connectivity between the cover plate 2 and the base plate 1, thereby reducing the risk of the cover plate 2 loosening and sliding off.

[0034] In summary, during use of the memory stick body 4, the present invention more effectively conducts heat from the memory stick body 4 to the metal base plate 1 and cover plate 2 via the first thermal pad 3 and the second thermal pad 5, and then dissipates the heat through the base plate 1 and the cover plate 2 into the surrounding air. Grooves d and heat dissipating fins e are provided on the surfaces of the base plate 1 and the cover plate 2 to increase the surface area of ​​the base plate 1 and the cover plate 2. This increases the heat dissipation area, thereby improving the heat dissipation effect and achieving efficient heat dissipation of the memory stick body 4, ensuring stable operation of the memory stick body 4 in high-temperature environments and extending the service life of the memory stick body 4. Furthermore, the provision of the first air vent b and the second air vent c allows air to blow directly onto the memory stick body 4, removing heat from the memory stick body 4 and further improving the heat dissipation effect of the memory stick body 4.

[0035] The above is only a specific implementation method of the present invention, but the design concept of the present invention is not limited to this. Any non-substantial changes to the present invention using this concept shall be deemed as an infringement of the protection scope of the present invention.

Claims

1. A memory module with high efficiency overclocking and heat dissipation, characterized in that: The memory module includes: Memory module body; A bottom plate, the bottom plate being arranged on the left side of the memory bar body; a cover plate, the cover plate being arranged on the right side of the memory bar body; a first thermal pad, disposed between the bottom plate and the memory module body, with two sides of the first thermal pad adhered to the bottom plate and the memory module body respectively; a second thermal pad, the second thermal pad being disposed between the cover plate and the memory module body, with two sides of the second thermal pad being adhered to the cover plate and the memory module body respectively; Wherein, the base plate and the cover plate are both made of metal, and the side surface of the base plate and the cover plate facing away from the memory bar body is provided with a plurality of inwardly concave grooves, and outwardly protruding heat dissipation fins are provided between adjacent grooves. The side surface of the base plate and the cover plate close to the memory bar body is provided with inwardly concave placement grooves, and the first thermal pad, the second thermal pad and the memory bar body are overlapped and placed in the two placement grooves. The top of the base plate and the cover plate are provided with a plurality of first air holes that penetrate into the memory bar body, and the top side surfaces of the base plate and the cover plate are provided with a plurality of second air holes, and the second air holes are connected to the first air holes.

2. The memory module with high efficiency overclocking and heat dissipation according to claim 1, characterized in that: The bottom plate and the cover plate are both made of metal copper.

3. The memory module with high efficiency overclocking and heat dissipation according to claim 1, characterized in that: The first thermal pad and the second thermal pad are both thermally conductive silicone pads.

4. The memory module with high efficiency overclocking and heat dissipation according to claim 1, characterized in that: The bottom plate and the cover plate are detachably connected.

5. The memory module with high efficiency overclocking and heat dissipation according to claim 4, characterized in that: The bottom plate and the cover plate are detachably connected via a fixing sleeve.

6. The memory module with high efficiency overclocking and heat dissipation according to claim 5, characterized in that: A plurality of inwardly recessed fixing grooves are provided on the top of the side surface of the bottom plate and the cover plate facing away from the main body of the memory stick. The fixing grooves are "L"-shaped. Fixed blocks are symmetrically provided on the inner wall of the fixing sleeve. The fixed blocks are detachably arranged in the fixing grooves and can slide along the fixing grooves.

7. The memory module with high efficiency overclocking and heat dissipation according to claim 4, characterized in that: Protruding limiting plates are symmetrically provided on both sides of the top of the bottom plate. When the bottom plate and the cover plate are assembled, the cover plate is mounted on the limiting plates.

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