Zoom module structure for multi-focal-length shooting

Abstract

The utility model relates to the technical field of image processing, in particular to a zoom module structure for multi-focal-length shooting, which comprises a photosensitive chip, an optical lens and a base capable of generating elastic deformation when heated, the base is positioned between the photosensitive chip and the optical lens, the photosensitive chip and the base are relatively fixed, and the optical lens is fixed on the base; a heating wire for heating the base and a temperature sensing element for detecting the temperature of the base are arranged in the base; the zoom module structure further comprises a control element, and the control element is used for receiving an electric signal of the temperature sensing element and then controlling the energizing current of the heating wire. Due to the characteristic that the base can generate elastic deformation after being heated, the heating wire in the base can enable the optical lens to generate displacement after being electrified to work, so that the distance between the photosensitive chip and the optical center of the optical lens is changed, namely, the change of the image distance is completed, the change of the focal length is realized, and the voice coil motor can be replaced to realize lens zooming.

Description

Technical Field

[0001] The utility model relates to the technical field of image processing, in particular to a zoom module structure for multi-focal-segment shooting. Background Art

[0002] Today's camera modules have introduced a voice coil motor structure to meet the needs of multi-focal-length shooting. However, this structure has defects such as posture difference and magnetic interference, and is not conducive to miniaturization. In addition, in some high-frequency vibration and special environments, it is impossible to use a voice coil motor for shooting, and only a fixed-focus camera module can be used, which makes it impossible to complete multi-focal-length shooting.

[0003] In order to achieve multi-focal length shooting in special circumstances where a voice coil motor cannot be used, a structure that can replace the voice coil motor to achieve lens zoom is needed. Utility Model Content

[0004] The purpose of the present invention is to provide a zoom module structure for multi-focal-segment shooting, aiming to provide a structure that can replace a voice coil motor to achieve lens zoom.

[0005] The utility model provides a zoom module structure for multi-focal-length shooting, comprising a photosensitive chip, an optical lens, and a base that will elastically deform when heated, wherein the base is located between the photosensitive chip and the optical lens, the positions of the photosensitive chip and the base are relatively fixed, and the optical lens is fixed on the base; the base is provided with a heating wire for heating the base, and a temperature sensing element for detecting the temperature of the base; the zoom module structure also includes a control element, which is used to control the current flowing through the heating wire after receiving an electrical signal from the temperature sensing element.

[0006] Optionally, the zoom module structure further includes a filter, the filter is located between the photosensitive chip and the optical lens, and the filter is fixed on the base.

[0007] Optionally, a groove is provided on the surface of the base, and the filter is embedded in the groove.

[0008] Optionally, the base is provided with windows penetrating two opposite surfaces thereof, the photosensitive chip and the optical lens are both facing the windows, and the filter covers the windows.

[0009] Optionally, the heating wire is distributed inside the base in a U-shaped pattern around the window.

[0010] Optionally, the plurality of temperature sensing elements are symmetrically distributed about the window.

[0011] Optionally, the zoom module structure further includes a heat-insulating medium, which is blocked between the optical lens surface and the base surface.

[0012] Optionally, the zoom module structure further includes a circuit board and a connector, the photosensitive chip and the base are both fixed on the surface of the circuit board, and the connector is electrically connected to the circuit board.

[0013] Optionally, a temperature sensing circuit is further provided in the base, the temperature sensing element is connected to the temperature sensing circuit, and the temperature sensing circuit and the heating wire are both provided with metal PIN pins exposed from the base.

[0014] Optionally, the base is a plastic part, and the heating wire is an insert embedded in the plastic part.

[0015] The technical effects achieved by the above technical solution of the utility model are:

[0016] 1. Due to the elastic deformation of the base when heated, the heating wire in the base will cause the optical lens to move when energized, changing the distance between the photosensitive chip and the optical center of the optical lens. This changes the image distance and thus the focal length. Therefore, it can replace the voice coil motor to achieve lens zoom.

[0017] 2. The zoom module structure that replaces the voice coil motor is integrated into the base, which facilitates miniaturization, simplifies design and reduces costs;

[0018] 3. Since the optical performance of the optical lens will decline after being heated, the imaging will be affected. The heat-insulating medium can prevent the heat from the base from being directly transferred to the optical lens during the zoom process, thus ensuring the imaging quality.

[0019] 4. The heating wire is integrally formed with the base through the insert injection molding process, and the heating wire is distributed in a U-shaped pattern inside the base, ensuring that the base can heat up steadily during the heating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 An exploded structural diagram of the zoom module structure in the embodiment;

[0021] Figure 2 A top view of the base showing the structure and position of the heating wire in the embodiment;

[0022] Figure 3 for Figure 2 Schematic diagram showing the heating wire and temperature sensing circuit after the base is hidden;

[0023] Figure 4 A bottom view of the base showing the structure and position of the temperature sensing circuit and the temperature sensing element in the embodiment;

[0024] Figure 5 2 is a flowchart of the zoom module structure in the embodiment.

[0025] Reference numerals:

[0026] 1. Circuit board; 2. Photosensitive chip; 3. Base; 30. Window; 31. Heating wire; 32. Temperature sensing circuit; 33. Temperature sensing element; 34. Metal PIN foot; 35. Groove; 36. Protrusion; 4. Filter; 5. Thermal insulation medium; 6. Optical lens; 7. Connector. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] It should be noted that, in this document, relational terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0029] Example

[0030] The present invention provides a zoom module structure for multi-focal-segment shooting. Figure 1 The zoom module structure includes a circuit board 1, a photosensitive chip 2 disposed on the surface of the circuit board 1, and electrically connected to the circuit board 1 by soldering. For example, a row of solder pads is disposed on the edge of the photosensitive chip 2, and a corresponding row of solder pads is also disposed on the circuit board 1. Gold wires are soldered to the solder pads of the photosensitive chip 2 and the solder pads of the circuit board 1 in a one-to-one correspondence.

[0031] Reference Figure 1 The zoom module structure also includes a base 3, which is fixedly arranged on the surface of the circuit board 1; the direction of the base 3 facing the circuit board 1 is defined as downward, and the opposite direction is defined as upward, and the base 3 is directly above the photosensitive chip 2; the base 3 is a plastic part, which has the characteristic of elastic deformation when heated; the center of the base 3 has a window 30 that passes through the opposite two surfaces of itself.

[0032] Reference Figure 1The zoom module structure also includes a filter 4 and an optical lens 6; the base 3 is located between the photosensitive chip 2 and the optical lens 6, the photosensitive chip 2 and the optical lens 6 are both facing the window 30, and the optical lens 6 is directly above the photosensitive chip 2, and the optical lens 6 is connected to the surface of the base 3 through a heat-insulating medium 5, and the heat-insulating medium 5 is blocked between the surface of the optical lens 6 and the surface of the base 3; the filter 4 is located between the photosensitive chip 2 and the optical lens 6, and a groove 35 is provided on the surface of the base 3 facing the optical lens 6, which surrounds the window 30. The groove 35 is provided along the periphery of the window 30, and the filter 4 is embedded and fixed in the groove 35 and covers the window 30. The bottom of the groove 35 forms a step surface that supports the periphery of the lower surface of the filter 4.

[0033] Reference Figure 1 Filter 4 has the function of filtering and optimizing imaging. In this embodiment, blue glass is preferably used as the filter. In this embodiment, when the camera module is performing a camera operation, the optical lens 6 converges the light of the observed target and transmits it to the filter 4. The light is filtered at the filter 4, and then the light passes through the window 30 of the base 3 and is projected onto the photosensitive chip 2. The light source is calculated and imaged at the photosensitive chip 2, thereby completing the camera operation. The heat-insulating medium 5 is also an adhesive, used to combine the optical lens 6 with the base 3. Since the optical performance of the optical lens 6 will decline after being heated, the imaging will be affected. In order to avoid the heat in the base 3 being directly transferred to the lens during the zoom process, the heat-insulating medium 5 needs to be made of a material with low thermal conductivity.

[0034] Reference Figure 2 and Figure 3 The base 3 includes a heating wire 31, a temperature sensing circuit 32, and a temperature sensing element 33. The temperature sensing element 33 is electrically connected to the temperature sensing circuit 32 via welding. The heating wire 31 is used to heat the base 3, and the temperature sensing element 33 is used to detect the temperature of the base 3. The zoom module structure also includes a control element, which is electrically connected to the heating wire 31 and the temperature sensing element 33. When the base 3 is heated, the temperature sensing element 33 feeds back the temperature of the base 3 to the control element via an electrical signal. The control element then controls the current flowing through the heating wire 31 according to a set program, thereby achieving the function of regulating the temperature of the base 3.

[0035] Reference Figure 2 and Figure 3 The heating wire 31 and the temperature sensing circuit 32 are formed into one piece with the base 3 through the insert injection molding process. The specific molding method is: first, the heating wire 31 and the temperature sensing circuit 32 are arranged in the base mold, and then injection molding is performed into the base mold. The heating wire 31 is distributed in the base 3 in a circular shape around the window 30 to ensure that the base 3 can heat up steadily during the heating process of the heating wire 31; the upper surface of the heating wire 31 can be flush with the upper surface of the base 3 (see Figure 2 ), the heating wire 31 can also be completely embedded in the base 3, which is not limited in this embodiment.

[0036] Reference Figure 4 The heating wire 31 and the temperature sensing circuit 32 are both provided with metal PIN pins 34 exposed at the edge of the base 3. The metal PIN pins 34 are connected to the copper window area of ​​the circuit board 1 by solder ball welding. In the base 3, the lower surface of the temperature sensing circuit 32 can be flush with the lower surface of the base 3 (see Figure 3 ), the temperature sensing circuit 32 can also be completely embedded within the base 3, but this is not a limitation in this embodiment. It only requires that the position of the heating wire 31 within the base 3 is higher than the temperature sensing circuit 32. The temperature sensing element 33 is soldered to the temperature sensing circuit 32 in close contact with the lower surface of the base 3, thereby connecting it to the loop of the temperature sensing circuit 32. The temperature sensing element 33 is placed below the heating wire 31, ensuring that the heating wire 31 maintains a safe distance from the photosensitive chip 2 and the circuit board 1. To improve detection accuracy, a temperature sensing element 33 is placed on either side symmetrically about the window 30.

[0037] Reference Figure 4 and Figure 1 The base 3 has a circle of protrusions 36 on the periphery of the lower surface. The base 3 is fixed to the circuit board 1 by connecting the protrusions 36 to the surface of the circuit board 1. The connection method between the protrusions 36 and the circuit board 1 is, for example, bonding or welding. The protrusions 36 form a space between the lower surface of the base 3 and the surface of the circuit board 1 to accommodate the temperature sensor 33, the photosensitive chip 2 and other electronic components on the circuit board 1. In this embodiment, the filter 4 is placed inside the window 30 of the base 3, and the photosensitive chip 2 is placed below the window 30. In this way, the filter 4 and the photosensitive chip 2 are placed inside the base 3 at the same time, thereby reducing the height of the stacked design of the three, improving space utilization, and correspondingly reducing the height of the camera module. The surface of one side of the circuit board 1 is also electrically connected to a connector 7, which is connected to the electronic equipment.

[0038] Reference Figure 5 , the workflow of the zoom module structure is:

[0039] The first step is module preparation;

[0040] In the second step, the module is checked for clarity. If the test passes, the module proceeds to the third step. If the test fails, the module proceeds to the fourth step.

[0041] The third step is to take pictures and complete the shooting;

[0042] Step 4: Heat up the base;

[0043] Step 5: Check the module again for clarity. If the test passes, proceed to step 6. If not, proceed to step 4.

[0044] Step 6: Stabilize the temperature, take the picture, and complete the shooting.

[0045] The fourth to sixth steps are the procedure for controlling the temperature of the base 3 .

[0046] The zoom module structure proposed in this embodiment works as follows:

[0047] According to the imaging formula, 1 / f=1 / u+1 / v, where f is the focal length, u is the object distance, and v is the image distance; changing any one of these items can complete the zoom of the camera system. This embodiment provides a structure for changing v; the heating wire 31 in the base 3 is energized and works. After the base 3 is heated, due to the characteristics of the plastic part, the base 3 will produce elastic deformation, which will then drive the optical lens 6 to produce displacement, causing the distance between the photosensitive chip 2 and the optical center of the optical lens 6 to change, thereby completing the change of v.

[0048] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A zoom module structure for multi-focal-length shooting, characterized in that: The invention comprises a photosensitive chip (2), an optical lens (6) and a base (3) which generates elastic deformation when heated, wherein the base (3) is located between the photosensitive chip (2) and the optical lens (6), the positions of the photosensitive chip (2) and the base (3) are relatively fixed, and the optical lens (6) is fixed on the base (3); a heating wire (31) for heating the base (3) and a temperature sensing element (33) for detecting the temperature of the base (3) are provided in the base (3); the zoom module structure further comprises a control element, wherein the control element is used to control the magnitude of the current flowing through the heating wire (31) after receiving an electrical signal from the temperature sensing element (33).

2. The zoom module structure for multi-focal-range shooting according to claim 1, wherein: The zoom module structure further comprises a filter (4), the filter (4) being located between the photosensitive chip (2) and the optical lens (6), and the filter (4) being fixed on the base (3).

3. The zoom module structure for multi-focal-range shooting according to claim 2, wherein: A groove (35) is provided on the surface of the base (3), and the filter (4) is embedded in the groove (35).

4. The zoom module structure for multi-focal-range shooting according to claim 2, wherein: The base (3) is provided with a window (30) penetrating two opposite surfaces thereof; the photosensitive chip (2) and the optical lens (6) are both facing the window (30); and the filter (4) covers the window (30).

5. The zoom module structure for multi-focal-range shooting according to claim 4, wherein: The heating wire (31) is distributed in the base (3) in a circular shape around the window (30).

6. The zoom module structure for multi-focal-range shooting according to claim 4, wherein: The plurality of temperature sensing elements (33) are symmetrically distributed about the window (30).

7. The zoom module structure for multi-focal-range shooting according to claim 1, wherein: The zoom module structure further includes a heat-insulating medium (5), which is located between the surface of the optical lens (6) and the surface of the base (3).

8. The zoom module structure for multi-focal-range shooting according to claim 1, wherein: The zoom module structure further comprises a circuit board (1) and a connector (7); the photosensitive chip (2) and the base (3) are both fixed on the surface of the circuit board (1); and the connector (7) is electrically connected to the circuit board (1).

9. The zoom module structure for multi-focal-range shooting according to claim 1, wherein: A temperature sensing circuit (32) is also provided in the base (3), the temperature sensing element (33) is connected to the temperature sensing circuit (32), and the temperature sensing circuit (32) and the heating wire (31) are both provided with a metal PIN pin (34) exposed from the base (3).

10. The zoom module structure for multi-focal-range shooting according to any one of claims 1 to 9, wherein: The base (3) is a plastic part, and the heating wire (31) is an insert embedded in the plastic part.

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