Bonding-wire-free normally-installed LED (light-emitting diode) chip

Abstract

The utility model provides a normal LED chip free of a bonding wire. The chip comprises a substrate, an LED chip, conductive glass, a conductive film and a bonding pad. A groove is formed in the substrate and used for installing the LED chip, the LED chip is fixed on the substrate through die bonding glue, the conducting film is arranged on the surface of the substrate, an electrode of the LED chip is bonded with the conducting film, the wire glass is installed above the conducting film, a conducting hole is formed in the substrate and penetrates through the upper surface and the lower surface of the substrate, and the LED chip is arranged in the conducting hole. Bonding pads are installed at the positions of the conducting holes in the lower surface of the substrate respectively and used for lightening the LED lamp beads. The utility model provides an innovative bonding-wire-free normal LED chip, which not only improves the light transmittance and the reliability of a product, but also reduces the manufacturing cost, and has a wide market application prospect.

Description

Technical Field

[0001] The utility model discloses a wire-free upright LED chip, belonging to the field of LED chip packaging. Background Art

[0002] In traditional LED packaging, the electrodes of the upright LED chip are connected to the external circuit through metal wire welding to form an ohmic contact, completing the connection between the internal and external circuits. The electrodes of the flip-chip chip are welded or bonded inward to the circuit, but the production process requirements are very strict and difficult. Utility Model Content

[0003] In response to the above technical difficulties, the present invention proposes an innovative solder-free upright LED chip, aiming to overcome the shortcomings of the existing technology.

[0004] The technical solution of the utility model is as follows:

[0005] A wire-free, upright LED chip comprising a substrate, an LED chip, conductive glass, a conductive film, and a solder pad;

[0006] A groove is provided on the substrate for installing an LED chip, which is fixed to the substrate by a die-bonding adhesive. The conductive film is provided on the surface of the substrate, and the electrodes of the LED chip are bonded to the conductive film. Wire glass is installed above the conductive film. A via hole is provided on the substrate, passing through the upper and lower surfaces of the substrate. Solder pads are respectively installed at the positions of the via holes on the lower surface of the substrate for lighting up the LED lamp beads.

[0007] Preferably, the top surface of the LED chip is flush with the substrate surface. This not only improves the product's aesthetics but also avoids installation issues caused by chip protrusions. Furthermore, two vias are designed for the positive and negative conductors, respectively, to ensure stable and efficient current transmission.

[0008] Preferably, there are two conducting holes, one for installing the positive and negative electrode wires respectively.

[0009] Preferably, the substrate is made of FR4, aluminum substrate, or ceramic substrate. These materials have good electrical conductivity, thermal conductivity, and mechanical strength, and can meet various requirements for LED chip packaging.

[0010] Preferably, the size of the groove is consistent with the size of the LED chip.

[0011] The beneficial effects of the present invention are mainly reflected in the following aspects:

[0012] 1. Improved light transmittance of the product: By using conductive glass, this design effectively improves the light transmittance of the LED chip, making the luminous effect of the LED lamp beads brighter and more uniform.

[0013] 2. Reduced production costs and improved reliability: This design eliminates the need for wire soldering, reducing production costs. Furthermore, by avoiding potential soldering issues such as poor soldering and cold solder joints, the reliability of the LED chip is significantly improved.

[0014] In summary, the present invention proposes an innovative solder-free upright LED chip. This design not only improves the light transmittance and reliability of the product, but also reduces the production cost, and has broad market application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram of the utility model;

[0016] Figure 2 is a schematic diagram of the substrate. DETAILED DESCRIPTION

[0017] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are not intended to limit the scope of protection of the present invention.

[0018] like Figure 1-2 As shown, a wire-free upright LED chip includes a substrate 1, an LED chip 2, a conductive glass 3, a conductive film 4, and a solder pad 5;

[0019] A groove 6 is provided on the substrate 1 for mounting the LED chip 2. The LED chip 2 is fixed on the substrate 1 by a die-bonding adhesive. The conductive film 4 is provided on the surface of the substrate 1. The electrodes of the LED chip 2 are bonded to the conductive film 4. A wire glass 3 is installed above the conductive film 4. A via hole 7 is provided on the substrate 1, which passes through the upper and lower surfaces of the substrate 1. Solder pads 5 are respectively installed at the positions of the via holes 7 on the lower surface of the substrate 1 for lighting the LED lamp beads.

[0020] Preferably, the upper surface of the LED chip 2 is flush with the surface of the substrate 1 .

[0021] Preferably, there are two conducting holes 7 , one for installing the positive and negative electrode wires respectively.

[0022] Preferably, the substrate 1 is made of one of FR4, aluminum substrate and ceramic board.

[0023] Preferably, the size of the groove 6 is consistent with the size of the LED chip 2 .

[0024] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A wire-free LED chip, characterized in that: The chip includes a substrate, an LED chip, conductive glass, a conductive film and a solder pad; A groove is provided on the substrate for installing an LED chip, which is fixed to the substrate by a die-bonding adhesive. The conductive film is provided on the surface of the substrate, and the electrodes of the LED chip are bonded to the conductive film. Wire glass is installed above the conductive film. A via hole is provided on the substrate, passing through the upper and lower surfaces of the substrate. Solder pads are respectively installed at the positions of the via holes on the lower surface of the substrate for lighting up the LED lamp beads.

2. The wire-free upright LED chip according to claim 1, characterized in that: The upper surface of the LED chip is flush with the surface of the substrate.

3. The wire-free upright LED chip according to claim 1, characterized in that: There are two conducting holes, one for installing the positive and negative electrode wires respectively.

4. The wire-free upright LED chip according to claim 1, characterized in that: The substrate is one of FR4, aluminum substrate and ceramic board.

5. The wire-free upright LED chip according to claim 1, characterized in that: The size of the groove is consistent with the size of the LED chip.

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