Packaging light-emitting device, backlight module and display device
By using packaged light-emitting devices in the backlight module and utilizing a small-sized quantum dot diffusion plate for color conversion, the problem of high cost of quantum dot membranes is solved, and the effects of reducing production costs and improving color gamut are achieved.
Patent Information
- Application Number
- CN202422737167.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2034-11-08
AI Technical Summary
The existing quantum dot diaphragms are expensive, which leads to high production costs for backlight modules.
The packaged light-emitting device includes a bracket, a light-emitting component, a packaging glue and a quantum dot diffusion plate. The quantum dot diffusion plate converts the color of the light emitted by the light-emitting component. The size is smaller than that of the traditional quantum dot film, reducing the use of quantum dots.
Significantly reduce the production costs of backlight modules and liquid crystal display devices, and improve the color gamut effect.
Smart Images
Figure CN223322371U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of light-emitting devices, and in particular to a packaged light-emitting device, a backlight module and a display device. Background Art
[0002] Image quality is the primary concern for consumers when it comes to display products. The human eye is highly sensitive to color, and products with a high color gamut make the product's image richer, more saturated, and clearer. Quantum dots (QD) are the technology with the highest color gamut in liquid crystal display products. Currently, quantum dot technology primarily achieves a high color gamut by introducing a quantum dot film (with quantum dot material encapsulated in the film) into the optical film assembly of the backlight module of a liquid crystal display device. This involves the blue LED light irradiating the quantum dot film, which converts the blue light into white light. The size of the quantum dot film is equal to the size of the display product. Due to its larger size, the amount of quantum dots used increases, and the cost of quantum dot materials is higher, which in turn increases the cost of the quantum dot film, and in turn, the production cost of the backlight module. Utility Model Content
[0003] Based on this, embodiments of the present application provide a packaged light-emitting device, a backlight module, and a display device.
[0004] In a first aspect, an embodiment of the present application provides a packaged light-emitting device, comprising:
[0005] a bracket, wherein the bracket has a groove;
[0006] a light-emitting component, disposed in the groove and connected to the bracket;
[0007] Packaging glue, disposed in the groove and covering the light-emitting component;
[0008] The quantum dot diffusion plate is arranged on a side of the packaging glue away from the bottom of the groove and is connected to the packaging glue.
[0009] In some embodiments, the bracket includes a first bottom plate and a first side plate connected to each other, wherein the first bottom plate and the first side plate enclose the groove; and / or,
[0010] The quantum dot diffusion plate includes a quantum dot diffusion layer, and the quantum dot diffusion layer includes a matrix and quantum dots dispersed in the matrix.
[0011] In some embodiments, the end of the first side plate away from the first bottom plate includes a first top surface and a second top surface, the second top surface is located on the inner side of the first top surface, and the distance between the second top surface and the first bottom plate is smaller than the distance between the first top surface and the first bottom plate; the edge of the quantum dot diffusion plate overlaps the second top surface.
[0012] In some embodiments, the light emitting assembly includes a first element, wherein the light emitted by the first element has a first color;
[0013] The quantum dots in the quantum dot diffusion layer include first quantum dots and second quantum dots. The light emitted by the first quantum dots has a second color. The light emitted by the second quantum dots has a third color. The first color, the second color, and the third color are different.
[0014] In some embodiments, the light emitting assembly includes a first element and a second element, wherein the light emitted by the first element has a first color and the light emitted by the second element has a second color;
[0015] The quantum dots in the quantum dot diffusion layer include second quantum dots, the emitted light of the second quantum dots has a third color, and the first color, the second color, and the third color are different.
[0016] In some embodiments, the quantum dot diffusion plate further includes an optical film layer, and the optical film layer is stacked and connected to the quantum dot diffusion layer.
[0017] In a second aspect, an embodiment of the present application provides a backlight module comprising the packaged light-emitting device as described above.
[0018] In some embodiments, the backlight module includes a back plate, a second diffuser plate, and an optical film assembly;
[0019] The back plate comprises a second bottom plate and a second side plate connected to each other, and the packaged light-emitting device is provided on the second bottom plate;
[0020] The second diffusion plate is arranged on a side of the packaged light emitting device away from the second base plate;
[0021] The optical film assembly is arranged on a side of the second diffusion plate away from the packaged light emitting device.
[0022] In some embodiments, the backlight module further includes a reflective sheet, and the reflective sheet is attached to the inner surfaces of the second bottom plate and the second side plate; and / or,
[0023] The backlight module further includes a lens, which is arranged on the second bottom plate and covers the periphery of the packaged light-emitting device.
[0024] In a third aspect, an embodiment of the present application provides a display device, comprising the packaged light-emitting device as described above or the backlight module as described above.
[0025] The packaged light-emitting device provided in the embodiment of the present application includes a quantum dot diffusion plate, which can convert the color of the light emitted by the light-emitting component to achieve a high color gamut of the product. Since the size of the packaged light-emitting device is small, that is, the size of the quantum dot diffusion plate is small, the size of the quantum dot diffusion plate is much smaller than the size of the quantum dot diaphragm introduced in the traditional backlight module (equal to the size of the display). Therefore, the amount of quantum dots used in the quantum dot diffusion plate is small, and the production cost of the quantum dot diffusion plate is much lower than the production cost of the quantum dot diaphragm in the traditional backlight module. When the packaged light-emitting device of the embodiment of the present application is applied to the backlight module, the quantum dot diaphragm can be omitted in the backlight module, thereby significantly reducing the production cost of the backlight module, and then reducing the production cost of the liquid crystal display device. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for describing the embodiments.
[0027] Figure 1 This is a schematic diagram of the first structure of the quantum dot diffusion plate provided in an embodiment of the present application.
[0028] Figure 2 This is a schematic diagram of the first structure of the packaged light-emitting device provided in an embodiment of the present application.
[0029] Figure 3 This is a schematic diagram of the second structure of the packaged light-emitting device provided in an embodiment of the present application.
[0030] Figure 4 This is a schematic diagram of the second structure of the quantum dot diffusion plate provided in an embodiment of the present application.
[0031] Figure 5 This is a schematic diagram of the third structure of the packaged light-emitting device provided in an embodiment of the present application.
[0032] Figure 6 This is a fourth structural schematic diagram of the packaged light-emitting device provided in an embodiment of the present application.
[0033] Figure 7 This is a structural diagram of the backlight module provided in an embodiment of the present application.
[0034] Component Symbol Description:
[0035] 100. Packaged light-emitting device; 30. Bracket; 31. First bottom plate; 32. First side plate; 321. First top surface; 322. Second top surface; 33. Groove; 41. Packaging glue; 50. Quantum dot diffusion plate; 51. Quantum dot diffusion layer; 52. Optical film layer; 61. First element; 62. Second element; 42. Wire; 200. Backlight module; 70. Back plate; 71. Second bottom plate; 72. Second side plate; 81. Second diffusion plate; 82. Optical film assembly; 83. Lens. DETAILED DESCRIPTION
[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.
[0037] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.
[0038] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.
[0039] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0040] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.
[0041] See also Figures 1 to 3 The embodiment of the present application provides a packaged light-emitting device 100, including a bracket 30, a light-emitting component, a packaging glue 41 and a quantum dot diffusion plate 50, the bracket 30 has a groove 33, the light-emitting component is arranged in the groove 33 and is connected to the bracket 30, the packaging glue 41 is arranged in the groove 33 and covers the light-emitting component, and the quantum dot diffusion plate 50 is arranged on the side of the packaging glue 41 away from the bottom of the groove 33 and is connected to the packaging glue 41.
[0042] Exemplarily, the light-emitting component includes one or more LED chips. In the embodiment of the present application, multiple refers to two or more, such as three, four, five, six, etc.
[0043] Exemplarily, the packaging glue 41 is epoxy resin.
[0044] It should be noted that the encapsulant 41 protects the light-emitting components, the wires connected to the light-emitting components, and the bracket 30, preventing them from being oxidized by air. It also reduces total reflection of light within the groove 33, thereby improving light extraction efficiency. Furthermore, the encapsulant 41 utilizes its adhesive properties to connect and secure the quantum dot diffuser plate 50.
[0045] The packaged light-emitting device 100 provided in the embodiment of the present application includes a quantum dot diffusion plate 50. The quantum dot diffusion plate 50 can convert the color of the light emitted by the light-emitting component to achieve a high color gamut of the product. Since the size of the packaged light-emitting device 100 is small, that is, the size of the quantum dot diffusion plate 50 is small, the size of the quantum dot diffusion plate 50 is much smaller than the size of the quantum dot diaphragm introduced in the traditional backlight module 200 (equal to the size of the display). Therefore, the amount of quantum dots used in the quantum dot diffusion plate 50 is small, and the production cost of the quantum dot diffusion plate 50 is much lower than the production cost of the quantum dot diaphragm in the traditional backlight module 200. When the packaged light-emitting device 100 of the embodiment of the present application is applied to the backlight module 200, the quantum dot diaphragm can be omitted in the backlight module 200, thereby significantly reducing the production cost of the backlight module 200, and further reducing the production cost of the liquid crystal display device.
[0046] See also Figure 2 and Figure 3 The bracket 30 includes a first bottom plate 31 and a first side plate 32 connected to each other, and the first bottom plate 31 and the first side plate 32 surround the groove 33.
[0047] See also Figure 2 and Figure 3 The light-emitting component is arranged on the first base plate 31 and connected to the first base plate 31.
[0048] See also Figure 1 The quantum dot diffusion plate 50 includes a quantum dot diffusion layer 51 , and the quantum dot diffusion layer 51 includes a matrix and quantum dots dispersed in the matrix.
[0049] Exemplarily, the quantum dot diffusion layer 51 further includes a diffusant dispersed in the matrix, wherein the diffusant is an inorganic diffusant or an organic diffusant, wherein the inorganic diffusant is barium sulfate, calcium carbonate, silicon dioxide or titanium dioxide, and the organic diffusant is styrene resin or acrylic resin.
[0050] In some embodiments, the quantum dot diffusion layer 51 further includes phosphors dispersed in the matrix, so that better color performance can be achieved by combining quantum dots with phosphors. For example, the phosphors may be KSF.
[0051] See also Figure 2 and Figure 3The end of the first side panel 32 away from the first bottom panel 31 includes a first top surface 321 and a second top surface 322, the second top surface 322 is located on the inner side of the first top surface 321, and the distance between the second top surface 322 and the first bottom panel 31 is smaller than the distance between the first top surface 321 and the first bottom panel 31; the edge of the quantum dot diffusion plate 50 overlaps the second top surface 322.
[0052] See also Figure 2 In some embodiments, the light-emitting component includes a first element 61, and the emission light of the first element 61 has a first color; the quantum dots in the quantum dot diffusion layer 51 include first quantum dots and second quantum dots, and the emission light of the first quantum dots has a second color, and the emission light of the second quantum dots has a third color, and the first color, the second color, and the third color are different.
[0053] Exemplarily, the first component 61 is an LED chip.
[0054] Exemplarily, the light of the first color emitted by the first element 61 , the light of the second color emitted by the first quantum dot, and the light of the third color emitted by the second quantum dot are mixed to form white light.
[0055] Exemplarily, the first color is blue, the second color is green, and the third color is red.
[0056] See also Figure 2 Two wires 42 are connected to the first element 61, and the two wires 42 are used to connect the positive electrode and the negative electrode of the power supply respectively.
[0057] See also Figure 3 In some other embodiments, the light-emitting component includes a first element 61 and a second element 62, the light emitted by the first element 61 has a first color, and the light emitted by the second element 62 has a second color; the quantum dots in the quantum dot diffusion layer 51 include second quantum dots, and the light emitted by the second quantum dots has a third color, and the first color, the second color, and the third color are different.
[0058] Exemplarily, the first element 61 and the second element 62 are both LED chips.
[0059] Exemplarily, the light of the first color emitted by the first element 61 , the light of the second color emitted by the second element 62 , and the light of the third color emitted by the second quantum dot are mixed to form white light.
[0060] For example, the first element 61 and the second element 62 can be connected in series or in parallel. For example, the number of the first element 61 and the second element 62 can be greater than or equal to 1, and can be adjusted according to requirements such as brightness and chromaticity.
[0061] See also Figure 3 When the first element 61 and the second element 62 are connected in series, the first element 61 and the second element 62 can be connected through a wire 42. The first element 61 and the second element 62 are each connected to a wire 42, one of which is used to connect to the positive pole of the power supply, and the other wire 42 is used to connect to the negative pole of the power supply.
[0062] See also Figure 4 The quantum dot diffusion plate 50 may further include an optical film layer 52 , and the optical film layer 52 is stacked and connected to the quantum dot diffusion layer 51 .
[0063] Exemplarily, the optical film layer 52 and the quantum dot diffusion layer 51 are connected via an adhesive layer.
[0064] Exemplarily, the adhesive layer is optically clear adhesive (OCA).
[0065] Exemplarily, the optical film layer 52 includes one or more stacked optical films. Exemplarily, the optical films include a diffusion film, a brightness enhancement film, or a reflective film.
[0066] For example, quantum dot material may be provided in the optical film layer 52 to improve the color gamut of the product.
[0067] In some embodiments, the quantum dots in the quantum dot diffusion layer 51 include second quantum dots (red quantum dots), and the quantum dots in the optical film layer 52 include first quantum dots (green quantum dots).
[0068] In other embodiments, the quantum dots in the quantum dot diffusion layer 51 include first quantum dots (green quantum dots), the quantum dots in the optical film layer 52 include second quantum dots (red quantum dots) and third quantum dots (blue quantum dots), and the luminescent color of the third quantum dots is the first color (blue).
[0069] See also Figure 5 , Figure 5 This is a third structural schematic diagram of the packaged light-emitting device 100 provided in an embodiment of the present application. Figure 5 and Figure 2 The difference is that, Figure 2 The packaged light emitting device 100 shown includes Figure 1The quantum dot diffuser plate 50 shown, Figure 5 The packaged light emitting device 100 shown includes Figure 4 The quantum dot diffuser plate 50 is shown.
[0070] See also Figure 6 , Figure 6 This is a fourth structural schematic diagram of the packaged light-emitting device 100 provided in an embodiment of the present application. Figure 6 and Figure 3 The difference is that, Figure 3 The packaged light emitting device 100 shown includes Figure 1 The quantum dot diffuser plate 50 shown, Figure 6 The packaged light emitting device 100 shown includes Figure 4 The quantum dot diffuser plate 50 is shown.
[0071] See also Figure 7 , an embodiment of the present application further provides a backlight module 200, comprising the packaged light-emitting device 100 in any of the above embodiments.
[0072] See also Figure 7 , the backlight module 200 includes a back plate 70, a second diffusion plate 81 and an optical film assembly 82;
[0073] The back plate 70 includes a second bottom plate 71 and a second side plate 72 connected to each other, and the packaged light emitting device 100 is provided on the second bottom plate 71;
[0074] The second diffusion plate 81 is arranged on a side of the packaged light emitting device 100 away from the second bottom plate 71;
[0075] The optical film assembly 82 is disposed on a side of the second diffuser 81 away from the packaged light emitting device 100 .
[0076] Since the packaged light-emitting device 100 includes a quantum dot diffusion plate 50, the color gamut of the backlight module 200 can be improved, thereby improving the display effect of the liquid crystal display device including the backlight module 200. The mixing layer of the backlight module 200 only needs to be provided with a second diffusion plate 81 and an optical film assembly 82, and there is no need to provide a quantum dot film of the same size as the liquid crystal display device, thereby reducing the production cost of the backlight module 200 and thereby reducing the production cost of the liquid crystal display device.
[0077] Exemplarily, the optical film assembly 82 includes one or more stacked optical films. Exemplarily, the optical films include a diffusion film, a brightness enhancement film, or a reflective film.
[0078] See also Figure 7The backlight module 200 further includes a reflective sheet, which is attached to the inner surfaces of the second bottom plate 71 and the second side plate 72 .
[0079] It is understandable that by providing the reflective sheet, the light utilization efficiency of the backlight module 200 can be improved.
[0080] See also Figure 7 The backlight module 200 further includes a lens 83 , which is disposed on the second base plate 71 and covers the periphery of the packaged light-emitting device 100 .
[0081] It is understandable that by arranging the lens 83 on the periphery of the packaged light emitting device 100 , the diffusion effect of the lens 83 can be utilized to increase the light divergence angle, thereby improving the light uniformity of the backlight module 200 .
[0082] An embodiment of the present application provides a display device, including the packaged light-emitting device 100 as described above or the backlight module 200 as described above.
[0083] For example, when the display device includes the packaged light-emitting device 100 , the display device can directly use the light emitted by the packaged light-emitting device 100 to display images.
[0084] For example, when the display device includes the backlight module 200, the display device may further include a display panel. The display panel and the backlight module 200 are stacked and arranged. The backlight module 200 is arranged on the light incident side of the display panel. The backlight module 200 provides a surface light source for the display panel, thereby realizing image display using the display panel. For example, the display panel is a liquid crystal display panel.
[0085] The above describes in detail the packaged light-emitting device, backlight module, and display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is intended only to facilitate understanding of the present application. Furthermore, those skilled in the art will appreciate that variations in the specific implementation methods and scope of application may occur based on the concepts of the present application. In summary, the contents of this specification should not be construed as limiting the present application.
Claims
1. A packaged light emitting device, characterized in that: include: a bracket, wherein the bracket has a groove; a light-emitting component, disposed in the groove and connected to the bracket; Packaging glue, disposed in the groove and covering the light-emitting component; The quantum dot diffusion plate is arranged on a side of the packaging glue away from the bottom of the groove and is connected to the packaging glue.
2. The packaged light emitting device according to claim 1, wherein: The bracket includes a first bottom plate and a first side plate connected to each other, wherein the first bottom plate and the first side plate surround the groove; and / or, The quantum dot diffusion plate includes a quantum dot diffusion layer, and the quantum dot diffusion layer includes a matrix and quantum dots dispersed in the matrix.
3. The packaged light emitting device according to claim 2, wherein: One end of the first side plate away from the first bottom plate includes a first top surface and a second top surface, the second top surface is located on the inner side of the first top surface, and the distance between the second top surface and the first bottom plate is smaller than the distance between the first top surface and the first bottom plate; the edge of the quantum dot diffusion plate overlaps the second top surface.
4. The packaged light emitting device according to claim 2, wherein: The light emitting assembly includes a first element, wherein the light emitted by the first element has a first color; The quantum dots in the quantum dot diffusion layer include first quantum dots and second quantum dots. The light emitted by the first quantum dots has a second color. The light emitted by the second quantum dots has a third color. The first color, the second color, and the third color are different.
5. The packaged light emitting device according to claim 2, wherein: The light emitting assembly includes a first element and a second element, wherein the light emitted by the first element has a first color, and the light emitted by the second element has a second color; The quantum dots in the quantum dot diffusion layer include second quantum dots, the emitted light of the second quantum dots has a third color, and the first color, the second color, and the third color are different.
6. The packaged light emitting device according to claim 2, wherein: The quantum dot diffusion plate further includes an optical film layer, which is stacked and connected to the quantum dot diffusion layer.
7. A backlight module, characterized in that: The packaged light-emitting device comprises the packaged light-emitting device according to any one of claims 1 to 6.
8. The backlight module according to claim 7, wherein: The backlight module includes a back plate, a second diffusion plate and an optical film assembly; The back plate comprises a second bottom plate and a second side plate connected to each other, and the packaged light-emitting device is provided on the second bottom plate; The second diffusion plate is arranged on a side of the packaged light emitting device away from the second base plate; The optical film assembly is arranged on a side of the second diffusion plate away from the packaged light emitting device.
9. The backlight module according to claim 8, wherein: The backlight module further includes a reflective sheet, and the reflective sheet is attached to the inner surfaces of the second bottom plate and the second side plate; and / or, The backlight module further includes a lens, which is arranged on the second bottom plate and covers the periphery of the packaged light-emitting device.
10. A display device, characterized in that: The invention comprises the packaged light-emitting device according to any one of claims 1 to 6 or the backlight module according to any one of claims 7 to 9.