Lens driving mechanism and carrier assembly thereof

Abstract

The utility model discloses a lens driving mechanism and a carrier assembly thereof, the lens driving mechanism comprises a pedestal, a frame and the carrier assembly, the frame is movably connected with the pedestal and is provided with an induction magnet; the carrier assembly is connected with the frame and comprises a carrier and an upper reed, the carrier is provided with a protruding plate, the protruding plate is provided with a control chip, and the control chip is provided with an induction capacitor. The induction capacitor is located below the induction magnet, the upper reed is located at the top of the carrier and connected with the carrier, and the upper reed is electrically connected with the control chip.

Description

Technical Field

[0001] The utility model relates to the technical field of optical element driving, in particular to a lens driving mechanism and a carrier component thereof. Background Art

[0002] Some electronic devices with camera or video recording functions are equipped with a lens driving module to drive an optical component such as a lens to move, thereby achieving an autofocus function.

[0003] Currently, in order to achieve lightweight electronic devices, it is necessary to continuously reduce the size and weight of the lens drive mechanism, while also ensuring accurate lens focusing. Therefore, in order to meet market demand, it is necessary to develop a more precise lens drive mechanism. Utility Model Content

[0004] The purpose of the utility model is to provide a lens driving mechanism and a carrier assembly thereof to solve the problems of the prior art.

[0005] In order to solve the above technical problems, the embodiment of the present utility model provides a carrier assembly, which includes:

[0006] A carrier, the carrier being provided with a protruding plate, the protruding plate being mounted with a control chip, and the control chip being mounted with an inductive capacitor; and

[0007] An upper spring piece is located on the top of the carrier and connected to the carrier, and the upper spring piece is electrically connected to the control chip.

[0008] In one embodiment, the carrier is an annular frame;

[0009] The protruding plate protrudes outwardly from the radial direction of the carrier.

[0010] In one embodiment, a plurality of connecting posts are provided on the top surface of the carrier, and at least some of the connecting posts are located radially inward of the protruding plate;

[0011] The upper spring sheet is provided with a plurality of connection holes, and at least some of the connection holes are connected to the connection posts at least partially located on the radial inner side of the protruding plate.

[0012] In one embodiment, the protruding plate is provided with a mounting hole;

[0013] The control chip is located on the top surface of the protruding plate;

[0014] The inductive capacitor is located in the mounting hole.

[0015] In one embodiment, two coil assemblies are mounted on the carrier, and the two coil assemblies are located on opposite sides of the carrier;

[0016] At least two groups of the connecting pillars are respectively located on opposite sides of the carrier and are respectively connected to at least two groups of the connecting holes.

[0017] The present invention also relates to a lens driving mechanism, which comprises:

[0018] base;

[0019] a frame, the frame being movably connected to the base and provided with an induction magnet;

[0020] In the above-mentioned carrier assembly, the carrier is connected to the frame, the inductive capacitor is located below the inductive magnet, and the upper spring is connected to the frame.

[0021] In one embodiment, the frame is an annular frame and has an avoidance groove on the top surface;

[0022] The carrier is located in the frame, and the protruding plate is located in the avoidance groove.

[0023] In one embodiment, the bottom wall of the avoidance groove is provided with a mounting groove;

[0024] The induction magnet is located in the installation groove.

[0025] In one embodiment, the base comprises:

[0026] a bottom plate, the bottom plate being located on the bottom surface of the frame and being rollably connected to the frame;

[0027] a plurality of support protrusions connected to the top surface of the bottom plate and arranged around the outer side of the frame;

[0028] A built-in circuit is located in the bottom plate and part of its connection end extends to the top surfaces of the plurality of support protrusions and is electrically connected to the upper spring sheet.

[0029] In one embodiment, the base plate and the frame are rollably connected via a plurality of balls. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a three-dimensional diagram of a lens driving mechanism according to an embodiment of the present invention.

[0031] Figure 2 yes Figure 1 Exploded view of the lens drive mechanism in the illustrated embodiment.

[0032] Figure 3 and Figure 4 They are Figure 1 Exploded view of the lens drive mechanism in the illustrated embodiment.

[0033] Figure 5 yes Figure 1 Exploded view of the lens drive mechanism in the illustrated embodiment.

[0034] Figure 6 yes Figure 2 Exploded view of the carrier, frame and upper spring in the illustrated embodiment.

[0035] Figure 7 It is a three-dimensional diagram of a built-in metal frame according to an embodiment of the present invention.

[0036] Figure 8 It is a three-dimensional diagram of the built-in circuit of an embodiment of the utility model.

[0037] Figure 9 and Figure 10 They are respectively top views of a lens driving mechanism according to an embodiment of the present invention.

[0038] Figure 11 yes Figure 9 A cross-sectional view along line AA in the illustrated embodiment.

[0039] Figure 12 yes Figure 10 A cross-sectional view along line BB in the illustrated embodiment.

[0040] Figure 13 yes Figure 1 A perspective view of the lens drive mechanism of the illustrated embodiment.

[0041] Reference numerals: 10, lens drive mechanism; 1, base; 11, bottom plate; 111, avoidance notch; 12, support protrusion; 13, built-in circuit; 131, access terminal; 132, connection terminal; 14, groove; 15, sensor; 16, boss; 17, lower ball groove; 18, lower abutment plate; 2, frame; 21, annular frame; 211, avoidance groove; 212, mounting groove; 22, built-in metal frame; 22 1. Metal sheet; 222. Upper abutment plate; 223. L-shaped metal sheet; 23. Magnet assembly; 24. Inductive magnet; 25. Upper ball groove; 3. Carrier; 31. Projecting plate; 32. Mounting hole; 33. Control chip; 34. Inductive capacitor; 35. Connecting post; 36. AF coil assembly; 4. Upper spring; 41. Connecting hole; 5. Lower spring; 6. Housing; 61. Avoidance hole; 7. Circuit board; 8. Ball; DETAILED DESCRIPTION

[0042] To make the objectives, technical solutions, and advantages of the present invention more clearly apparent, various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will appreciate that many technical details are provided in various embodiments of the present invention to facilitate a better understanding of the present application. However, even without these technical details and the various variations and modifications based on the following embodiments, the technical solutions claimed in the claims of this application can be achieved.

[0043] Unless the context requires otherwise, throughout the specification and claims, the word "comprise" and variations such as "include" and "have" should be construed in an open, inclusive sense, that is, should be interpreted to mean "including, but not limited to."

[0044] The following will be combined with the accompanying drawings to describe in detail the various embodiments of the present invention so that the purpose, features and advantages of the present invention can be more clearly understood. It should be understood that the embodiments shown in the accompanying drawings are not intended to limit the scope of the present invention, but are only intended to illustrate the essential spirit of the technical solution of the present invention.

[0045] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any manner in one or more embodiments.

[0046] As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. It should be noted that the term "or" is generally employed in its sense including "and / or" unless the context clearly dictates otherwise.

[0047] In the following description, in order to clearly demonstrate the structure and working mode of the present invention, many directional words will be used for description, but words such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and should not be understood as restrictive terms.

[0048] The utility model relates to a lens driving mechanism 10, which includes a carrier 3 component, a frame 2, a base 1 and a shell 6, wherein the base 1 is used to support the frame 2 and the carrier 3, and the shell 6 is connected to the base 1 to protect the frame 2 and the carrier 3. The carrier 3 component includes the carrier 3 and an upper spring 4, and the carrier 3 is used to install the lens and drive the lens to move along the optical axis of the lens, thereby realizing the focusing function. The optical axis direction of the lens is also Figure 3The frame 2 is located radially outside the carrier 3 and can move in two directions perpendicular to the optical axis to prevent the lens from shaking. Figure 3 Two directions perpendicular to each other in the horizontal direction.

[0049] In a specific embodiment, the base 1 includes a bottom plate 11, a plurality of support protrusions 12 and a built-in circuit 13, wherein the bottom plate 11 is a rectangular plate and is located on the bottom surface of the frame 2, and the bottom surface of the bottom plate 11 is provided with at least two grooves 14, which are used to accommodate a sensor 15, and the sensor 15 can sense the position of the frame 2.

[0050] In a preferred embodiment, an OIS coil assembly can also be positioned within the base plate 11, and at least two magnet assemblies 23 are positioned on the frame 2. The OIS coil assembly and magnet assemblies 23 cooperate to drive the frame 2 in two directions perpendicular to the optical axis to prevent lens shake. Because the OIS coil assembly needs to cooperate with the magnet assemblies 23 of the frame 2 and therefore requires proximity to the top surface of the base plate 11, a recess 14 for accommodating the sensor 15 is provided on the bottom surface of the base plate 11. This avoids occupying space on the top surface of the base plate 11 and reduces space within the lens drive mechanism 10.

[0051] The four support protrusions 12 are respectively connected to the four corners of the bottom plate 11 and extend upward. The four support protrusions 12 form a ring around the radial outer side of the frame 2 to limit the movement range of the frame 2.

[0052] The internal circuit 13 is located in the bottom plate 11 and the four connecting ends 132 of the internal circuit 13 extend from the four supporting protrusions 12 to the top ends thereof for connecting with the upper spring 4 , which will be described in detail below.

[0053] The built-in circuit 13 also has an access end 131, which needs to be welded to the circuit interface in the electronic device. The access end 131 of the built-in circuit 13 of the utility model is arranged on the radial outside of the base plate 11 and can be directly welded to the circuit interface welding on the bottom surface of the base plate 11.

[0054] Specifically, a clearance notch 111 is provided on the radially outer side of the base plate 11. This clearance notch 111 is open toward the bottom surface or radially outward of the base plate 11, and an access port 131 of the internal circuit 13 is located within this clearance notch 111. Generally, the circuit interface of the electronic device can be provided on the bottom surface of the base plate 11 and aligned with the access port 131. This access port 131 can be directly soldered to the circuit interface of the electronic device for convenient operation.

[0055] In existing designs, a connecting plate is typically extended from the bottom or outside of the base plate 11. The access port 131 of the internal circuit 13 then needs to extend to the connecting plate before connecting to the circuit interface of the electronic device. This connecting plate takes up extra space. However, the present invention locates the circuit interface radially outward from the base plate 11, facilitating soldering without taking up extra space.

[0056] The top surface of the base plate 11 is also provided with four bosses 16, which are respectively located at the four corners of the base plate 11 and radially inward of the four supporting protrusions 12. The four bosses 16 are respectively provided with ball grooves, which are lower ball grooves 17. The four lower ball grooves 17 are respectively formed by the depressions on the top surface of each boss 16 and are used to install the ball 8.

[0057] Four lower abutment plates 18 are also provided inside the bottom plate 11. The four lower abutment plates 18 and the built-in circuit 13 are integrally formed. The top surfaces of the four lower abutment plates 18 are respectively exposed in the four lower ball grooves 17 and form the bottom walls of the lower ball grooves 17. That is, the four lower abutment plates 18 are used to support the balls 8 to prevent the balls 8 from wearing the bottom plate 11 or the electronic device from damaging the bottom plate 11 during a fall.

[0058] The lower abutment plate 18 of the existing design needs to be separately installed on the bottom surface of the bottom plate 11 or embedded inside the bottom plate 11, which is difficult to process. However, the lower abutment plate 18 and the internal circuit 13 of the utility model are integrally formed, and the internal circuit 13 is directly embedded in the bottom plate 11 during the injection molding process, which is convenient for processing.

[0059] Of course, in this embodiment, the boss 16 may not be provided, and the lower abutment plate 18 is located inside the bottom plate 11 . The top surface of the bottom plate 11 is recessed to form the lower ball groove 17 , and the lower ball groove 17 may be recessed to the lower abutment plate 18 .

[0060] In some other embodiments, without providing the boss 16 , the lower abutment plate 18 can also be exposed on the top surface of the base plate 11 , the ball 8 is located on the top surface of the lower abutment plate 18 , and an upper ball groove 25 is provided on the top surface of the frame 2 to limit the rolling range of the ball 8 .

[0061] As a preferred solution, the lower abutment plate 18 is a multi-layer structure formed by multiple bending of the metal sheet 221, or at least a double-layer stacked structure, that is, a double-layer structure formed by bending a metal sheet 221, which can increase the stability of the lower abutment plate 18.

[0062] The frame 2 is located on the top surface of the base plate 11 and in the ring formed by the four support protrusions 12. In one embodiment, the frame 2 includes an annular frame 21 and a built-in metal frame 22. The annular frame 21 is a rectangular ring, but can also be a circular ring or other shapes.

[0063] In some embodiments, a circuit board 7 is further provided on the top surface of the base plate 11. The circuit board 7 is stacked on the top surface of the base plate 11 and is substantially flush with the top surfaces of the four bosses 16. The circuit board 7 is electrically connected to the internal circuit 13 within the base plate 11, and the OIS circuit can also be provided within the circuit board 7.

[0064] The annular frame 21 is located on the top surface of the bottom plate 11 and has four upper ball grooves 25 on its bottom. The four balls 8 are located in the upper ball grooves 25 of the annular frame 21 and the lower ball grooves 17 of the bottom plate 11, respectively. Of course, in other embodiments, if the bottom plate 11 is provided with the lower ball grooves 17, the bottom surface of the annular frame 21 may not be provided with the upper ball grooves 25.

[0065] The top surface of the annular frame 21 is provided with an avoidance groove 211 , which is located at a side of the annular frame 21 . The bottom wall of the annular frame 21 is provided with a recessed installation groove 212 , in which the induction magnet 24 is installed.

[0066] Three sides of the annular frame 21 are respectively provided with magnet grooves for mounting three magnet groups 23 , wherein one magnet groove is located at a side of the annular frame 21 where the avoidance groove 211 is provided.

[0067] The built-in metal frame 22 is located in the annular frame 21 and includes multiple metal sheets 221 and four upper abutment plates 222. Among the multiple metal sheets 221, two metal sheets 221 are arranged opposite to each other and are located on two opposite sides of the annular frame 21. One side of the two metal sheets 221 is respectively exposed in the two magnet grooves and fits with the magnet group 23 in the magnet groove, which is used to magnetically attract the magnet group 23 and facilitate the stabilization of the magnet group 23.

[0068] Another L-shaped metal piece 221 is located on one side of the annular frame 21 where the avoidance groove 211 is located. The top surface of the L-shaped metal piece 223 is exposed within the mounting groove 212 and forms the bottom wall of the mounting groove 212, facilitating the stabilization of the inductive magnet 24. The inner wall of the L-shaped metal piece 223 forms the inner wall of the other magnet groove. In other words, the other magnet assembly 23 is installed within the L-shaped metal piece 223 and is attracted to the L-shaped metal piece 223.

[0069] The four upper abutment plates 222 are respectively located at the four corners of the annular frame 21 and are integrally formed with the plurality of metal sheets 221 . During processing, the built-in metal frame 22 and the annular frame 21 are integrally injection-molded, which is convenient for processing.

[0070] The bottom surfaces of the four upper abutment plates 222 are exposed to the bottom surface of the annular frame 21 or form the top wall of the ball groove 25 on the bottom surface of the annular frame 21. The four upper abutment plates 222 are respectively aligned with the four lower abutment plates 18 in the vertical direction. The four balls 8 are respectively clamped between the four upper abutment plates 222 and the four lower abutment plates 18, which can prevent the annular frame 21 and the bottom plate 11 from being worn, and can also prevent the annular frame 21 and the bottom plate 11 from being damaged after the electronic device falls.

[0071] In the prior art, the bottom plate 11 is provided with a lower abutment plate 18, but the frame 2 is not provided with an upper abutment plate 222. However, if the electronic device is dropped multiple times during use, the ball bearings 8 may damage the annular frame 21, thereby affecting the movement and anti-shake function of the frame 2. Therefore, the present invention also provides an upper abutment plate 222 within the annular frame 21, and the upper abutment plate 222 and the metal sheet 221 are integrally formed, which facilitates processing and can increase the service life of the frame 2.

[0072] It should be understood that if the bottom plate 11 is provided with the lower ball rolling groove 17, the upper abutment plate 222 can be directly exposed to the bottom surface of the annular frame 21. If the bottom plate 11 is not provided with the lower ball rolling groove 17, the bottom surface of the annular frame 21 needs to be provided with the upper ball rolling groove 25 to limit the rolling range of the balls 8. In this case, the upper abutment plate 222 needs to be exposed to the bottom wall of the upper ball rolling groove 25 of the annular frame 21. Of course, in other embodiments, both the bottom plate 11 and the annular frame 21 are provided with ball rolling grooves.

[0073] In one embodiment, the carrier 3 is mounted within the annular frame 21 of the frame 2 and is movable in the vertical direction. The carrier 3 is annular and has a protruding plate 31 radially outwardly disposed. The protruding plate 31 is located within the avoidance groove 211 of the annular frame 21 and is movable in the vertical direction along with the carrier 3.

[0074] A control chip 33 is mounted on the protruding plate 31 , and an induction capacitor 34 is mounted on the control chip 33 . The induction capacitor 34 is located above the induction magnet 24 and cooperates with the induction magnet 24 to sense the carrier 3 .

[0075] In the prior art, two sensors 15 are provided on the base 1 to sense the position of the frame 2. These sensors 15 are located on the top surface of the base plate 11 of the base 1. However, since the circuit board 7 needs to be installed on the base plate 11, or a large number of OIS coils need to be installed inside the base plate 11, there is no extra space to install the sensors 15. Therefore, the present invention installs the two sensors 15 of the sensing frame 2 on the bottom surface of the base plate 11. Since there is no extra space to install the sensors 15 for sensing the carrier 3, the prior art generally cannot sense the position of the carrier 3. However, the present invention provides a protruding plate 31 on the outside of the carrier 3 for mounting a sensing capacitor 34, and installs a sensing magnet 24 on the annular frame 21. The two sensors work together to sense the position of the carrier 3, and can accurately control the position of the carrier 3 to facilitate precise focusing.

[0076] In some embodiments, the annular frame 21 may not be provided with the avoidance groove 211. The top surface of the annular frame 21 may be provided with a groove 14 for mounting the sensing magnet 24. The protruding plate 31 is located at the top radially outward of the carrier 3 and directly above the annular frame 21. The sensing capacitor 34 is located above the sensing magnet 24 and can also sense the position of the carrier 3. Since the carrier 3 needs to move in the vertical direction, the avoidance groove 211 is provided on the frame 2. The avoidance groove 211 can provide a portion of space for the carrier 3 to face the vertical direction, thereby reducing the internal space of the lens driving mechanism 10 and preventing the protruding plate 31 from contacting the top wall of the housing 6.

[0077] As a preferred solution, the protruding plate 31 is provided with a mounting hole 32 , and the control chip 33 is located on the top surface of the protruding plate 31 . The sensing capacitor 34 is connected to the bottom surface of the control chip 33 and is located in the mounting hole 32 .

[0078] The carrier 3 is generally rectangular and annular, and is further equipped with two AF coil assemblies 36 on its exterior. These AF coil assemblies 36 are located on opposite sides of the carrier 3 and cooperate with the magnet assembly 23 of the frame 2 to drive the carrier 3 in vertical motion for focal length adjustment. In some embodiments, the carrier 3 can also be driven by other means, such as a piezoelectric mechanism, and the specific embodiment of driving the movement of the carrier 3 is not limited.

[0079] The top surface of the carrier 3 is provided with a plurality of connecting posts 35. Two groups of connecting posts 35 are located on opposite sides of the top surface of the carrier 3 and are used to connect to the ends of two AF coil assemblies 36, respectively. The ends of the two AF coil assemblies 36 are wound around the outside of these two groups of connecting posts 35 for electrical connection to the upper spring 4. Two other groups of connecting posts 35 are located on the top surface of the other side of the carrier 3, radially inward of the protruding plate 31. Each of these two groups of connecting posts 35 has three connecting posts 35, each for connecting to the control chip 33.

[0080] The upper spring 4 is located on the top surface of the carrier 3 and frame 2. It has multiple connection holes 41. Two sets of connection holes 41 are connected to the two sets of connection posts 35 housing the two AF coil assemblies 36, and are electrically connected to the ends of the two coil assemblies. The other two sets of connection holes 41 are connected to the other two sets of connection posts 35 for electrical connection to the control chip 33.

[0081] The radial outer side of the upper spring 4 is also connected to the frame 2. The upper spring 4 is elastic and can drive the carrier 3 to reset when the carrier 3 moves in the vertical direction.

[0082] Preferably, the four connection ends 132 of the built-in circuit 13 extend to the top surfaces of the four supporting protrusions 12 and are electrically connected to the upper spring 4 respectively. When the built-in circuit 13 is energized, it can supply power to the AF coil assembly 36 and the control chip 33.

[0083] As a preferred solution, a lower spring 5 is further installed on the bottom surface of the carrier 3 and the frame 2. The lower spring 5 is also elastic and elastically connected to the frame 2 and the carrier 3 respectively. The lower spring 5 cooperates with the upper spring 4 to drive the carrier 3 to reset.

[0084] The housing 6 is further provided with an avoidance hole 61 to facilitate welding of the upper spring 4 and the AF coil assembly 36 .

[0085] While preferred embodiments of the present invention have been described in detail above, it should be understood that aspects of the embodiments can be modified, if necessary, to employ aspects, features and concepts of the various patents, applications and publications to provide further embodiments.

[0086] These and other changes can be made to the embodiments in light of the above detailed description.In general, in the claims, the terms used should not be construed as limited to the specific embodiments disclosed in the specification and claims, but should be construed to include all possible embodiments along with the full scope of equivalents to which these claims are entitled.

[0087] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present invention, and in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present invention.

Claims

1. A carrier assembly, characterized in that: The carrier assembly comprises: A carrier, the carrier being provided with a protruding plate, the protruding plate being mounted with a control chip, and the control chip being mounted with an inductive capacitor; and An upper spring piece is located on the top of the carrier and connected to the carrier, and the upper spring piece is electrically connected to the control chip.

2. The carrier assembly according to claim 1, wherein: The carrier is an annular frame type; The protruding plate protrudes from the radial outer side of the carrier.

3. The carrier assembly according to claim 2, characterized in that A plurality of connecting posts are provided on the top surface of the carrier, and at least some of the connecting posts are located radially inward of the protruding plate; The upper spring sheet is provided with a plurality of connection holes, and at least some of the connection holes are connected to the connection posts at least partially located on the radial inner side of the protruding plate.

4. The carrier assembly according to claim 3, characterized in that The protruding plate is provided with a mounting hole; The control chip is located on the top surface of the protruding plate; The inductive capacitor is located in the mounting hole.

5. The carrier assembly according to claim 3, characterized in that Two coil groups are installed on the carrier, and the two coil groups are respectively located on opposite sides of the carrier; At least two groups of the connecting pillars are respectively located on opposite sides of the carrier and are respectively connected to at least two groups of the connecting holes.

6. A lens driving mechanism, characterized in that: The lens driving mechanism comprises: base; a frame, the frame being movably connected to the base and provided with an induction magnet; The carrier assembly according to claim 1, wherein the carrier is connected to the frame, the inductive capacitor is located below the inductive magnet, and the upper spring is connected to the frame.

7. The lens driving mechanism according to claim 6, wherein: The frame is an annular frame and has an avoidance groove on the top surface; The carrier is located in the frame, and the protruding plate is located in the avoidance groove.

8. The lens driving mechanism according to claim 7, wherein: The bottom wall of the avoidance groove is provided with a mounting groove; The induction magnet is located in the installation groove.

9. The lens driving mechanism according to claim 6, wherein: The base comprises: a bottom plate, the bottom plate being located on the bottom surface of the frame and being rollably connected to the frame; a plurality of support protrusions connected to the top surface of the bottom plate and arranged around the outer side of the frame; A built-in circuit is located in the bottom plate and part of its connection end extends to the top surfaces of the plurality of support protrusions and is electrically connected to the upper spring sheet.

10. The lens driving mechanism according to claim 9, wherein: The bottom plate and the frame are rollably connected via a plurality of balls.

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