Core board and industrial control mainboard

Abstract

The utility model discloses a core board and an industrial control mainboard, a plurality of functional modules such as a central processing unit, a dynamic random access memory, an embedded multimedia memory, a wireless network module, a cooling fan and a power supply management unit are integrated on the core board, and unnecessary circuits and interfaces are reduced through simple design of the core board. The overall design is simplified, the core board and the substrate are detachably connected through the first connector, the convenience of maintenance and upgrading of a system is improved, and the problems that an industrial control mainboard is high in complexity and large in occupied area are solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic equipment and relates to a core board and an industrial control mainboard. Background Art

[0002] In today's industrial automation field, traditional core boards have many shortcomings. The mainboard usually has a complex structure, making repair complicated and time-consuming in the event of a fault. At the same time, due to the large number of components integrated on it, excessive heat is generated, which may affect the reliability and performance stability of the entire system. Further problems include the large size of the traditional PCB design, which not only takes up valuable space, but also leads to unnecessary high energy consumption and increased operating costs. In addition, the excessive number of interfaces increases the complexity of system configuration, limiting its adaptability to rapidly changing industrial needs. Utility Model Content

[0003] The present application aims to provide a core board and an industrial control mainboard, which solve the problems of high complexity and large occupied area of ​​the industrial control mainboard through the streamlined design of the core board.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A core board includes a board card, the board card is used to connect to a baseboard, and the board card is provided with:

[0006] Central processing unit, used to execute programs and process data;

[0007] A dynamic random access memory (DRAM), connected to the central processing unit (CPU), for storing temporary data and programs for rapid access by the CPU;

[0008] An embedded multimedia memory connected to the central processing unit and used for storing an operating system, application programs and user data;

[0009] A wireless network module, connected to the central processing unit, for providing network wireless communication function;

[0010] A cooling fan connected to the central processing unit for cooling the board;

[0011] A power management unit, connected to the central processing unit, the dynamic random access memory, the embedded multimedia memory, the wireless network module and the cooling fan, and responsible for managing and distributing power on the board;

[0012] A first connector is connected to the central processing unit and is used to transmit data signals on the board to the substrate.

[0013] Furthermore, a network interface chip is provided between the central processing unit and the first connector;

[0014] The network interface chip is used to convert the PC IE signal of the central processing unit into an RJ45 differential data signal, and transmit the RJ45 differential signal to the baseboard through the first connector.

[0015] Furthermore, an audio chip is provided between the central processing unit and the first connector;

[0016] The audio chip receives the digital audio signal from the central processing unit, and after being analyzed by the audio chip, transmits the analog audio signal to the substrate through the first connector.

[0017] Furthermore, an RC series circuit is connected between the audio chip and the first connector for coupling signals between the audio chip and the first connector.

[0018] Furthermore, provided between the central processing unit and the first connector is:

[0019] A differential data line, for transmitting a differential data signal of the central processing unit to the first connector;

[0020] An I2C signal transmission line, for transmitting the I2C signal of the central processing unit to the first connector;

[0021] The HPD signal transmission line is used to transmit the HPD signal of the central processing unit to the first connector.

[0022] Furthermore, the differential data line includes a coupling capacitor, and two ends of the coupling capacitor are respectively connected to the central processing unit and the first connector.

[0023] Furthermore, the I 2 C signal transmission line includes an effect transistor, a gate of the effect transistor is connected to the power management unit, and a source and a drain of the effect transistor are connected to the central processing unit and the first connector respectively.

[0024] Furthermore, a power chip is provided between the power management unit and the central processing unit, and the power management unit is connected to the first connector via the power chip.

[0025] An industrial control mainboard comprises a baseboard and a core board, wherein the core board integrates a central processing unit, a dynamic random access memory, an embedded multimedia memory, a wireless network module, a cooling fan and a power management unit; the core board transmits a data signal to the baseboard via a first connector; the baseboard and the core board are pluggably connected via the first connector; the baseboard is used as a platform for providing installation and connection of electronic components, and the core board expands connection ports via the baseboard.

[0026] Furthermore, the connection between the base plate and the core board adopts a micro socket connection.

[0027] The beneficial effects of the present invention are as follows: the core board of the present invention integrates multiple functional modules such as a central processing unit, a dynamic random access memory, an embedded multimedia memory, a wireless network module, a cooling fan and a power management unit. Through the streamlined design of the core board, the core board integrates key functional unit modules. There is no need to set too many port circuits on the core board. Instead, the substrate is connected through a first connector. The substrate is used to provide an electronic connection platform, which reduces unnecessary circuits and interfaces of the core board and simplifies the overall design. The core board and the substrate are detachably connected through the first connector. Users can design the core board and the substrate separately according to actual needs to achieve specific functions. There is no need to design the industrial control mainboard as a whole, avoid integrating too many circuits and ports, improve the convenience of system maintenance and upgrade, and solve the problems of high complexity and large occupied area of ​​the industrial control mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the structure of the utility model;

[0029] Figure 2 This is a schematic diagram of the connection circuit of the first connector of the utility model;

[0030] Figure 3 This is a schematic diagram of the connection circuit of the network interface chip of the utility model;

[0031] Figure 4 This is a schematic diagram of the signal conversion interface of the network interface chip of the utility model;

[0032] Figure 5 This is a schematic diagram of the connection circuit of the audio chip of the utility model;

[0033] Figure 6 This is a schematic diagram of a partial connection circuit between the audio chip and the first connector of the utility model;

[0034] Figure 7 This is a schematic diagram of the connection circuit of the power chip of the utility model;

[0035] Figure 8This is a schematic diagram of a differential data signal transmission circuit of the utility model;

[0036] Figure 9 This is a schematic diagram of the HDP signal transmission circuit of the utility model;

[0037] Figure 10 This is a schematic diagram of the I2C signal transmission circuit of the utility model. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. It should be understood that this application is not limited to the example embodiments disclosed herein. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0039] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0041] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0042] The utility model provides an attached Figures 1 to 10In an embodiment of the present invention, a core board includes a board card, the board card is used to connect to a substrate, and the board card is provided with:

[0043] Central processing unit (CPU), which executes programs, processes data, and controls the operations of other components;

[0044] Dynamic random access memory (DRAM), which is connected to the central processing unit and is used to store temporary data and programs for rapid access by the central processing unit. It is the main memory resource when the system is running;

[0045] An embedded multimedia memory, connected to the central processing unit, which may be a solid-state storage device such as EMMC or UFS, for storing an operating system, applications, and user data;

[0046] A wireless network module is connected to the central processing unit to provide network wireless communication functions, such as WIFI or Bluetooth, allowing the core board to connect wirelessly to other devices or networks;

[0047] A cooling fan connected to the central processing unit is used to cool the board, the CPU and other heat-generating components, ensuring that the board operates at a safe temperature and preventing performance degradation or damage caused by overheating;

[0048] A power management unit, connected to the central processing unit, the dynamic random access memory, the embedded multimedia memory, the wireless network module, and the cooling fan, and responsible for managing and distributing power on the board to ensure that each component receives appropriate voltage and current;

[0049] The first connector, namely the gold finger interface, is connected to the central processing unit to transmit the data signal on the board to the baseboard, and also allows the core board to connect with other system components.

[0050] The core board integrates multiple functional modules such as a central processing unit, dynamic random access memory, embedded multimedia memory, wireless network module, cooling fan and power management unit. This integrated design reduces the need for external connections and simplifies the overall structure of the system. It is connected to the baseboard through a first connector (gold finger interface), which simplifies the connection method between the core board and other system components, making the transmission of data signals more efficient and reliable. Through the streamlined design of the core board, the core board integrates key functional unit modules. There is no need to set up too many port circuits on the core board. Instead, it is connected to the baseboard through the first connector. The baseboard is used to provide an electronic connection platform, which reduces unnecessary circuits and interfaces of the core board and simplifies the overall design. The core board and the baseboard are detachably connected through the first connector. Users can design the core board and the baseboard separately according to actual needs to achieve specific functions. There is no need to design the industrial control mainboard as a whole, avoid integrating too many circuits and ports, improve the convenience of system maintenance and upgrades, and solve the problems of high complexity and large area occupied by the industrial control mainboard.

[0051] A network interface chip is provided between the central processing unit and the first connector;

[0052] The network interface chip is used to convert the PC IE signal of the central processing unit into an RJ45 differential data signal, and transmit the RJ45 differential signal to the baseboard through the first connector.

[0053] Specifically, refer to Figure 3 and Figure 4 , the network interface chip U53 communicates with the CPU through the PC IE signals of pins 14 (PC I E_TXP9), 15 (PC I E_TXN9), 16 (CLK_PC I E2), 17 (CLK_PC I E2#), 18 (PC I E_RXP9), and 19 (PC I E_RXN9), which are converted into RJ45 differential data signals and transmitted to pins 2 (LAN1_MD I 3-), 4 (LAN1_MD I 1+), 5 (LAN1_MD I 1-), 6 (LAN1_MD I 2+), 7 (LAN1_MD I 2-), 9 (LAN1_MD I 3+), and 10 (LAN1_MD I 3-) of the first connector through pins 1 (LAN1_MD I 0+), 2 (LAN1_MD I 0-), 4 (LAN1_MD I 1+), 5 (LAN1_MD I 1-), 6 (LAN1_MD I 2+), 7 (LAN1_MD I 2-), 9 (LAN1_MD I 3+), and 10 (LAN1_MD I 3-). 3+), 6-pin (LAN1_MD I 2-), 8-pin (LAN1_MDI 2+), 10-pin (LAN1_MD I 1-), 12-pin (LAN1_MD I 1+), 14-pin (LAN1_MD I 0-), 16-pin (LAN1_MD I0+).

[0054] The network interface chip converts the PCIe signal of the central processing unit into an RJ45 differential data signal. This conversion enables the core board to communicate with external devices through a standardized network interface (such as Ethernet). By converting the PCIe signal into an RJ45 differential signal, the core board can be compatible with a wide range of existing network equipment and infrastructure, including routers, switches and other network interface devices. By setting the network interface chip between the CPU and the Golden Hand interface, a modular design of the core board is achieved. This design makes it easier for the core board to be integrated with other system components, improving the flexibility and scalability of the system. By integrating the network interface chip, the core board can provide plug-and-play network connection without the need for additional network adapters or complicated configuration processes. The integrated network interface chip reduces the need for external network interface cards, saves space, and reduces the overall cost of the system.

[0055] An audio chip is provided between the central processing unit and the first connector;

[0056] The audio chip receives the digital audio signal from the central processing unit, and after being analyzed by the audio chip, transmits the analog audio signal to the substrate through the first connector.

[0057] Specifically, refer to Figure 5 and Figure 6 The audio chip is connected to the CPU and inputs data audio signals through pins 5 (HDA_SDO), 6 (HDA_BCLK), 8 (HDA_SD IN), 10 (HDA_SYNC), and 11 (HDA_RST#). After AU1 audio analysis, the analog audio signals are transmitted from pins 35 (FRONT_OUT_L) and 36 (FRONT_OUT_R) to pins 73 (FRONT_L) and 75 (FRONT_R) of the first connector.

[0058] By integrating the audio chip between the central processing unit and the gold finger, the core board can directly process the audio signal without the need for an additional audio interface card or external audio processing equipment. The audio chip converts the digital audio signal provided by the CPU into an analog audio signal. This conversion process is necessary for connecting to analog audio output devices (such as speakers or headphones). Signal processing through the integrated audio chip can ensure the integrity and quality of the audio signal during transmission and reduce signal interference and noise. The integrated audio chip provides a simplified audio interface solution, allowing the core board to be directly connected to common audio output devices without complex configuration or additional hardware. The integrated audio chip allows the core board to achieve plug-and-play audio output function, optimizing the steps of system upgrade and maintenance.

[0059] An RC series circuit is connected between the audio chip and the first connector, for coupling signals between the audio chip and the first connector.

[0060] Specifically, refer to Figure 6 The audio signal from the AU1 audio chip's audio analysis is transmitted from pin 35 (FRONT_OUT_L) via the AC5 matching capacitor and AR6 matching resistor connected in series to pin 73 (FRONT_L) of the first connector (gold finger interface). The analog audio signal from the AU1 audio chip's audio analysis is transmitted from pin 36 (FRONT_OUT_R) via the AC4 matching capacitor and AR5 matching resistor connected in series to pin 75 (FRONT_R) of the first connector (gold finger interface). The matching resistor in the RC series circuit is used to match the impedance between the audio chip and the first connector, ensuring efficient signal transmission and minimizing reflections. The matching capacitor is typically used to filter out high-frequency noise, while the matching resistor helps suppress electromagnetic interference, thereby improving signal clarity and quality. The integrated RC series circuit simplifies the design of the audio signal path and provides a standardized approach to signal transmission issues.

[0061] Between the central processing unit and the gold finger is provided:

[0062] A differential data line, for transmitting a differential data signal of the central processing unit to the first connector;

[0063] an I2C signal transmission line, for transmitting the I2C signal of the central processing unit to the first connector;

[0064] The HPD signal transmission line is used to transmit the HPD signal of the central processing unit to the first connector.

[0065] The central processing unit (CPU) and the first connector are connected via differential data lines, I2C signal transmission lines, and HPD signal transmission lines to enable complete transmission of HDMI (High-Definition Multimedia Interface) signals. The HDMI transmission lines use differential signals to improve signal integrity and anti-interference capabilities, while the differential data signals are responsible for transmitting video data. I2C is a serial communication protocol used for transmitting control and configuration signals between devices. In HDMI applications, I2C lines allow the CPU to communicate with the HDMI interface chip and exchange configuration information, such as EDID. The HPD signal is used to detect whether the HDMI device is connected, that is, whether the plug is inserted. When the HDMI is electrically connected to a display device, the HPD signal notifies the CPU, enabling video transmission. The HDMI includes differential data lines, I2C signal transmission lines, and HPD signal transmission lines. These lines are integrated into the core board and connected to the first connector. The integrated HDMI signal transmission lines help ensure the core board's compatibility with various HDMI display devices.

[0066] The differential data line includes a coupling capacitor, and the two ends of the coupling capacitor are connected to the central processing unit and the first connector respectively. Figure 8 , Coupling capacitors include coupling capacitor C429, coupling capacitor C430, coupling capacitor C431, coupling capacitor C432, coupling capacitor C434, coupling capacitor C433, coupling capacitor C435, and coupling capacitor C436. Coupling capacitors help filter out high-frequency noise of non-differential signals, thereby maintaining signal integrity and stability. Differential data signals are output from the CPU's DDI 1_TXN0 pin, DDI 1_TXP0 pin, DDI 1_TXN1 pin, DDI 1_TXP1 pin, DDI 1_TXN2 pin, DDI 1_TXP2 pin, and DDI 1_TXN3 pin through the series coupling capacitors HDM I 2_DATA2_P, HDM I 2_DATA2_N, HDM I 2_DATA1_P, HDM I 2_DATA1_N, HDM I 2_DATA0_P, HDM I 2_DATA0_N, HDMI 2_CLK_P, HDM I 2_CLK_N inputs HDM I differential data signals to pins 3, 5, 9, 11, 15, 17, 21, and 23 of the gold finger connector. Coupling capacitors are used to filter out high-frequency noise that could interfere with the transmission quality of the differential data signals. By filtering this noise, signal integrity and stability are maintained. Signal integrity is a critical factor in high-speed data transmission, and coupling capacitors help ensure that signals remain clear and accurate during transmission from the central processing unit to the first connector.

[0067] The I2C signal transmission line includes an effect transistor, the gate of the effect transistor is connected to the power management unit, and the source and drain of the effect transistor are connected to the central processing unit and the first connector respectively. Figure 9 and Figure 10 The I2C signal passes through pull-up resistors R471 and R472, then through isolation and level conversion transistors Q145 and Q147. It then passes through resistors R473 and R474, and is connected to gold finger pins 29 (HDM I 2_SCL) and 30 (HDM I 2_SDA). Furthermore, the HDP signal passes through pull-up resistors R475, level conversion transistors Q146, and pull-down resistor R476, connecting to gold finger pin 33 (DDI 1_HPD). Specifically, the effect tube can provide electrical isolation, reduce mutual interference between different parts, and improve stability and isolation. Different circuits or devices require different level standards. The effect tube can be used to convert levels to ensure that the signal is correctly transmitted between different level systems. R471 and R472 are used as pull-up / pull-down resistors to ensure that the signal line remains at a certain level when idle, reducing floating and noise. R475 is used as a pull-up resistor to ensure that the HDP signal remains at a high level when not connected. R476 is used as a pull-down resistor to ensure that the HDP signal can be correctly pulled down when connected. R473 and R474 are used as current-limiting resistors and are used in conjunction with the effect tube to prevent excessive current from damaging the circuit.

[0068] A power chip is provided between the power management unit and the central processing unit, and the power management unit is connected to the first connector via the power chip. Figure 1 The USB_PN3 pin and USB_PP3 pin of the central processing unit CPU are connected to pins 28 (USB_PN3) and 29 (USB_PN3) of the first connector through lines. The power is input from pin 5 of the power chip U55, filtered by capacitor C493, and output from pin 1 of the power chip U55 to pins 32 and 34 of the first connector. Through the power chip U55, the power of the USB port can be precisely controlled to ensure that appropriate power is provided for the connected USB devices.

[0069] An industrial control motherboard includes a baseboard and a core board, wherein the core board integrates a central processing unit, a dynamic random access memory, an embedded multimedia memory, a wireless network module, a cooling fan, and a power management unit, wherein the baseboard and the core board are pluggable connected via a first connector, the baseboard is used as a platform for providing electronic component installation and connection, and the core board has an expansion connection port via the baseboard. In order to address the shortcomings of traditional industrial control motherboards, such as complex design, high heat generation, large size, high power consumption, and complex interfaces, by integrating core functions into the core board, the core board and the baseboard are detachably connected via a first connector, namely a gold finger interface, which can reduce unnecessary circuits and interfaces and simplify the overall design.

[0070] Specifically, the core board mainly includes a combination of devices such as the central processing unit (CPU), dynamic random access memory (DRAM), embedded multimedia memory, wireless network module, cooling fan, power management unit, etc., to achieve the basic configuration for running the OS, and transmit relevant data to the baseboard through the gold finger interface.

[0071] The substrate is provided with a second connector (M2 port) for connecting to the first connector (gold finger interface) of the core board. The RJ45 signal is connected to the substrate RJ45 circuit through the gold finger through the substrate M2 port, and is connected to the Internet of Things by extending the RJ45 connector to realize network communication. The USB signal is connected to the substrate USB circuit through the gold finger through the substrate M2 port, and is connected to the external hot-swappable USB port through the USB connection extension port. The AUD IO signal is connected to the substrate audio circuit through the gold finger through the substrate M2 port, and is connected to the headset through the audio headphone socket expansion port. The HDM I signal is connected to the substrate HDM I circuit through the gold finger through the substrate M2 port, and is output through the HDM I connector, outputting the HDM I image signal to connect to the monitor for display.

[0072] The connection between the substrate and the core board uses a micro-socket connection. Micro-socket connection technology can provide precise spacing and alignment, ensuring that each socket accurately matches the corresponding pin on the core board, thereby achieving a reliable connection. The micro-socket can be designed with a shielding layer to effectively isolate external electromagnetic interference and protect the signal from noise.

[0073] It should also be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0074] The above description of the disclosed embodiments will enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A core board, comprising a board card, wherein the board card is used to connect to a substrate, characterized in that: The board is provided with: Central processing unit, used to execute programs and process data; A dynamic random access memory (DRAM), connected to the central processing unit (CPU), for storing temporary data and programs for rapid access by the CPU; An embedded multimedia memory connected to the central processing unit and used for storing an operating system, application programs and user data; A wireless network module, connected to the central processing unit, for providing network wireless communication function; A cooling fan connected to the central processing unit for cooling the board; A power management unit, connected to the central processing unit, the dynamic random access memory, the embedded multimedia memory, the wireless network module and the cooling fan, and responsible for managing and distributing power on the board; A first connector is connected to the central processing unit and is used to transmit data signals on the board to the substrate.

2. A core board according to claim 1, characterized in that, A network interface chip is provided between the central processing unit and the first connector; The network interface chip is used to convert the PCIE signal of the central processing unit into an RJ45 differential data signal, and transmit the RJ45 differential signal to the baseboard through the first connector.

3. A core board according to claim 1, characterized in that, An audio chip is provided between the central processing unit and the first connector; The audio chip receives the digital audio signal from the central processing unit, and after being analyzed by the audio chip, transmits the analog audio signal to the substrate through the first connector.

4. A core board according to claim 3, characterized in that, An RC series circuit is connected between the audio chip and the first connector, for coupling signals between the audio chip and the first connector.

5. A core board according to claim 1, characterized in that: Between the central processing unit and the first connector is provided: A differential data line, for transmitting a differential data signal of the central processing unit to the first connector; An I2C signal transmission line, for transmitting the I2C signal of the central processing unit to the first connector; The HPD signal transmission line is used to transmit the HPD signal of the central processing unit to the first connector.

6. A core board according to claim 5, characterized in that: The differential data line includes a coupling capacitor, and two ends of the coupling capacitor are respectively connected to the central processing unit and the first connector.

7. A core board according to claim 5, characterized in that: The I2C signal transmission line includes an effect tube, a gate of the effect tube is connected to the power management unit, and a source and a drain of the effect tube are respectively connected to the central processing unit and the first connector.

8. A core board according to claim 1, characterized in that: A power chip is provided between the power management unit and the central processing unit, and the power management unit is connected to the first connector via the power chip.

9. An industrial control motherboard, characterized in that: comprising a substrate and a core board according to any one of claims 1 to 8, The core board is integrated with a central processing unit, a dynamic random access memory, an embedded multimedia memory, a wireless network module, a cooling fan and a power management unit; The core board transmits the data signal to the base board through the first connector; The base board and the core board are connected via a first connector; The substrate is used as a platform for installing and connecting electronic components, and the core board extends the connection port through the substrate.

10. The industrial control motherboard according to claim 9, characterized in that: The connection between the base plate and the core board adopts a micro socket type connection.

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