Rear cover, structural member and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, provides a rear cover, a structural member and electronic equipment, and can solve the problems that the strength of the rear cover at the position of a concave cavity is relatively low and the rear cover is easy to damage in the related technology. The rear cover is used for the electronic equipment and comprises a cover body, an appearance decoration layer and an appearance structural member, the cover body is an organic fiber composite material cover body, the cover body is provided with a first surface and a second surface which are arranged oppositely, and the first surface is provided with a concave cavity pressed by a mold; the appearance decoration layer covers the first surface on the periphery of the concave cavity; and the appearance structural member is arranged in the concave cavity. The method can be applied to the mobile phone.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a back cover, a structural component and an electronic device. Background Art

[0002] The back cover (also known as the battery cover) is a structural component covering the back of an electronic device. It primarily protects the internal components of the device and enhances its aesthetics. With the advancement of electronic technology, electronic devices are becoming thinner and lighter, placing higher demands on the material selection of the back cover. Designing a back cover that meets these requirements of low density and high strength has become a key issue in the industry. Utility Model Content

[0003] The embodiments of the present application provide a back cover, a structural member, and an electronic device, which are used to solve the problem in the related art that the back cover has low strength at the position of the cavity and is easily damaged.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, an embodiment of the present application provides a back cover for an electronic device, comprising a cover body, an appearance decorative layer, and an appearance structural member; the cover body is an organic fiber composite material cover body, the cover body having a first surface and a second surface arranged opposite to each other, the first surface being provided with a cavity pressed out by a mold; the appearance decorative layer is covered on the first surface outside the cavity; the appearance structural member is arranged in the cavity.

[0006] The back cover provided in the embodiment of the present application has a cavity pressed out by a mold on the cover body, so the depth of the cavity is controlled by the size of the mold itself. Since the size of the mold itself has a high precision, the depth of the pressed cavity can be guaranteed to have a high precision, thereby ensuring the strength of the weak area between the cavity and the second surface of the cover body, avoiding the above-mentioned weak area from being penetrated during the assembly of the appearance structural parts, and thus helping to improve the structural reliability of the back cover.

[0007] In some embodiments of the first aspect, the cover includes a base and a plurality of organic fiber layers embedded within the base along the thickness of the base, wherein at least one of the organic fiber layers has a curved region located at the location of the cavity. This arrangement can improve the structural strength and impact resistance of the back cover at the location of the cavity.

[0008] In some embodiments of the first aspect, the curved region includes a first curved region, the first curved region being located between the concave cavity and the second surface and curving toward a side away from the exterior decorative layer. This arrangement facilitates improving the structural strength and impact resistance of the weak region between the concave cavity and the second surface of the cover.

[0009] In some embodiments of the first aspect, a slit is provided in the first curved region, the slit extending through the first curved region in the thickness direction. This configuration relieves stress on the organic fiber layer caused by die extrusion, thereby reducing the obstruction of the organic fiber layer in the first curved region to die extrusion.

[0010] In some embodiments of the first aspect, at least one organic fiber layer has an escape opening through which the cavity passes; the curved region includes a second curved region located at an edge of the escape opening. This arrangement helps improve the structural strength and impact resistance of the cover at the edge of the cavity.

[0011] In some embodiments of the first aspect, the organic fiber layer is one of a PI fiber layer, a PBO fiber layer, and an aramid fiber layer; and the matrix is ​​a resin matrix. This configuration not only reduces the weight of the back cover but also improves its strength and rigidity.

[0012] In some embodiments of the first aspect, the organic fiber layer is a UHMWPE fiber layer and the matrix is ​​a resin matrix. This configuration can reduce the weight of the back cover.

[0013] In some embodiments of the first aspect, a fillet is provided at the junction of the bottom wall of the cavity and the side wall of the cavity; the radius of the fillet is in the range of 0.1 mm to 0.25 mm. This configuration can prevent the fillet from excessively occupying space within the cavity and can also prevent stress concentration at the junction of the bottom wall and the side wall of the cavity.

[0014] In some embodiments of the first aspect, a receiving portion is provided on the bottom wall of the cavity; the receiving portion is a through-hole extending through the second surface, and the through-hole is configured to allow components on a circuit board within the electronic device to extend therethrough. This arrangement allows the back cover and the components to overlap in their thickness direction, thereby facilitating a reduction in the thickness of the electronic device.

[0015] In some embodiments of the first aspect, a receiving portion is provided on the bottom wall of the cavity; the receiving portion is a receiving groove into which the protruding structure on the appearance structural component extends. With this arrangement, the receiving groove serves to position the appearance structural component, thereby facilitating installation of the appearance structural component in a target position.

[0016] In some embodiments of the first aspect, a rib is provided on the cavity bottom wall to support the exterior structural member. The rib divides the cavity bottom wall into a first region and a second region. The first region includes a receiving portion, and the second region includes an adhesive portion that bonds the exterior structural member to the cavity bottom wall. With this arrangement, the rib acts as a barrier, preventing uncured adhesive from flowing into the receiving portion, thereby blocking the receiving portion.

[0017] In the second aspect, an embodiment of the present application provides a structural part for making a back cover of an electronic device, including a cover body and an appearance decorative layer; the cover body is an organic fiber composite material cover body, the cover body having a first surface and a second surface arranged opposite to each other, and the first surface is provided with a cavity pressed out by a mold; the appearance decorative layer is covered on the first surface, and the appearance decorative layer has a covering area, which is located at the position of the cavity and covers the cavity opening of the cavity.

[0018] The beneficial effects of the structural member in the embodiment of the present application are the same as the beneficial effects of the back cover in the first aspect, and will not be repeated here.

[0019] In some embodiments of the second aspect, the cover includes a base, and a plurality of organic fiber layers embedded in the base along a thickness direction of the base, at least one organic fiber layer has a curved region, and the curved region is located at the position of the concave cavity.

[0020] In some embodiments of the second aspect, the bending area includes a first bending area, the first bending area is located between the cavity and the second surface, and is bent toward a side away from the appearance decoration layer.

[0021] In some embodiments of the second aspect, a slit is provided on the first bending region, and the slit runs through the first bending region along the thickness direction.

[0022] In some embodiments of the second aspect, at least one organic fiber layer has an avoidance opening, the avoidance opening allowing the cavity to pass through, and the bending region includes a second bending region located at an edge of the avoidance opening.

[0023] In some embodiments of the second aspect, the organic fiber layer is one of a PI fiber layer, a PBO fiber layer, an aramid fiber layer, and a UHMWPE fiber layer; and the matrix is ​​a resin matrix.

[0024] In some embodiments of the second aspect, a chamfer is provided at the junction of the bottom wall of the cavity and the side wall of the cavity; the radius of the chamfer is in the range of 0.1 mm to 0.25 mm.

[0025] In some embodiments of the second aspect, a removable protective member is disposed within the cavity. The protective member comprises a support surface located at the cavity opening, and the covering region is disposed on the support surface. This configuration allows the protective member to support the exterior decoration, ensuring that the exterior decoration layer covers the cavity. Furthermore, the protective member protects the structure within the cavity, preventing damage to the structure during subsequent processing steps.

[0026] In some embodiments of the second aspect, a rib is provided on the bottom wall of the cavity, and the rib is used to support the protective member. In this way, the rib can raise the height of the protective member relative to the bottom wall of the cavity, which is conducive to reducing the weight of the protective member.

[0027] In a third aspect, an embodiment of the present application provides a back cover for an electronic device, which is made of the structural parts described in any embodiment of the second aspect.

[0028] The beneficial effects of the back cover in the embodiment of the present application are the same as the beneficial effects of the structural member in the second aspect, and will not be repeated here.

[0029] In a fourth aspect, an embodiment of the present application provides an electronic device, comprising a display screen, a middle frame, and the back cover described in the first aspect or the third aspect, wherein the display screen is arranged on one side of the middle frame, and the back cover is arranged on the other side of the middle frame.

[0030] The beneficial effects of the electronic device in the embodiment of the present application are the same as the beneficial effects of the back cover in the first aspect or the third aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic structural diagram of the back side of an electronic device in the related art;

[0032] Figure 2 for Figure 1 An AA cross-sectional view of the back cover of the electronic device shown;

[0033] Figure 3 A cross-sectional view of another back cover at the concave cavity in the related art;

[0034] Figure 4 This is a schematic structural diagram of the back side of the electronic device (mobile phone) in the first embodiment of the present application;

[0035] Figure 5 for Figure 4 BB cross-sectional view of the electronic device shown in;

[0036] Figure 6 for Figure 5 A partial enlarged view of the back cover of an electronic device;

[0037] Figure 7 for Figure 6 The top view of the rear cover after removing the exterior structural parts;

[0038] Figure 8 for Figure 6 A partial enlarged view of

[0039] Figure 9 A cross-sectional view of another back cover of the electronic device at the concave portion in the first embodiment of the present application;

[0040] Figure 10 Schematic diagram of the manufacturing process of the back cover of the electronic device in the first embodiment of the present application;

[0041] Figure 11 This is a schematic structural diagram of the back side of an electronic device (mobile phone) in the second embodiment of the present application;

[0042] Figure 12 for Figure 11 A CC cross-sectional view of the electronic device shown in ;

[0043] Figure 13 for Figure 12 A partial enlarged view of the back cover of an electronic device;

[0044] Figure 14 A schematic diagram of the manufacturing process of the back cover of the electronic device in the second embodiment of the present application is shown. DETAILED DESCRIPTION

[0045] The technical solutions in some embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0046] The back cover is a structural component covering the back of electronic devices (such as mobile phones and tablets). It not only protects the internal circuits and components, but also affects the appearance, feel, and durability of the device. With the development of electronic technology, electronic devices are moving towards lighter and thinner devices, which places higher demands on the selection of back cover materials. How to design back covers to meet the requirements of low density and high strength has become a major issue in the industry.

[0047] like Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the structure of the back side of an electronic device in the related art. Figure 2 for Figure 1 The AA cross-sectional view of the back cover of the electronic device is shown. The back cover 100 of the electronic device includes a cover body 1, an appearance decoration layer 2 and an appearance structural member 3.

[0048] The cover body 1 is an inorganic fiber composite material cover body, including a base body 11, and multiple (three shown in the figure) inorganic fiber layers 12 embedded in the base body 11. The multiple inorganic fiber layers 12 are arranged along the thickness direction Z of the base body 11. The inorganic fiber layers 12 can be glass fiber layers, carbon fiber layers, etc.

[0049] The base 11 has a first surface 10a and a second surface 10b arranged opposite to each other. The appearance decoration layer 2 covers the first surface 10a. The outer surface of the appearance decoration layer 2 is provided with a cavity 14. The cavity 14 is located at one side edge of the back cover 100 (for example, the lower edge, that is, the side edge of the back cover 100 away from the camera) and passes through the appearance decoration layer 2 and a portion of the cover body 1. Figure 1 and Figure 2As shown, the concave cavity 14 is a logo groove (LOGO groove), and the appearance structural component 3 is a logo component (LOGO).

[0050] The back cover 100 is made by the following steps: M1, making the cover body 1 by a hot pressing process; M2, covering the appearance decoration layer 2 on the first surface 10a of the cover body 1; M3, removing part of the appearance decoration layer 2 and part of the cover body 1 by CNC machining to form a cavity 14.

[0051] In the related art, the back cover 100 has a cover body 1 made of an inorganic fiber composite material. Due to the high density of the inorganic fiber composite material, the back cover 100 is heavy and cannot meet the development requirements of lightweight electronic devices.

[0052] In order to solve the above problems, Figure 3 As shown, the related art provides another back cover 100 of an electronic device. Figure 2 The main differences in the back cover 100 are: Figure 3 The cover body 1 of the back cover 100 shown in the figure is made of an organic fiber composite material, as described below: the cover body 1 of the back cover 100 includes a base 11, and a plurality of (three as shown in the figure) organic fiber layers 13 embedded in the base 11, and the plurality of organic fiber layers 13 are arranged along the thickness direction Z of the base 11.

[0053] The back cover 100 is made by the following steps: N1, making the cover body 1 through a hot pressing process; N2, covering the first surface 10a of the cover body 1 with an appearance decoration layer 2; N3, removing part of the appearance decoration layer 2 and part of the cover body 1 through laser cutting (organic fiber composite materials have high toughness and cannot be machined by tools) to form a cavity 14.

[0054] However, the depth of the cavity 14 formed by laser cutting is difficult to control precisely, which may easily lead to excessive cutting of material, resulting in reduced strength of the weak area between the cavity 14 and the second surface 10b of the cover body 1. In the process of assembling the appearance structural component 3 in the cavity 14, the above-mentioned weak area is easily penetrated by the appearance structural component 3, thereby reducing the structural reliability of the back cover 100.

[0055] To this end, the embodiments of the present application provide a back cover, a structural component and an electronic device. By setting a cavity pressed out by a mold on the cover body of the back cover, the depth of the cavity can be precisely controlled, thereby ensuring the strength of the weak area between the cavity and the second surface of the cover body, which is beneficial to improving the structural reliability of the back cover.

[0056] The electronic device in the embodiment of the present application can be an electronic device such as a mobile phone, a tablet computer, a wearable device (such as a smart watch), etc. The electronic device in the embodiment of the present application is specifically introduced using a mobile phone as an example. Other types of electronic devices can be specifically set up with reference to the structure of the mobile phone embodiment, and will not be described one by one here.

[0057] like Figure 4 and Figure 5 As shown, Figure 4 This is a structural diagram of the back side of the electronic device (mobile phone) in the first embodiment of the present application. Figure 5 for Figure 4 The electronic device includes a display screen 200, a middle frame 300 (also called a front shell or front frame), a back cover 100, and a camera module 500. The display screen 200 is arranged on one side of the middle frame 300, and the back cover 100 is arranged on the other side of the middle frame 300.

[0058] In some embodiments, as Figure 5 As shown, the display screen 200 and the middle frame 300 enclose a first accommodation space 410. The first accommodation space 410 is used to accommodate electronic components such as a motherboard (not shown in the figure). The motherboard and the display screen 200 are electrically connected via a flexible circuit board. The display screen 200 can be a liquid crystal display screen 200 or an OLED (Organic Light-Emitting Diode) display screen 200, which is not specifically limited here.

[0059] The back cover 100 and the middle frame 300 form a second accommodating space 420, and the camera module 500 is arranged in the second accommodating space 420. The camera module 500 includes a camera 510 and a connecting circuit board 520 electrically connected to the camera 510. The connecting circuit board 520 is electrically connected to the main board. The light input end of the camera 510 is arranged relative to the camera window 6 set on the back cover 100 to ensure that the camera 510 can receive light emitted by the scene being photographed outside the electronic device.

[0060] The camera 510 may be provided as one or more cameras, for example Figure 4 and Figure 5 As shown, there are three cameras 510 , which are arranged side by side; the back cover 100 is provided with a camera window 6 at a position corresponding to each camera 510 .

[0061] Of course, the positional relationship among the display screen 200, middle frame 300, back cover 100, mainboard and camera module 500 of the electronic device is not limited to that shown above, and other settings may be adopted according to actual conditions, which is not specifically limited here.

[0062] like Figure 5 and Figure 6 As shown, Figure 6 for Figure 5 A partial enlarged view of the back cover 100 of an electronic device. Back cover 100 comprises a cover body 1, a decorative layer 2, and a structural member 3. Cover body 1 is made of an organic fiber composite material and has a first surface 10a and a second surface 10b disposed opposite each other. A cavity 14 is formed on the first surface 10a, formed by a mold. The decorative layer 2 covers the first surface 10a, surrounding the cavity 14. The structural member 3 is disposed within the cavity 14.

[0063] The back cover 100 in the embodiment of the present application has a cavity 14 pressed out by a mold on the cover body 1, so the depth of the cavity 14 is controlled by the size of the mold itself. Since the size of the mold itself has a high precision, the depth of the pressed cavity 14 can be guaranteed to have a high precision, thereby ensuring the strength of the weak area between the cavity 14 and the second surface 10b of the cover body 1, avoiding the above-mentioned weak area from being penetrated during the assembly of the appearance structural part 3, and thus helping to improve the structural reliability of the back cover 100.

[0064] In addition, the cover 1 is provided with a cavity 14 extruded by a mold, so that the cavity 14 is not prone to debris during the forming process, thereby facilitating cleaning of the cover 1 after the cavity 14 is formed. At the same time, after the cavity 14 is formed, it has little effect on the appearance of the cover 1, thereby helping to improve the yield rate of the appearance of the back cover 100.

[0065] The concave cavity 14 may be a groove, a hole, or a combination of a groove and a hole, which is not specifically limited here. Figure 4 、 Figure 5 and Figure 6 As shown, the exterior structural member 3 is a logo member (i.e., a logo), and the concave cavity 14 is a logo slot (i.e., a logo slot). Of course, this is not limited to this. The exterior structural member 3 can also be other exterior components. For example, the exterior structural member 3 can also be a decorative sheet, and the concave cavity 14 can be a decorative slot. For another example, the exterior structural member 3 can also be a metal sheet (e.g., a steel sheet), and the concave cavity 14 can be a metal sheet receiving slot.

[0066] In some embodiments, as Figure 4 and Figure 5 As shown, the concave cavity 14 is provided at the position of the camera window 6 on the cover 1. Of course, the concave cavity 14 is not limited to being provided at the position of the camera window 6, and can also be provided in other areas on the cover 1, such as at the lower left corner, lower right corner, upper right corner, etc. of the cover 1.

[0067] In some embodiments, as Figure 6As shown, the cover 1 includes a base 11 and a plurality of organic fiber layers 13 embedded in the base 11 along the thickness direction Z of the base 11. At least one organic fiber layer 13 has a curved region 131, and the curved region 131 is located at the position of the cavity 14. The curved region 131 is formed when the organic fiber layer 13 is squeezed by the mold during the formation of the cavity 14.

[0068] In the cover 1 , one organic fiber layer 13 may have the curved region 131 , or multiple organic fiber layers 13 may have the curved region 131 , for example Figure 6 As shown, there are three organic fiber layers 13 . Along the direction away from the exterior decoration layer 2 , the three organic fiber layers 13 are respectively an organic fiber layer 13 a , an organic fiber layer 13 b and an organic fiber layer 13 c . The organic fiber layer 13 a and the organic fiber layer 13 b both have a curved area 131 .

[0069] In this embodiment, since at least one organic fiber layer 13 has a curved area 131, when the back cover 100 around the cavity 14 is subjected to external force, such as when assembling the appearance structural part 3, the curved area 131 can disperse the stress well, thereby improving the structural strength and impact resistance of the back cover 100 at the cavity 14, which is beneficial to improving the structural reliability of the back cover 100.

[0070] In some embodiments, as Figure 6 As shown, the curved region 131 includes a first curved region 131a, which is located between the cavity 14 and the second surface 10b and bends toward a side away from the exterior decorative layer 2. Because the first curved region 131a is located between the cavity 14 and the second surface 10b, when the back cover 100 around the cavity 14 is subjected to external forces, such as when assembling the exterior structural component 3, the first curved region 131a can effectively disperse the stress in the weak region between the cavity 14 and the second surface 10b, thereby improving the structural strength and impact resistance of the weak region. As a result, the weak region is less likely to be penetrated during assembly of the exterior structural component 3, thereby improving the structural reliability of the back cover 100.

[0071] In some embodiments, as Figure 6 As shown, a slit 132 is provided on the first curved region 131a, and the slit 132 penetrates the first curved region 131a along the thickness direction Z of the base 11. By providing the slit 132, when the mold extrudes the cover body 1 to form the cavity 14, the slit 132 can release the stress exerted on the organic fiber layer 13 by the mold extrusion, thereby reducing the obstruction of the organic fiber layer 13 in the first curved region 131a to the mold extrusion, thereby facilitating the formation of the cavity 14 more smoothly.

[0072] The extending direction of the slit 132 can be perpendicular to the thickness direction Z of the base 11. For example, the extending direction of the slit 132 can be parallel to the width direction of the cavity 14. The width direction of the cavity 14 is perpendicular to the length direction of the cavity 14. The size of the cavity 14 in the length direction is greater than the size of the cavity 14 in the width direction. Figure 7 As shown, Figure 7 for Figure 6 The top view of the rear cover 100 is shown after the appearance structural member 3 is removed. The up-down direction in the figure is the width direction of the cavity 14 , and the left-right direction in the figure is the length direction of the cavity 14 .

[0073] In some embodiments, as Figure 8 As shown, Figure 8 for Figure 6 A partially enlarged view of the cavity 14 is provided with a fillet 143 at the junction of the cavity bottom wall 141 and the cavity side wall 142 of the cavity 14. The radius of the fillet 143 ranges from 0.1 mm to 0.25 mm. The fillet 143 is an arc formed at the junction of the cavity bottom wall 141 and the cavity side wall 142 of the cavity 14.

[0074] Such a setting can avoid the radius of the fillet 143 being too large or too small. If the radius of the fillet 143 is too large, the fillet 143 will squeeze the space inside the cavity 14, making the effective space inside the cavity 14 smaller, which is not conducive to the optimal arrangement of the structure inside the cavity 14. If the radius of the fillet 143 is too small, the junction of the cavity bottom wall 141 and the cavity side wall 142 of the cavity 14 is prone to stress concentration and damage. Research has found that when the radius of the fillet 143 is set to a range of 0.1mm to 0.25mm, it can not only avoid the fillet 143 from excessively occupying the space inside the cavity 14, but also avoid stress concentration at the junction of the cavity bottom wall 141 and the cavity side wall 142 of the cavity 14.

[0075] The bottom wall 141 of the cavity 14 is specifically an inner wall opposite to the cavity opening of the cavity 14 , and the side wall 142 of the cavity 14 is specifically an inner wall disposed at the edge of the bottom wall 141 and extending toward the cavity opening.

[0076] In some embodiments, as Figure 9 As shown, Figure 9 This is a cross-sectional view of another back cover 100 of the electronic device in the first embodiment of the present application at the cavity 14. At least one organic fiber layer 13 has an escape opening 133 through which the cavity 14 passes; the curved region 131 includes a second curved region 131b located at the edge of the escape opening 133.

[0077] In the cover 1 , one organic fiber layer 13 may have the avoidance opening 133 , or multiple organic fiber layers 13 may have the avoidance opening 133 , which is specifically determined by the depth of the cavity 14 . Figure 9 As shown, there are three organic fiber layers 13. Along the direction away from the exterior decoration layer 2, the three organic fiber layers 13 are respectively an organic fiber layer 13a, an organic fiber layer 13b and an organic fiber layer 13c. The organic fiber layer 13a has an avoidance opening 133; the second bending area 131b is located at the edge of the avoidance opening 133 of the organic fiber layer 13a.

[0078] In this embodiment, since the second bending area 131b is located at the edge of the avoidance opening 133, when the back cover 100 around the cavity 14 is subjected to external force, such as when assembling the appearance structural part 3, the second bending area 131b can well disperse the stress at the edge of the cavity 14, which is beneficial to improving the structural strength and impact resistance of the cover body 1 at the edge of the cavity 14, so that the cover body 1 at the edge of the cavity 14 is not easily damaged.

[0079] In some embodiments, as Figure 6 and Figure 9 As shown, the base 11 is a resin base.

[0080] In some embodiments, as Figure 6 and Figure 9 As shown, the organic fiber layer 13 is a PI (Polyimide) fiber layer. PI fiber layers have the characteristics of low density and high modulus. This configuration not only reduces the weight of the back cover 100 but also improves its strength and rigidity. Furthermore, configuring the organic fiber layer 13 as a PI fiber layer optimizes the bonding between the organic fiber layer 13 and the resin matrix, thereby facilitating the manufacture of the cover body 1.

[0081] In some embodiments, as Figure 6 and Figure 9 As shown, the organic fiber layer 13 is a PBO (Poly-p-phenylenebenzobisoxazole) fiber layer. PBO fiber layers have the characteristics of low density and high modulus. This configuration not only reduces the weight of the back cover 100 but also improves the strength and rigidity of the back cover 100.

[0082] In some embodiments, as Figure 6 and Figure 9 As shown, the organic fiber layer 13 is an aramid fiber layer. Aramid fiber layers have the characteristics of low density and high modulus. This arrangement not only reduces the weight of the back cover 100 but also improves the strength and rigidity of the back cover 100.

[0083] In some embodiments, as Figure 6 and Figure 9 As shown, the organic fiber layer 13 is a UHMWPE (ultra-high molecular weight polyethylene) fiber layer. The UHMWPE fiber layer has the characteristics of low density and high modulus. This configuration can reduce the weight of the back cover 100.

[0084] The organic fiber layer 13 may be an organic fiber woven layer, such as an organic fiber cloth.

[0085] In some embodiments, as Figure 6 and Figure 7 As shown, a receiving portion 144 is provided on the bottom wall 141 of the cavity 14. The receiving portion 144 is a receiving groove into which the protrusion 31 on the appearance structural member 3 extends. This arrangement allows the protrusion 31 on the appearance structural member 3 to extend into the receiving groove, thereby positioning the appearance structural member 3 and facilitating installation of the appearance structural member 3 in the target position.

[0086] Among them, such as Figure 6 and Figure 7 As shown, the receiving groove is a square groove and the protruding structure 31 is a square column. However, it is not limited thereto, the receiving groove can also be a circular groove and the protruding structure 31 can also be a circular column.

[0087] In some embodiments, as Figure 6 and Figure 7 As shown, the bottom wall 141 of the cavity 14 is provided with a rib 145. The rib 145 is used to support the appearance structural member 3. The rib 145 divides the bottom wall 141 into a first area 141a and a second area 141b. The first area 141a is provided with a receiving portion 144, and the second area 141b is provided with an adhesive portion 4. The adhesive portion 4 adheres the appearance structural member 3 to the bottom wall 141. With this arrangement, the rib 145 acts as a barrier, preventing uncured adhesive portion 4 from flowing to the receiving portion 144 and thereby blocking it. Simultaneously, the rib 145 also supports the appearance structural member 3, raising it relative to the bottom wall 141. This reduces the thickness of the appearance structural member 3, thereby reducing the weight of the appearance structural member 3 and, in turn, the weight of the back cover 100.

[0088] Among them, the bonding part 4 can be glue point, and glue point can be set one or more (such as Figure 7 ), which is not specifically limited here.

[0089] Of course, the ribs 145 and the accommodating portion 144 may not be provided on the cavity bottom wall 141 of the cavity 14 , and an adhesive layer may be provided between the appearance structural component 3 and the cavity bottom wall 141 to fix the appearance structural component 3 in the cavity 14 .

[0090] like Figure 10 As shown, Figure 10 Schematic diagram of the manufacturing process of the back cover 100 of the electronic device in the first embodiment of the present application. The manufacturing method of the back cover 100 includes the following steps:

[0091] S1, such as Figure 10 As shown in (1), a cavity 14 is pressed out on the cover body 1 by a mold;

[0092] The cover 1 can be manufactured by the following steps: S11, pre-impregnating the three organic fiber layers 13 with epoxy resin to form three prepregs; S12, stacking the three prepregs and applying pressure to form the cover 1. For example, the three prepregs can be formed into the cover 1 by processes such as hot pressing, molding, vacuum bagging, and vacuum canning.

[0093] S2, such as Figure 10 As shown in (2), a protective member 5 is provided in the concave cavity 14 so that the supporting surface 51 of the protective member 5 is located at the cavity opening of the concave cavity 14.

[0094] Among them, such as Figure 10 As shown in (2), the protective member 5 can be a sheet structure, for example, the protective member 5 can be a PET (Polyethylene terephthalate) protective sheet; but it is not limited thereto, and the protective member 5 can also be set to other structures according to actual conditions.

[0095] S3, such as Figure 10 As shown in (3), the first surface 10a of the cover 1 and the supporting surface 51 of the protective member 5 are covered with an appearance decoration layer 2;

[0096] Among them, in some embodiments, the appearance decoration layer 2 can be a decorative paint layer, which is covered on the first surface 10a and the supporting surface 51 through a spraying process. The decorative paint layer can be a piano paint layer, a frosted paint layer, a matte paint layer, a gradient paint layer, a textured paint layer, etc.

[0097] In other embodiments, the appearance decoration layer 2 may be a coating, which may be covered on the first surface 10a and the support surface 51 through a coating process. The coating may be an anti-scratch coating, an anti-fingerprint coating, an anti-reflective coating, etc.

[0098] S4, such as Figure 10As shown in (4), the appearance decoration layer 2 covering the cavity 14 is removed, and the protective member 5 is moved out of the cavity 14; wherein, the appearance decoration layer 2 covering the cavity 14 can be removed by laser cutting.

[0099] S5, such as Figure 10 As shown in (5), the appearance structural member 3 is set in the concave cavity 14.

[0100] Figure 11 This is a structural diagram of the back side of an electronic device (mobile phone) in the second embodiment of the present application. Figure 12 for Figure 11 The CC cross-sectional view of the electronic device shown in, Figure 13 for Figure 12 A partially enlarged view of the back cover 100 of the electronic device. Figures 11 to 13 The back cover 100 shown is Figures 4 to 9 The main differences of the back cover 100 shown are: the structure of the receiving portion 144 in the cavity 14 is different and the number of organic fiber layers 13 in the cover body 1 is different, as described below:

[0101] like Figure 11 、 Figure 12 and Figure 13 As shown, a receiving portion 144 is provided on the bottom wall 141 of the cavity 14. The receiving portion 144 is a receiving through-hole extending through the second surface 10b and is used to allow components 600 on the circuit board inside the electronic device to extend therethrough. The provision of the receiving portion 144 provides a clearance for the components 600 on the circuit board inside the electronic device, allowing the back cover 100 and the components 600 to overlap in the thickness direction Z of the back cover 100, thereby facilitating a reduction in the thickness of the electronic device.

[0102] Among them, such as Figure 12 As shown, the circuit board can be the connection circuit board 520 connected to the camera 510, and the component 600 can be an infrared temperature sensor used to measure the ambient temperature around the electronic device and the temperature of surrounding objects. The exterior structural member 3 is made of an infrared light-transmitting material, such as aluminate glass or germanate glass. Of course, the component 600 is not limited to an infrared temperature sensor and can also be other devices, such as a photoelectric sensor.

[0103] In some embodiments, as Figure 13 As shown, there are two organic fiber layers 13 . Along the direction away from the exterior decoration layer 2 , the two organic fiber layers 13 are respectively an organic fiber layer 13 a and an organic fiber layer 13 b . The organic fiber layer 13 a has a curved region 131 .

[0104] like Figure 14 As shown, Figure 14The following is a schematic diagram showing the manufacturing process of the back cover 100 of the electronic device in the second embodiment of the present application. The manufacturing method of the back cover 100 includes the following steps:

[0105] P1, such as Figure 14 As shown in (1), a cavity 14 is pressed out on the cover body 1 by a mold;

[0106] The cover 1 can be manufactured by the following steps: P11, pre-impregnating the two organic fiber layers 13 with epoxy resin to form two prepregs; P12, stacking the two prepregs and applying pressure to form the cover 1. For example, the two prepregs can be formed into the cover 1 by processes such as hot pressing, molding, vacuum bagging, and vacuum canning.

[0107] P2, such as Figure 14 As shown in (2), the first surface 10a of the cover body 1 is covered with an appearance decoration layer 2; wherein, the appearance decoration layer 2 covers the cavity 14; the appearance decoration layer 2 can be an artificial leather layer, such as a plain leather layer, so that the back cover 100 can present a leather appearance.

[0108] P3, such as Figure 14 As shown in (3), the appearance decoration layer 2 covering the cavity 14 is removed; wherein, the appearance decoration layer 2 covering the cavity 14 can be removed by laser cutting.

[0109] P4, such as Figure 10 As shown in (4), an accommodating portion 144 is formed on the bottom wall 141 of the cavity 14 by a laser forming process.

[0110] P5, such as Figure 10 As shown in (5), the appearance structural member 3 is set in the concave cavity 14.

[0111] like Figure 10 (3) and Figure 14 As shown in (2), the embodiment of the present application further provides a structural component for making a back cover 100 of an electronic device, the structural component including a cover body 1 and an appearance decoration layer 2, the cover body 1 is an organic fiber composite material cover body 1, the cover body 1 has a first surface 10a and a second surface 10b arranged opposite to each other, the first surface 10a is provided with a cavity 14 pressed out by a mold; the appearance decoration layer 2 covers the first surface 10a, the appearance decoration layer 2 has a covering area 21, the covering area 21 is located at the position of the cavity 14 and covers the cavity opening of the cavity 14.

[0112] In some embodiments, as Figure 10As shown in (3), a protective member 5 is detachably provided in the concave cavity 14. The protective member 5 has a support surface 51, which is located at the cavity opening of the concave cavity 14. The covering area 21 is provided on the support surface 51. By providing the protective member 5, the protective member 5 can support the exterior decorative layer 2, ensuring that the exterior decorative layer 2 can cover the concave cavity 14. At the same time, the protective member 5 can also protect the structure within the concave cavity 14, preventing damage to the structure within the concave cavity 14 caused by subsequent processes.

[0113] The protective member 5 can be detachably disposed in the cavity 5 by bonding, snapping, or the like.

[0114] In some embodiments, as Figure 10 As shown in (3), a rib 145 is provided on the bottom wall 141 of the cavity 14, and the rib 145 is used to support the protective member 5. In this way, the rib 145 can raise the height of the protective member 5 relative to the bottom wall 141, so that the protective member 5 does not need to be designed to be so thick, which is conducive to reducing the weight of the protective member 5 and further helping to reduce the weight of the structural member.

[0115] As for other structural features of the structural parts, please refer to the description of the same features in the embodiment of the rear cover 100 above, and no further details will be given here.

[0116] like Figure 10 (5) and Figure 14 As shown in (5), the embodiment of the present application further provides a back cover 100, which is made of the structural parts in the above embodiment.

[0117] In some embodiments, Figure 10 As shown in (5), the back cover 100 is formed by removing the cover area 21 from the appearance decoration layer 2 of the structural member in the above embodiment, and moving the protective member 5 out of the cavity 14. In other embodiments, such as Figure 14 As shown in (5), the back cover 100 is formed by removing the masking area 21 from the appearance decoration layer 2 of the structural member in the above embodiment.

[0118] As for the specific structure of the back cover 100, please refer to the above description and will not be repeated here.

[0119] The types of hatching in the drawings of this application are for the purpose of distinguishing different components and should not be understood as limiting the materials of the components. The drawings of this application are for the purpose of illustrating the structural composition and are not shown to scale with the actual product.

[0120] Although the description of this application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to these embodiments. On the contrary, the purpose of introducing the application in conjunction with the embodiments is to cover other options or modifications that may be extended based on the claims of this application. In order to provide a deep understanding of this application, the above description will contain many specific details. This application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of this application, some specific details will be omitted in the description. It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other unless there is a conflict.

[0121] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0122] In the embodiments of this application, "and / or" is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0123] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of the present application, such as "up", "down", "left", "right", "inside", "outside", etc., are only reference to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. "Multiple" means at least two.

[0124] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0125] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A back cover for an electronic device, characterized in that: include: A cover body (1), the cover body (1) being an organic fiber composite material cover body, the cover body (1) having a first surface (10a) and a second surface (10b) disposed opposite to each other, the first surface (10a) being provided with a cavity (14) pressed out by a mold; an exterior decorative layer (2) covering the first surface (10a) outside the cavity (14); The appearance structural component (3) is arranged in the concave cavity (14).

2. The back cover according to claim 1, wherein: The cover (1) comprises a base (11), and a plurality of organic fiber layers (13) embedded in the base (11) along a thickness direction (Z) of the base (11), at least one of the organic fiber layers (13) having a curved region (131), and the curved region (131) is located at the position of the concave cavity (14).

3. The back cover according to claim 2, wherein: The bending region (131) comprises a first bending region (131a), wherein the first bending region (131a) is located between the cavity (14) and the second surface (10b), and is bent toward a side away from the exterior decoration layer (2).

4. The back cover according to claim 3, characterized in that: The first bending region (131a) is provided with a slit (132), and the slit (132) penetrates the first bending region (131a) along the thickness direction (Z).

5. The back cover according to any one of claims 2 to 4, characterized in that: At least one of the organic fiber layers (13) has an avoidance opening (133) for the cavity (14) to pass through; the bending area (131) includes a second bending area (131b) located at the edge of the avoidance opening (133).

6. The back cover according to any one of claims 2 to 4, characterized in that: The organic fiber layer (13) is one of a PI fiber layer, a PBO fiber layer, an aramid fiber layer, and a UHMWPE fiber layer; and the matrix (11) is a resin matrix.

7. The back cover according to any one of claims 1 to 4, characterized in that: A chamfered corner (143) is provided at the junction of the cavity bottom wall (141) of the cavity (14) and the cavity side wall (142) of the cavity (14); the radius of the chamfered corner (143) ranges from 0.1 mm to 0.25 mm.

8. The back cover according to any one of claims 1 to 4, characterized in that: A receiving portion (144) is provided on the bottom wall (141) of the concave cavity (14); The accommodating portion (144) is a accommodating through hole penetrating the second surface (10b), and the accommodating through hole is used for allowing components (600) on a circuit board inside the electronic device to extend therein; or, the accommodating portion (144) is a accommodating groove, and the convex structure (31) on the appearance structural component (3) is allowed to extend therein.

9. The back cover according to claim 8, characterized in that: The cavity bottom wall (141) is provided with a convex rib (145), the convex rib (145) is used to support the appearance structural component (3), the convex rib (145) divides the cavity bottom wall (141) into a first area (141a) and a second area (141b), the first area (141a) is provided with the accommodating portion (144), the second area (141b) is provided with a bonding portion (4), and the bonding portion (4) bonds the appearance structural component (3) to the cavity bottom wall (141).

10. A structural part used for making a back cover of an electronic device, characterized in that: include: A cover body (1), the cover body (1) being an organic fiber composite material cover body, the cover body (1) having a first surface (10a) and a second surface (10b) disposed opposite to each other, the first surface (10a) being provided with a cavity (14) pressed out by a mold; An exterior decoration layer (2) is covered on the first surface (10a), and the exterior decoration layer (2) has a covering area (21). The covering area (21) is located at the position of the cavity (14) and covers the cavity opening of the cavity (14).

11. The structural member according to claim 10, characterized in that The cover (1) comprises a base (11), and a plurality of organic fiber layers (13) embedded in the base (11) along a thickness direction (Z) of the base (11), at least one of the organic fiber layers (13) having a curved region (131), and the curved region (131) is located at the position of the concave cavity (14).

12. The structural member according to claim 11, characterized in that The bending region (131) comprises a first bending region (131a), wherein the first bending region (131a) is located between the cavity (14) and the second surface (10b), and is bent toward a side away from the exterior decoration layer (2).

13. The structural member according to claim 12, characterized in that The first bending region (131a) is provided with a slit (132), and the slit (132) penetrates the first bending region (131a) along the thickness direction (Z).

14. The structural member according to any one of claims 11 to 13, characterized in that: At least one of the organic fiber layers (13) has an avoidance opening (133) for the cavity (14) to pass through, and the bending area (131) includes a second bending area (131b) located at the edge of the avoidance opening (133).

15. The structural member according to any one of claims 11 to 13, characterized in that: The organic fiber layer (13) is one of a PI fiber layer, a PBO fiber layer, an aramid fiber layer, and a UHMWPE fiber layer; and the matrix (11) is a resin matrix (11).

16. The structural member according to any one of claims 10 to 13, characterized in that: A chamfered corner (143) is provided at the junction of the cavity bottom wall (141) of the cavity (14) and the cavity side wall (142) of the cavity (14); the radius of the chamfered corner (143) ranges from 0.1 mm to 0.25 mm.

17. The structural member according to any one of claims 10 to 13, characterized in that: A protective member (5) is detachably provided in the concave cavity (14), wherein the protective member (5) has a supporting surface (51), the supporting surface (51) is located at the cavity opening of the concave cavity (14), and the covering area (21) is provided on the supporting surface (51).

18. The structural member according to claim 17, characterized in that A convex rib (145) is provided on the bottom wall (141) of the concave cavity (14), and the convex rib (145) is used to support the protective member (5).

19. A back cover for an electronic device, characterized in that: The invention is manufactured by using the structural member according to any one of claims 10 to 18.

20. An electronic device, characterized in that: The invention comprises a display screen (200), a middle frame (300), and a back cover (100) according to any one of claims 1 to 9 and 19, wherein the display screen (200) is arranged on one side of the middle frame (300), and the back cover (100) is arranged on the other side of the middle frame (300).

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