LED packaging structure and infrared equipment

Abstract

The utility model provides an LED packaging structure and an infrared device. The LED packaging structure comprises the components of a substrate which is provided with a concave cavity; the light-emitting chip is arranged on the bottom wall of the concave cavity; a convex lens covering the light emitting chip; the convex lens is provided with a light emitting surface; the wing-shaped structure is arranged on the light-emitting surface of the convex lens; one side, facing the substrate, of the wing-shaped structure is provided with a reflecting surface; the reflecting surface is used for reflecting light emitted by the light-emitting chip and emitted to the reflecting surface through the convex lens. The LED packaging structure and the infrared equipment can improve the illumination brightness of a specific area.

Description

Technical Field

[0001] The present application relates to the field of infrared equipment, and specifically to an LED packaging structure and an infrared equipment. Background Art

[0002] LED (light-emitting diode) technology has been widely used in lighting, display, and other fields. Compared with traditional light sources, LEDs offer advantages such as low energy consumption, long life, and compact size. With technological advancements, LED packaging technology has gradually matured and is now widely used in various products.

[0003] A traditional LED package structure may include a substrate, a light-emitting chip, and a lens. The light-emitting chip is mounted on the substrate, and the lens covers the light-emitting chip to protect the chip and adjust the direction of light emission.

[0004] In order to meet the requirements of light emission direction and brightness in specific application scenarios, the LED packaging structure needs to be optimized. Utility Model Content

[0005] Multiple embodiments of the present application provide an LED packaging structure and an infrared device that can increase the brightness of light emitted to a specific area.

[0006] In a first aspect, an embodiment of the present application provides an LED packaging structure, comprising: a substrate having a concave cavity; a light-emitting chip disposed on the bottom wall of the concave cavity; a convex lens covering the light-emitting chip; the convex lens having a light-emitting surface; an airfoil structure disposed on the light-emitting surface of the convex lens; the airfoil structure having a reflective surface on the side facing the substrate; the reflective surface being used to reflect light emitted by the light-emitting chip and emitted toward the reflective surface via the convex lens.

[0007] Optionally, the wing-shaped structure has a light-splitting end on a side facing the substrate, the light-splitting end being in contact with the light-emitting surface of the convex lens.

[0008] Optionally, the light-emitting surface has a vertex; the side of the wing-shaped structure facing the convex lens forms a curved cone, the curved cone forms the light-splitting end, and the top of the curved cone abuts the vertex, and the side of the curved cone forms the reflecting surface.

[0009] Optionally, the curvature radius of the reflective surface falls within the range of 0.5 mm to 1.5 mm.

[0010] Optionally, the depth of the cavity falls within the range of 0.1 mm to 1.0 mm; and the opening angle of the cavity falls within the range of 10° to 160°.

[0011] Optionally, the LED packaging structure includes a conductive reflective layer, which covers at least part of the surface of the cavity; some pins of the light-emitting chip are electrically connected to the conductive reflective layer; wherein the conductive reflective layer serves as an electrode terminal of the light-emitting chip.

[0012] Optionally, the conductive reflective layer includes a first sub-conductive reflective layer and a second sub-conductive reflective layer that are electrically isolated from each other; wherein the first sub-conductive reflective layer covers at least a portion of the side wall and the bottom wall of the cavity; the second sub-conductive reflective layer covers a portion of the outer surface of the substrate; wherein the LED packaging structure has a wiring hole that passes through the side wall of the cavity; and part of the conductive leads of the light-emitting chip pass through the wiring hole and are electrically connected to the second sub-conductive reflective layer.

[0013] Optionally, the side wall of the cavity is further provided with a positioning opening, and the wiring hole is provided at the positioning opening.

[0014] Optionally, the light emitting angle of the LED packaging structure is in the range of 10° to 45°.

[0015] In a second aspect, an embodiment of the present application provides an infrared device comprising any of the aforementioned LED packaging structures.

[0016] In multiple embodiments provided in the present application, an airfoil structure is provided on the light-emitting surface of the convex lens, and the airfoil structure has a reflective surface on the side facing the substrate, so that light emitted by the light-emitting chip and directed toward the reflective surface through the convex lens is reflected, and by adjusting the reflective surface, the reflected light is mainly directed toward a specific area, thereby improving the light brightness in the specific area and improving the optical performance of the LED packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic cross-sectional view of an LED package structure provided in one embodiment of the present application passing through the center line a of a convex lens, wherein the positions of the leads are shown in the schematic cross-sectional view.

[0018] Figure 2 A schematic diagram of the light path of a light beam provided for one embodiment of the present application.

[0019] Figure 3 A schematic cross-sectional view of an LED package structure provided in one embodiment of the present application, passing through the center line a of a convex lens.

[0020] Figure 4 A schematic diagram of a light distribution curve of an LED package structure provided in one embodiment of the present application, wherein the light emitting angle of the LED package structure is 20°.

[0021] Figure 5A schematic diagram of a light distribution curve of an LED package structure provided in one embodiment of the present application, wherein the light emitting angle of the LED package structure is 30°.

[0022] Figure 6 A schematic diagram of a light distribution curve of an LED package structure provided in one embodiment of the present application, wherein the light emitting angle of the LED package structure is 45°.

[0023] Figure 7 A schematic diagram of a light distribution curve of an LED package structure provided in one embodiment of the present application, wherein the light emitting angle of the LED package structure is 10°. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0025] In this application, the drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show details of the local features.

[0026] Unless otherwise indicated, all technical and scientific terms used in this application have the same meaning as those generally understood by those skilled in the art in the technical field of this application. The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit the scope of this application. The term "and / or" used in this application includes any and all combinations of one or more related listed items. The singular forms "a", "above", and "the" used in this application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0027] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the described features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0028] In the description of this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of a simplified description of this application, and do not indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation to this application.

[0029] In the description of this application, unless otherwise expressly defined, the terms "installed," "connected," "connect," "fixed," and "disposed" should be understood broadly. For example, "connection" can mean fixed, removable, or integrated; it can mean mechanical or electrical; it can mean direct or indirect connection through an intermediary; it can also mean internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0030] See also Figure 1 and Figure 2 The embodiment of the present application provides an LED package structure 100 , which includes a substrate 110 , a light emitting chip 120 , a convex lens 130 , and an airfoil structure 140 .

[0031] In this embodiment, substrate 110 is generally used to support and secure light-emitting chip 120 and provide electrical connections. Substrate 110 can be made of ceramic, metal, plastic, or other materials to meet the thermal and mechanical strength requirements of the package structure. Substrate 110 is provided with a cavity 111. Cavity 111 provides a mounting space for light-emitting chip 120, specifically, light-emitting chip 120 can be mounted on cavity bottom wall 117 of cavity 111.

[0032] The light emitting chip 120 is a light source element of the LED package structure 100, used to generate light. The light emitting chip 120 can be made of semiconductor materials (such as gallium nitride, gallium arsenide, etc.), and can generate visible light or infrared light by injecting current.

[0033] Convex lens 130 covers the light-emitting chip 120 and can be used to adjust the direction of light emission. Convex lens 130 has a light-emitting surface 131. The curved surface of light-emitting surface 131 focuses or adjusts the light emitted by light-emitting chip 120 to achieve adjusted light distribution. In some embodiments, convex lens 130 can be designed in a variety of shapes, including circular, elliptical, and square, depending on application requirements. Circular convex lenses offer excellent performance in adjusting the concentration and uniformity of light and are often used in applications requiring efficient light focusing. Elliptical convex lenses are more suitable for situations where light needs to be stretched or expanded in a specific direction. Square convex lenses are used in some specialized optical systems to match specific shapes of light-emitting areas or optical devices. By selecting different convex lens 130 shapes and optimizing the curved surface design of light-emitting surface 131, the light emission angle, distribution, and brightness can be adjusted to meet the optical performance requirements of the LED package structure 100 in different application scenarios.

[0034] The airfoil structure 140 is provided on the light-emitting surface 131 of the convex lens 130. The side of the airfoil structure 140 facing the substrate 110 has a reflective surface 141. The reflective surface 141 is used to reflect light emitted by the light-emitting chip 120 and directed toward the reflective surface 141 via the convex lens 130. In this embodiment, the reflective surface 141 reflects the light emitted by the light-emitting chip 120 and directed toward the reflective surface 141 via the convex lens 130, changing the propagation path of the light so that it is emitted toward a specific area. In this way, without changing the overall structure of the convex lens 130, accurate control of the light emission direction is achieved, thereby improving the optical performance of the LED package structure 100.

[0035] In summary, by setting the wing-shaped structure 140 on the light-emitting surface 131 of the convex lens 130, the focusing function of the convex lens 130 is utilized to gather more light onto the reflecting surface 141 of the wing-shaped structure 140, thereby effectively reducing the scattering and loss of light, achieving effective control of the light emission direction, and improving the overall performance of the LED packaging structure 100.

[0036] In some embodiments, the side of the wing-shaped structure 140 facing the substrate 110 has a light splitting end 142 that abuts against the light emitting surface 131 of the convex lens 130. The wing-shaped structure 140 is disposed on the light emitting surface 131 of the convex lens 130 and achieves light separation through its structural features.

[0037] In this embodiment, the light-splitting end 142 of the airfoil structure 140 contacts the light-emitting surface 131 of the convex lens 130. This light-splitting end 142 serves to separate the light, dispersing and reflecting the light emitted by the light-emitting chip 120 after passing through the convex lens 130, directing the light toward the reflective surface 141 of the airfoil structure 140, thereby changing the light's exit direction. Of course, the contact between the light-splitting end 142 and the light-emitting surface 131 of the convex lens 130 also stabilizes the position of the airfoil structure 140, ensuring its stability.

[0038] In this embodiment, the light splitting end 142 has a top that abuts the convex lens 130. The size of the top can affect the effect of the light splitting end 142 in separating light. Specifically, the light directly hitting the top may be reflected at the top position, or enter the interior of the airfoil structure 140 after a certain refraction, constituting lost stray light. In this way, the smaller the size of the top, the less light directly hits the top, so that more light can hit the reflecting surface 141 and be reflected to a specific area. The larger the size of the top, the more light directly hits the top, and the more stray light is lost.

[0039] In some embodiments, the light-emitting surface 131 of the convex lens 130 has a vertex 132, and the side of the airfoil structure 140 facing the convex lens 130 forms a curved frustum, which forms the light-splitting end 142, and the top of the curved frustum abuts against the vertex 132 of the convex lens 130, and the side of the curved frustum forms the reflective surface 141. Figure 3 shown.

[0040] In this embodiment, the curved frustum shape of the airfoil structure 140 can utilize the principle of total reflection so that after the light is converged by the convex lens 130, at least a portion of it is directed toward the reflective surface 141. Since the top of the curved frustum abuts the vertex 132 of the convex lens 130, the light is effectively separated at the abutment position of the two. Furthermore, by reasonably setting the curvature of the reflective surface 141, the incident angle of the light directed toward the reflective surface 141 exceeds the critical angle of the material, thereby achieving total reflection of the light on the reflective surface 141. Combined with the curved frustum shape, the light can propagate in the circumferential direction of the airfoil structure 140. And by designing the curvature of the reflective surface 141, the emitted light can be directed toward a specific area. In this embodiment, the specific area can be a spatial area surrounding the airfoil structure 140.

[0041] This embodiment utilizes the principle of total reflection. By abutting the light splitting end 142 of the wing-shaped structure 140 with the vertex 132 of the convex lens 130, and forming a reflective surface 141 with a certain curvature by a curved frustum, circumferential total reflection of the light is achieved, thereby improving the optical performance of the LED package structure 100 and meeting the requirements for light distribution and brightness in different application scenarios. Of course, in some embodiments, inspired by the technical essence of the embodiments of the present application, technicians in the relevant field can also realize the light splitting end of the wing-shaped structure through other structures. For example, the wing-shaped structure can use a curved frustum to form the light splitting end, the wing-shaped structure can also use a cone shape to form the light splitting end, or it can also be formed by a pyramid-like shape, or the wing-shaped structure can also use an irregular shape with a pointed end to form the light splitting end. It can be seen that there will be more expanded embodiments, but as long as the functions and effects achieved are the same or similar to the embodiments of the present application, they should all be included in the scope of protection of the present application.

[0042] In some embodiments, the curvature radius of the reflective surface 141 falls within a range of 0.5 mm to 1.5 mm. In this embodiment, the curvature radius of the reflective surface 141 is set within a range of 0.5 mm to 1.5 mm, which can effectively make the incident angle of the incident light on the reflective surface 141 greater than the critical angle, thereby facilitating total internal reflection and achieving a better concentration of light in a specific area. For example, the specific area can be the circumferential side of the LED package structure 100, or the specific area can be both sides of the direct direction of the light-emitting chip 120.

[0043] In some embodiments, the depth of the cavity 111 falls within the range of 0.1 mm to 1.0 mm, and the opening angle α of the cavity 111 falls within the range of 10° to 160°. For example, the depth of the cavity 111 may be 0.1 mm, and the opening angle of the cavity 111 may be 160°; the depth of the cavity 111 may be 0.3 mm, and the opening angle of the cavity 111 may be 120°; the depth of the cavity 111 may be 0.5 mm, and the opening angle of the cavity 111 may be 60°; the depth of the cavity 111 may be 0.7 mm, and the opening angle of the cavity 111 may be 30°; the depth of the cavity 111 may be 1.0 mm, and the opening angle of the cavity 111 may be 10°.

[0044] In some embodiments, the opening angle of the cavity 111, the depth of the cavity 111, and the curvature radius of the reflective surface 141 can be designed to achieve different luminous angles of the LED package structure. Specifically, the luminous angle of the LED package structure 100 can be within the range of 10° to 45°. For example, Figure 4 As shown, the light of the LED package structure 100 is mainly concentrated between 40° and 60°, that is, the light emitting angle of the LED package structure 100 is 20°. Figure 5 As shown, the light of the LED package structure 100 is mainly concentrated between 30° and 60°, that is, the light emitting angle of the LED package structure 100 is 30°. Figure 6 As shown, the light of the LED package structure 100 is mainly concentrated between 20° and 65°, that is, the light emitting angle of the LED package structure 100 is 45°. Figure 7 As shown, the light of the LED package structure 100 is mainly concentrated between 50° and 60°, that is, the light emitting angle of the LED package structure 100 is 10°. The above are just a few examples, and the LED package structure 100 provided in this application is not limited to the above examples.

[0045] Furthermore, the smaller the opening angle α of the cavity 111, the more concentrated the light directed toward the airfoil structure 140, resulting in a more concentrated light reflected from the airfoil structure 140 to a specific area, and a higher brightness. The larger the opening angle of the cavity 111, the more divergent the light directed toward the airfoil structure 140, and the light directed toward the airfoil structure 140 is also relatively dispersed, resulting in a more divergent light reflected from the anisotropic structure 140 to a specific area.

[0046] Optionally, the light-emitting chip 120 is located at the focus of the light-emitting surface 131, so that the light emitted after passing through the convex lens 130 is more along the axis a direction of the convex lens 130 or close to the axis a direction, so that the light reflected by the airfoil reflective surface 1411 can be more evenly distributed in a specific area.

[0047] In some embodiments, the LED packaging structure 100 includes a conductive reflective layer 150, which covers at least part of the surface of the cavity; some pins of the light-emitting chip are electrically connected to the conductive reflective layer; wherein the conductive reflective layer serves as an electrode terminal of the light-emitting chip.

[0048] In this embodiment, the conductive reflective layer covers at least a portion of the surface of the cavity, enhancing light reflection. Furthermore, the conductive reflective layer 150 not only serves as a light reflective layer but also as an electrode terminal for the light-emitting chip 120, achieving a combination of electrical connection and optical performance. For example, the conductive reflective layer 150 can be made of materials such as copper, silver, or aluminum, ensuring that it reflects light while providing reliable current conduction.

[0049] In some embodiments, some pins of the light-emitting chip 120 can be directly electrically connected to the conductive reflective layer 150 without wires, allowing the conductive reflective layer 150 to serve as electrode terminals for the light-emitting chip 120 and provide a stable current input for the light-emitting chip 120. Overall, this simplifies the internal structure of the LED package structure 100 and further improves the overall optical and electrical performance of the LED package structure 100.

[0050] In some embodiments, the conductive reflective layer 150 includes a first sub-conductive reflective layer 152 and a second sub-conductive reflective layer 153 that are electrically isolated from each other; wherein the first sub-conductive reflective layer 152 covers at least a portion of the cavity side wall 112 and the cavity bottom wall 117; the second sub-conductive reflective layer 153 covers a portion of the outer surface of the substrate 110; wherein the LED packaging structure 100 has a wiring hole 115 that passes through the cavity side wall 112; and some conductive leads 160 of the light-emitting chip 120 pass through the wiring hole 115 and are electrically connected to the second sub-conductive reflective layer 153.

[0051] In this embodiment, the conductive lead 160 is electrically connected to the second sub-conductive reflective layer 153 through the wiring hole 115, so that the connection structure between the conductive lead 160 and the second sub-conductive reflective layer 153 is located outside the cavity 111, thereby reducing the impact on light reflection within the cavity 111. Furthermore, this connection structure does not occupy space in the cavity 111, thereby reducing the volume of the cavity 111 to a certain extent, which is conducive to miniaturization of the LED package structure 100.

[0052] In some embodiments, a recessed portion 113 may be provided on one side surface of the substrate 110 surrounding the cavity 111, with the second sub-conductive reflective layer 153 covering the surface of the recessed portion 113. The recessed portion 113 may have a recessed sidewall 118, with a wiring hole 115 extending through the recessed sidewall 118. Thus, the conductive lead 160 passing through the wiring hole 115 can be electrically connected to the second sub-conductive reflective layer 153 in the recessed portion 113. The area of ​​the substrate 110 between the recessed portion 113 and the cavity 111 is not covered by the conductive reflective layer 150. Furthermore, on the bottom surface of the substrate 110 facing away from the light-emitting chip 120, no electrical connection is established between the first sub-conductive reflective layer 152 and the second sub-conductive reflective layer 153, thereby achieving electrical isolation between the first sub-conductive reflective layer 152 and the second sub-conductive reflective layer 153.

[0053] Furthermore, in some embodiments, a positioning opening 116 may be provided on the cavity sidewall 112, and the wiring hole 115 is provided at the positioning opening 116. The positioning opening 116 allows, on the one hand, quick location of the wiring hole 115, thereby improving efficiency when inserting the conductive lead 160 through the wiring hole 115. Furthermore, the positioning opening 116 reserves space for the conductive lead 160 to pass through the wiring hole 115, thereby facilitating smooth passage of the conductive lead 160 through the wiring hole 115. In some embodiments, the surface of the positioning opening 116 is covered with a first sub-conductive reflective layer 152, so that light emitted by the light-emitting chip 120 within the cavity 111 can be effectively reflected toward the airfoil structure 140. Furthermore, when the conductive lead 160 passes through the wiring hole 115, it does not come into contact with the first sub-conductive reflective layer 152. After the convex lens 130 is manufactured, the conductive trace 114 is embedded in the convex lens 130 . The material of the convex lens 130 further fixes the relative positions of the conductive lead 160 and the first sub-conductive reflective layer 152 .

[0054] Optionally, the conductive reflective layer 150 may be, but is not limited to, a copper layer, a gold layer, a silver layer, and an electroplated silver layer, or a combination thereof.

[0055] Optionally, the thickness of the substrate 110 falls within the range of 0.1 mm to 1.1 mm.

[0056] Optionally, the LED package structure 100 further includes a fixing glue 180 disposed around the light emitting chip 120 to fix the light emitting chip 120 on the substrate 110. Optionally, the fixing glue 180 is formed of a die-bonding glue.

[0057] Alternatively, the conductive leads 160 may be formed of, but not limited to, gold wires.

[0058] Optionally, in a direction perpendicular to the thickness of the substrate 110, the cross-section of the cavity 111 may be, but is not limited to, elliptical, conical, or square. Different cross-sections of the cavity 111 may affect the lighting efficiency and beam distribution of the LED. For example, an elliptical cavity 111 helps achieve directional lighting and can better control the angle and distribution of the light beam in a direction perpendicular to the thickness of the substrate 110; a conical cavity 111 can cause the light at the cup mouth to overlap with the light refracted at the highest point of the convex lens 130 after the light is reflected by the copper foil, thereby improving the concentration and intensity of the light; a square cavity 111 helps achieve directional control of the light beam, especially in applications requiring a square or rectangular light spot.

[0059] An infrared device provided in another embodiment of the present application includes the LED packaging structure provided in any embodiment of the present application.

[0060] The infrared device includes the LED package structure provided in the embodiments of the present application. Light emitted by the light-emitting chip and directed toward the airfoil structure via a convex lens is reflected by the reflective surface of the airfoil structure and then emitted laterally. This allows the light emitted by the light-emitting chip to be concentrated in a specific lateral area, thereby increasing the brightness of the specific area and reducing the emission angle. Specifically, infrared devices may include, but are not limited to, infrared surveillance cameras, infrared remote controls, infrared rangefinders, infrared sensors, infrared communication modules, infrared spectrometers, and the like.

[0061] It can be understood that in the various embodiments of the present application, the size of the serial number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0062] It can be understood that the various embodiments described in this application can be implemented individually or in combination, and the embodiments of this application are not limited to this.

[0063] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0064] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. An LED packaging structure, characterized in that: The LED packaging structure includes: a substrate, wherein a cavity is provided on the substrate; a light-emitting chip, disposed on the bottom wall of the cavity; a convex lens covering the light-emitting chip; the convex lens having a light-emitting surface; An airfoil structure is provided on the light-emitting surface of the convex lens; the airfoil structure has a reflective surface on the side facing the substrate; the reflective surface is used to reflect light emitted by the light-emitting chip and directed toward the reflective surface via the convex lens.

2. The LED packaging structure according to claim 1, wherein: The side of the wing-shaped structure facing the substrate has a light splitting end that abuts against the light-emitting surface of the convex lens.

3. The LED packaging structure according to claim 2, wherein: The light-emitting surface has a vertex; the side of the wing-shaped structure facing the convex lens forms a curved cone, the curved cone forms the light-splitting end, and the top of the curved cone abuts the vertex, and the side of the curved cone forms the reflecting surface.

4. The LED packaging structure according to claim 1, wherein: The curvature radius of the reflective surface falls within the range of 0.5 mm to 1.5 mm.

5. The LED packaging structure according to any one of claims 1 to 4, characterized in that: The depth of the cavity falls within the range of 0.1 mm to 1.0 mm; the opening angle of the cavity falls within the range of 10° to 160°.

6. The LED packaging structure according to any one of claims 1 to 4, characterized in that: The LED packaging structure includes a conductive reflective layer, which covers at least part of the surface of the cavity; some pins of the light-emitting chip are electrically connected to the conductive reflective layer; wherein the conductive reflective layer serves as the electrode terminal of the light-emitting chip.

7. The LED packaging structure according to claim 6, characterized in that: The conductive reflective layer includes a first sub-conductive reflective layer and a second sub-conductive reflective layer that are electrically isolated from each other; wherein the first sub-conductive reflective layer covers at least a portion of the side wall and the bottom wall of the cavity; and the second sub-conductive reflective layer covers a portion of the outer surface of the substrate; wherein the LED package structure has a wiring hole that passes through the side wall of the cavity; Part of the conductive leads of the light-emitting chip pass through the routing holes and are electrically connected to the second sub-conductive reflective layer.

8. The LED packaging structure according to claim 7, wherein: The side wall of the cavity is further provided with a positioning opening, and the wiring hole is provided at the positioning opening.

9. The LED packaging structure according to claim 5, characterized in that: The light emitting angle of the LED packaging structure is within the range of 10° to 45°.

10. An infrared device, characterized in that: The LED packaging structure comprises the LED packaging structure according to any one of claims 1 to 9.

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