Wafer test box and wafer test equipment

Abstract

The utility model relates to the technical field of wafer testing, and provides a wafer testing box and wafer testing equipment. The device comprises a carrying box body, an extension cylinder body, a test box body and a drying assembly, wherein the carrying box body is provided with a carrying cavity; the extending cylinder is connected to the carrying box body, the extending cylinder is provided with a carrying channel and an opening communicating with the carrying channel, and the carrying channel communicates with the carrying cavity; the test box body is provided with a test cavity and a carrying window communicated with the test cavity, the test box body is connected with the extension cylinder body, and the carrying window is communicated with the opening; the drying assembly comprises a first branch and a second branch, and the first branch and the second branch are arranged in parallel and each provided with a plurality of air outlet channels arranged at intervals. The first branch is mounted in the carrying cavity and used for introducing dry gas into the carrying cavity; and the second branch is mounted in the test cavity and is used for introducing dry gas into the test cavity. The wafer test box is used for testing the wafer in a low-temperature environment, and is convenient for controlling the dew point temperature during the test, thereby ensuring the test safety.

Description

Technical Field

[0001] The present application relates to the field of wafer testing technology, and in particular to a wafer testing box and wafer testing equipment. Background Art

[0002] Wafer testing is a critical process in the chip manufacturing chain. With the continuous advancement of technologies in aerospace, automotive electronics, photovoltaics, industrial automation, and other fields, chips are increasingly being used in a variety of extreme environments. Typically, wafer temperatures must be controlled between -55°C and 150°C. For example, during low-temperature testing, the wafer temperature must be kept below 0°C, even as low as -55°C. However, if the low-temperature environment contains high levels of moisture, or if the low-temperature wafer is directly exposed to air, problems such as frost or ice formation can easily occur. Utility Model Content

[0003] Based on this, it is necessary to provide a wafer testing box for testing wafers in a low-temperature and dry environment, so as to facilitate the control of the dew point temperature during the test and ensure the safety of the test.

[0004] A wafer testing box comprises a transport box, an extension cylinder, a test box and a drying assembly: the transport box has a transport cavity; the extension cylinder is connected to the transport box, the extension cylinder is configured with a transport channel and an opening connected to the transport channel, and the transport channel is connected to the transport cavity; the test box has a test cavity and a transport window connected to the test cavity, the test box is connected to the extension cylinder, and the transport window is connected to the opening; the drying assembly comprises a first branch and a second branch, the first branch and the second branch are arranged in parallel and are both configured with a plurality of spaced-apart air outlet channels; the first branch is installed in the transport cavity for introducing dry gas into the transport cavity; the second branch is installed in the test cavity for introducing dry gas into the test cavity.

[0005] It can be understood that the transport box is mainly responsible for the automatic transport of wafers, and the test box is mainly responsible for the testing of wafers. The extended cylinder facilitates the connection of the transport box and the test box into an integral structure, and the transport channel can be used to connect the test cavity and the transport cavity to meet the flow of wafers between the test cavity and the transport cavity. In this process, the first branch is assembled relative to the transport cavity, and dry gas is filled into the transport cavity to reduce the water vapor content in the transport cavity; at the same time, the second branch is assembled relative to the test cavity, and dry gas is filled into the test cavity to reduce the water vapor content in the test cavity. In this way, it can be ensured that the wafers are in an environment with low water vapor content during transportation and testing, and the dryness of the internal environment of the entire testing process can be maintained, thereby achieving dew point temperature control and ensuring test safety.

[0006] In some embodiments, the first branch includes a plurality of nozzles arranged at intervals and a first pipe connected between each of the nozzles, each of the nozzles forming an air outlet channel; and / or, the second branch includes an injection pipe and a manifold, the injection pipe is arranged in a ring in the test cavity and is constructed with a plurality of injection holes arranged at intervals, each of the injection holes forming an air outlet channel, one end of the manifold is connected to the injection pipe, and the other end passes through to the outside of the test cavity.

[0007] In some embodiments, the transport box body includes at least a top plate structure; the top plate structure includes a top plate body and a first partition plate, the top plate body and the first partition plate are arranged at intervals along the thickness direction of the top plate body, the first partition plate is located on the side of the top plate body facing the transport cavity, and there is a first interlayer cavity between the top plate body and the first partition plate.

[0008] In some embodiments, the transport box further includes at least two second partitions, each of which is installed in the transport cavity and connected to part of the cavity wall of the transport cavity to separate the transport cavity into a first cavity and a second cavity, the first cavity and the second cavity are independent of each other and not connected to each other, and the first cavity is connected to the transport channel.

[0009] In some embodiments, the test box body includes at least a side baffle plate that defines the test cavity, the side baffle plate is arranged along the circumference of the test box body, the transport window is arranged on one of the side walls of the side baffle plate, and at least one side wall of the remaining side walls of the side baffle plate is constructed with a second interlayer cavity.

[0010] In some embodiments, the wafer testing box further includes a blocking door panel movably mounted at the transport window or the opening, and the blocking door panel has a blocking state and an open state; in the open state, the test cavity is connected to the transport cavity through the transport window and the transport channel; in the blocking state, the blocking door panel can block the transport window or the opening to block the connection between the test cavity and the transport cavity.

[0011] In some embodiments, a fixed door frame is provided at the transport window, and the fixed door frame is installed on the side of the test box facing the test cavity; the blocking door panel and / or the fixed door frame are provided with a first sealing strip, and in the blocking state, the first sealing strip is pressed between the blocking door panel and the fixed door frame.

[0012] In some embodiments, the transport box includes at least a first side panel, the first side panel is arranged close to the test box, the extension cylinder is connected to and protrudes from a side of the first side panel facing away from the transport cavity, and the protruding end of the extension cylinder is connected to the test box.

[0013] In some embodiments, the test box is formed by at least a plurality of first sheet metal plates being spliced ​​together, and a second sealing strip is provided at the joint of each of the first sheet metal plates; and / or, the transport box includes a support frame and a plurality of second sheet metal plates connected to the support frame, and each of the second sheet metal plates is spliced ​​together to enclose the transport cavity, and a third sealing strip is provided at the joint of each of the second sheet metal plates.

[0014] The present application also provides a wafer testing device, including the above-mentioned wafer testing box. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 A first partial schematic diagram of a wafer testing box provided in one embodiment of the present application;

[0017] Figure 2 A second partial schematic diagram of a wafer testing box provided in one embodiment of the present application;

[0018] Figure 3 A third partial schematic diagram of a wafer testing box provided in one embodiment of the present application;

[0019] Figure 4 A fourth partial schematic diagram of a wafer testing box provided in one embodiment of the present application;

[0020] Figure 5 A simplified diagram of a drying component in a wafer testing chamber provided in one embodiment of the present application;

[0021] Figure 6 A partial schematic diagram of a drying component in a wafer testing chamber provided in one embodiment of the present application;

[0022] Figure 7 for Figure 2 A partial enlarged view of point A in the middle;

[0023] Figure 8 for Figure 3 A partial enlarged view of point B in the middle;

[0024] Figure 9 A schematic diagram of a transport box in a wafer testing box provided in one embodiment of the present application;

[0025] Figure 10 A partial schematic diagram of a test box in a wafer test box provided in one embodiment of the present application.

[0026] Figure 10: Transport box; 101: Transport chamber; 11: First side panel; 13: Top panel structure; 14: Second partition; 15: Second side panel; 16: Bottom panel; 17: Third side panel; 19: Support frame; 20: Test box; 21: Side baffle; 22: Fixed door frame; 23: Power source; 24: Guide member; 25: Upper cover; 30: Blocking door panel; 31: Abutting flange; 40: Drying assembly; 41: Main pipe; 42: First branch; 43: Second branch; 44: Drying Dryer; 50, extension cylinder; 131, top plate body; 132, first partition; 201, test chamber; 202, transport window; 401, air outlet channel; 402, injection pipe; 403, manifold; 421, nozzle; 501, transport channel; 502, opening; 1301, first interlayer chamber; 1011, first cavity; 1012, second cavity; 2101, second interlayer chamber; 221, sealing flange; 222, avoidance gap; 2201, open side; 2202, closed side. DETAILED DESCRIPTION

[0027] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0028] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0030] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0031] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.

[0032] See also Figures 1 to 5 The present application provides a wafer testing box, comprising a transport box 10, a test box 20, an extension cylinder 50 and a drying assembly 40. The transport box 10 has a transport chamber 101. The extension cylinder 50 is connected to the transport box 10, and the extension cylinder 50 is configured with a transport channel 501 and an opening 502 connected to the transport channel 501, and the transport channel 501 is connected to the transport chamber 101. The test box 20 has a test chamber 201 and a transport window 202 connected to the test chamber 201. The test box 20 is connected to the extension cylinder 50, and the transport window 202 is connected to the opening 502, that is, the test chamber 201 can be connected to the transport chamber 101 through the transport window 202, the opening 502 and the transport channel 501. The drying assembly 40 includes a first branch 42 and a second branch 43, and the first branch 42 and the second branch 43 are arranged in parallel. The first branch 42 and the second branch 43 are both configured with a plurality of air outlet channels 401 arranged at intervals. The first branch 42 is installed in the transport chamber 101 and is used to introduce dry gas into the transport chamber 101. The second branch 43 is installed in the test chamber 201 and is used to introduce dry gas into the test chamber 201.

[0033] It is understandable that the transport box 10 is mainly used to realize the automatic transport of wafers, so a transport mechanism for wafer transport is provided in the transport chamber 101. The test box 20 is mainly used to realize the test of wafers, so a test mechanism such as a probe station for wafer testing is provided in the test chamber 201. When performing wafer testing, the wafer needs to be transported to the transport chamber 101, and then transported to the test chamber 201 for testing through the transport chamber 101; and, the wafer after testing needs to be transported to the transport chamber 101, and then transported to other stations through the transport chamber 101. In this process, the setting of the extension cylinder 50 not only facilitates the connection of the transport box 10 and the test box 20 into an integral structure, but also can utilize the transport channel 501 to connect the test chamber 201 and the transport chamber 101 to meet the flow of wafers between the test chamber 201 and the transport chamber 101. During the test, it is also necessary to utilize a high and low temperature control system to temperature control the test mechanism to create a high and low temperature environment for wafer testing.

[0034] Taking low-temperature testing as an example, during low-temperature testing, the temperature within test chamber 201 must be controlled below 0°C, or even as high as -55°C. If the moisture content in test chamber 201 is high, or if the low-temperature wafers are directly exposed to air, frost or ice formation can easily occur. Furthermore, since wafers must be transferred between test chamber 201 and transport chamber 101, if the moisture content in transport chamber 101 is too high, frost or ice formation can easily occur within transport chamber 101 when the tested wafers are transported to transport chamber 101, as the wafers are still at a low temperature. Furthermore, wafers transferred from transport chamber 101 to test chamber 201 may carry moisture within transport chamber 101, leading to excessively high moisture content within test chamber 201. Therefore, by utilizing the configuration of the drying assembly 40, dry gas is introduced into the transport chamber 101 through the first branch 42, which is mounted relative to the transport chamber 101, thereby reducing the water vapor content within the transport chamber 101. Simultaneously, dry gas is introduced into the test chamber 201 through the second branch 43, which is mounted relative to the test chamber 201, thereby reducing the water vapor content within the test chamber 201. This ensures that wafers are kept in an environment with low water vapor content during both transport and testing, maintaining a dry internal environment throughout the entire testing process, thereby achieving dew point temperature control and ensuring testing safety.

[0035] See also Figures 2 to 7Exemplarily, the first branch 42 includes a plurality of nozzles 421 arranged at intervals and a first pipe (not shown in the figure) connected between the nozzles 421, and each nozzle 421 forms an air outlet channel 401. Part of the first pipe can extend out of the transport chamber 101 to connect to a structure for generating dry gas (such as a dryer). The second branch 43 includes a spray pipe 402 and a manifold 403. The spray pipe 402 is arranged in a ring in the test chamber 201 and is constructed with a plurality of spray holes arranged at intervals, and each spray hole forms an air outlet channel 401. One end of the manifold 403 is connected to the spray pipe 402, and the other end passes through the test chamber 201 and is used to connect to a structure for generating dry gas (such as a dryer).

[0036] In actual use, the drying assembly 40 also includes a dryer 44, which is located outside the test chamber 20 and the transport chamber 10. The first pipe in the first branch 42 is connected to the dryer 44, and the manifold 403 in the second branch 43 is also connected to the dryer 44. This ensures that dry gas is introduced into the transport chamber 101 and the test chamber 201 using the first and second branches 42 and 43, respectively. The dryer 44 dries the gas to reduce or even remove the water vapor in it. After drying in the dryer 44, a portion of the gas flows to the manifold 403, from which it flows to the injection pipe 402 and is ejected from multiple injection holes into the test chamber 201. Another portion of the gas flows to the first pipe, from which it flows to the various nozzles 421 and is ejected into the transport chamber 101.

[0037] Furthermore, the main pipe 41 can be connected to the air outlet of the dryer 44, and the first pipeline and the confluence pipe 403 are both connected in parallel to the main pipe 41. In this case, the dryer 44 only needs to be provided with one air outlet.

[0038] It should be added that the specific structure and working principle of the dryer 44 are existing mature technologies, so they are not described here in detail.

[0039] In some specific embodiments, multiple injection holes are arranged in the injection tube 402 at intervals along the circumference of the test chamber 201. This arrangement further ensures that the dry gas introduced through the manifold 403 and the injection tube 402 is more evenly distributed within the test chamber 201, ensuring consistent water vapor content. The nozzles of the multiple injection holes can be oriented horizontally toward the interior of the test chamber 201, or some can be oriented vertically downward, some vertically upward, and some horizontally inward. This arrangement is sufficient as long as it ensures uniform dry gas flow. The injection holes have a small diameter to facilitate acceleration of the dry gas at the injection holes and its ejection. The injection tube 402 can be directly fixed to the wall of the test chamber 201. In this case, multiple annular collars can be provided at intervals along the circumference of the test chamber 201, and the injection tube 402 can be secured to the collars. Of course, a bracket can also be installed within the test chamber 201 to support the injection tube 402. It only needs to ensure that the injection tube 402 is installed in the test cavity 201 in a ring shape.

[0040] It's worth noting that because test chamber 201 is primarily used to create a low-temperature testing environment, while transport chamber 101 is primarily used for wafer handling, the water vapor content within test chamber 201 is significantly lower than that within transport chamber 101. Therefore, the injection pipes 402 in second branch 43 need to be arranged around test chamber 201 to ensure uniform gas flow and, consequently, a uniform and low water vapor content within test chamber 201. Furthermore, since the temperature within transport chamber 101 is approximately room temperature, multiple nozzles 421 can be used to inject dry gas, reducing manufacturing costs while ensuring a higher flow of dry gas to test chamber 201.

[0041] Alternatively, both the first branch 42 and the second branch 43 may include a spray pipe 402 and a conduit 403. In this case, the conduit 403 of the first branch 42 needs to extend outside the transfer chamber 101 and connect to the dryer 44, while the conduit 403 of the second branch 43 needs to extend outside the testing chamber 201 and connect to the dryer 44. Alternatively, both the first branch 42 and the second branch 43 may include a plurality of spaced-apart nozzles 421 and a first pipe connecting the nozzles 421. One end of the first pipe of the first branch 42 extends outside the transfer chamber 101 and connects to the dryer 44, while one end of the first pipe of the second branch 43 extends outside the testing chamber 201 and connects to the dryer 44. Alternatively, the first branch 42 may include a spray pipe 402 and a conduit 403, while the second branch 43 may include a plurality of spaced-apart nozzles 421 and a first pipe connecting the nozzles 421. As long as the dry gas can be filled into the test chamber 201 and the transport chamber 101 to meet the respective dew point temperature requirements, this is only an example for explanation.

[0042] like Figures 1 to 3As shown, in actual use, the wafer test box also includes a blocking door panel 30 movably installed at the transport window 202. The blocking door panel 30 has a blocking state and an open state. In the open state, the test chamber 201 is connected to the transport chamber 101 through the transport window 202, the opening 502 and the transport channel 501. In the blocking state, the blocking door panel 30 can block the transport window 202 to block the connection between the test chamber 201 and the transport chamber 101. In other words, the setting of the blocking door panel 30 is used to achieve the connection and blockage between the test chamber 201 and the transport chamber 101. During the test process, the blocking door panel 30 is used to block the test chamber 201 relative to the transport chamber 101 to ensure the sealing of the test chamber 201 itself and prevent the test chamber 201 from being affected by the water vapor in the transport chamber 101; during the transport process, the blocking door panel 30 is used to connect the test chamber 201 and the transport chamber 101 to facilitate the transport of wafers between the two chambers.

[0043] like Figure 3 and Figure 8 As shown, further, a fixed door frame 22 is provided at the transport window 202, and the fixed door frame 22 is installed on the side of the test box 20 facing the test cavity 201. The blocking door panel 30 is provided with a first sealing strip. In the blocked state, the first sealing strip is pressed between the blocking door panel 30 and the fixed door frame 22. It can be understood that the provision of the fixed door frame 22 ensures that there is sufficient area to cooperate with the blocking door panel 30 for sealing, thereby not only blocking the test cavity 201 and the transport cavity 101, but also ensuring the sealing of the transport window 202, preventing the dry gas in the test cavity 201 from leaking during testing. The fixed door frame 22 protrudes relative to the test box 20 to ensure that there is sufficient pressing area for the blocking door panel 30.

[0044] In actual use, along the vertical direction (i.e., the Z-axis direction), the fixed door frame 22 has a closed side 2202 and an open side 2201 that are arranged relative to and spaced apart from each other, and the closed side 2202 is located downstream of the open side 2201 in the closing direction of the blocking door panel 30. The closing direction of the blocking door panel 30 is the upward direction along the vertical direction, and the opening direction is the downward direction along the vertical direction. Therefore, the closed side 2202 is the end point of the upward movement of the blocking door panel 30. When the blocking door panel 30 moves to the closed side 2202 and presses the first sealing strip against the fixed door frame 22, the blocking door panel 30 is in a blocked state; the open side 2201 is the position where the blocking door panel 30 moves downward along the Z-axis direction to completely move out of the transport window 202, at which point the blocking door panel 30 is in an open state. The fixed door frame 22 is provided with an annular sealing flange 221 to facilitate press-fitting with the blocking door panel 30 to meet the sealing requirements in the blocked state. At the same time, the opening side 2201 of the fixed door frame 22 is constructed with a relief notch 222 to prevent interference with the vertical reciprocating movement of the blocking door panel 30. Furthermore, a protruding abutment flange 31 is provided on the side of the blocking door panel 30 facing the fixed door frame 22. When in the blocking state, this flange 31 presses against the side of the sealing flange 221 facing away from the closing side 2202 at the relief notch 222 to form a seal. Furthermore, the dimension of the transport door panel along the X-axis gradually increases from the closing side 2202 toward the opening side 2201 to enhance the sealing effect.

[0045] When the transfer window 202 is rectangular, the length of the transfer window 202 is in the X-axis direction, and the width is in the vertical direction (i.e., the Z-axis direction). In this case, the transfer channel 501 formed by the extended cylindrical body 50 has a central axis along the transfer direction, with the axial direction of the central axis being the Y-axis direction. It should be noted that the transfer direction herein refers to the direction in which the wafer is transferred between the transfer channel 501, the opening 502, and the transfer window 202.

[0046] like Figure 8 As shown, further, the blocking door panel 30 moves in the vertical direction relative to the fixed door frame 22 to achieve the switching of the blocking door panel 30 between the open state and the blocked state. A power source 23 is installed on the side of the test box 20 facing the test cavity 201. For example, it can be a linear moving module such as a cylinder or an electric push rod to achieve linear drive of the blocking door panel 30. With the setting of the power source 23, the opening and closing adjustment of the blocking door panel 30 can be performed by electric control, which is more convenient to operate. At the same time, a guide member 24 is provided between the blocking door panel 30 and the test box 20 to guide the moving direction of the blocking door panel 30 and ensure that the blocking door panel 30 will not deviate during the movement, thereby causing damage to the sealing performance. The guide member 24 can be a combination of a guide rail and a slider. The guide rail is installed on the test box 20, and the slider is installed on the blocking door panel 30.

[0047] Alternatively, the first sealing strip can also be installed on the fixed door frame 22. Alternatively, the blocking door panel 30 can also block the opening 502. In this case, the blocking door panel 30 can be rotatably connected to the side of the extension cylinder 50 facing the transport chamber 101. This is just an example.

[0048] See also Figure 1 and Figure 2 In an optional embodiment, the transport box 10 includes at least a first side panel 11, which is disposed adjacent to the test box 20. The extension cylinder 50 is connected to and protrudes from the side of the first side panel 11 facing away from the transport cavity 101, and the protruding end of the extension cylinder 50 is connected to the test box 20. Such a configuration not only ensures the connection between the test cavity 201 and the transport cavity 101, but also separates the transport box 10 and the test box 20 to avoid assembly interference between the two. The extension cylinder 50 has openings at both ends along its own axis, one of which faces the test box 20 and is defined as an opening 502, and the other faces the transport box 10 and is defined as an installation opening. The edge of the installation opening is provided with a flange, which is pressed onto the first side panel 11 and connected to the first side panel 11 using screws or other structures.

[0049] Alternatively, the first side plate 11 and the extension cylinder 50 may be integrally formed.

[0050] Please combine Figure 1 、 Figure 2 and Figure 9 Exemplarily, the transport box 10 includes at least a top plate structure 13, which is configured with a first interlayer cavity 1301. Specifically, the top plate structure 13 includes a top plate body 131 and a first partition 132. The top plate body 131 and the first partition 132 are spaced apart along the thickness of the top plate body 131, with the first partition 132 located on the side of the top plate body 131 facing the transport cavity 101. The first interlayer cavity 1301 is defined between the top plate body 131 and the first partition 132. This arrangement reduces the headroom of the transport cavity 101, thereby reducing the actual space required to hold dry gas and the amount of dry gas used, thereby ensuring that sufficient dry gas is diverted to the testing cavity 201. In some specific embodiments, the volume of the first interlayer cavity 1301 accounts for 5%-12% of the volume of the transport cavity 101, for example, 5%, 10%, or 12%.

[0051] In some specific embodiments, the first partition plate 132 may be recessed into the transport chamber 101 to form a groove, and the top plate body 131 may be covered at the notch of the groove to define the first interlayer chamber 1301 .

[0052] like Figure 2As shown, the transport box 10 optionally further includes at least two second partitions 14. Each second partition 14 is installed within the transport chamber 101 and connected to a portion of the chamber wall of the transport chamber 101, thereby dividing the transport chamber 101 into a first chamber 1011 and a second chamber 1012. The first chamber 1011 and the second chamber 1012 are independent and non-interconnected, and the first chamber 1011 is connected to the transport channel 501. The second chamber 1012 can house electrical components for controlling the transport mechanism, achieving electrical isolation. This configuration reduces the volume of the transport chamber 101, thereby reducing the amount of drying gas used and the time and power consumption required to achieve the desired dew point stabilization within the transport chamber 101. Furthermore, the electrical isolation allows maintenance and replacement of electrical components without affecting the dew point temperature within the transport chamber 101. The volume of the second chamber 1012 accounts for 10% to 25% of the volume of the test chamber 201, for example, 10%, 20%, or 25%.

[0053] In some specific embodiments, the transport box 10 further includes a second side panel 15, a third side panel 17, a bottom panel 16, and a fourth side panel (not shown). The bottom panel 16 is arranged vertically opposite and spaced apart from the top panel structure 13, serving as the bottom and top of the transport box 10, respectively. The second side panel 15 is arranged opposite and spaced apart from the first side panel 11 along the Y-axis, and the third side panel 17 is arranged opposite and spaced apart from the fourth side panel along the X-axis. Two second partitions 14 are provided, arranged and connected in an L-shape. One second partition 14 is parallel to the bottom panel 16 and connected to the first side panel 11, the second side panel 15, and the third side panel 17; the other second partition 14 is parallel to the third side panel 17 and connected to the first side panel 11, the second side panel 15, and the bottom panel 16. In this way, the first cavity 1011 and the second cavity 1012 can be separated, achieving electrical isolation. The fourth side panel can be provided with a feeding window for feeding wafers into and out of the first cavity 1011. The feeding window is provided with a feeding door panel to block or open the feeding window.

[0054] Please continue to combine Figure 1 、 Figure 2 and Figure 9In actual use, the transport box 10 includes a support frame 19 and multiple second sheet metal panels connected to the support frame 19. The second sheet metal panels are spliced ​​together to form the transport chamber 101, and a third sealing strip is provided at the joints of each second sheet metal panel. As will be understood, the support frame 19 primarily serves as a support to ensure the structural strength of the transport box 10 and facilitate assembly of the transport mechanism. The provision of multiple second sheet metal panels not only facilitates manufacturing, but also allows the third sealing strip to ensure the sealing of the entire test chamber 201, reducing leakage of the drying gas. The third sealing strip can be made of materials such as silicone and sponge and can be bonded to the joints of each second sheet metal panel. The aforementioned nozzle 421 can be mounted on the support frame 19. Two nozzles 421 can form a nozzle group, and multiple nozzle groups can be spaced apart within the first chamber 1011 to ensure uniform filling of the drying gas.

[0055] Please combine Figure 3 、 Figure 4 and Figure 10 As another example, the test box 20 includes at least a side baffle 21 disposed along the circumference of the test box 20. A transfer window 202 is provided on one side wall of the side baffle 21. Furthermore, at least one of the remaining side walls of the side baffle 21 is configured with a second interlayer cavity 2101.

[0056] Specifically, the test box 20 also includes an upper cover plate 25 and a lower support plate (not shown in the figure), which are respectively connected to both sides of the side baffle plate 21 in the vertical direction. The second interlayer cavity 2101 on the side baffle plate 21 is provided to reduce the volume of the test cavity 201, thereby reducing the amount of dry gas filled into the test cavity 201; and the provision of the second interlayer cavity 2101 can play a role in heat preservation, thereby effectively reducing the risk of condensation caused by large internal temperature differences. Among them, the upper cover plate 25 is provided with a viewing window to facilitate observation of the test conditions in the test cavity 201. Among them, the injection pipe in the aforementioned second branch 43 is fixed to the side baffle plate 21, and the side baffle plate 21 is provided with an outlet hole for the manifold to pass through, and a sealing structure is provided at the hole wall of the outlet hole and the outer tube wall of the manifold.

[0057] In actual use, the test chamber 20 is constructed from at least a plurality of first sheet metal panels, with second sealing strips positioned at the joints between each first sheet metal panel. This arrangement not only facilitates manufacturing but also ensures a good seal throughout the test chamber 20, minimizing leakage of dry gas. The second sealing strips can be made of materials such as silicone and sponge.

[0058] Another embodiment of the present application provides a wafer testing device, including the above-mentioned wafer testing box. The wafer testing device also includes a transport mechanism, a testing mechanism and a high and low temperature control system. The transport mechanism is installed in the transport box, and the testing mechanism is installed in the testing box. The high and low temperature control system can be electrically connected to the testing mechanism to control the temperature of the testing mechanism, thereby meeting the high and low temperature tests of the wafer. In actual use, according to different types of wafers, it is necessary to replace the probe station in the testing mechanism, so the test box is also provided with a card changing window, and the card changing window is rotatably connected to a card changing sealing plate, and a fourth sealing strip is pressed at the edge of the card changing sealing plate and the card changing window to ensure the sealing of the test box.

[0059] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. A wafer testing box, characterized in that: The wafer testing box includes: A transport box (10) having a transport cavity (101); An extension cylinder (50) is connected to the transport box (10), the extension cylinder (50) is configured with a transport channel (501) and an opening (502) connected to the transport channel (501), and the transport channel (501) is connected to the transport chamber (101); A test box (20) having a test cavity (201) and a transport window (202) communicating with the test cavity (201), wherein the test box (20) is connected to the extension cylinder (50), and the transport window (202) is communicated with the opening (502); The drying assembly (40) comprises a first branch (42) and a second branch (43), wherein the first branch (42) and the second branch (43) are arranged in parallel and are each configured with a plurality of spaced-apart gas outlet channels (401); the first branch (42) is installed in the transport chamber (101) and is used to introduce dry gas into the transport chamber (101); and the second branch (43) is installed in the test chamber (201) and is used to introduce dry gas into the test chamber (201).

2. The wafer testing box according to claim 1, characterized in that: The first branch (42) comprises a plurality of nozzles (421) arranged at intervals and a first pipe communicating between the nozzles (421), each nozzle (421) forming an air outlet channel (401); and / or, The second branch (43) comprises an injection pipe (402) and a confluence pipe (403); the injection pipe (402) is arranged in a ring in the test chamber (201) and is configured with a plurality of injection holes arranged at intervals, each of the injection holes forming an air outlet channel (401); one end of the confluence pipe (403) is connected to the injection pipe (402), and the other end passes through to the outside of the test chamber (201).

3. The wafer testing box according to claim 1, wherein: The transport box (10) at least includes a top plate structure (13); The top plate structure (13) includes a top plate body (131) and a first partition (132), wherein the top plate body (131) and the first partition (132) are spaced apart along the thickness direction of the top plate body (131), and the first partition (132) is located on the side of the top plate body (131) facing the transport cavity (101), and a first interlayer cavity (1301) is provided between the top plate body (131) and the first partition (132).

4. The wafer testing box according to claim 1 or 3, characterized in that: The transport box (10) further comprises at least two second partitions (14), each of which is installed in the transport cavity (101) and connected to a portion of the cavity wall of the transport cavity (101) to separate the transport cavity (101) into a first cavity (1011) and a second cavity (1012). The first cavity (1011) and the second cavity (1012) are independent of each other and are not connected to each other. The first cavity (1011) is connected to the transport channel (501).

5. The wafer testing box according to claim 1 or 3, characterized in that: The test box (20) comprises at least a side baffle (21), wherein the side baffle (21) is arranged along the circumference of the test box (20), the transport window (202) is arranged on one of the side walls of the side baffle (21), and at least one of the remaining side walls of the side baffle (21) is constructed with a second interlayer cavity (2101).

6. The wafer testing box according to claim 1, wherein: The wafer testing box further comprises a blocking door panel (30) movably mounted at the transport window (202) or the opening (502), wherein the blocking door panel (30) has a blocking state and an open state; In the open state, the test chamber (201) is connected to the transport chamber (101) through the transport window (202) and the transport channel (501); in the blocked state, the blocking door panel (30) can block the transport window (202) or the opening (502) to block the communication between the test chamber (201) and the transport chamber (101).

7. The wafer testing box according to claim 6, characterized in that: A fixed door frame (22) is provided at the transport window (202), and the fixed door frame (22) is installed on a side of the test box (20) facing the test cavity (201); The blocking door panel (30) and / or the fixed door frame (22) are provided with a first sealing strip. In the blocking state, the first sealing strip is pressed between the blocking door panel (30) and the fixed door frame (22).

8. The wafer testing box according to claim 1, wherein: The transport box (10) comprises at least a first side panel (11), the first side panel (11) being arranged close to the test box (20), the extension cylinder (50) being connected to and protruding from a side of the first side panel (11) facing away from the transport cavity (101), and the protruding end of the extension cylinder (50) being connected to the test box (20).

9. The wafer testing box according to claim 1, wherein: The test box (20) is formed by splicing at least a plurality of first sheet metal plates, and a second sealing strip is provided at the splicing position of each of the first sheet metal plates; and / or, The transport box (10) comprises a support frame (19) and a plurality of second sheet metal plates connected to the support frame (19), wherein the second sheet metal plates are spliced ​​and collectively enclose the transport cavity (101), and a third sealing strip is provided at the splicing locations of the second sheet metal plates.

10. A wafer testing device, characterized in that: A wafer testing box comprising the wafer testing box according to any one of claims 1 to 9.

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