Signal acquisition unit and primary and secondary fusion pole-mounted switch device

Abstract

The utility model discloses an information acquisition unit, discloses a primary and secondary fusion pole-mounted switch device with the information acquisition unit, and relates to the field of primary and secondary fusion pole-mounted switch devices. The component assembly comprises a zero-sequence current sampling resistor, a phase current sampling resistor and a zero-sequence voltage dividing capacitor, the zero-sequence current sampling resistor, the phase current sampling resistor and the zero-sequence voltage dividing capacitor are all arranged on the circuit board and the plug end, the plug end is arranged on the circuit board and electrically connected with the component assembly, the plug end is provided with a groove, and the plug end is electrically connected with the component assembly. The groove is provided with a plurality of flexible connection probes, part of the flexible connection probes are used for connecting the sensor unit, and the other part of the flexible connection probes are used for connecting the terminal unit. According to the signal acquisition unit, the zero-sequence current sampling resistor, the phase current sampling resistor, the zero-sequence voltage dividing capacitor and the plugging end are arranged on the circuit board, so that the signal acquisition unit has the characteristics of integration, small size and structuralization.

Description

Technical Field

[0001] The present application relates to the field of a primary-secondary fusion column-mounted switch device, and in particular to a signal acquisition unit. Background Art

[0002] Fusion primary and secondary pole-mounted switches have been developed for many years, and various voltage and current sensor technologies have already been developed. However, the sampling and processing of the secondary signals transmitted by the sensors is still not perfect. Existing secondary signal acquisition units are generally complex, bulky, and occupy a large space, making them less than ideal in practice. Utility Model Content

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a signal acquisition unit that reduces the volume occupied by the signal acquisition unit, thereby facilitating the miniaturization of related equipment. This application also proposes a primary-secondary fusion column-mounted switch equipped with the aforementioned signal acquisition unit.

[0004] According to the first embodiment of the present application, a signal acquisition unit includes:

[0005] circuit boards;

[0006] A component assembly, wherein the component assembly includes a zero-sequence current sampling resistor, a phase current sampling resistor, and a zero-sequence voltage dividing capacitor. The zero-sequence current sampling resistor, the phase current sampling resistor, and the zero-sequence voltage dividing capacitor are all provided on the circuit board. The zero-sequence current sampling resistor and the phase current sampling resistor are used to convert the current signal transmitted by the sensor unit into a voltage signal. The zero-sequence voltage dividing capacitor is used to convert the voltage signal transmitted by the sensor unit into a zero-sequence voltage signal.

[0007] The plug-in end is provided on the circuit board, the plug-in end is electrically connected to the component assembly, the plug-in end is provided with a groove, the groove is provided with a plurality of flexible connection probes, some of the flexible connection probes are used to connect to the sensor unit, and the other part of the flexible connection probes are used to connect to the terminal unit.

[0008] The signal acquisition unit according to the embodiments of the present application has at least the following beneficial effects: by mounting the zero-sequence current sampling resistor, phase current sampling resistor, and zero-sequence voltage divider capacitor on the same circuit board, the signal acquisition unit can convert both the current signal transmitted by the sensor unit into a voltage signal and the voltage signal transmitted by the sensor unit into a zero-sequence voltage signal. Furthermore, the volume occupied by the signal acquisition unit can be reduced, facilitating the miniaturization of related equipment. The flexible connection probe at the plug-in end connects to the sensor unit and the terminal unit, making the connection tighter, facilitating more stable signal transmission, and reducing the incidence of failures.

[0009] According to some embodiments of the present application, a shell assembly is further included, which includes an outer shell, a base plate and a cover plate. A cavity is formed inside the outer shell, and the outer shell is provided with a first opening and a second opening connected to the cavity. The circuit board is placed in the cavity, the base plate is detachably installed on the first opening, and the cover plate is detachably installed on the second opening.

[0010] According to some embodiments of the present application, the resistance temperature drift of the zero-sequence current sampling resistor and the phase current sampling resistor is less than or equal to 25 ppm; the resistance accuracy of the zero-sequence current sampling resistor and the phase current sampling resistor is greater than or equal to 0.1%.

[0011] According to some embodiments of the present application, the plug-in end is a Phoenix terminal, the flexible connection probes are provided in two rows, the spacing between the two rows of flexible connection probes is 6.35 mm, and the Phoenix terminal is provided with a first hole.

[0012] According to some embodiments of the present application, the housing is an integrally formed aluminum profile.

[0013] According to some embodiments of the present application, the surface of the shell is coated with an oxide film.

[0014] According to some embodiments of the present application, the cover plate is provided with a through opening, the plug end is passed through the through opening, and a reminder mark is provided on a side of the cover plate opposite to the cavity.

[0015] According to some embodiments of the present application, mounting holes are respectively provided on two opposite sides of the base plate, and the housing is located between the mounting holes on both sides.

[0016] According to the second embodiment of the present application, a primary and secondary fusion column mounted switch device includes:

[0017] A sensor unit, wherein the sensor unit is provided with a high-voltage arm capacitor group;

[0018] According to the signal acquisition unit of the embodiment of the first aspect of the present application, the signal acquisition unit is connected to the high-voltage arm capacitor group through the plug-in end, and the signal acquisition unit is used to acquire the current and voltage signals transmitted by the sensor unit.

[0019] The primary and secondary fusion column-mounted switch device according to the embodiment of the present application has at least the following beneficial effects: by installing the zero-sequence current sampling resistor, the phase current sampling resistor and the zero-sequence voltage divider capacitor on the same circuit board, the signal acquisition unit can convert the current signal transmitted by the sensor unit into a voltage signal, and can also convert the voltage signal transmitted by the sensor unit into a zero-sequence voltage signal, and can reduce the occupied volume of the signal acquisition unit, which is conducive to the miniaturization of related equipment. The flexible connection probe at the plug end is connected to the sensor unit and the terminal unit, which can make the connection tighter, promote more stable signal transmission, and reduce the occurrence rate of faults. The high-voltage arm capacitor group is arranged on the sensor unit.

[0020] According to some embodiments of the present application, the zero-sequence voltage divider capacitor and the high-voltage arm capacitor group are both ceramic capacitors.

[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 A schematic diagram of a signal acquisition unit according to an embodiment of the present application;

[0024] Figure 2 for Figure 1 A schematic diagram of a signal acquisition unit with its housing assembly removed is shown;

[0025] Figure 3 for Figure 1 A schematic diagram of a housing assembly of a signal acquisition unit is shown;

[0026] Figure 4 for Figure 1 The schematic diagram of the signal acquisition unit after packaging is shown;

[0027] Figure 5 for Figure 3 a schematic diagram of the housing assembly from another perspective;

[0028] Figure 6 for Figure 5 A schematic diagram of the cover plate of the housing assembly is shown.

[0029] Reference numerals:

[0030] Signal acquisition unit 10; component assembly 100; zero-sequence current sampling resistor 110; phase current sampling resistor 120; zero-sequence voltage divider capacitor 130; housing assembly 200; shell 210; base plate 220; mounting hole 221; cover 230; second hole 231; prompt mark 232; plug-in terminal 300; first hole 310; flexible connection probe 320; circuit board 400. DETAILED DESCRIPTION

[0031] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0032] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0033] In the description of this application, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The terms "first" and "second" are used solely to distinguish technical features and are not to be construed as indicating or implying relative importance, or as implicitly specifying the number or order of the technical features indicated.

[0034] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0035] In the field of primary and secondary integrated pole-mounted switches that has been developed for many years, the development of voltage and current sensor technology has achieved relatively satisfactory results. However, the low-voltage signal processing solutions of the sensors compared with them are not satisfactory, each with its own advantages and disadvantages, and most technical solutions use an independent signal acquisition unit 10 to process the signal, resulting in a large unit size and high space occupancy, which greatly increases the cost.

[0036] Based on this, an embodiment of the present application provides a signal acquisition unit 10 that can reduce the space occupancy of the signal acquisition unit 10 and achieve a miniaturized structure of the signal acquisition unit 10 .

[0037] The following references Figures 1 to 6 The signal acquisition unit 10 according to an embodiment of the present application is described.

[0038] like Figure 2 As shown, the signal acquisition unit 10 according to the embodiment of the present application includes: a circuit board 400, a component assembly 100 and a plug-in end 300, the component assembly 100 includes a zero-sequence current sampling resistor 110, a phase current sampling resistor 120 and a zero-sequence voltage dividing capacitor 130, the zero-sequence current sampling resistor 110, the phase current sampling resistor 120 and the zero-sequence voltage dividing capacitor 130 are all arranged on the circuit board 400, the zero-sequence current sampling resistor 110 and the phase current sampling resistor 120 are used to convert the current signal transmitted by the sensor unit into a voltage signal, and the zero-sequence voltage dividing capacitor 130 is used to convert the voltage signal transmitted by the sensor unit into a zero-sequence voltage signal; the plug-in end 300 is provided on the circuit board 400, the plug-in end 300 is electrically connected to the component assembly 100, the plug-in end 300 is provided with a groove, and the groove is provided with a plurality of flexible connection probes 320, some of the flexible connection probes 320 are used to connect the sensor unit, and the other part of the flexible connection probes 320 are used to connect the terminal unit.

[0039] The beneficial effects of the signal acquisition unit 10 of the embodiment of the present application can be manifested as follows: by mounting the zero-sequence current sampling resistor 110, the phase current sampling resistor 120, and the zero-sequence voltage divider capacitor 130 on the same circuit board 400, the signal acquisition unit 10 can convert both the current signal transmitted by the sensor unit into a voltage signal and the voltage signal transmitted by the sensor unit into a zero-sequence voltage signal, and can also reduce the volume occupied by the signal acquisition unit 10, which is conducive to the miniaturization of related equipment. The flexible connection probe 320 of the plug end 300 is connected to the sensor unit and the terminal unit, which can achieve a tighter connection, promote more stable signal transmission, and reduce the incidence of failures.

[0040] Specifically, the circuit board 400 is used to centrally install the relevant component assemblies 100. The circuit board 400 integrates the component assemblies 100 in a small volume, which promotes the miniaturization of the unit structure, reduces the required space, and reduces costs. The components included in the zero-sequence current sampling resistor 110, the phase current sampling resistor 120 and the zero-sequence voltage divider capacitor 130 are all connected to the circuit board 400 by welding, making the connection tighter and more reliable. The zero-sequence current sampling resistor 110 and the phase current sampling resistor 120 convert the current signal transmitted by the sensor unit into a voltage signal, while the zero-sequence voltage divider capacitor 130 converts the voltage signal transmitted by the sensor unit into a zero-sequence voltage signal, so that the output signal can adapt to the terminal unit. Among them, the input of the signal acquisition unit 10 and the sensor unit signal and the output of the processed signal to the terminal unit are both realized through the plug-in terminal 300. The plug-in end 300 is provided with a groove, in which a number of flexible connection probes 320 are provided. The flexible connection probes 320 are used to connect the sensor unit and the terminal unit. The use of the flexible connection probes 320 makes the connection between the signal acquisition unit 10 and other units more secure, thereby promoting more stable signal transmission, and the connection interfaces of each unit are connected to the plug-in end 300, making management more unified and simple.

[0041] It should be noted that the circuit board 400 can be of any shape and size. The sensor unit can be a unit that includes any sensor, such as a voltage sensor and a current sensor. The parameter values ​​of the zero-sequence current sampling resistor 110, the phase current sampling resistor 120, and the zero-sequence voltage divider capacitor 130 can be arbitrary. The plug-in terminal 300 can be any port for connecting other units or components. The terminal unit can be any next-level device, such as a relay protection device. In addition to welding, the zero-sequence current sampling resistor 110, the phase current sampling resistor 120, and the zero-sequence voltage divider capacitor 130 can be connected to the circuit board 400 by any method or structure for fixed connection. Ideally, the converted zero-sequence voltage signal should be zero, but in actual operation, the zero-sequence voltage is generally a non-zero signal. The number and specifications of the flexible connecting probes 320 can be arbitrary and can be used to connect other units. The flexible connecting probes 320 are electrically connected to the zero-sequence current sampling resistor 110, the phase current sampling resistor 120, and the zero-sequence voltage divider capacitor 130.

[0042] It is understandable that: Figure 1 、 Figure 3 、 Figure 4 and Figure 5As shown, it also includes a shell assembly 200, which includes an outer shell 210, a base plate 220 and a cover plate 230. A cavity is formed inside the outer shell 210, and the outer shell 210 is provided with a first opening and a second opening connected to the cavity. The circuit board 400 is placed in the cavity, the base plate 220 can be detachably installed in the first opening, and the cover plate 230 can be detachably installed in the second opening.

[0043] Specifically, the cavity of the housing 210 is formed inside the housing 210. The top and bottom of the housing 210 are respectively provided with a first opening and a second opening that communicate with the cavity. The cover plate 230 is connected to the first opening by bolts and screws, and the bottom plate 220 is connected to the second opening by bolts and screws. The bottom plate 220 completely covers the second opening, so that the circuit board 400 can be placed in the cavity, making it easier to take the circuit board 400. The volume of the cavity should be exactly the same as the volume of the circuit board 400 to ensure the miniaturization of the overall volume. At the same time, the shape of the cavity of the housing 210 at the four corners is a long tubular shape so that the screws can be embedded in the housing 210 to achieve the connection function.

[0044] It should be noted that the connection between the bottom plate 220 and the cover plate 230 and the housing 210 may be any detachable connection structure in addition to bolts and screws. The shape of the cavity may be any shape and size that can accommodate the circuit board 400.

[0045] It is understandable that: Figure 1 and Figure 2 As shown, the resistance temperature drift of the zero-sequence current sampling resistor 110 and the phase current sampling resistor 120 is less than or equal to 25 ppm; the resistance accuracy of the zero-sequence current sampling resistor 110 and the phase current sampling resistor 120 is greater than or equal to 0.1%.

[0046] Specifically, the zero-sequence current sampling resistor 110 and the phase current sampling resistor 120 are fixed to the circuit board 400. During use, the zero-sequence current sampling resistor 110 and the phase current sampling resistor 120 are both resistors with a resistance temperature drift less than or equal to 25 ppm. For example, in one embodiment, the resistance temperature drift of the zero-sequence current sampling resistor 110 and the phase current sampling resistor 120 are both 25 ppm; in another embodiment, the resistance temperature drift of the zero-sequence current sampling resistor 110 is 23 ppm, and the resistance temperature drift of the phase current sampling resistor 120 is 24 ppm. This reduces resistance variation and ensures resistance accuracy and stability. At the same time, by setting the accuracy of the zero-sequence current sampling resistor 110 and the phase current sampling resistor 120 to be greater than or equal to 0.1%, for example, in one embodiment, the resistance accuracy of the zero-sequence current sampling resistor 110 and the phase current sampling resistor 120 are both 0.1%; in another embodiment, the resistance accuracy of the zero-sequence current sampling resistor 110 is 0.3%, and the resistance accuracy of the phase current sampling resistor 120 is 0.2%, so that the resistance accuracy is further improved, thereby improving the overall reliability.

[0047] It is understandable that: Figure 1 and Figure 4 As shown, the plug end 300 is a Phoenix terminal, and the flexible connection probes 320 are provided in two rows. The spacing between the two rows of flexible connection probes 320 is 6.35 mm, and a first hole 310 is provided on the Phoenix terminal.

[0048] Specifically, the plug-in terminal 300 is a Phoenix terminal, and a first hole 310 is provided at both ends of the Phoenix terminal. The first hole 310 is used to connect with the components of other units to prevent the related combined connection from falling off. The two rows of flexible connection probes 320 set in the groove of the Phoenix terminal are indirectly 6.35mm. By indirectly limiting the flexible connection probes 320, the risk of pin short circuit failure caused by condensation is reduced. Each unit is connected to the plug-in terminal 300 by matching the plug with the flexible connection probe 320. The structural design of the two rows of flexible connection probes 320 can improve the plug-in and pull-out force between the plug and the plug-in terminal 300, and thus maintain a fixed state even when the first hole 310 is not firmly connected, and the plug will not fall off, thereby improving reliability and stability. At the same time, multiple plugs are matched with the flexible connection probes 320, so that the plugs of each unit are concentrated on the plug-in terminal 300, which makes it more convenient to manage the plugs and the corresponding units in a unified manner.

[0049] It should be noted that the first hole 310 of the Phoenix terminal can be set at any position that can be used for connection.

[0050] It is understandable that: Figure 3 and Figure 5 As shown, the housing 210 is an integrally formed aluminum profile.

[0051] Specifically, housing 210 is an integrally molded component that undergoes a cast-in-place insulation treatment. This provides housing 210 with insulating properties. The integrally molded structure facilitates industrial production, improves adaptability, and avoids issues such as poor collection efficiency due to condensation, thereby increasing production efficiency. Housing 210 is constructed of aluminum, which reduces costs and provides a more stable structure.

[0052] It is understandable that: Figure 1 and Figure 3 As shown, the surface of the housing 210 is coated with an oxide film.

[0053] Specifically: the surface of the shell 210 is coated with a layer of anodized film, which improves the corrosion resistance and wear resistance of the structure, thereby ensuring that the signal acquisition unit 10 will not be easily damaged in a short time, and has the function of shielding external electromagnetic interference, which also improves stability to a certain extent.

[0054] It should be noted that, in addition to the anodic oxide film, any oxide film that can be coated on the surface of the housing 210 may also be used.

[0055] It is understandable that: Figure 6 As shown, the cover plate 230 is provided with a through opening, the plug end 300 is passed through the through opening, and a prompt mark 232 is provided on the side of the cover plate 230 opposite to the cavity.

[0056] Specifically, the four corners of the cover plate 230 are provided with second holes 231, and the cover plate 230 can be detachably mounted on the housing 210 through the second holes 231, which is convenient for taking and placing the circuit board 400. A through opening is provided on the board cover for the plug-in end 300 to pass through the through opening, so that the plug-in end 300 can be better connected with other unit plugs, thereby improving the stability of transmission. A prompt mark 232 is engraved on the side of the cover plate 230 facing away from the cavity, which is used to display the position and parameters of each lead, facilitates fault troubleshooting, and improves safety performance.

[0057] It should be noted that the size of the opening on the cover 230 can be any size that can be passed through by the plug end 300. The prompt mark 232 can be set on the cover 230 by laser engraving or other methods. The content of the prompt mark 232 is customized and determined according to actual needs.

[0058] It is understandable that: Figure 1 、 Figure 3 As shown, mounting holes 221 are respectively provided on two opposite sides of the bottom plate 220 , and the housing 210 is located between the mounting holes 221 on both sides.

[0059] Specifically, the base plate 220 is removably mounted to the housing 210. Mounting holes 221 are located on opposite sides of the base that are not in contact with the housing 210. The mounting holes 221 are relatively centrally located. This design allows for greater installation compatibility and adaptability to various structural organizations.

[0060] It should be noted that the shape of the mounting hole 221 is arbitrary.

[0061] According to the second embodiment of the utility model, the primary and secondary fusion upper column switch device includes:

[0062] A sensor unit, wherein the sensor unit is provided with a high-voltage arm capacitor group;

[0063] According to the signal acquisition unit 10 of the first embodiment, the signal acquisition unit 10 is connected to the high-voltage arm capacitor group via the plug-in terminal 300 , and the signal acquisition unit 10 is used to acquire the current and voltage signals transmitted by the sensor unit.

[0064] According to the signal acquisition unit 10 of the embodiment of the present application, by installing the zero-sequence current sampling resistor 110, the phase current sampling resistor 120 and the zero-sequence voltage divider capacitor 130 on the same circuit board 400, the signal acquisition unit 10 can convert the current signal transmitted by the sensor unit into a voltage signal, and can also convert the voltage signal transmitted by the sensor unit into a zero-sequence voltage signal, and can reduce the occupied volume of the signal acquisition unit 10, which is conducive to the miniaturization of related equipment. The flexible connection probe 320 of the plug-in terminal 300 is connected to the sensor unit and the terminal unit, which can make the connection tighter, promote more stable signal transmission, and reduce the incidence of faults. The high-voltage arm capacitor group is provided on the sensor unit.

[0065] Specifically, the sensor unit is electrically connected to the signal acquisition unit 10, and the high-voltage arm capacitor group of the sensor unit includes three groups of high-voltage arm capacitors (not shown in the accompanying drawings). The high-voltage arm capacitors are connected in parallel, and the output of the high-voltage arm capacitor group is input into the signal acquisition unit 10 through the plug-in terminal 300, ensuring the stability of signal transmission. The high-voltage arm capacitor group and the zero-sequence voltage divider capacitor 130 are connected in series (not shown in the accompanying drawings). The three groups of voltages of the high-voltage arm capacitor group enter the signal acquisition unit 10, and the zero-sequence voltage divider capacitor 130 synthesizes the three groups of input voltages to obtain a zero-sequence voltage, which is then output to the terminal unit through the plug-in terminal 300.

[0066] It should be noted that the three voltage groups can be voltages generated by a power source composed of three AC potentials with a phase difference of 120 degrees, or any voltage that can be synthesized into a zero-sequence voltage. The number of capacitors included in the high-voltage arm capacitor group can be selected according to actual needs.

[0067] It can be understood that the zero-sequence voltage divider capacitor 130 and the high-voltage arm capacitor group are both ceramic capacitors.

[0068] Specifically, the zero-sequence voltage divider capacitor 130 in the information acquisition unit and the high-voltage arm capacitor in the sensor unit are both ceramic capacitors (not shown in the drawings), and the materials used for the zero-sequence voltage divider capacitor 130 and the high-voltage arm capacitor are consistent, so as to ensure the consistency of the temperature drift of the high and low voltage arms of the sensor unit, thereby improving the zero-sequence voltage sampling accuracy and linearity.

[0069] It should be noted that if the requirements for accuracy and linearity of ceramic capacitors are not high, ceramics with inconsistent materials can also be used. The specific selection can be based on actual conditions and cost requirements.

[0070] Other structures and operations of the primary and secondary fusion upper column switch device according to the embodiment of the present application are known to ordinary technicians in this field and will not be described in detail here.

[0071] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the purpose of the present application.

Claims

1. A signal acquisition unit, characterized in that: include: circuit boards; A component assembly, wherein the component assembly includes a zero-sequence current sampling resistor, a phase current sampling resistor, and a zero-sequence voltage dividing capacitor. The zero-sequence current sampling resistor, the phase current sampling resistor, and the zero-sequence voltage dividing capacitor are all provided on the circuit board. The zero-sequence current sampling resistor and the phase current sampling resistor are used to convert the current signal transmitted by the sensor unit into a voltage signal. The zero-sequence voltage dividing capacitor is used to convert the voltage signal transmitted by the sensor unit into a zero-sequence voltage signal. The plug-in end is provided on the circuit board, the plug-in end is electrically connected to the component assembly, the plug-in end is provided with a groove, the groove is provided with a plurality of flexible connection probes, some of the flexible connection probes are used to connect to the sensor unit, and the other part of the flexible connection probes are used to connect to the terminal unit.

2. The signal acquisition unit according to claim 1, characterized in that: It also includes a shell assembly, which includes an outer shell, a base plate and a cover plate. A cavity is formed inside the outer shell, and the outer shell is provided with a first opening and a second opening connected to the cavity. The circuit board is placed in the cavity, the base plate is detachably mounted on the first opening, and the cover plate is detachably mounted on the second opening.

3. The signal acquisition unit according to claim 1, characterized in that: The resistance temperature drift of the zero-sequence current sampling resistor and the phase current sampling resistor is less than or equal to 25 ppm; the resistance accuracy of the zero-sequence current sampling resistor and the phase current sampling resistor is greater than or equal to 0.1%.

4. The signal acquisition unit according to claim 1, characterized in that: The plug-in end is a Phoenix terminal, the flexible connection probes are provided in two rows, the spacing between the two rows of flexible connection probes is 6.35 mm, and the Phoenix terminal is provided with a first hole.

5. The signal acquisition unit according to claim 2, characterized in that: The shell is an integrally formed aluminum profile.

6. The signal acquisition unit according to claim 2, characterized in that: The surface of the shell is coated with an oxide film.

7. The signal acquisition unit according to claim 2, characterized in that: The cover plate is provided with a through opening, the plug end is passed through the through opening, and a prompt mark is provided on a side of the cover plate opposite to the cavity.

8. The signal acquisition unit according to claim 2, characterized in that: Two opposite sides of the bottom plate are respectively provided with mounting holes, and the shell is located between the mounting holes on the two sides.

9. A primary and secondary fusion column switch device, characterized in that: include: A sensor unit, wherein the sensor unit is provided with a high-voltage arm capacitor group; According to the signal acquisition unit according to any one of claims 1 to 8, the signal acquisition unit is connected to the high-voltage arm capacitor group through the plug-in terminal, and the signal acquisition unit is used to acquire the current and voltage signals transmitted by the sensor unit.

10. The primary and secondary fusion column mounted switch device according to claim 9, characterized in that: The zero-sequence voltage divider capacitor and the high-voltage arm capacitor group are both ceramic capacitors.

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