Chip identifying and positioning device

Abstract

The embodiment of the utility model provides a chip identifying and positioning device, a box body is internally provided with a camera module for irradiating a chip and positioning the chip, an adsorption disc is located in the box body, the adsorption disc is provided with a mounting groove for mounting an adhesive film, and the bottom of the mounting groove is connected with vacuum adsorption equipment; the top of the supporting convex part is in contact with the bottom of the adhesive film, and when gas between the mounting groove and the adhesive film is exhausted under the action of vacuum adsorption equipment, the supporting convex part supports the adhesive film, so that the part, which is not in contact with the supporting convex part, of the adhesive film is sunken towards one side of the bottom wall of the mounting groove, the contact area between the top of the adhesive film and the chip is reduced, and the chip is conveniently picked up; meanwhile, the adhesive film is a dark adhesive film, and under the irradiation of the camera module, the adhesive film and the chip can form obvious chromatic aberration, so that the chip can be conveniently positioned, and the problem that the camera module cannot identify the low-reflectance chip or positioning deviation is caused is solved.

Description

Technical Field

[0001] The present application relates to the field of chip assembly, and in particular, to a chip identification and positioning device. Background Art

[0002] With the rapid development of the domestic semiconductor industry, chips, as an indispensable branch, have become important in various fields. Chip production and processing begins with wafer testing and backgrinding to achieve the required thickness. Wafer sawing then proceeds to cut the wafer into chips. Selected high-quality chips are then attached to a lead frame or substrate through the die attach process. Wire bonding is then used to achieve electrical connection between the chip and substrate. Finally, epoxy molding compound (EMC) is used for sealing and protection.

[0003] The chip recognition process is part of the chip mounting process. Specifically, the chip box is vacuum-adsorbed, and the chip and film are separated under vacuum operation. At the same time, the chip is positioned by a camera. Due to the poor reflectivity of the chip, the camera enhances the light and illuminates the chip, film, and grid at the same time, resulting in the camera being unable to recognize the chip or misidentifying it, resulting in poor chip positioning. Utility Model Content

[0004] In an embodiment of the present application, a chip identification and positioning device is provided to solve the problem that after the existing camera enhances the light, the chip and the film become bright at the same time, making it impossible to identify the chip.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] A chip identification and positioning device, comprising:

[0007] The box body is provided with a camera module;

[0008] An adsorption plate is provided inside the box body, a mounting groove is provided on the top of the adsorption plate, a film is provided in the mounting groove, and the bottom of the mounting groove is connected to the vacuum adsorption device;

[0009] A plurality of supporting protrusions are provided in the mounting groove, wherein the top of any of the supporting protrusions contacts the bottom of the adhesive film, and under the action of a vacuum adsorption device, the portion of the adhesive film not in contact with the supporting protrusion is recessed toward the bottom wall of the mounting groove;

[0010] The adhesive film is a dark-colored adhesive film.

[0011] Optionally, the adhesive film is a black adhesive film.

[0012] Optionally, a frosted layer is provided on the top wall of the adhesive film to cause diffuse reflection of the light signal.

[0013] Optionally, a matte layer is provided on the top wall of the adhesive film to scatter the light signal.

[0014] Optionally, the top wall of the adhesive film is provided with a diagonal layer or a patterned layer.

[0015] Optionally, the light transmittance of the adhesive film is less than or equal to 20%.

[0016] Optionally, the thickness of the adhesive film is greater than or equal to 25 μm and less than or equal to 50 μm.

[0017] Optionally, any of the supporting protrusions is a dark supporting protrusion.

[0018] Optionally, any of the supporting protrusions is a black supporting grid.

[0019] Optionally, the distance between the camera module and the film is greater than or equal to 10 cm and less than or equal to 45 cm.

[0020] The chip identification and positioning device provided in the embodiment of the present application includes: a box body, which is equipped with a camera module; an adsorption plate, which is arranged inside the box body, and the top of the adsorption plate is provided with a mounting groove, and the mounting groove is provided with a film, and the bottom of the mounting groove is connected to a vacuum adsorption device; a plurality of supporting protrusions are provided in the mounting groove, and the top of any supporting protrusion contacts the bottom of the film, and under the action of the vacuum adsorption device, the part of the film that is not in contact with the supporting protrusion is recessed toward the bottom wall of the mounting groove; the film is a dark film.

[0021] Compared with the prior art, the chip identification and positioning device provided in the embodiments of the present application has the following technical effects:

[0022] A camera module for illuminating and positioning the chip is provided in the box body. The adsorption plate is located in the box body and has a mounting groove for mounting the adhesive film. The bottom of the mounting groove is connected to the vacuum adsorption device. The top of the supporting protrusion contacts the bottom of the adhesive film. When the gas between the mounting groove and the adhesive film is discharged under the action of the vacuum adsorption device, the supporting protrusion supports the adhesive film, causing the part of the adhesive film not in contact with the supporting protrusion to be concave toward the bottom wall of the mounting groove, thereby reducing the contact area between the top of the adhesive film and the chip, making it easier to pick up the chip.

[0023] At the same time, the film is a dark film. Under the illumination of the camera module, the film can form an obvious color difference with the chip, which is convenient for positioning the chip and solves the problem that the camera module cannot recognize low-reflectivity chips or the positioning is offset. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0025] Figure 1 A schematic structural diagram of a chip identification and positioning device provided in an embodiment of the present application.

[0026] The following are marked in the accompanying drawings:

[0027] Box body 1, camera module 2, adsorption plate 3, adhesive film 4, supporting protrusion 5, chip 6;

[0028] Mounting groove 31 and vent hole 32. DETAILED DESCRIPTION

[0029] The embodiment of the utility model discloses a chip identification and positioning device to solve the problem that the chip and the film become brighter at the same time after the light of the existing camera is enhanced, thereby failing to identify the chip.

[0030] In order to make the technical solutions and advantages of the embodiments of the present application more clearly understood, the exemplary embodiments of the present application are further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, and are not an exhaustive list of all the embodiments. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other unless they conflict.

[0031] See also Figure 1 , Figure 1 A schematic structural diagram of a chip identification and positioning device provided in an embodiment of the present application.

[0032] In a specific embodiment, the chip box provided by the present application includes a box body 1, an adsorption disk 3, and a plurality of supporting protrusions 5; wherein the box body 1 is provided with a camera module 2, which can be specifically configured as a device with a camera function such as a camera. The camera module 2 is preferably arranged at the top of the box body 1 to illuminate the film 4 and the chip 6 on the adsorption disk 3 from above. The box body 1 is provided with an adsorption disk 3, and the top of the adsorption disk 3 has a mounting groove 31, specifically, the top wall of the adsorption disk 3 is recessed downward to a preset depth to form the mounting groove 31; the mounting groove 31 is provided with an adhesive film 4, preferably, the circumferential edge of the groove wall of the mounting groove 31 is provided with a snap groove, and the circumferential edge of the adhesive film 4 is snapped into the snap groove and adhesively fixed, thereby achieving the installation and fixation of the adhesive film 4 and the adsorption disk 3; and an air duct is formed between the adhesive film 4 and the bottom wall of the mounting groove 31. Accordingly, the bottom of the mounting groove 31 is provided with a vent hole 32 connected to the air duct. The vent hole 32 is connected to the vacuum adsorption device, and the gas in the air duct is discharged under the action of the vacuum adsorption device. Specifically, a plurality of supporting protrusions 5 are provided in the mounting groove 31. The supporting protrusions 5 can be set as raised columns or other raised structures to support the adhesive film 4. The supporting protrusions 5 are evenly arranged in the mounting groove, such as a dot matrix arrangement or a radial arrangement, so that the adhesive film 4 can be evenly recessed toward the bottom wall of the mounting groove 31 under the action of the vacuum adsorption equipment, while ensuring uniform adhesion between the upper adhesive film 4 and the chip 6. In order to support the film 4, the top of any supporting protrusion 5 contacts the bottom of the film 4, and the gas between the mounting groove 31 and the film 4 is discharged under the action of the vacuum adsorption equipment, so that the part of the film 4 that is not in contact with the supporting protrusion 5 is recessed toward the bottom wall of the mounting groove 31. When in use, the chip 6 is placed on the film 4, and the film 4 itself is adhesively fixed to the chip 6, and several supporting protrusions 5 form multi-point contact with the film 4; when taking out the chip 6, the vacuum adsorption equipment is used to extract air from the vent 32. As the gas in the vent is discharged, the film 4 that is not in contact with the supporting protrusion 5 is recessed toward the bottom wall of the mounting groove 31 under the action of atmospheric pressure, reducing the contact area between the film 4 and the bottom of the chip 6, reducing the adhesion of the film 4 to the chip 6, and facilitating the removal of the chip 6.

[0033] To better identify and locate chip 6, the film 4 is a dark color. Dark colors are colors with low color purity, such as black, dark blue, brown, or dark green. Under the illumination of camera module 2, the dark film 4 appears dark or black on the camera, while the chip 6 appears white under the camera's illumination. This creates a distinct color difference, facilitating the positioning of chip 6 and improving the accuracy of chip 6 positioning. Furthermore, all supporting protrusions 5 are dark in color to further enhance the color difference, preventing the chip 6 and background objects from simultaneously brightening and whitening under camera illumination. This facilitates the positioning and identification of chip 6 and further improves the camera's recognition accuracy for low-reflectivity chips 6.

[0034] In one embodiment, the film 4 is black and has a strong light-absorbing property. Light signals are absorbed upon reaching the film 4, reducing reflection of the light signal. This increases the color difference and contrast between the film 4 and the chip 6 when illuminated by the camera, facilitating positioning and identification of the chip 6 under camera illumination, further improving identification accuracy. Specifically, additional blackening treatment can be performed using black paint or other special processes, and can be configured accordingly based on the state of the art, all of which are within the scope of protection of this application.

[0035] Preferably, any supporting protrusion 5 is black; black supporting protrusions 5 have strong light absorption properties. Light signals reaching these protrusions are also absorbed, further reducing light signal reflection and increasing the color difference between the light signal and the chip 6. In the above embodiment, the adhesive film 4 and supporting protrusions 5 are both black. When light signals reach the adsorption plate 3, they are absorbed by the black adhesive film 4 and supporting protrusions 5, respectively, further reducing light signal reflection under camera illumination and further improving recognition accuracy.

[0036] Furthermore, the top wall of the film 4 is provided with a frosted layer, which makes the top wall of the film 4 rough. The frosted layer causes light to be irradiated thereon to form a diffuse reflection, further reducing the reflection of the light signal. Optionally, the top wall of the film 4 is provided with a twill layer or a patterned layer, which also serves to make the top wall of the film 4 rough, so that when light is irradiated thereon, diffuse reflection is formed, reducing the reflection of the light signal and preventing interference with the recognition of the chip 6. Preferably, the depth of the frosted layer is 15-30 μm, and the frosted particles are 100-120 mesh. It can be understood that the lower the glossiness of the surface of an object, the weaker the mirror reflection ability of the surface of the object to the light signal. At a measurement angle of 60°, its glossiness is less than or equal to 180GU.

[0037] Based on the above embodiments, the transmittance of the film 4 is less than or equal to 20%. Based on the fact that the film 4 is a dark film 4, the top wall of the film 4 is a frosted layer and has a transmittance less than or equal to 20%, thereby further reducing light signal reflection and improving the recognition accuracy of the chip 6.

[0038] Based on the above embodiments, the thickness of the adhesive film 4 is greater than or equal to 25 μm and less than or equal to 50 μm. In one embodiment, the thickness of the adhesive film 4 is preferably 50 μm. The thickness of the adhesive film 4 can be set based on the material properties of the adhesive film 4 itself and the spacing and arrangement of the supporting protrusions 5. The thickness should be such that the adhesive film 4 not in contact with the supporting protrusions 5 can be recessed toward the bottom side of the mounting groove 31 under the action of the vacuum adsorption device. Based on the above, the thickness of the adhesive film 4 is increased as much as possible to further reduce reflection of the optical signal and reduce light transmittance.

[0039] On the basis of the above embodiments, the distance between the camera module and the film 4 is greater than or equal to 10 cm and less than or equal to 45 cm. In an optional embodiment, the distance between the camera module and the film 4 is 10 cm, 30 cm, 40 cm or 45 cm. By adjusting the distance between the camera module and the film, the degree of reflection or absorption of the semiconductor chip when light is irradiated on the semiconductor chip is adjusted, thereby reducing the reflection of the light signal and improving the recognition accuracy. Specifically, the smaller the distance between the camera module and the film, the higher the degree of light absorption by the semiconductor chip and the lower the reflectivity of the light signal.

[0040] As for the structure of the supporting protrusion 5, it can be set as a number of raised columns fixed in the mounting groove 31, or set as a supporting grid, the supporting grid includes a number of support lines staggered horizontally and vertically, and the supporting grid can be set as a nylon supporting grid, and a nylon supporting grid with a suitable mesh size is selected according to the size of the chip 6; the nylon supporting grid is easy to set up and has a regular shape, so that the upper film 4 can be evenly concave downward, and a uniform pore is formed between the film 4 and the chip 6, ensuring the uniformity of the adhesion between the chip 6 and the film 4. At the same time, the nylon supporting grid is low in cost, which reduces the production cost of the chip 6.

[0041] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0042] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A chip identification and positioning device, characterized in that: include: The box body is provided with a camera module; An adsorption plate is provided inside the box body, a mounting groove is provided on the top of the adsorption plate, a film is provided in the mounting groove, and the bottom of the mounting groove is connected to the vacuum adsorption device; A plurality of supporting protrusions are provided in the mounting groove, wherein the top of any of the supporting protrusions contacts the bottom of the adhesive film, and under the action of a vacuum adsorption device, the portion of the adhesive film not in contact with the supporting protrusion is recessed toward the bottom wall of the mounting groove; The adhesive film is a dark-colored adhesive film.

2. The chip identification and positioning device according to claim 1, characterized in that: The adhesive film is a black adhesive film.

3. The chip identification and positioning device according to claim 1, characterized in that: The top wall of the adhesive film is provided with a frosted layer to cause diffuse reflection of the light signal.

4. The chip identification and positioning device according to claim 1, characterized in that: The top wall of the adhesive film is provided with a matte layer to scatter the light signal.

5. The chip identification and positioning device according to claim 1, characterized in that: The top wall of the adhesive film is provided with a diagonal layer or a patterned layer.

6. The chip identification and positioning device according to any one of claims 1 to 5, characterized in that: The light transmittance of the adhesive film is less than or equal to 20%.

7. The chip identification and positioning device according to any one of claims 1 to 5, characterized in that: The thickness of the adhesive film is greater than or equal to 25 μm and less than or equal to 50 μm.

8. The chip identification and positioning device according to any one of claims 1 to 5, characterized in that: Any of the supporting protrusions is a dark supporting protrusion.

9. The chip identification and positioning device according to claim 8, characterized in that: Any of the supporting protrusions is a black supporting grid.

10. The chip identification and positioning device according to any one of claims 1 to 5, characterized in that: The distance between the camera module and the film is greater than or equal to 10 cm and less than or equal to 45 cm.

Images