Inverter mainboard heat dissipation structure and inverter
By using copper sheets as the heat-conducting and heat-dissipating body and conductive circuit in the inverter, designing a T-shaped structure and optimizing the fan layout, the production inconvenience and space occupation problems of the existing inverter heat dissipation structure are solved, and the effects of efficient heat conduction and space saving are achieved.
Patent Information
- Application Number
- CN202422385780.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-09-29
AI Technical Summary
The existing inverter heat dissipation structure cannot be processed arbitrarily during production, and occupies a large circuit board space, resulting in low heat conduction efficiency.
Copper sheets are used as the main body of heat conduction and heat dissipation. The copper sheets are welded to the circuit board pads, serving as both heat dissipation and conductive circuits. They are designed as T-shaped structures to save space, and cooling fans are used to optimize air circulation.
It improves thermal conductivity, saves insulation materials, reduces circuit board space occupation, and enhances current carrying capacity.
Smart Images
Figure CN223348561U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an inverter mainboard heat dissipation structure and an inverter. Background Art
[0002] An inverter is a power electronic device that converts direct current (DC) into alternating current (AC). It is widely used in solar and wind power generation, as well as in electric vehicles. Its main functions include converting the DC power generated by solar panels into AC power that can be directly used by household and industrial equipment. The inverter can adjust the output voltage to suit the requirements of the equipment being used. High-quality inverters provide stable, sinusoidal current, minimizing damage to electrical appliances and improving their efficiency. Many modern inverters are equipped with monitoring systems that provide real-time monitoring of parameters such as power generation efficiency, current, and voltage.
[0003] There are many types of inverters, including photovoltaic inverters, vehicle inverters, and centralized and distributed inverters for power systems.
[0004] In the prior art, inverters typically use aluminum heat sinks, which are generally made of stretched aluminum profiles that are cut and then drilled. These heat sinks cannot be processed arbitrarily during production and require a large amount of circuit board space. Utility Model Content
[0005] The technical problem to be solved by the present invention is to overcome the defects of the inverter heat dissipation structure in the prior art that it cannot be arbitrarily processed and adjusted during production and requires a large circuit board space, and to provide an inverter mainboard heat dissipation structure and inverter that provide a larger air contact area, are easy to produce and have improved thermal conductivity.
[0006] The utility model solves the above technical problems through the following technical solutions:
[0007] An inverter mainboard heat dissipation structure is used for an inverter. The inverter includes an inverter mainboard, two semiconductor device modules and a transformer. The inverter mainboard heat dissipation structure includes a plurality of heat sinks and a plurality of heat dissipation fans.
[0008] The semiconductor devices in the first semiconductor device module are evenly distributed on the first heat sink, the first heat sink is installed in parallel on one end of the inverter mainboard, and the first cooling fan is installed on one side of the inverter mainboard and the blowing direction is parallel to the plane where the first heat sink and the inverter mainboard are located;
[0009] The semiconductor devices in the second semiconductor device module are evenly distributed on the second heat sink, and the second heat sink is installed in parallel on the other end of the inverter mainboard. The second cooling fan is installed on the other side of the inverter mainboard and the blowing direction is parallel to the plane where the first heat sink and the inverter mainboard are located. The second heat sink is perpendicular to the first heat sink.
[0010] Preferably, the transformer is provided between two semiconductor device modules.
[0011] Preferably, the number of the heat sink copper plates is 4, and the 4 heat sink copper plates are installed in parallel on one end of the inverter mainboard, with the two outer heat sink copper plates aligned and the two inner heat sink copper plates aligned, and each heat sink copper plate is provided with 3 or 4 semiconductor devices.
[0012] Preferably, a copper plate connecting bridge is connected between the two inner heat dissipation copper plates, and three capacitor components are provided between the two inner heat dissipation copper plates.
[0013] Preferably, the semiconductor device in the low-voltage region is an IGBT tube, and the semiconductor device in the high-voltage region is a MOS tube.
[0014] Preferably, the second heat sink is an aluminum alloy heat sink, and two third heat sinks are provided on the top of the two second heat sinks. The blowing direction of the third heat sink is perpendicular to the plane where the inverter mainboard is located.
[0015] Preferably, the second heat sink is an aluminum alloy heat sink, and a third heat sink fan is provided on one side of the two second heat sinks. The blowing direction of the third heat sink fan is parallel to the plane where the inverter mainboard is located.
[0016] Preferably, the third cooling fan is arranged on a side close to an edge of the inverter mainboard.
[0017] Preferably, the number of the second cooling fans is two, the blowing direction of the first cooling fan is from the outside to the inside of the inverter mainboard, and the blowing direction of the second cooling fan is from the inside to the outside of the inverter mainboard.
[0018] The utility model also provides an inverter, which is characterized in that the inverter includes the inverter mainboard heat dissipation structure as described above.
[0019] On the basis of conforming to the common sense in this field, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present utility model.
[0020] The positive progress effect of this utility model is:
[0021] The copper sheet is welded to the pads on the circuit board and acts as a heat sink for the IGBT and circuit board, while also being part of the electrical system. The thicker the copper sheet is, the greater its current carrying capacity is compared to the copper foil on the circuit board.
[0022] This structure differs from traditional aluminum heat sinks, which are typically cut from extruded aluminum and then drilled. This advantage is that it provides a larger air contact area. However, aluminum's thermal conductivity is inferior to copper, its shape cannot be freely processed, and it requires a larger amount of circuit board space.
[0023] After the copper sheet is used for both heat dissipation and conductive circuit, the insulation requirements of the original aluminum heat dissipation strip structure can be omitted, a large number of insulating thermal conductive silicone pads and screw insulating pads are saved, and the thermal conductivity efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 This is a structural schematic diagram of the heat dissipation structure of the inverter mainboard in Example 1 of the present utility model.
[0025] Figure 2 This is a schematic diagram of the effect of the heat dissipation structure of the inverter mainboard in Example 1 of the present utility model. DETAILED DESCRIPTION
[0026] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.
[0027] Example 1
[0028] In this embodiment, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like, indicating positions or locations, are based on the positions or locations shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0029] See also Figures 1 to 2 This embodiment provides an inverter mainboard heat dissipation structure for a high-power inverter. The inverter includes an inverter mainboard 11, two semiconductor device modules 12, and a transformer 13.
[0030] The inverter mainboard heat dissipation structure includes a plurality of heat sinks and a plurality of heat dissipation fans.
[0031] The semiconductor devices 121 in the first semiconductor device module are evenly distributed on the first heat sink.
[0032] The first heat sink 14 is installed parallel to one end of the inverter mainboard, and the first cooling fan 16 is installed on one side of the inverter mainboard and the blowing direction is parallel to the plane where the first heat sink and the inverter mainboard are located;
[0033] The semiconductor devices 121 in the second semiconductor device module are evenly distributed on the second heat sink. The second heat sink 15 is installed in parallel on the other end of the inverter mainboard. The second cooling fan 17 is installed on the other side of the inverter mainboard and the blowing direction is parallel to the plane where the first heat sink and the inverter mainboard are located.
[0034] The second heat sink is perpendicular to the first heat sink.
[0035] The first heat sink and the second heat sink are in T shape, which not only allows air to circulate, but also Figure 2 The direction of the red arrow can also save the use space of the inverter mainboard.
[0036] The transformer 13 is disposed between two semiconductor device modules.
[0037] The number of the heat dissipation copper sheets is 4, and the 4 heat dissipation copper sheets are installed in parallel on one end of the inverter mainboard.
[0038] The two outer heat dissipation copper plates are aligned, and the two inner heat dissipation copper plates are aligned. Each heat dissipation copper plate is provided with 3 or 4 semiconductor devices, and in this embodiment, there are 4 semiconductor devices.
[0039] A copper plate connecting bridge 18 is connected between the two inner heat dissipation copper plates, and three capacitor components 19 are provided between the two inner heat dissipation copper plates.
[0040] The semiconductor device in the low-voltage area is an IGBT tube, and the semiconductor device in the high-voltage area is a MOS tube.
[0041] The second heat sink is an aluminum alloy heat sink. Two third heat sink fans 20 are provided on the top of the two second heat sinks. The blowing direction of the third heat sink fans 20 is perpendicular to the plane where the inverter mainboard is located.
[0042] The number of the second cooling fans is two. The blowing direction of the first cooling fan is from the outside to the inside of the inverter mainboard, and the blowing direction of the second cooling fan is from the inside to the outside of the inverter mainboard.
[0043] Example 2
[0044] This embodiment is basically the same as the first embodiment, except that:
[0045] The second heat sink is an aluminum alloy heat sink. A third heat sink fan is provided on one side of the two second heat sinks. The blowing direction of the third heat sink fan is parallel to the plane where the inverter mainboard is located.
[0046] The third cooling fan is arranged on a side close to the edge of the inverter mainboard.
[0047] Although specific embodiments of the present invention have been described above, those skilled in the art will appreciate that these are merely illustrative and that the scope of protection of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, and such changes and modifications are intended to fall within the scope of protection of the present invention.
Claims
1. An inverter mainboard heat dissipation structure for an inverter, wherein the inverter comprises an inverter mainboard, two semiconductor device modules and a transformer, characterized in that: The inverter mainboard heat dissipation structure includes a plurality of heat sinks and a plurality of heat dissipation fans. The semiconductor devices in the first semiconductor device module are evenly distributed on the first heat sink, the first heat sink is installed in parallel on one end of the inverter mainboard, and the first cooling fan is installed on one side of the inverter mainboard and the blowing direction is parallel to the plane where the first heat sink and the inverter mainboard are located; The semiconductor devices in the second semiconductor device module are evenly distributed on the second heat sink, and the second heat sink is installed in parallel on the other end of the inverter mainboard. The second cooling fan is installed on the other side of the inverter mainboard and the blowing direction is parallel to the plane where the first heat sink and the inverter mainboard are located. The second heat sink is perpendicular to the first heat sink.
2. The inverter mainboard heat dissipation structure according to claim 1, characterized in that: The transformer is arranged between two semiconductor device modules.
3. The inverter mainboard heat dissipation structure according to claim 2, wherein: There are four heat sinks, which are installed in parallel on one end of the inverter mainboard. The two outer heat sinks are aligned, and the two inner heat sinks are aligned. Each heat sink is provided with three or four semiconductor devices.
4. The inverter mainboard heat dissipation structure according to claim 3, wherein: A copper plate connecting bridge is connected between the two inner heat dissipation copper plates, and three capacitor components are arranged between the two inner heat dissipation copper plates.
5. The inverter mainboard heat dissipation structure according to claim 3, characterized in that: The semiconductor device in the low-voltage area is an IGBT tube, and the semiconductor device in the high-voltage area is a MOS tube.
6. The inverter mainboard heat dissipation structure according to claim 1, wherein: The second heat sink is an aluminum alloy heat sink. Two third heat sink fans are provided on the top of the two second heat sinks. The blowing direction of the third heat sink is perpendicular to the plane where the inverter mainboard is located.
7. The inverter mainboard heat dissipation structure according to claim 1, wherein: The second heat sink is an aluminum alloy heat sink. A third heat sink fan is provided on one side of the two second heat sinks. The blowing direction of the third heat sink fan is parallel to the plane where the inverter mainboard is located.
8. The inverter mainboard heat dissipation structure according to claim 7, characterized in that: The third cooling fan is arranged on a side close to the edge of the inverter mainboard.
9. The inverter mainboard heat dissipation structure according to claim 1, wherein: The number of the second cooling fans is two. The blowing direction of the first cooling fan is from the outside to the inside of the inverter mainboard, and the blowing direction of the second cooling fan is from the inside to the outside of the inverter mainboard.
10. An inverter, characterized in that: The inverter includes the inverter mainboard heat dissipation structure according to any one of claims 1 to 9.