Dual-chip communication circuit capable of improving EMI radiation function

Abstract

The utility model particularly relates to a dual-chip communication circuit for improving an EMI radiation function, which comprises a first communication module U1, a second communication module U2 and a control panel, and is characterized in that a common end between the first communication module U1 and a first joint CN1 is connected with a first resistor R1, a second resistor R2, a first capacitor C1 and a second capacitor C2; and a common end between the second communication module U2 and the second connector CN2 is connected with a sixth resistor R6, a fifth resistor R5, a fourth capacitor C4 and a fifth capacitor C5. According to the circuit, a combination of a first resistor R1, a second resistor R2, a first capacitor C1 and a second capacitor C2 is additionally arranged on the first communication module U1, a combination of a fifth resistor R5, a sixth resistor R6, a fourth capacitor C4 and a fifth capacitor C5 is additionally arranged on the second communication module U2, the level pull-up and level pull-down principles are implemented, and radiation interference can be improved.

Description

Technical Field

[0001] The utility model specifically relates to a dual-chip communication circuit for improving EMI radiation function. Background Art

[0002] With the rapid development of intelligent control technology, certification test requirements have become more comprehensive. EMI radiation test items are required for some products that need to be exported, and lithium battery product certification has become increasingly important.

[0003] However, some products are usually designed with two panels to meet the product design requirements due to factors such as beautiful and simple structural appearance, space size, and functional expansion.

[0004] When a single chip cannot meet the requirements of two board designs, dual-chip communication control is often used to optimize cost and design layout. However, for some products requiring EMI radiation testing, dual-chip communication often presents challenges. Therefore, a stable and simple solution for optimizing and improving EMI radiation testing was developed. Summary of the Invention

[0005] This utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of this utility model is to provide a dual-chip communication circuit with improved EMI radiation performance. This circuit significantly reduces radiated interference and reduces the need for magnetic rings to reduce radiated interference. The circuit is suitable for various dual-chip communication home appliances, is low-cost, and has a simple circuit configuration.

[0006] According to the utility model, a dual-chip communication circuit for improving EMI radiation function includes a first communication module U1, a second communication module U2 and a control board. The first communication module U1 is provided with a first connector CN1, and the second communication module U2 is provided with a second connector CN2. The first connector CN1 is connected to a first antenna, and the second connector CN2 is connected to a second antenna. The first communication module U1 and the second communication module U2 are respectively connected to the control board. The common end between pin 6 of the first communication module U1 and pin 3 of the first connector CN1 is connected to a first resistor R1. The first resistor R1 is also connected to a second resistor R2. The common end between the first resistor R1 and the second resistor R2 is connected to a power supply end. The common end between pin 5 of the first communication module U1 and pin 4 of the first connector CN1 is connected to the second resistor R2. The common end between pin 3 of the first connector CN1 and the first resistor R1 is also connected to a first capacitor C1. The first capacitor C1 is connected to a second capacitor C2. The common end between the first capacitor C1 and the second capacitor C2 is connected to a ground terminal GND. The other end of the second capacitor C2 is connected to the common end between the second resistor R2 and pin 4 of the first connector CN1.

[0007] The common end between the second communication module U2 and pin 3 of the second connector CN2 is connected to the fifth resistor R5, which is also connected to the sixth resistor R6. The common end between the fifth resistor R5 and the sixth resistor R6 is connected to the power supply end. The common end between pin 8 of the second communication module U2 and pin 3 of the second connector CN2 is connected to the sixth resistor R6. The common end between pin 3 of the second connector CN2 and the fifth resistor R5 is also connected to the fourth capacitor C4. The fourth capacitor C4 is connected to the fifth capacitor C5. The common end between the fifth capacitor C5 and the fourth capacitor C4 is connected to the ground end GND. The other end of the second capacitor C2 is connected to the common end between the sixth resistor R6 and pin 4 of the second connector CN2.

[0008] Specifically, a third resistor R3 is connected between pin 6 of the first communication module U1 and pin 3 of the first connector CN1.

[0009] Specifically, a fourth resistor R4 is connected between pin 5 of the first communication module U1 and pin 4 of the first connector CN1.

[0010] Specifically, a third capacitor C3 and a first electrolytic capacitor EC1 are connected in parallel between pins 1 and 3 of the first communication module U1 , and common ends of the third capacitor C3 and the first electrolytic capacitor EC1 are connected to a power supply end.

[0011] Specifically, a seventh resistor R7 is further connected between pin 8 of the second communication module U2 and pin 3 of the second connector CN2.

[0012] Specifically, an eighth resistor R8 is further connected between pin 7 of the second communication module U2 and pin 4 of the second connector CN2.

[0013] Specifically, a sixth capacitor C6 and a second electrolytic capacitor EC2 are connected in parallel between pins 1 and 3 of the second communication module U2 , and common ends of the sixth capacitor C6 and the second electrolytic capacitor EC1 are connected to a power supply end.

[0014] Specifically, the model of the first communication module U1 is SC92F8411M.

[0015] Specifically, the model of the second communication module U2 is SC92F7413M28U.

[0016] The beneficial effects of the present invention are as follows: the present circuit adds a first resistor R1, a second resistor R2, a first capacitor C1 and a second capacitor C2 combination to the input end of the first communication module U1, and cooperates with the second communication module U2 to add a fifth resistor R5, a sixth resistor R6, a fourth capacitor C4 and a fifth capacitor C5 combination, and simultaneously implements the level pull-up and level pull-down principles, which can greatly improve radiation interference and reduce the use of magnetic ring methods to reduce radiation interference. The present circuit is suitable for various dual-chip communication home appliances, is low-cost, simple and efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings.

[0018] Figure 1 This is a circuit diagram of the first communication module U1 of the present invention.

[0019] Figure 2 It is a circuit diagram of the second communication module U2 of the present invention.

[0020] Figure 3 It is a schematic diagram of the connection between the first communication module U1, the second communication module U2 and the control board. DETAILED DESCRIPTION

[0021] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0022] Reference below Figures 1 to 3A dual-chip communication circuit for improving EMI radiation function according to an embodiment of the present invention is described, including a first communication module U1, a second communication module U2, and a control board. The first communication module U1 is provided with a first connector CN1, and the second communication module U2 is provided with a second connector CN2. The first connector CN1 is connected to a first antenna, and the second connector CN2 is connected to a second antenna. The first communication module U1 and the second communication module U2 are respectively connected to the control board. The common end between pin 6 of the first communication module U1 and pin 3 of the first connector CN1 is connected to a first resistor R1. The first resistor R 1 is also connected to a second resistor R2. The common end between the first resistor R1 and the second resistor R2 is connected to the power supply end. The common end between pin 5 of the first communication module U1 and pin 4 of the first connector CN1 is connected to the second resistor R2. The common end between pin 3 of the first connector CN1 and the first resistor R1 is also connected to a first capacitor C1. The first capacitor C1 is connected to a second capacitor C2. The common end between the first capacitor C1 and the second capacitor C2 is connected to the ground terminal GND. The other end of the second capacitor C2 is connected to the common end between the second resistor R2 and pin 4 of the first connector CN1.

[0023] The common end between the second communication module U2 and pin 3 of the second connector CN2 is connected to the fifth resistor R5, which is also connected to the sixth resistor R6. The common end between the fifth resistor R5 and the sixth resistor R6 is connected to the power supply end. The common end between pin 8 of the second communication module U2 and pin 3 of the second connector CN2 is connected to the sixth resistor R6. The common end between pin 3 of the second connector CN2 and the fifth resistor R5 is also connected to the fourth capacitor C4. The fourth capacitor C4 is connected to the fifth capacitor C5. The common end between the fifth capacitor C5 and the fourth capacitor C4 is connected to the ground end GND. The other end of the second capacitor C2 is connected to the common end between the sixth resistor R6 and pin 4 of the second connector CN2.

[0024] This circuit adds a first resistor R1, a second resistor R2, a first capacitor C1, and a second capacitor C2 to the input end of the first communication module U1, and cooperates with the second communication module U2 to add a fifth resistor R5, a sixth resistor R6, a fourth capacitor C4, and a fifth capacitor C5. The circuit simultaneously implements the principles of level pull-up and level pull-down, which can greatly improve radiation interference and reduce the need for magnetic ring methods to reduce radiation interference. It is suitable for various dual-chip communication home appliances and is low-cost, simple, and efficient.

[0025] Traditional dual-chip communication lacks pull-up and pull-down circuitry, resulting in radiation exceeding -3.5dB in the 32Hz and 160Hz frequency bands. This circuit's communication lines utilize a pull-up and pull-down design (i.e., the principle of level pull-up and level pull-down) to effectively reduce radiation interference. The first, second, fourth, and fifth capacitors C1, C2, C4, and C5 in this circuit use 100pF pull-down capacitors, while the first, second, fifth, and sixth resistors R1, R2, R5, and R6 use 47k pull-up resistors. Actual radiation test results show a margin of 3.25 dB at 32Hz and +3.71 dB at 160Hz, significantly improving radiation interference and eliminating the need for magnetic rings to reduce radiation interference. In addition, the power supply end of this circuit is 5V. In this circuit, the resistance values ​​of the first resistor R1, the second resistor 2, the fifth resistor R5 and the sixth resistor R6 can be adjusted, which is not limited to this embodiment; in addition, the capacitance values ​​of the first capacitor C1, the second capacitor C2, the fourth capacitor C4 and the fifth capacitor C5 can be adjusted, which is not limited to this embodiment.

[0026] A third resistor R3 is connected between pin 6 of the first communication module U1 and pin 3 of the first connector CN1. A fourth resistor R4 is connected between pin 5 of the first communication module U1 and pin 4 of the first connector CN1. A third capacitor C3 and a first electrolytic capacitor EC1 are connected in parallel between pins 1 and 3 of the first communication module U1. The common terminals of the third capacitor C3 and the first electrolytic capacitor EC1 are connected to a power supply. A seventh resistor R7 is also connected between pin 8 of the second communication module U2 and pin 3 of the second connector CN2. An eighth resistor R8 is also connected between pin 7 of the second communication module U2 and pin 4 of the second connector CN2. The resistance of the third resistor R3, fourth resistor R4, seventh resistor R7, and eighth resistor R8 is 100 ohms. The third resistor R3, fourth resistor R4, seventh resistor R7, and eighth resistor R8 all function to limit voltage, protecting the first and second communication modules U1 and U2. The third capacitor C3 and first electrolytic capacitor EC1 function to stabilize voltage. Similarly, a sixth capacitor C6 and a second electrolytic capacitor EC2 are connected in parallel between pins 1 and 3 of the second communication module U2 in this circuit. The common terminals of the sixth capacitor C6 and the second electrolytic capacitor EC1 are connected to the power supply. The parallel connection of the sixth capacitor C6 and the second electrolytic capacitor EC1 provides stability. The model of the first communication module U1 in this circuit is SC92F8411M. The model of the second communication module U2 in this circuit is SC92F7413M28U.

[0027] During the implementation process, this circuit can adjust the parameters of the resistors and capacitors according to the specific application scenario to optimize the test optimization data. It is suitable for various dual-chip communication home appliances, has low cost, is simple and efficient, and improves versatility and flexibility. The control board of this circuit receives the information received by the first communication module U1 and the second communication module U2, and converts it into information recognized by the home appliance, and inputs it into the receiving information module on the home appliance. The transmitting information module on the home appliance can also implement the transmission of information through this circuit. The receiving information module and the transmitting information module are both conventional circuits, and the control board of this application is also a conventional circuit. The relevant circuits are not disclosed here, or other types of receiving information modules and transmitting information modules are specially designed according to the present circuit, so that the present circuit can communicate with each other. In addition, the control board is also provided with conventional sockets and serial ports, etc., which are convenient for connection with home appliances.

[0028] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A dual-chip communication circuit for improving EMI radiation performance, comprising a first communication module U1, a second communication module U2, and a control board. The first communication module U1 is provided with a first connector CN1, and the second communication module U2 is provided with a second connector CN2. The first connector CN1 is connected to a first antenna, and the second connector CN2 is connected to a second antenna. The first communication module U1 and the second communication module U2 are each connected to the control board. The circuit is characterized by: A first resistor R1 is connected to the common end between pin 6 of the first communication module U1 and pin 3 of the first connector CN1. The first resistor R1 is further connected to a second resistor R2. The common end between the first resistor R1 and the second resistor R2 is connected to a power supply. A common end between pin 5 of the first communication module U1 and pin 4 of the first connector CN1 is connected to the second resistor R2. A first capacitor C1 is further connected to the common end between pin 3 of the first connector CN1 and the first resistor R1. The first capacitor C1 is connected to a second capacitor C2. The common end between the first capacitor C1 and the second capacitor C2 is connected to a ground terminal GND. The other end of the second capacitor C2 is connected to the common end between the second resistor R2 and pin 4 of the first connector CN1. The common end between the second communication module U2 and pin 3 of the second connector CN2 is connected to the fifth resistor R5, which is also connected to the sixth resistor R6. The common end between the fifth resistor R5 and the sixth resistor R6 is connected to the power supply end. The common end between pin 8 of the second communication module U2 and pin 3 of the second connector CN2 is connected to the sixth resistor R6. The common end between pin 3 of the second connector CN2 and the fifth resistor R5 is also connected to the fourth capacitor C4. The fourth capacitor C4 is connected to the fifth capacitor C5. The common end between the fifth capacitor C5 and the fourth capacitor C4 is connected to the ground end GND. The other end of the second capacitor C2 is connected to the common end between the sixth resistor R6 and pin 4 of the second connector CN2.

2. The dual-chip communication circuit for improving EMI radiation according to claim 1, characterized in that: A third resistor R3 is connected between pin 6 of the first communication module U1 and pin 3 of the first connector CN1 .

3. The dual-chip communication circuit for improving EMI radiation according to claim 1, wherein: A fourth resistor R4 is connected between pin 5 of the first communication module U1 and pin 4 of the first connector CN1 .

4. The dual-chip communication circuit for improving EMI radiation according to claim 1, characterized in that: A third capacitor C3 and a first electrolytic capacitor EC1 are connected in parallel between pins 1 and 3 of the first communication module U1 , and common terminals of the third capacitor C3 and the first electrolytic capacitor EC1 are connected to a power supply terminal.

5. The dual-chip communication circuit for improving EMI radiation function according to claim 1, characterized in that: A seventh resistor R7 is further connected between pin 8 of the second communication module U2 and pin 3 of the second connector CN2.

6. The dual-chip communication circuit for improving EMI radiation according to claim 1, characterized in that: An eighth resistor R8 is further connected between pin 7 of the second communication module U2 and pin 4 of the second connector CN2.

7. The dual-chip communication circuit for improving EMI radiation according to claim 1, characterized in that: A sixth capacitor C6 and a second electrolytic capacitor EC2 are connected in parallel between pins 1 and 3 of the second communication module U2 , and common ends of the sixth capacitor C6 and the second electrolytic capacitor EC1 are connected to a power supply end.

8. The dual-chip communication circuit with improved EMI radiation function according to any one of claims 1 to 4, characterized in that: The model of the first communication module U1 is SC92F8411M.

9. The dual-chip communication circuit with improved EMI radiation function according to any one of claims 5 to 7, characterized in that: The model of the second communication module U2 is SC92F7413M28U.

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