Automatic punching production line for IGBT (Insulated Gate Bipolar Translator) module substrate

Abstract

The utility model discloses an IGBT module substrate automatic stamping production line which comprises a discharging mechanism, a feeding mechanism, a stamping mechanism and a material receiving mechanism, curled materials are placed in the discharging mechanism, the discharging mechanism can discharge the curled materials to the feeding mechanism in a horizontal state, the feeding mechanism can convey the materials to the stamping mechanism, and the stamping mechanism is connected with the material receiving mechanism. The stamping mechanism can stamp materials to form a module base plate, and the material receiving mechanism can take out the module base plate. According to the device, full automation of the stamping production module substrate can be achieved, the problem of plate pollution caused by manual contact with plates is solved, meanwhile, labor can be saved, the production efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of IGBT module substrate production devices, in particular to an IGBT module substrate automatic stamping production line. Background Art

[0002] The existing process for stamping IGBT module substrates requires sheet metal. This sheet metal must first be manually cut to the required length and width for the module substrate, then manually placed in a dedicated feeding device, which then feeds it sequentially into the stamping die for stamping. Manual handling involves an operator stacking the cut sheets one by one on a dedicated feeding device, which then semi-automatically feeds them into the stamping die for stamping. Another operator is required to pick up the stamped module substrates one by one after stamping. This method is time-consuming and labor-intensive, and is prone to missed items, resulting in irreversible cosmetic defects. Furthermore, hand sweat from contact with the sheet metal can cause oxidative contamination. Utility Model Content

[0003] In response to the defects in the existing technology, the utility model provides an automatic stamping production line for IGBT module substrates. This device can realize the full automation of stamping production of module substrates, solve the problem of sheet material contamination caused by manual contact with the sheet material, and at the same time save labor, improve production efficiency and reduce production costs.

[0004] An automatic stamping production line for IGBT module substrates comprises a discharge mechanism, a feeding mechanism, a stamping mechanism and a receiving mechanism. Curled material is placed in the discharge mechanism, and the discharge mechanism can discharge the curled material in a horizontal state to the feeding mechanism. The feeding mechanism can transport the material to the stamping mechanism, and the stamping mechanism can stamp the material into a module substrate. The receiving mechanism can take out the module substrate.

[0005] Preferably, a leveling mechanism is further included, and the leveling mechanism is located between the discharge mechanism and the feed mechanism, and the leveling mechanism can level the surface of the material.

[0006] Preferably, it further comprises a stacking mechanism, which can stack the module substrates taken out by the feeding mechanism.

[0007] Preferably, the discharge mechanism has a rotating drum, and the material is wound around the rotating drum.

[0008] Preferably, a flow box is further included, and the stacking mechanism is capable of placing the module substrate in the flow box.

[0009] The beneficial effects of the present invention are as follows: a discharge mechanism, a leveling mechanism, a feeding mechanism, a punching mechanism, a receiving mechanism and a stacking mechanism are provided in the present technical solution, and the original sheet material is replaced with a curled material, and the curled material is discharged from the leveling mechanism in a horizontal state through the discharge mechanism, and the leveling mechanism levels the surface of the material and then transmits it to the feeding mechanism, and the feeding mechanism conveys the material to the punching mechanism, and the punching mechanism punches the material to form a module substrate, and after the receiving mechanism takes out the module substrate, it is stacked by the stacking mechanism, thus forming a set of production lines, which solves the problems of heavy manual picking workload, missed picking and complicated sheet material processing procedures, realizes full automation of stamping production of module substrates, and solves the problem of sheet material contamination caused by manual contact with the sheet material. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly describes the drawings required for the specific embodiments or the description of the prior art. Similar elements or parts are generally identified by similar reference numerals throughout the drawings. Elements or parts in the drawings are not necessarily drawn to scale.

[0011] Figure 1 This is a schematic diagram of the location distribution of the utility model.

[0012] In the accompanying drawings, 1-discharging mechanism, 2-leveling mechanism, 3-feeding mechanism, 4-punching mechanism, 5-receiving mechanism, 6-palletizing mechanism. DETAILED DESCRIPTION

[0013] The following embodiments of the technical solution of the present invention are described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are therefore only examples and are not intended to limit the scope of protection of the present invention.

[0014] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by those skilled in the art to which this utility model belongs.

[0015] Example 1

[0016] like Figure 1 As shown, in this embodiment, an automatic stamping production line for an IGBT module substrate is provided, comprising a discharge mechanism 1, a feeding mechanism 3, a stamping mechanism 4 and a receiving mechanism 5. Curled materials are placed in the discharge mechanism 1, and the discharge mechanism 1 can discharge the curled materials in a horizontal state to the feeding mechanism 3, and the feeding mechanism 3 can transport the materials to the stamping mechanism 4, and the stamping mechanism 4 can stamp the materials to form a module substrate, and the receiving mechanism 5 can take out the module substrate.

[0017] This embodiment also includes a flattening mechanism 2, located between the unloading mechanism 1 and the feeding mechanism 3. The flattening mechanism 2 can flatten the surface of the material. Curled material will form wrinkles on the surface after being discharged in a horizontal state. Flattening the surface of the material by the flattening mechanism 2 can improve product quality.

[0018] This embodiment further includes a stacking mechanism 6 , which can stack the module substrates taken out by the feeding mechanism.

[0019] In this embodiment, the discharge mechanism 1 has a rotating drum, and the material is wound around the rotating drum.

[0020] This embodiment also includes a flow box, and the stacking mechanism 6 can place the module substrate in the flow box.

[0021] In this embodiment, a discharge mechanism 1, a leveling mechanism 2, a feeding mechanism 3, a punching mechanism 4, a receiving mechanism 5 and a stacking mechanism 6 are provided to replace the original sheet material with a curled material. The curled material is discharged from the leveling mechanism 2 in a horizontal state by the discharge mechanism 1. The leveling mechanism 2 levels the surface of the material and then transfers it to the feeding mechanism 3. The feeding mechanism 3 conveys the material to the punching mechanism 4. The punching mechanism 4 punches the material to form a module substrate. After the module substrate is taken out by the receiving mechanism 5, it is stacked by the stacking mechanism 6. In this way, a production line is formed, which solves the problems of large manual picking workload, missed picking and complicated sheet material processing procedures, realizes full automation of stamping production of module substrates, and solves the problem of sheet material contamination caused by manual contact with the sheet material.

[0022] This technical solution can quickly, accurately, and continuously feed the curled material into the punching mechanism 4, significantly shortening the feeding time compared to the existing technology and reducing the risk of contamination. The stacking mechanism 6 ensures that each module substrate is accurately placed into the transfer box. This technical solution saves labor, improves production efficiency, reduces costs, reduces errors, and is simple and convenient to use.

[0023] In this embodiment, the unloading mechanism 1, the leveling mechanism 2, the feeding mechanism 3, the punching mechanism 4, the receiving mechanism 5 and the stacking mechanism 6 are all existing ones. The improvement in this embodiment is an improvement to the entire production line and is not limited to the improvement of a certain mechanism.

[0024] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and description of the present invention.

Claims

1. An IGBT module substrate automatic stamping production line, characterized in that: The invention comprises a discharge mechanism (1), a feeding mechanism (3), a punching mechanism (4) and a receiving mechanism (5); the discharge mechanism (1) contains a curled material; the discharge mechanism (1) can discharge the curled material in a horizontal state to the feeding mechanism (3); the feeding mechanism (3) can transport the material to the punching mechanism (4); the punching mechanism (4) can punch the material to form a module substrate; and the receiving mechanism (5) can take out the module substrate.

2. The IGBT module substrate automatic stamping production line according to claim 1, characterized in that: It also includes a leveling mechanism (2), which is located between the discharge mechanism (1) and the feed mechanism (3), and can level the surface of the material.

3. The IGBT module substrate automatic stamping production line according to claim 1, characterized in that: It also includes a stacking mechanism (6), which is capable of stacking the module substrates taken out by the docking mechanism.

4. The IGBT module substrate automatic stamping production line according to claim 1, characterized in that: The material discharge mechanism (1) has a rotating drum inside, and the material is wound around the rotating drum.

5. The IGBT module substrate automatic stamping production line according to claim 3, characterized in that: It also includes a flow box, and the stacking mechanism (6) can place the module substrate in the flow box.

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