Novel high-overload-resistant double-differential torsion micro-accelerometer structure

Abstract

The utility model discloses a novel anti-high overload double differential torsion micro accelerometer structure, which relates to the technical field of micro accelerometers, and comprises an outer frame, the top side of the outer frame is fixedly connected with two zone plates, the top sides of the two zone plates are both provided with substrates, the middle part of the top side of each substrate is provided with a plurality of mass blocks, and the mass blocks are arranged in the middle of the top side of each substrate. Stress grooves are formed in the peripheries of the outer walls of the mass blocks, and supporting beams I are fixedly connected between the two mass blocks on the left side and the right side. The micro-accelerometer has the advantages that through arrangement of the release blocks and the release grooves, deformation of the supporting beams I and the supporting beams II can be reduced under the condition that the working state of the micro-accelerometer is not affected, and the stability of the micro-accelerometer is improved; the rigidity and the structural rigidity of the first supporting beam and the second supporting beam are improved, so that the micro-accelerometer can show more excellent stability and reliability in a high overload environment, and finally the overload resistance of the micro-accelerometer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of micro-accelerometers, in particular to a novel high-overload resistant double-differential torsional micro-accelerometer structure. Background Art

[0002] Micromachined accelerometers are one of the most successful devices in microelectromechanical systems (MEMS). They have broad application prospects in both military and civilian fields, and hold enormous social and economic benefits. Improving performance indicators is currently a research focus in the field of micromachined accelerometers. Resonant micromachined accelerometers measure acceleration by detecting changes in the resonant frequency of a mechanical resonator. They are characterized by good stability and high precision. Their outstanding advantage is that they directly output frequency signals, which are not easily distorted during transmission and can be easily interfaced with digital circuits.

[0003] With the marketization of MEMS silicon micro-accelerometers, the reliability requirements for silicon micro-accelerometer products are becoming increasingly higher, such as overload resistance and large range requirements. However, the current mature and mass-produced domestic MEMS silicon micro-accelerometers generally have low overload resistance and it is difficult to meet the sensing requirements of existing processes. To this end, we propose a new high-overload resistant dual-differential torsional micro-accelerometer structure. Utility Model Content

[0004] The purpose of the utility model is to provide a novel high overload resistant double differential torsional micro accelerometer structure.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a novel high-overload resistant dual-differential torsional micro-accelerometer structure, comprising an outer frame, two zone plates fixedly connected to the top side of the outer frame, a substrate provided on the top side of the two zone plates, a plurality of mass blocks provided in the middle of the top side of the substrate, stress grooves provided around the outer walls of the mass blocks, a support beam 1 fixedly connected between the two mass blocks on the left and right sides, a support beam 2 fixedly connected between the two mass blocks on the upper and lower sides, a release block fixedly connected at the intersection of the two support beams 1 and the two support beams 2, a plurality of release grooves provided inside the release block.

[0006] As a further solution of the present invention: a bonding block 1 is fixedly connected to the middle of the bottom side of the substrate, and bonding anchor points 1 are fixedly connected to the four corners of the bottom side of the bonding block 1.

[0007] As a further solution of the present invention: a second bonding block is fixedly connected to the middle portion of the top side of the outer frame, and two bonding anchor points are fixedly connected to the four corners of the top side of the second bonding block.

[0008] As a further solution of the present invention: the plurality of second bonding anchor points and the plurality of first bonding anchor points are arranged in a one-to-one correspondence.

[0009] As a further solution of the present invention: a plurality of capacitors are fixedly connected to the top side surfaces of the two zone plates.

[0010] As a further solution of the present invention: a pin 1 is fixedly connected to the middle portion of the right side of the bonding block 2.

[0011] As a further solution of the present invention: a pin 2 is fixedly connected to the middle of the right side of the two zone plates.

[0012] By adopting the above technical solution, compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. The present invention reduces the deformation of the first and second support beams without affecting the working state of the micro-accelerometer by providing a release block and a release groove, thereby improving the stiffness and structural rigidity of the first and second support beams. This enables the micro-accelerometer to exhibit greater stability and reliability in high overload environments, ultimately improving the micro-accelerometer's overload resistance.

[0014] 2. The utility model avoids the generation of direct bonding stress between the bonding anchor points and the support beams through the coordinated arrangement of multiple bonding anchor points 1 and multiple bonding anchor points 2, greatly reduces the wafer-level bonding stress, and plays a buffering role when the bonding plane deforms downward under high overload conditions, thereby improving the impact resistance of the micro accelerometer, effectively improving the overload resistance of the silicon micro accelerometer, and effectively ensuring the service life and long-term reliability of the product.

[0015] Other advantages, objectives and features of the present invention will be described in part in the following description and will be apparent to those skilled in the art based on an examination of the following or may be learned from the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is an overall schematic diagram of an embodiment of the present utility model;

[0017] Figure 2 for Figure 1 A magnified schematic diagram of point A in the middle;

[0018] Figure 3 This is a schematic diagram of the position of a bonding block in an embodiment of the present utility model;

[0019] Figure 4 This is a schematic diagram of the second bonding anchor point in an embodiment of the present utility model.

[0020] In the figure: 1. outer frame; 2. zone plate; 3. substrate; 4. mass block; 5. support beam 1; 6. support beam 2; 7. release block; 8. release slot; 9. bonding block 1; 10. bonding anchor point 1; 11. bonding block 2; 12. bonding anchor point 2; 13. pin 1; 14. pin 2; 15. capacitor. DETAILED DESCRIPTION

[0021] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention.

[0022] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0023] Please see the attached Figure 1 -Attached Figure 4 The utility model discloses a novel high-overload resistant dual-differential torsional micro-accelerometer structure, comprising an outer frame 1, two zone plates 2 are fixedly connected to the top side of the outer frame 1, substrates 3 are provided on the top sides of the two zone plates 2, a plurality of mass blocks 4 are provided in the middle of the top side of the substrate 3, stress grooves are provided around the outer walls of the mass blocks 4, support beam 1 5 is fixedly connected between the two mass blocks 4 on the left and right sides, support beam 2 6 is fixedly connected between the two mass blocks 4 on the upper and lower sides, a release block 7 is fixedly connected at the intersection of the two support beams 1 5 and the two support beams 2 6, and a plurality of release grooves 8 are provided inside the release block 7.

[0024] Specifically, by setting the release block 7 and the release slot 8, it is possible to reduce the deformation of support beam 1 5 and support beam 2 6 without affecting the working state of the micro-accelerometer, and improve the stiffness and structural rigidity of support beam 1 5 and support beam 2 6, so that the micro-accelerometer can exhibit better stability and reliability when facing a high overload environment.

[0025] In the first embodiment, a bonding block 9 is fixedly connected to the middle portion of the bottom side of the substrate 3, and bonding anchor points 10 are fixedly connected to the four corners of the bottom side of the bonding block 9. A bonding block 2 11 is fixedly connected to the middle portion of the top side of the outer frame 1, and bonding anchor points 2 12 are fixedly connected to the four corners of the top side of the bonding block 2 11. The multiple bonding anchor points 2 12 and the multiple bonding anchor points 10 are arranged in a one-to-one correspondence.

[0026] Specifically, through the coordination of multiple bonding anchor points 10 and multiple bonding anchor points 2 12, the bonding planes between bonding block 1 9, bonding block 2 11 and substrate 3 are configured in a suspended configuration. Since the bonding connection has the advantage of low stress, the direct bonding stress generation between the bonding anchor points and the support beams is avoided, and the wafer-level bonding stress is greatly reduced. Moreover, since each bonding plane is suspended, the downward deformation of the bonding plane under high overload conditions plays a buffering role, thereby improving the impact resistance of the micro accelerometer.

[0027] In the second embodiment, the top surfaces of the two zone plates 2 are fixedly connected with a plurality of capacitors 15, the middle portion of the right side of the second bonding block 11 is fixedly connected with a pin 13, and the middle portion of the right side of the two zone plates 2 is fixedly connected with a pin 2 14;

[0028] Specifically, through multiple evenly distributed capacitors 15 , it is possible to provide stable capacitor 15 performance to meet circuit design requirements, while ensuring effective connection with the external circuit through pin 1 13 and pin 2 14 .

[0029] Working principle:

[0030] During use, the bonding planes between the bonding block 1 9, the bonding block 2 11 and the substrate 3 are suspended by cooperating with multiple bonding anchor points 10 and multiple bonding anchor points 2 12. Since the bonding connection has the advantage of low stress, the generation of direct bonding stress between the bonding anchor points and the support beams is avoided, and the wafer-level bonding stress is greatly reduced. Moreover, since each bonding plane is suspended, the downward deformation of the bonding plane under high overload conditions plays a buffering role, thereby improving the impact resistance of the micro-accelerometer. At the same time, through the setting of the release block 7 and the release groove 8, it is possible to reduce the deformation of the support beam 1 5 and the support beam 2 6 without affecting the working state of the micro-accelerometer, and improve the stiffness and structural rigidity of the support beam 1 5 and the support beam 2 6, so that the micro-accelerometer can show better stability and reliability when facing a high overload environment. At this point, the entire workflow ends.

[0031] The above-mentioned front, back, left, right, up and down are all based on the Figure 1 As a benchmark, according to the person's observation perspective, the side of the device facing the observer is defined as the front, the left side of the observer is defined as the left, and so on.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present invention.

[0033] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments.

[0034] For those skilled in the art, it is possible to make various changes, modifications, substitutions and variations to these embodiments without departing from the principles and spirit of the present invention, and they still fall within the scope of protection of the present invention.

Claims

1. A novel high overload resistant double differential torsional micro accelerometer structure, comprising an outer frame (1), characterized in that: Two zone plates (2) are fixedly connected to the top side of the outer frame (1), a base plate (3) is provided on the top side of each of the two zone plates (2), a plurality of mass blocks (4) are provided in the middle of the top side of the base plate (3), stress grooves are provided around the outer walls of the mass blocks (4), a support beam 1 (5) is fixedly connected between the two mass blocks (4) on the left and right sides, a support beam 2 (6) is fixedly connected between the two mass blocks (4) on the upper and lower sides, a release block (7) is fixedly connected at the intersection of the two support beams 1 (5) and the two support beams 2 (6), and a plurality of release grooves (8) are provided inside the release block (7).

2. The novel high overload resistant dual differential torsional micro accelerometer structure according to claim 1 is characterized in that: A bonding block 1 (9) is fixedly connected to the middle of the bottom side of the substrate (3), and bonding anchor points 1 (10) are fixedly connected to the four corners of the bottom side of the bonding block 1 (9).

3. The novel high overload resistant dual differential torsional micro accelerometer structure according to claim 2 is characterized in that: A second bonding block (11) is fixedly connected to the middle of the top side of the outer frame (1), and two bonding anchor points (12) are fixedly connected to the four corners of the top side of the second bonding block (11).

4. The novel high overload resistant dual differential torsional micro accelerometer structure according to claim 3 is characterized in that: The plurality of bonding anchor points 2 (12) and the plurality of bonding anchor points 1 (10) are arranged in a one-to-one correspondence.

5. The novel high overload resistant dual differential torsional micro accelerometer structure according to claim 1 is characterized in that: The top side surfaces of the two zone plates (2) are both fixedly connected with a plurality of capacitors (15).

6. The novel high overload resistant dual differential torsional micro accelerometer structure according to claim 3 is characterized in that: The middle portion of the right side of the second bonding block (11) is fixedly connected with a pin one (13).

7. The novel high overload resistant dual differential torsional micro accelerometer structure according to claim 1 is characterized in that: The middle parts of the right sides of the two zone plates (2) are both fixedly connected with pin two (14).

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