Electronic device

Abstract

The utility model provides electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a first body, a key module and a mainboard, an accommodating space is formed in the first body and comprises a first area and a second area which are horizontally connected; the key module is at least partially arranged in the first area; the mainboard is arranged in the second area.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] With the development of science and technology, users' demand for lighter and thinner electronic devices is gradually increasing. In the current development trend of electronic devices, product thinning has gradually become the mainstream trend of electronic device products. How to make electronic devices even lighter and thinner has become a problem in this field. Utility Model Content

[0003] The purpose of the embodiment of the present application is to provide an electronic device, and the technical solution is as follows:

[0004] The present application provides an electronic device, including:

[0005] A first body having an accommodating space therein, the accommodating space including a first area and a second area connected horizontally;

[0006] a button module, the button module being at least partially disposed in the first area;

[0007] The main board is arranged in the second area and is located on one side of the key module.

[0008] In some modified embodiments of the present application, it further includes: a second body, the second body is rotatably connected to the first body, and the second area is located between the first area and the rotational connection position of the first body and the second body.

[0009] In some modified embodiments of the present application, the first body is composed of a first area and a second area, and / or the outer edge of the main board matches the inner wall of the second area.

[0010] In some modified embodiments of the present application, the mainboard includes a substrate, an integrated chip module, a first functional module and a second functional module; the integrated chip module is arranged on the first surface of the substrate, and the edge of the integrated chip module coincides with the two opposite edges of the first surface; the first functional module and the second functional module are arranged on the first surface and are respectively located on both sides of the integrated chip module along the first direction.

[0011] In some modified embodiments of the present application, the integrated chip module is divided into a first functional area, a second functional area and a third functional area in sequence along the first direction; an integrated chip is arranged in the center of the second functional area, and passive components are arranged around the integrated chip; the first functional area is provided with a first power management component, a second power management component and a third power management component at intervals along the second direction, and the second direction is perpendicular to the first direction; the third functional area is provided with a fourth power management component and an oscillator at intervals along the second direction.

[0012] In some modified embodiments of the present application, the first functional module includes a solid-state drive module and a motherboard power module, the solid-state drive module and the motherboard power module are spaced apart on the first surface, and the solid-state drive module is farther away from the integrated chip module than the motherboard power module.

[0013] In some modified embodiments of the present application, the first functional module further includes a power input interface, which is embedded in the side of the substrate between the mainboard power module and the first functional area.

[0014] In some modified embodiments of the present application, the second functional module includes: an embedded controller module, a mainboard display power module and a network card module. The embedded controller module, the mainboard display power module and the network card module are all arranged on the first surface, and the mainboard display power module and the network card module are farther away from the integrated chip module than the embedded controller module. The mainboard display power module and the network card module are spaced apart along the second direction.

[0015] In some modified embodiments of the present application, the mainboard also includes: a mainboard display screen power management module and an audio encoder module. The mainboard display screen power management module corresponds to the mainboard display screen power module and is arranged on the second surface of the substrate. The second surface is opposite to the first surface. The audio encoder module corresponds to the first functional module and is arranged on one side of the second surface.

[0016] In some modified embodiments of the present application, the mainboard further includes: at least two external ports, and the at least two external ports are embedded in the side of the substrate on both sides of the integrated chip module in the first direction.

[0017] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application and to implement it in accordance with the contents of the specification, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] Figure 1 The following schematically shows a structural diagram of an electronic device provided in an embodiment of the present application;

[0020] Figure 2 Schematically shows a structural diagram of another electronic device provided in an embodiment of the present application;

[0021] Figure 3 The structure diagram of the first surface of the substrate of the mainboard of an electronic device provided in an embodiment of the present application is schematically shown;

[0022] Figure 4 The following schematically shows a structural diagram of an integrated chip module of a mainboard of an electronic device provided in an embodiment of the present application;

[0023] Figure 5 The structural diagram of the second surface of the substrate of the mainboard of an electronic device provided in an embodiment of the present application is schematically shown.

[0024] Description of reference numerals:

[0025] 1. First body; 11. Accommodation space; 111. First area; 112. Second area;

[0026] 2. Button module;

[0027] 3. Mainboard; 31. Baseboard; 32. Integrated chip module; 33. First functional module; 34. Second functional module; 35. Mainboard display power management module; 36. Audio encoder module; 37. External port; 311. First surface; 312. Second surface; 321. First functional area; 322. Second functional area; 323. Third functional area; 331. Solid-state drive module; 332. Mainboard power module; 333. Power input interface; 341. Embedded controller module; 342. Mainboard display power module; 343. Network card module; 3211. First power management component; 3212. Second power management component; 3213. Third power management component; 3221. Integrated chip; 3222. Passive components; 3231. Fourth power management component; 3232. Oscillator;

[0028] 4. Second body; 41. Rotation connection position;

[0029] A. First direction; B. Second direction; C. Horizontal direction. DETAILED DESCRIPTION

[0030] The following embodiments of the present disclosure are further described in detail with reference to the accompanying drawings and examples. The detailed description of the following examples and the accompanying drawings are intended to illustrate the principles of the present disclosure, but are not intended to limit the scope of the present disclosure. The present disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but rather includes all technical solutions within the scope of the claims.

[0031] The present disclosure provides these embodiments in order to make this disclosure thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specifically stated, the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values ​​set forth in these embodiments should be interpreted as merely exemplary, and not as limiting.

[0032] It should be noted that, in the description of this disclosure, unless otherwise specified, "plurality" means greater than or equal to two; terms such as "upper," "lower," "left," "right," "inner," and "outer" indicating directions or positional relationships are intended solely to facilitate and simplify the description of this disclosure, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this disclosure. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0033] In addition, the terms "first," "second," and similar terms used in this disclosure do not denote any order, quantity, or importance, but are merely used to distinguish different parts. "Perpendicular" does not mean perpendicular in the strict sense, but rather means within the tolerance range. "Parallel" does not mean parallel in the strict sense, but rather means within the tolerance range. "Include" or "comprising" and similar terms mean that the elements preceding the term include the elements listed after the term, and do not exclude the possibility of also including other elements.

[0034] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in this disclosure depending on the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intervening device between the specific device and the first or second device.

[0035] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in, for example, common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or highly formal sense, unless explicitly defined as such herein.

[0036] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0037] With the development of science and technology, users' demand for thinner and lighter electronic devices has gradually increased. After creative work, the inventors found that the stacking arrangement of the motherboard and the key module in the electronic device is not conducive to the thinner and lighter development of the electronic device.

[0038] like Figure 1 As shown, an embodiment of the present application provides an electronic device, which may include a first body 1, a button module 2 and a main board 3; the first body 1 has a accommodating space 11, and the accommodating space 11 may include a first area 111 and a second area 112 connected horizontally; the button module 2 is at least partially arranged in the first area 111; and the main board 3 is arranged in the second area 112.

[0039] In this embodiment, the electronic device includes a first body 1, which can be a base shell structure of the electronic device. The first body 1 has a storage space 11 including a first area 111 and a second area 112 connected horizontally. The first area 111 and the second area 112 are connected horizontally. When the first body of the electronic device is placed horizontally on a carrier such as a desktop or a platform, the direction in which it is located is the horizontal direction C. In this application, the first area 111 and the second area 112 are connected horizontally, that is, the two areas are continuously connected together in the horizontal direction C. The two areas can have a certain height difference or be on the same horizontal plane. In this application, after the key module 2 and the main board 3 are installed corresponding to the first area 111 and the second area 112 respectively, the main board 3 is located on one side of the key module 2. The key module 2 and the main board 3 are respectively arranged in independent spaces in the first body 1. Compared with the stacked arrangement, the thickness of the first body 1 required for arranging the main board 3 and the key module 2 can be reduced, meeting the lightweight and thin design requirements of the electronic device.

[0040] The motherboard 3 is a core component in an electronic device. It can serve as the physical carrier and electrical connection center for the hardware components in the electronic device. The motherboard 3 not only provides interfaces for installing and connecting various hardware components, but also integrates multiple functions such as power management, signal processing, and data transmission. The motherboard 3 provided in this application can be the motherboard 3 of a laptop computer, desktop computer, game console, etc., or the motherboard 3 of a server such as a data center or enterprise-level server, or the motherboard 3 of an embedded system such as an industrial control system or an Internet of Things device, or the motherboard 3 of an automation device such as an industrial robot or an editable logic controller, etc., without limitation.

[0041] In the present application, the button module 2 is at least partially disposed within the first area 111. The button module 2 may have one button or multiple buttons, with no specific limitation. The number of buttons can be adjusted based on the type of electronic device. For example, the electronic device may be a remote control electronic device with a single button. In the present application, the motherboard 3 of the remote control electronic device is positioned to one side of the button, thereby achieving a thinner and lighter remote control electronic device. For example, the electronic device may also be a supermarket checkout device, a game controller, or the like with multiple buttons.

[0042] In one embodiment of the present application, the electronic device can also be a laptop computer, the first body 1 is the bottom shell of the laptop computer, the key module 2 can include a keyboard module with multiple keys and / or a touchpad, etc., the keyboard module and / or the touchpad are at least partially arranged in the first area 111 in the accommodating space 11 of the bottom shell, and the present application arranges the motherboard 3 in the second area 112 in the accommodating space 11 of the bottom shell so that the motherboard 3 is located on one side of the keyboard module and / or the touchpad, and the second area 112 can be arranged in the bottom shell at a position between the keyboard module and the laptop computer rotation axis position. The position between the keyboard module and the laptop computer rotation axis position is usually located on the upper side of the bottom shell, and according to different structural settings, the rotation axis position and the upper side of the bottom shell are The edges have different spacings, which in turn affects the space size of the second area 112 between the keyboard module and the hinge position; the present application can also set the second area 112 between the keyboard module and the left side of the bottom shell, or the keyboard module and the right side of the bottom shell, or the keyboard module and the lower side of the bottom shell. The touchpad is usually set on the lower side of the keyboard module. The present application can also set the second area 112 between the touchpad and the lower side of the bottom shell, or between the touchpad and the left side of the bottom shell, or between the touchpad and the right side of the bottom shell. The motherboard 3 is correspondingly set in the second area 112. Compared with the stacking arrangement of the motherboard 3 and the keyboard module or the touchpad, the present application can reduce the thickness of the bottom shell required for arranging the motherboard 3 and the key module 2, thereby meeting the lightweight and thin design requirements of the laptop computer.

[0043] The specific shape of the second area 112 of the present application is not limited, and it can be horizontally connected with the first area 111 that at least partially accommodates the key module 2. The outer edge of the mainboard 3 can match the inner wall of the second area 112, or there can be a preset structural gap with the inner wall of the second area 112. The specific shape is not limited, so that the mainboard 3 can be stably installed and accommodated in the second area 112, thereby realizing the lightweight and thinness of the electronic device.

[0044] The present application provides an electronic device, comprising a first body 1, a key module 2, and a main board 3. The first body 1 has a housing space 11 therein, the housing space 11 comprising a first area 111 and a second area 112 connected horizontally. The key module 2 is at least partially disposed within the first area 111. The main board 3 is disposed within the second area 112 and is located to one side of the key module 2. The present application utilizes the first area 111 and the second area 112 connected horizontally within the first body 1 of the electronic device, and installs the key module 2 and the main board 3 corresponding to the first area 111 and the second area 112, respectively, so that the main board 3 is located to one side of the key module 2. Compared to a stacked arrangement of the key module 2 and the main board 3, the thickness of the first body 1 required for arranging the main board 3 and the key module 2 can be reduced, thereby meeting the requirements for a lightweight and thin design of the electronic device.

[0045] Further, such as Figure 2 As shown, in some embodiments, it may further include: a second body 4, the second body 4 is rotatably connected to the first body 1, and the second area 112 is located between the first area 111 and the rotation connection position 41 of the first body 1 and the second body 4.

[0046] In this embodiment, the electronic device of the present application may further include a second body 4, so that the second body 4 can be rotatably connected to the first body 1 to achieve the folding and opening function of the electronic device. In order to meet the requirements of the lightweight design of the electronic device, the present application sets the second area 112 between the first area 111 and the rotational connection position 41 of the first body 1 and the second body 4, so that when the electronic device is installed with the motherboard 3, it is located on one side of the key module 2. As a result, when the motherboard 3 and the key module 2 are installed and accommodated, they can each occupy the space within the horizontally connected first area 111 and the second area 112, which reduces the space thickness required for installation compared to a stacked arrangement. As a result, the first body 1 can adaptively reduce the thickness while meeting the installation requirements of the motherboard 3 and the key module 2, thereby achieving the design purpose of lightweight and thin electronic equipment. At the same time, after the motherboard 3 is located on one side of the key module 2, compared to a stacked arrangement, the motherboard 3 and the key module 2 each have a larger heat dissipation area, thereby improving heat dissipation efficiency, improving the stability of system operation, and extending the service life of the electronic device.

[0047] Furthermore, in some embodiments, the first body 1 may be composed of a first region 111 and a second region 112 , and / or an outer edge of the main board 3 matches an inner wall of the second region 112 .

[0048] In this embodiment, the first body 1 of the electronic device of the present application can be composed of a first area 111 and a second area 112. The key module 2 can be at least partially disposed within the first area 111. The space in the first area 111 not occupied by the key module 2 in the thickness direction of the first body 1 can be adaptively arranged with other components as needed, or the first area 111 can be completely occupied by the key module 2 extending into the first body 1, with no specific limitation. The second area 112 can only meet the accommodation requirements of the main board 3, or, on the basis of matching the outer edge of the main board 3 with the inner wall of the second area 112, the space in the second area 112 not occupied by the main board 3 in the thickness direction of the first body 1 can be adaptively arranged with other components, with no specific limitation.

[0049] In the present application, the outer edge of the mainboard 3 can match the inner wall of the second area 112, so that the geometric shape and size of the outer edge of the mainboard 3 can be closely matched with the geometric shape and size of the inner wall of the space of the second area 112, thereby maximizing the space utilization of the second area 112, thereby reducing the space required to be occupied by the second area 112 in the first body 1, and at the same time improving the installation stability of the mainboard 3 in the second area 112, avoiding the risk of displacement caused by vibration or collision of the electronic device, and improving the stability of the connection line between the mainboard 3 and other components in the electronic device. In order to achieve the matching of the outer edge of the mainboard 3 with the inner wall of the second area 112, a bump, a card block, etc. can be set on the outer edge of the mainboard 3, and a positioning hole or positioning groove that matches the bump, a card slot or card slot that matches the card block, etc. can be set on the inner wall of the second area 112, without limitation.

[0050] Further, such as Figure 3 As shown, in some embodiments, the mainboard 3 may include a substrate 31, an integrated chip module 32, a first functional module 33 and a second functional module 34; the integrated chip module 32 is arranged on the first surface 311 of the substrate 31, and the edges of the integrated chip module 32 coincide with the two opposite sides of the first surface 311; the first functional module 33 and the second functional module 34 are arranged on the first surface 311 and are respectively located on both sides of the integrated chip module 32 along the first direction A.

[0051] In this embodiment, the motherboard 3 provided in this application can integrate the integrated chip module 32, the first functional module 33 and the second functional module 34 on the substrate 31. The integrated chip module 32 can be located in the middle of the motherboard 3, while the first functional module 33 and the second functional module 34 are respectively located on both sides thereof to form an integrated motherboard 3 with clear partitions and compact layout, which meets the requirements of electronic equipment in terms of functionality, reliability, convenience and thinness.

[0052] The integrated chip module 32 can be located in the middle of the mainboard 3, while the first functional module 33 and the second functional module 34 are located on both sides thereof. In one embodiment, the first functional module 33 can be located on the left side of the integrated chip module 32, and the second functional module 34 can be located on the right side of the integrated chip module 32. In another embodiment, the second functional module 34 can be located on the left side of the integrated chip module 32, and the first functional module 33 can be located on the right side of the integrated chip module 32. The specific embodiments are not limited thereto. In this application, the first functional module 33 and the second functional module 34 are configured according to the functional integration requirements of the mainboard 3, and the arrangement positions of different components can be adjusted according to the adaptability of the wiring design of the mainboard 3, and the specific embodiments are not limited thereto.

[0053] In one embodiment, the main board 3 provided by the present application is in the shape of an elongated strip, and the setting position of the elongated main board 3 can be adaptively adjusted according to the setting position and spatial structure of the second area 112 in the first body 1 of the electronic device. In one embodiment, the present application can set the elongated main board 3 between the first area 111 and the rotation connection position 41 of the first body 1 and the second body 4, that is, between the side of the key module 2 close to the second body 4 and the rotation connection position 41, so as to improve the space utilization of the first body 1. In another embodiment, the present application can also set the elongated main board 3 between the first area 111 and the side of the first body 1, that is, between the key module 2 and the side of the first body 1, so as to achieve effective space utilization, without limitation.

[0054] The substrate 31 can be an epoxy glass fiber substrate 31, a ceramic substrate 31, a metal substrate 31, or a flexible substrate 31 made of a flexible material such as polyimide or polyester, etc., without limitation. It can be configured to suit the electronic device's configuration requirements for mechanical strength, performance, heat dissipation, cost, and other factors. In this application, the integrated chip module 32, the first functional module 33, and the second functional module 34 can all be disposed on the first surface 311 on the same side of the substrate 31. The remaining integrated functional modules can also be disposed on the other side of the substrate 31 opposite the first surface 311, without limitation.

[0055] The integrated chip module 32 in the motherboard 3 can realize functions such as data processing calculation, data communication transmission, data cache storage, and power consumption management. As the core module of the motherboard 3, the integrated chip module 32 can be a chip component that integrates any one or more of multiple functional units such as CPU (Central Processing Unit), GPU (Graphics Processing Unit), memory controller, power management unit, input and output interface, network controller, audio processing unit, etc.

[0056] In this application, the edge of the integrated chip module 32 is arranged to coincide with the two opposite sides of the first surface 311. Since the integrated chip module 32 in the mainboard has a greater width than the first functional module 33 and the second functional module 34, when the edge of the integrated chip module 32 coincides with the two opposite sides of the first surface 311, the required width of the substrate 31 of the mainboard 3 can be minimized, which is conducive to the compact integration of the mainboard 3 design. In this application, the width of the substrate 31 can be set to be less than 43 mm, but there is no specific limit. According to the different configurations of the integrated chip module 32 in the mainboard 3 of the electronic device, the width of the substrate 31 can be set to match the width of the corresponding integrated chip module 32. At the same time, the size of the mainboard 3 is reduced, and the space occupied by the installation is reduced, which makes it easier to arrange it in the second area 112 on the side of the first area 111 in the electronic device, so as to reduce the thickness of the first body 1, which is conducive to the development of lightweight and thin electronic devices.

[0057] Further, such as Figure 4 As shown, in some embodiments, the integrated chip module 32 can be divided into a first functional area 321, a second functional area 322 and a third functional area 323 in sequence along the first direction A; an integrated chip 3221 is arranged at the center of the second functional area 322, and passive components 3222 can be arranged around the integrated chip 3221; the first functional area 321 can be provided with a first power management component 3211, a second power management component 3212 and a third power management component 3213 at intervals along the second direction B, and the second direction B is perpendicular to the first direction A; the third functional area 323 can be provided with a fourth power management component 3231 and an oscillator 3232 at intervals along the second direction B.

[0058] In this embodiment, the present application divides the integrated chip module 32 into a first functional area 321, a second functional area 322 and a third functional area 323 along the first direction A, so as to effectively utilize the space of the integrated chip module 32 in the first direction A based on the width limitation of the integrated chip module 32, thereby improving space utilization and integration.

[0059] An integrated chip 3221 may be provided at the center of the second functional area 322. As the core component of the integrated chip module 32, the integrated chip 3221 may realize functions such as data processing calculation, data communication transmission, data cache storage, and power consumption management. The integrated chip 3221 may integrate various functional units such as CPU, GPU, memory controller, power management unit, input and output interface, network controller, and audio processing unit. The specific configuration is not limited. The integrated chip 3221 of the present application may be surrounded by passive components 3222. The passive components 3222 may be capacitors, inductors, resistors, etc. The passive components 3222 provide decoupling and filtering effects to improve the integrity and stability of signal transmission. At the same time, the passive components 3222 generate less heat than the integrated chip 3221, and may form a heat dissipation channel for the integrated chip 3221, thereby improving the heat dissipation efficiency of the integrated chip 3221 and providing stability in system operation.

[0060] The first functional area 321 may be provided with a first power management component 3211, a second power management component 3212, and a third power management component 3213 at intervals along the second direction B, and the third functional area 323 may be provided with a fourth power management component 3231. In one embodiment of the present application, the first power management component 3211, the second power management component 3212, the third power management component 3213, and the fourth power management component 3231 may all be a combination of a SCVR (Switched Capacitor Voltage Regulator) and a PMIC (Power Management Integrated Circuit). The SCVR can achieve efficient voltage conversion through switched capacitor technology and dynamically adjust the output voltage to adapt to different load conditions. For example, when the electronic device system needs to process a large amount of data, the SCVR can quickly adjust the output voltage to meet the instantaneous increase in load demand. The PMIC can achieve multi-channel power management and simultaneously provide a stable voltage supply for multiple components in the motherboard 3. In other embodiments of the present application, the first power management component 3211, the second power management component 3212, the third power management component 3213 and the fourth power management component 3231 can also use SMPS (Switched-Mode Power Supply) or LDO (Low-Dropout Linear Regulator) to provide a stable power supply for the integrated chip module 32, without limitation.

[0061] Oscillator 3232 generates a stable, periodic clock signal to synchronize the operation of components and circuits within motherboard 3 during system startup, providing a correct time reference. The spacing between oscillator 3232 and fourth power management component 3231 reduces signal line crossover within integrated chip module 32, improving signal transmission reliability. Oscillator 3232 can be a crystal oscillator, inductor-capacitor oscillator, voltage-controlled oscillator, ceramic oscillator, multivibrator, or any other type, with no specific limitations and can be adjusted based on the configuration requirements of the electronic device.

[0062] In a working process of the integrated chip module 32 in this embodiment, when the power supply of the mainboard 3 is connected, the oscillator 3232 starts working first and outputs a periodic clock signal. Then the fourth power management component 3231 works to supply power to the peripheral interface to ensure the normal operation of the peripheral interface of the mainboard 3. Then the second power management component 3212 works to provide power to the memory. Then the third power management component 3213 works to provide additional voltage levels for the memory to meet the voltage requirements of different types of memory chips. Finally, the first power management component 3211 works to supply core voltage to the integrated chip 3221, thereby realizing the full startup of the integrated chip module 32.

[0063] Further, such as Figure 3 As shown, in some embodiments, the first functional module 33 may include a solid-state drive module 331 and a mainboard power module 332. The solid-state drive module 331 and the mainboard power module 332 may be spaced apart on the first surface 311, and the solid-state drive module 331 may be farther away from the integrated chip module 32 than the mainboard power module 332.

[0064] In this embodiment, the first functional module 33 may include a solid-state drive module 331 and a motherboard power module 332. The motherboard power module 332 provides power support for the motherboard 3. Placing the motherboard power module 332 close to the integrated chip module 32 helps shorten wiring length, simplify wiring, and improve power supply stability. The solid-state drive module 331 and the motherboard power module 332 are spaced apart, and the solid-state drive module 331 is farther away from the integrated chip module 32 than the motherboard power module 332. This allows the solid-state drive module 331 to avoid electromagnetic interference generated by the integrated chip module 32, thereby providing stable solid-state drive read and write performance and ensuring data transmission stability and reliability. Furthermore, the spaced-apart arrangement of the solid-state drive module 331 and the motherboard power module 332 also helps avoid heat concentration on the motherboard 3, improving the overall heat dissipation efficiency of the system and extending its service life. In this application, the solid-state drive module 331 can be configured according to different interface protocols, without specific limitations. In this application, the motherboard power module 332 can take various forms, such as an integrated power management unit, a multi-phase power supply, a digital power controller, etc., without specific limitations, as long as it can provide power support for the motherboard 3.

[0065] Further, such as Figure 3 As shown, in some embodiments, the first functional module 33 may further include a power input interface 333 , and the power input interface 333 may be embedded in the side of the substrate 31 between the mainboard power module 332 and the first functional area 321 .

[0066] In this embodiment, the first functional module 33 further includes a power input interface 333, which is located between the mainboard power module 332 and the first functional area 321. The power line is connected through the power input interface 333, and the connection position is close to the mainboard power module 332 and the integrated chip module 32 that requires a large amount of power to operate. This shortens the wiring distance, reduces the voltage drop and signal loss during the power line transmission process, and is conducive to simplifying the power line wiring of the mainboard 3 and improving the reliability of power transmission. In addition, the power input interface 333 can be embedded in the side of the substrate 31 between the mainboard power module 332 and the first functional area 321, thereby utilizing the edge space of the mainboard 3, improving space utilization, and enhancing the convenience of power line access and maintenance. At the same time, the power input interface 333 usually generates a certain amount of heat. Placing the interface on the side of the substrate 31 is beneficial for avoiding the location of other heat-generating components on the mainboard 3, avoiding heat concentration. At the same time, the side location is also conducive to heat dissipation of the power input interface 333, extending the service life of the mainboard 3. In the present application, the power input interface 333 can be selected from different types such as a DC power jack, an AC power socket, a USB (Universal Serial Bus) power interface, etc., without limitation.

[0067] Further, such as Figure 3 As shown, in some embodiments, the second functional module 34 may include: an embedded controller module 341, a mainboard display power module 342 and a network card module 343. The embedded controller module 341, the mainboard display power module 342 and the network card module 343 may all be arranged on the first surface 311, and the mainboard display power module 342 and the network card module 343 may both be farther away from the integrated chip module 32 than the embedded controller module 341. The mainboard display power module 342 and the network card module 343 may be spaced apart along the second direction B.

[0068] In this embodiment, the present application arranges the embedded controller module 341, the mainboard display power module 342 and the network card module 343 on the first surface 311, thereby improving the space utilization of the mainboard 3, realizing a high degree of integration of the functions of the mainboard 3, and facilitating the compact integration and reasonable layout of the design of the mainboard 3.

[0069] Embedded controller module 341 is responsible for handling tasks such as system startup and shutdown, power status monitoring, and temperature management within motherboard 3. This application places embedded controller module 341 close to integrated chip module 32. This shortens the wiring distance between embedded controller module 341 and integrated chip module 32, simplifying wiring within motherboard 3. This also increases the response speed of embedded controller module 341 and improves overall system performance. The embedded controller module can be a digital signal processor, programmable gate array, application-specific integrated circuit, programmable logic controller, or any other type, without limitation, and can be configured based on the functional configuration requirements of motherboard 3 in the electronic device.

[0070] In this application, the motherboard display power module 342 can provide stable voltage and current to the display screen or display of the electronic device, achieving brightness adjustment, display effect adjustment, etc. The network card module 343 can realize data transmission between the electronic device and the Internet, meet the user's network usage needs, and improve the integration and functionality of the electronic device motherboard 3. In this application, the motherboard display power module 342 and the network card module 343 are both farther away from the integrated chip module 32 than the embedded controller module 341, which can reduce signal interference, improve signal transmission quality and system stability. At the same time, the motherboard display power module 342 and the network card module 343 are spaced apart along the second direction B, which helps to avoid heat concentration when the motherboard 3 is working, improve the heat dissipation efficiency of the motherboard 3, and extend the service life of the electronic device.

[0071] Further, such as Figure 5 As shown, in some embodiments, the mainboard 3 may further include: a mainboard display screen power management module 35 and an audio encoder module 36. The mainboard display screen power management module 35 may correspond to the mainboard display screen power module 342 and be arranged on the second surface 312 of the substrate 31. The second surface 312 is opposite to the first surface 311. The audio encoder module 36 may correspond to the first functional module 33 and be arranged on one side of the second surface 312.

[0072] In this embodiment, to further optimize the space utilization of the motherboard 3 in the electronic device of this application, the present application utilizes the second surface 312 of the substrate 31 of the motherboard 3, which is separate from the first surface 311. This improves the space utilization of the motherboard 3, facilitates simplified wiring within the motherboard 3, and promotes a compact, integrated design and rational layout of the motherboard 3. Furthermore, the placement of the motherboard display power management module 35 and the audio encoder module 36 on the second surface 312 can reduce the temperature of the first surface 311 and improve the heat dissipation efficiency of the motherboard 3.

[0073] In this application, the mainboard display power management module 35 can be set corresponding to the mainboard display power module 342. The mainboard display power management module 35 and the mainboard display power module 342 work together to ensure that stable and accurate voltage and current are provided to the display. At the same time, the mainboard display power management module 35 can dynamically adjust the power output by the mainboard display power module 342 according to the actual load requirements of the display to adapt to different working states of the electronic equipment.

[0074] The audio encoder module 36 set in this application can improve the audio processing capability of the electronic device and provide high-quality sound output. By optimizing the layout of the motherboard 3, the audio encoder module 36 can be set on the side of the second surface 312 corresponding to the first functional module 33. It is set on the second surface 312 avoiding the motherboard display power management module 35, which is conducive to the wiring of the motherboard 3 and the simplification of the second surface 312, and avoids the position of other high-frequency or high-power components in the motherboard 3, which helps to improve the quality of the audio signal, reduce noise, and improve the user experience.

[0075] Further, such as Figure 3 As shown, in some embodiments, the mainboard 3 may further include: at least two external ports 37 . The at least two external ports 37 may be embedded in the sides of the substrate 31 on both sides of the integrated chip module 32 in the first direction A.

[0076] In this embodiment, in order to enhance the functionality and practicality of the mainboard 3 in the electronic device of the present application and improve the user experience, the mainboard 3 of the present application may also include at least two external ports 37 to provide users with more external options and improve the scalability and applicability of the mainboard 3. The external port 37 can be a USB (Universal Serial Bus) port, a Type-C port, an HDMI (High-Definition Multimedia Interface) port and other forms, without limitation, and at least two multi-ports can be any combination of the above-mentioned ports and can be configured according to actual needs.

[0077] The present application provides at least two external ports 37 that can be embedded in the sides of the substrate 31 on either side of the integrated chip module 32 in the first direction A, optimizing the spatial layout of the motherboard 3. The external ports 37 are arranged away from the integrated chip module 32. Furthermore, based on the condition that the edges of the integrated chip module 32 coincide with the two opposite sides of the first surface 311, the width of the core area of ​​the motherboard 3 is determined based on the integrated chip module 32, which facilitates the compact integration and rational layout of the motherboard 3. Furthermore, the provision of at least two external ports 37 on either side of the integrated chip module 32 can reduce signal interference between different ports and improve the stability and integrity of data transmission. Furthermore, this arrangement facilitates the routing of connections for external components or devices, avoiding entanglement and interference.

[0078] Thus far, various embodiments of the present disclosure have been described in detail. To avoid obscuring the concept of the present disclosure, some details known in the art have not been described. Based on the above description, those skilled in the art can fully understand how to implement the technical solutions disclosed herein.

[0079] Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art will understand that the above examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Those skilled in the art will understand that the above embodiments may be modified or some technical features may be replaced with equivalents without departing from the scope and spirit of the present disclosure. In particular, as long as there are no structural conflicts, the various technical features mentioned in the various embodiments may be combined in any manner.

Claims

1. An electronic device, characterized in that: include: A first body, wherein the first body has an accommodating space therein, and the accommodating space includes a first area and a second area connected horizontally; a button module, wherein the button module is at least partially disposed in the first area; A main board is arranged in the second area.

2. The electronic device according to claim 1, wherein Also includes: The second body is rotatably connected to the first body, and the second area is located between the first area and the rotational connection position of the first body and the second body.

3. The electronic device according to claim 1 or 2, characterized in that: The first body is composed of a first area and a second area, and / or the outer edge of the main board matches the inner wall of the second area.

4. The electronic device according to claim 3, wherein: The mainboard includes: substrate; an integrated chip module, the integrated chip module being disposed on the first surface of the substrate, wherein edges of the integrated chip module coincide with two opposite sides of the first surface; A first functional module and a second functional module, wherein the first functional module and the second functional module are arranged on the first surface and are respectively located on two sides of the integrated chip module along a first direction.

5. The electronic device according to claim 4, characterized in that The integrated chip module is divided into a first functional area, a second functional area and a third functional area in sequence along the first direction; An integrated chip is arranged at the center of the second functional area, and passive components are arranged around the integrated chip; The first functional area is provided with a first power management component, a second power management component and a third power management component at intervals along a second direction, and the second direction is perpendicular to the first direction; The third functional area is provided with a fourth power management component and an oscillator at intervals along the second direction.

6. The electronic device according to claim 5, characterized in that The first functional module includes a solid state drive module and a mainboard power module. The solid state drive module and the mainboard power module are spaced apart on the first surface, and the solid state drive module is farther away from the integrated chip module than the mainboard power module.

7. The electronic device according to claim 6, wherein: The first functional module further includes a power input interface, which is embedded in the side of the substrate between the mainboard power module and the first functional area.

8. The electronic device according to claim 7, wherein: The second functional module includes: An embedded controller module, a mainboard display power module and a network card module, wherein the embedded controller module, the mainboard display power module and the network card module are all arranged on the first surface, and the mainboard display power module and the network card module are farther away from the integrated chip module than the embedded controller module, and the mainboard display power module and the network card module are spaced apart along the second direction.

9. The electronic device according to claim 8, wherein: The mainboard further includes: The mainboard display power management module and the audio encoder module, the mainboard display power management module corresponds to the mainboard display power module and is arranged on the second surface of the substrate, the second surface is opposite to the first surface, and the audio encoder module corresponds to the first functional module and is arranged on one side of the second surface.

10. The electronic device according to claim 9, characterized in that The mainboard further includes: At least two external connection ports are embedded in the side of the substrate at two sides of the integrated chip module in the first direction.

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