Heat dissipation module, display device with heat dissipation module and electronic device with heat dissipation module

Abstract

The utility model discloses a heat dissipation module and a display device and an electronic device with the heat dissipation module, and the heat dissipation module comprises a heat conduction element which is used for being attached to a heating element; a heat dissipation element; the heat transfer element comprises a first heat transfer end and a second heat transfer end, the first heat transfer end is connected with the heat conduction element, and the second heat transfer end is connected with the heat dissipation element; and at least one elastic pressing and fixing piece, the elastic pressing and fixing piece comprises a first pressing and fixing end and a second pressing and fixing end, the first pressing and fixing end abuts against or is connected with the heat conduction element, and the second pressing and fixing end is used for being connected or abutting against relative structures, which are arranged oppositely and at intervals, of the heating element. Therefore, the heat conduction element is tightly pressed on the heating element. According to the heat dissipation module, the assembly difficulty, the design difficulty and the production cost of a product are reduced, and meanwhile the heat dissipation performance of the product is improved.

Description

Technical Field

[0001] The present disclosure belongs to the technical field of electronic equipment, and in particular relates to a heat dissipation module and a display device and an electronic device having the same. Background Art

[0002] With the advancement of science and technology, electronic products such as laptops, all-in-one computers, and tablets are becoming increasingly powerful, requiring more electronic components and more complex electronic circuits to achieve their functions. The more powerful these electronic products are, the more powerful processor chips they require to support these increasingly powerful features. This leads to increased power consumption and heat generation in these processor chips. These factors not only complicate the layout and routing of components on electronic product motherboards, but also result in poor heat dissipation performance.

[0003] As electronic products develop towards being thinner and smaller, it is no longer feasible to achieve powerful functions by increasing the size of electronic products. Therefore, electronic products require motherboards with more reasonable device layouts and heat dissipation modules with higher thermal conductivity. This poses great challenges to the motherboard device layout design and heat dissipation design of electronic products.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the Invention

[0005] The present disclosure aims to at least partially resolve the technical issues of difficult layout of motherboard components and poor heat dissipation performance of electronic products. To this end, the present disclosure provides a heat dissipation module and a display device and electronic device having the same.

[0006] The present disclosure discloses a heat dissipation module, which includes: a heat-conducting element, which is used to be attached to a heating element; a heat dissipation element; a heat transfer element, which includes a first heat transfer end and a second heat transfer end, the first heat transfer end is connected to the heat-conducting element, and the second heat transfer end is connected to the heat dissipation element; and at least one elastic pressing piece, which includes a first pressing end and a second pressing end, the first pressing end abuts or connects to the heat-conducting element, and the second pressing end is used to connect or abut with a relative structure that is opposite and spaced apart from the heating element to press the heat-conducting element onto the heating element.

[0007] In some embodiments, the heat dissipation module further includes: a first positioning element, the first positioning element is connected to the heat conducting element, the first positioning element is provided with a first positioning portion, and the first positioning portion is connected to the adjacent structure of the heating element; and / or, a second positioning element, the second positioning element is connected to the heat dissipation element, the second positioning element is provided with a second positioning portion, and the second positioning portion is connected to the adjacent structure; and / or, a third positioning element, the third positioning element is connected to the heat conducting element, the third positioning element is provided with a third positioning portion, and the third positioning portion is connected to the adjacent structure.

[0008] In some embodiments, the elastic pressing member includes any one of a compression spring, a spring sheet, and an elastic member, the first pressing end is connected to or abuts against the heat conducting element, and the second pressing end is connected to or abuts against the relative structure.

[0009] In some embodiments, the first pressing end is provided with a pressure equalizing plate, and the first pressing end is connected to or abuts against the heat conducting element through the pressure equalizing plate.

[0010] In some embodiments, the heat-conducting element includes a first heat-conducting surface and a second heat-conducting surface, the first heat-conducting surface is used to fit with the heating element, and the second heat-conducting surface is provided with a first compression limit portion, and the first compression limit portion is used to connect or abut with the first compression end.

[0011] In some embodiments, the second heat-conducting surface is provided with first compression-fixing limiting portions whose number matches the number of the elastic compression members, and the first compression-fixing limiting portions are evenly distributed on the second heat-conducting surface.

[0012] In some embodiments, the first compression limiting portion is a groove or a protrusion.

[0013] The present disclosure also discloses a display device, which includes a back panel, a main board arranged on the back panel, a rear shell covering the main board, and the above-mentioned heat dissipation module. The main board includes a circuit board and the heating element arranged on the circuit board, and the relative structure is selected from the rear shell.

[0014] In some embodiments, the heat dissipation module further includes:

[0015] a first positioning element, the first positioning element being connected to the heat-conducting element, the first positioning element being provided with a first positioning portion, the first positioning portion being connected to an adjacent structure of the heating element; and / or

[0016] A second positioning element, the second positioning element is connected to the heat dissipation element, the second positioning element is provided with a second positioning portion, and the second positioning portion is connected to the adjacent structure; and / or,

[0017] a third positioning element, the third positioning element being connected to the heat transfer element, the third positioning element being provided with a third positioning portion, the third positioning portion being connected to the adjacent structure;

[0018] The adjacent structure is selected from the back plate and / or the circuit board.

[0019] In some embodiments, a second pressing and limiting portion is provided on the rear shell, and the second pressing and limiting portion is used to connect with or abut against the second pressing end.

[0020] In some embodiments, the rear shell is provided with a reinforcement connection portion around the second compression limit portion, and the reinforcement connection portion is used to connect to the back plate; and / or the rear shell is provided with a reinforcement buckle, and the reinforcement buckle is used to connect to the back plate; and / or the rear shell is provided with reinforcement ribs.

[0021] In some embodiments, the connection method between the second pressing end and the second pressing limit part is selected from snap connection, bolt connection, riveting, welding, plug-in and gluing; or, the second pressing end is pre-embedded in the second pressing limit part.

[0022] In some embodiments, the second compression limit portion is provided with a retractable pressing module, the retractable pressing module passes through the rear shell, the retractable pressing module includes a retractable end and a pressing end, the retractable end is connected or abuts against the second compression end, and the pressing end is located on the side of the rear shell away from the main board.

[0023] An embodiment of the present disclosure discloses an electronic device, which includes a mainboard and the above-mentioned heat dissipation module. The mainboard includes a circuit board and the heating element arranged on the circuit board.

[0024] The embodiments of the present disclosure have at least the following beneficial effects:

[0025] In the above-mentioned heat dissipation module, the heat-conducting element is pressed against the heating element by an elastic pressing piece. The elastic pressing piece includes a first pressing end and a second pressing end. The second pressing end is connected or abutted against the relative structure arranged opposite to the heating element, so that the first pressing end is connected or abutted against the heat-conducting element from the side of the heat-conducting element away from the heating element, thereby applying pressure on the side of the heat-conducting element away from the heating element. First, the force-bearing area of ​​the heat-conducting element can be increased, making the pressure applied to the heat-conducting element more balanced; second, at least one elastic pressure piece simultaneously generates a large transient pressure on the heat-conducting element, which can make the force on the heat-conducting element and the heating element more uniform and stable, and can reduce the tilting of the heat dissipation module and the uneven force on the heating element during assembly, which may cause the chip to tilt or be damaged; third, the heat dissipation module and the heat-conducting element therein do not need to be provided with connecting parts such as riveted springs in the related art, which can simplify the structure of the heat dissipation module and the heat-conducting element, reduce the production difficulty and cost of the heat dissipation module and the heat-conducting element, and improve the production yield; finally, the heat dissipation module does not need to be fixed by the mounting structure where the heating element is located, which can avoid deformation of the mounting structure due to force, and can also avoid setting connection structures such as screw holes or studs on the mounting structure, thereby avoiding design restrictions on the mounting structure. That is, the heat dissipation module disclosed in the present invention reduces the assembly difficulty, design difficulty and production cost of the product, while improving the heat dissipation performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, a brief introduction will be given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] Figure 1 A schematic structural diagram of a heat dissipation module in one embodiment of the present disclosure is shown;

[0028] Figure 2 Shown Figure 1 A schematic diagram of the structure of the elastic pressure piece in the heat dissipation module;

[0029] Figure 3 Shown Figure 1 Schematic diagram of the structure of the heat dissipation module when the heat conducting element is not in contact with the elastic pressing piece;

[0030] Figure 4 A schematic structural diagram of a heat dissipation module in another embodiment of the present disclosure is shown;

[0031] Figure 5 A schematic structural diagram of a heat dissipation module in another embodiment of the present disclosure is shown;

[0032] Figure 6 Shown Figure 5 A schematic diagram of the structure of the elastic pressure piece in the heat dissipation module;

[0033] Figure 7 A schematic structural diagram of a display device after removing the rear cover in one embodiment of the present disclosure is shown;

[0034] Figure 8 Shown Figure 7 A schematic diagram of the rear housing structure of the central display device;

[0035] Figure 9 Shown Figure 8 Cross-sectional view of the rear housing and heat dissipation module;

[0036] Figure 10 Shown Figure 7 A schematic diagram of the relative positions of the back panel, main board, and heat dissipation module of the display device;

[0037] Figure 11 Shown Figure 10 A cross-sectional view of the back panel, main board, and heat dissipation module of the central display device;

[0038] Figure 12 Shown Figure 7 A schematic diagram of the relative positions of the mainboard and heat dissipation module of the display device;

[0039] Figure 13 Shown Figure 7 Schematic diagram of the structure of the main board;

[0040] Figure 14 A schematic structural diagram of a display device with a rear cover removed in another embodiment of the present disclosure is shown;

[0041] Figure 15 Shown Figure 14 A schematic diagram of the rear housing structure of the central display device;

[0042] Figure 16 Shown Figure 15 Cross-sectional view of the rear housing and heat dissipation module;

[0043] Figure 17 A schematic structural diagram of a display device with a rear cover removed in another embodiment of the present disclosure is shown;

[0044] Figure 18 Shown Figure 17 A schematic diagram of the rear housing structure of the central display device;

[0045] Figure 19 Shown Figure 18 Cross-sectional view of the rear housing and heat dissipation module;

[0046] Figure 20A schematic structural diagram of a rear housing in a display device in another embodiment of the present disclosure is shown;

[0047] Figure 21 A schematic structural diagram of a rear housing in a display device according to an embodiment of the present disclosure is shown;

[0048] Figure 22 Shown Figure 21 A cross-sectional view of the retractable pressing module of the middle rear housing in the extended state;

[0049] Figure 23 Shown Figure 21 A cross-sectional view of the retractable pressing module of the middle rear housing in a compressed state;

[0050] Figure 24 A schematic diagram of the structure of a display device in the related art after removing the rear cover is shown;

[0051] Figure 25 A schematic structural diagram of a display device in another related art after removing the rear cover is shown;

[0052] Figure 26 Shown Figure 24 and Figure 25 A schematic diagram of the mainboard structure in the display device;

[0053] Figure 27 A comparison diagram of the pressure distribution clouds exerted on the heating element by the heat dissipation module of the related art and the heat dissipation module of the embodiment of the present disclosure is shown;

[0054] Figure 28 A comparison diagram of the stress deformation caused to the mounting structure by the heat dissipation module of the related art and the heat dissipation module of the embodiment of the present disclosure is shown.

[0055] Reference numerals:

[0056] 100. Heat dissipation module; 110. Heat-conducting element; 111. First pressing and limiting portion; 120. Heat dissipation element; 130. Heat transfer element; 140. Elastic pressing piece; 141. First pressing end; 1411. Pressure equalizing plate; 142. Second pressing end; 150. First positioning element; 160. Second positioning element; 170. Third positioning element; 200. Back panel; 300. Main board; 310. Circuit board; 311. Positioning and fitting portion; 320. Heating element; 321. Solder ball; 330. Connection position; 400. Back cover; 410. Second pressing and limiting portion; 420. Reinforced connection portion; 430. Reinforced buckle; 440. Retractable pressing module.

[0057] 10. Heat dissipation module of related technology; 11. Heat conducting element; 12. Heat dissipation element; 13. Heat pipe; 14. Fastening portion; 15. Fastener. DETAILED DESCRIPTION

[0058] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present disclosure.

[0059] In addition, the present disclosure may repeat reference numbers and / or reference letters in different examples. This repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0060] The present disclosure is described below with reference to specific embodiments and in conjunction with the accompanying drawings:

[0061] The present disclosure discloses a heat dissipation module 100. Figures 1 to 23 As shown, the heat dissipation module 100 includes a heat-conducting element 110, a heat dissipating element 120, a heat transfer element 130 and at least one elastic pressing member 140. The heat-conducting element 110 is used to fit with the heating element 320; the heat transfer element 130 includes a first heat transfer end and a second heat transfer end, the first heat transfer end is connected to the heat-conducting element 110, and the second heat transfer end is connected to the heat dissipating element 120; the elastic pressing member 140 includes a first pressing end 141 and a second pressing end 142, the first pressing end 141 abuts or connects with the heat-conducting element 110, and the second pressing end 142 is used to connect or abut with the relative structure of the heating element 320 that is opposite and spaced apart, so as to press the heat-conducting element 110 onto the heating element 320.

[0062] The heat dissipation module 100 disclosed in the embodiment of the present disclosure is as follows: Figures 1 to 23As shown, the heat-conducting element 110 is pressed against the heating element 320 by the elastic pressing piece 140. The elastic pressing piece 140 includes a first pressing end 141 and a second pressing end 142. The second pressing end 142 is connected or abutted with the relative structure of the heating element 320, so that the first pressing end 141 is connected or abutted with the heat-conducting element 110 from the side away from the heating element 320, thereby applying pressure on the side of the heat-conducting element 110 away from the heating element 320. First, the force-bearing area of ​​the heat-conducting element 110 can be increased, so that the pressure applied to the heat-conducting element 110 is more balanced, thereby effectively improving the heat conduction efficiency of the heat-conducting element 110 and the heating element 320, and further improving the heat dissipation efficiency of the heating element 320; secondly, at least one elastic pressing member 140 simultaneously generates a transient large pressure on the heat-conducting element 110, which can make the force on the heat-conducting element 110 and the heating element 320 more uniform and stable, and can reduce the tilt of the heat dissipation module 100 during the assembly process and the uneven force on the heating element 320, which may cause the chip to Tilt or damage; secondly, the heat dissipation module 100 and the heat-conducting element 110 therein do not need to be provided with connecting parts such as riveted springs in the related art, which can simplify the structure of the heat dissipation module 100 and the heat-conducting element 110, reduce the production difficulty and cost of the heat dissipation module 100 and the heat-conducting element 110, and improve the production yield; finally, the heat dissipation module 100 does not need to be fixed by the mounting structure where the heating element 320 is located, which can avoid deformation of the mounting structure due to force, and can also avoid setting connection structures such as screw holes or studs on the mounting structure, thereby avoiding design restrictions on the mounting structure. In other words, the heat dissipation module 100 of the present disclosure reduces the assembly difficulty, design difficulty and production cost of the product, while improving the heat dissipation performance of the product.

[0063] In some embodiments of the present disclosure, the heat dissipation module 100 can be used to be set in display products or electronic products such as laptops, all-in-one computers, tablet computers, computer hosts, etc. to dissipate heat from the heating elements 320 in these products.

[0064] In a product incorporating the heat dissipation module 100, the relative structure refers to a structure that is positioned opposite and spaced apart from the heating element 320. This relative structure, positioned opposite and spaced apart from the heating element 320, allows for sufficient installation space for the thermally conductive element 110 and the elastic pressing member 140 and provides a certain amount of deformation force for the elastic pressing member 140. After the thermally conductive element 110 and the heating element 320 are bonded together, the relative structure is located on the side of the thermally conductive element 110 away from the heating element 320. Consequently, after the relative structure is installed in the product, pressure can be applied to the thermally conductive element 110 from the side away from the heating element 320 via the elastic pressing member 140.

[0065] In some embodiments of the present disclosure, the heat dissipation module 100 of the present disclosure is described using the heat dissipation of a chip in a motherboard 300 as an example. The motherboard 300 may include a circuit board 310 and a chip disposed on the circuit board 310. The chip is the heating element 320 of the motherboard 300, and the circuit board 310 is the mounting structure for the chip. The motherboard 300 may be disposed within the product and located inwardly of the rear housing 400. The rear housing 400 can then be considered as a structure disposed opposite and spaced apart from the heating element 320.

[0066] In some embodiments of the present disclosure, in a product equipped with the heat dissipation module 100, the mounting structure refers to the structure where the heating element 320 is mounted. For example, when the heating element 320 is a chip, the circuit board 310 where the chip is mounted is considered the mounting structure.

[0067] In some embodiments of the present disclosure, in a product equipped with a heat dissipation module 100, an adjacent structure refers to a structure disposed adjacent to a heating element 320. This may be a mounting structure for the heating element 320 or another structure adjacent to the mounting structure. For example, when the heat dissipation module 100 is used to dissipate heat from a chip on a circuit board 310, the circuit board 310 may be disposed on a backplane 200. The adjacent structure may be the circuit board 310, which serves as the chip mounting structure, or the backplane 200 adjacent to the circuit board 310.

[0068] In some embodiments of the present disclosure, the first heat transfer end and the second heat transfer end may be located at opposite ends of the heat transfer element 130, that is, the opposite ends of the heat transfer element 130 are respectively connected to the heat conducting element 110 and the heat dissipating element 120 to achieve heat transfer between the heat conducting element 110 and the heat dissipating element 120.

[0069] In some embodiments of the present disclosure, the first pressing end 141 and the second pressing end 142 may be located at opposite ends of the elastic pressing member 140, the first pressing end 141 abuts or connects with the heat-conducting element 110, and the second pressing end 142 is used to connect or abut with the relative structure of the heating element 320 that is opposite and spaced apart. Under the joint action of the heat-conducting element 110 and the relative structure, the elastic pressing member 140 may be deformed to generate a reaction force, and the reaction force is applied to the heat-conducting element. In related technologies, such as Figures 24 to 26 As shown, the heat dissipation module 10 of the related art may include a heat conducting member 11, a heat dissipating member 12, a heat pipe 13 and a fastener 15, and the heat conducting member 11 is connected to the heat dissipating member 12 through the heat pipe 13. Figure 24 As shown, the heat conducting member 11 may be connected to a fastening portion 14, which is connected to the mounting structure of the heating element 320 via a fastener 15, thereby pressing the heat conducting member 11 onto the heating element 320. Figure 25As shown, the fastening portion 14 may be a spring sheet, which may be connected to the mounting structure of the heating element 320 via a fastener 15 , and the heat conducting member 11 may be pressed against the heating element 320 via the spring sheet.

[0070] In the heat dissipation module 10 of the related art, it is necessary to make the pressure center of the heat conductor 11 coincide with the center of the heating element 320, so that the heat conductor 11 and the heating element 320 are as closely fitted as possible, reducing the thermal resistance between the heat conductor 11 and the heating element 320. However, for each specific product, the connection position 330 of the mounting structure for connecting the fastener 15 to the heating element 320 needs to be adjusted according to the function of the mounting structure, that is, the connection position 330 is not fixed, and it is difficult to achieve the coincidence of the pressure center of the heat conductor 11 with the center of the heating element 320. This causes uneven force on the heat conductor 11 and uneven pressure generated by the heat conductor 11 on the heating element 320, resulting in increased thermal resistance between the heat conductor 11 and the chip, reducing the heat dissipation performance of the heat dissipation module 10 of the related art, and further causing the temperature of the heating element 320 to increase and the product surface to become hot. Taking the chip as the heating element 320 as an example, when the temperature of the chip reaches a certain level, for the purpose of safety protection, the function of the chip will be reduced, which will lead to a decline in product performance and fail to meet the user's usage needs.

[0071] In related technologies, such as Figure 26 As shown, in order to connect the fastener 15 to the mounting structure of the heating element 320, it is necessary to reserve multiple connection positions 330 for the fastener 15 to connect around the heating element 320 on the mounting structure. Typically, each heating element 320 needs to reserve 3-4 connection positions 330 for locking the heat dissipation module 100, which greatly limits the design space of the mounting structure. Taking the heat dissipation of the motherboard 300 as an example, where the chip serves as the heating element 320 and the circuit board 310 serves as the mounting structure, when it is necessary to reserve 3-4 connection positions 330 on the circuit board 310, the layout and routing on the circuit board 310 need to bypass the connection positions 330, and other electronic components also need to have a certain distance from the connection positions 330. However, when the product needs to achieve more powerful functions, it is necessary to layout more electronic components and routing on the limited space of the circuit board 310. The presence of multiple connection positions 330 brings great difficulties to the layout of electronic components and routing, greatly limiting the design space of the motherboard 300.

[0072] In related technologies, such as Figures 24 to 26As shown, the heat conductor 11 in the heat dissipation module 10 of the related art needs to be locked on the mounting structure by multiple fasteners 15. In the process of locking the heat conductor 11 by fasteners 15 such as screws, after the first fastener 15 is locked, the heat conductor 11 will tilt in that direction. In the process of locking the second fastener 15, a large pressure will be applied to the position of the heating element 320 corresponding to the first fastener 15 in a short period of time. The pressure at this time may cause the chip and other structures of the heating element 320 to break, causing damage to the heating element 320. At the same time, when locking the heat conductor 11 on the mounting structure by multiple fasteners 15, the multiple fasteners 15 need to be locked in a certain order. Not only does it take a long time to assemble and the assembly process is complicated, but also during the assembly process, after the first fastener 15 is locked, the heat conductor 11 will tilt to a certain extent, making it more difficult to assemble the subsequent fasteners 15. It is difficult to replace manual assembly with automated assembly methods such as robots, resulting in increased labor costs.

[0073] In related technologies, such as Figures 24 to 26 As shown, after the heat conductor 11 in the heat dissipation module 10 of the related technology is locked on the mounting structure by multiple fasteners 15, the connection position 330 of the mounting structure will be subjected to the tension of the fasteners 15, causing the connection position 330 of the mounting structure and its surrounding areas to easily generate stress deformation, thereby causing other electronic components on the mounting structure to become desoldered and fall off or wiring to break, resulting in product damage.

[0074] The heat dissipation module 100 disclosed in the embodiment of the present disclosure is as follows: Figures 1 to 23 As shown, the heat dissipation module 100 applies pressure to the heat-conducting element 110 from the side of the heat-conducting element 110 away from the heating element 320 through the elastic pressing piece 140. The reaction force generated by the compression or deformation of the elastic pressing piece 140 is applied to the side of the heat-conducting element 110 away from the heating element 320. When the relative structures are assembled, the pressure is instantaneously applied to the heat-conducting element 110 and the heating element 320 as a whole. This pressure application method can avoid the risk of the heat-conducting element 110 being easily tilted during the assembly process to a certain extent, and can avoid the transient large pressure generated at the local position of the heating element 320 causing damage, thereby making the force on the heating element 320 more uniform and stable, and reducing the thermal resistance between the heat-conducting element 110 and the heating element 320, thereby improving the heat dissipation performance of the heat dissipation module 100 and ensuring the high-performance operation of the heating element 320. Figure 27 As shown, a comparison diagram of the pressure distribution cloud applied by the heat dissipation module 10 of the related art and the heat dissipation module 100 of the embodiment of the present disclosure to the heating element 320 is shown. The pressure distribution cloud applied by the heat dissipation module 10 of the related art and the heat dissipation module 100 of the embodiment of the present disclosure to the heating element 320 can be tested by the G-Scan pressure testing system. Figure 27Point A in the middle is the pressure test result of the heat dissipation module 10 of the related technology on the heating element 320. It can be seen from the figure that the pressure applied by the heat dissipation module 10 of the related technology on the heating element 320 is mainly concentrated in the edge area of ​​the heating element 320, and there is almost no pressure in the middle area of ​​the heating element 320, that is, the force on the heating element 320 is uneven, resulting in a large thermal resistance between the heating element 320 and the heat conductor 11, and a low thermal conductivity efficiency. Figure 27 Point B in the middle is the result of the pressure test of the heat dissipation module 100 on the heating element 320 in the embodiment of the present disclosure. It can be seen from the figure that the pressure applied by the heat dissipation module 100 on the heating element 320 in the embodiment of the present disclosure is almost distributed in the entire area of ​​the heating element 320, and the pressure applied to the heating element 320 is relatively uniform, which can reduce the thermal resistance between the heating element 320 and the heat conducting element 110, improve the thermal conductivity, and thus ensure the heat dissipation efficiency and performance of the product. The heat dissipation module 100 disclosed in the embodiment of the present disclosure adopts a modular pressure structure design, which can modularly adjust the pressure generated by the heat dissipation module 100. The pressure adjustment can be achieved by adjusting the elasticity and deformation size of the elastic pressing piece 140, which reduces the difficulty of the pressure design of the heat dissipation module 100 and can also improve the versatility of the heat dissipation module 100, so that the heat dissipation module 100 can be applied to different products.

[0075] The heat dissipation module 100 disclosed in the embodiment of the present disclosure is as follows: Figures 7 to 23 As shown, the heat dissipation module 100 has a low impact on the mounting structure of the heating element 320, and there is no need to reserve a connection position 330 on the mounting structure for fastening the heat-conducting element 110, which can greatly expand the design space of the mounting structure. Taking the heat dissipation module 100 for the motherboard 300 as an example, where the chip serves as the heating element 320 and the circuit board 310 serves as the mounting structure, since there is no need to reserve a connection position 330 on the circuit board 310, the space of the circuit board 310 is saved. The electronic components and wiring layout on the circuit board 310 do not need to consider the reservation of the connection position 330. Therefore, the structure of the motherboard 300 can be optimized according to the design requirements of the motherboard 300, making the wiring on the circuit board 310 smoother, increasing the usable area of ​​the circuit board 310, and arranging more electronic components within a limited area, thereby reducing design difficulty and cost.

[0076] The heat dissipation module 100 disclosed in the embodiment of the present disclosure is as follows: Figures 7 to 23 As shown, the heat-conducting element 110 does not need to be fixed to the mounting structure by a plurality of fasteners 15, and the fastening portion 14, the fasteners 15 and the reserved connection position 330 can be eliminated, which not only reduces the design difficulty and cost of the heat dissipation module 100, but also reduces the assembly time of the heat dissipation module 100, reduces the assembly difficulty, simplifies the assembly process, and can adopt automated assembly to reduce assembly costs and improve the overall yield.

[0077] The heat dissipation module 100 disclosed in the embodiment of the present disclosure is as follows: Figures 7 to 23 As shown, the heat dissipation module 100 is provided with an elastic pressing member 140 by an adjacent structure, and does not need to fix the heat conducting element 110 through a mounting structure, thereby reducing the stress on the mounting structure, reducing the risk of damage to the mounting structure due to excessive stress, and avoiding the risk of desoldering and falling of the heating element 320 and other electronic components due to stress deformation of the mounting structure, thereby effectively improving the service life of the heating element 320 and its mounting structure. Figure 28 , which shows a comparison diagram of the stress deformation caused by the mounting structure of the heat dissipation module 10 in the related art and the heat dissipation module 100 in the embodiment of the present disclosure. Figure 28 Point A in the middle shows the stress deformation of the mounting structure caused by the heat dissipation module 10 of the related technology. As can be seen from the figure, after the heat conductor 11 is fastened to the mounting structure by multiple fasteners 15, the mounting structure will be subjected to greater stress, and a greater deformation will be generated at the heating element 320, which will not only easily lead to wiring breakage, but also easily cause the heating element 320 and other electronic components to separate from the tin solder ball 321, resulting in the risk of desoldering and falling. Figure 28 Point B in the middle shows the stress deformation of the mounting structure caused by the heat dissipation module 100 in the embodiment of the present disclosure. As can be seen from the figure, after the heat-conducting element 110 is pressed against the heating element 320 by the relative structure and the elastic pressing piece 140, the mounting structure is subjected to the pressure transmitted by the heating element 320. The stress on the mounting structure is small, and the stress deformation generated is small, that is, it will not cause the wiring to break, nor will it cause the electronic components such as the heating element 320 to separate from the tin solder ball 321, resulting in the risk of desoldering and falling, which can effectively ensure the service life of the heating element 320 and its mounting structure.

[0078] In some embodiments of the present disclosure, the thermal conductive element 110 can be made of a metal material with high thermal conductivity, such as copper. The thermal conductive element 110 can be connected to the first heat transfer end of the heat transfer element 130 by welding or other means, so that the thermal conductive element 110 transfers heat to the heat dissipation element 120 through the heat transfer element 130, and heat is dissipated through the heat dissipation element 120. The specific shape of the thermal conductive element 110 can be adjusted to suit the structure of the heating element 320 and will not be further described here.

[0079] In some embodiments of the present disclosure, the heat dissipation element 120 can be made of a metal material with high thermal conductivity, such as copper. The heat dissipation element 120 can have a heat dissipation fin structure, thereby increasing the heat dissipation area and heat dissipation efficiency of the heat dissipation element 120. The heat dissipation element 120 and the second heat transfer end of the heat transfer element 130 can be connected together by welding or other means to receive heat transferred from the heat conductive element 110 through the heat transfer element 130 and achieve heat dissipation through heat exchange with the surrounding environment. The specific shape of the heat dissipation element 120 can be adaptively adjusted according to the structure of the installation space and will not be described in detail here.

[0080] In some embodiments of the present disclosure, the heat transfer element 130 may be a heat pipe 13 structure and may be made of a copper composite material. The first heat transfer end of the heat transfer element 130 is connected to the heat conducting element 110, and the second heat transfer end is connected to the heat dissipating element 120 to conduct heat through the heat transfer element 130.

[0081] In some embodiments of the present disclosure, the number of heat-conducting elements 110, heat-transfer elements 130, and heat-dissipating elements 120 in the heat-dissipating module 100 can be adjusted according to the heat-dissipating requirements. One heat-conducting element 110 can be connected to one heat-dissipating element 120 through one heat-transfer element 130, one heat-conducting element 110 can be connected to two or more heat-dissipating elements 120 through two or more heat-transfer elements 130, or two or more heat-conducting elements 110 can be connected to one or more heat-dissipating elements 120 respectively through one or more heat-transfer elements 130.

[0082] In some embodiments of the present disclosure, the number of elastic compression members 140 in the heat dissipation module 100 can be adaptively adjusted based on the number and structure of the thermally conductive elements 110 and the number and structure of the heating elements 320. Each thermally conductive element 110 can be provided with one elastic compression member 140, two elastic compression members 140, three elastic compression members 140, four elastic compression members 140, and so on. When the area of ​​the side of the thermally conductive element 110 away from the heating element 320 is larger, the number of elastic compression members 140 can be appropriately increased to ensure a more balanced force on the side of the thermally conductive element 110 away from the heating element 320. When the area of ​​the side of the thermally conductive element 110 away from the heating element 320 is smaller, the number of elastic compression members 140 can be appropriately reduced. This ensures a balanced force on the side of the thermally conductive element 110 away from the heating element 320 while also reducing the cost of the heat dissipation module 100.

[0083] As an optional implementation, Figures 1 to 23As shown, the heat dissipation module 100 also includes: a first positioning element 150, the first positioning element 150 is connected to the heat conducting element 110, the first positioning element 150 is provided with a first positioning portion, and the first positioning portion is connected to the adjacent structure of the heating element 320; and / or, a second positioning element 160, the second positioning element 160 is connected to the heat dissipation element 120, the second positioning element 160 is provided with a second positioning portion, and the second positioning portion is connected to the adjacent structure; and / or, a third positioning element 170, the third positioning element 170 is connected to the heat conducting element 130, the third positioning element 170 is provided with a third positioning portion, and the third positioning portion is connected to the adjacent structure.

[0084] In some embodiments of the present disclosure, Figures 1 to 6 As shown, the heat dissipation module 100 may be provided with a first positioning element 150 connected to the heat-conducting element 110. The first positioning element 150 has a first positioning portion, which is connected to the adjacent structure of the heating element 320. Thus, the heat-conducting element 110 is initially positioned by the first positioning element 150, and the relative positions of the heat-conducting element 110 and the heating element 320 are fixed, thereby ensuring that the heat dissipation module 100 will not shift or fall off during subsequent product assembly, and ensuring that the heat-conducting element 110 will not shift relative to the heating element 320. The heat-conducting element 110 can further be pressed against the heating element 320 by the elastic pressing member 140. Accordingly, in order to connect the first positioning portion to the adjacent structure, a first positioning matching portion 311 can be provided on the adjacent structure to achieve a positioning connection with the first positioning portion. Since the heat-conducting element 110 is pressed against the heat-conducting element 110 by the elastic pressing piece 140, the first positioning element 150 is only used for the preliminary positioning of the heat-conducting element 110, and the first positioning element 150 is almost not subjected to force. Therefore, there are no strict requirements for the connection position of the first positioning portion of the first positioning element 150 at the adjacent position, that is, there are no strict requirements for the setting position of the first positioning matching portion 311, so that the position of the first positioning matching portion 311 can be adaptively adjusted according to the design requirements of the adjacent structure; at the same time, after the first positioning element 150 is connected to the adjacent structure, the adjacent structure is almost not subjected to force, so there is no risk of deformation of the adjacent structure due to force. For example, when the heat dissipation module 100 is used to dissipate heat from the heat-generating element 320 chip in the mainboard 300, the adjacent structure can be the circuit board 310 on which the chip is set, or it can be a back plate 200, a shell, or other structures used to set the circuit board 310; when the circuit board 310 is used as the adjacent structure, the position of the first positioning and fitting portion 311 on the circuit board 310 can be adjusted according to the layout of the electronic components and traces on the circuit board 310, and the first positioning and fitting portion 311 can be set at a position that does not affect the layout of the electronic components and traces on the circuit board 310; when the circuit board 310 is not suitable as an adjacent structure for setting the first positioning and fitting portion 311, the back plate 200 or the shell and other structures can also be used as adjacent structures for setting the first positioning and fitting portion 311.

[0085] In some embodiments of the present disclosure, Figures 1 to 6 As shown, optionally, the first positioning element 150 can be connected to the heat conducting element 110 by welding, riveting or other connection methods.

[0086] In some embodiments of the present disclosure, Figures 1 to 6 As shown, the first positioning portion and the first positioning matching portion 311 can be connected in different ways to preliminarily position the thermal conductive element 110 on the adjacent structure.

[0087] In some embodiments of the present disclosure, optionally, the first positioning portion may be provided with a first positioning hole, and correspondingly, the first positioning fitting portion 311 may be provided with a first positioning column, and the first positioning portion is positioned and connected to the first positioning fitting portion 311 by sleeve-mounting the first positioning hole on the first positioning column, thereby positioning the first positioning portion and the first positioning fitting portion 311, thereby positioning the first positioning member on the adjacent structure. Optionally, the first positioning hole may be circular, and correspondingly, the first positioning column may be cylindrical. Optionally, the first positioning hole may be a non-centrally symmetrical shape such as a rectangle, a trapezoid, or a triangle, and correspondingly, the first positioning column may be a corresponding columnar structure, so that after the first positioning hole is sleeved on the first positioning column, the first positioning hole cannot rotate around the first positioning column, thereby making the positioning of the heat-conducting element 110 on the adjacent structure more accurate and stable. Optionally, the column body of the first positioning column is shrinkable and expandable. When an external force squeezes the column body, the column body can shrink, so that the first positioning hole can be smoothly mounted on the column body and accurately reach a preset position. When the external force squeezing the column body disappears, the column body can expand, thereby limiting the position of the first positioning hole, so that the first positioning hole is fixed relative to the position of the first positioning column, so as to position and connect the first positioning portion with the first positioning matching portion, thereby achieving the preliminary positioning of the heat-conducting element 110 on the adjacent structure, so that the relative position of the heat-conducting element 110 and the heating element 320 is fixed.

[0088] In some embodiments of the present disclosure, optionally, the first positioning portion may be provided with a first positioning hole, and accordingly, the first positioning matching portion 311 may be provided with a first positioning column, and the first positioning column is provided with a screw hole. The first positioning hole is floated on the first positioning column and locked on the first positioning column by a screw, so that the first positioning portion and the first positioning matching portion 311 are positioned and connected, thereby positioning the first positioning member on the adjacent structure.

[0089] In some embodiments of the present disclosure, optionally, the first positioning portion may be provided with a first positioning hole, and correspondingly, the first positioning matching portion 311 may be provided with a first threaded hole. The first positioning portion and the first positioning matching portion 311 are positioned and connected by inserting a screw into the first positioning hole and threading the screw with the first threaded hole, so that the first positioning portion and the first positioning matching portion 311 are positioned and connected, thereby positioning the first positioning member on the adjacent structure.

[0090] In some embodiments of the present disclosure, optionally, the first positioning portion may be provided with a first snap fit portion, and correspondingly the adjacent structure may be provided with a first snap fit portion matching the first snap fit portion. The first positioning portion may be connected to the adjacent structure by a snap connection between the first snap fit portion and the first snap fit portion, so as to position the first positioning member on the adjacent structure.

[0091] In some embodiments of the present disclosure, Figures 1 to 6 As shown, optionally, the heat dissipation module 100 may be provided with only one first positioning element 150 ; correspondingly, only one first positioning matching portion 311 is provided on the adjacent structure.

[0092] In some embodiments of the present disclosure, Figures 1 to 6 As shown, optionally, the heat dissipation module 100 may also be provided with more than two first positioning elements 150, and accordingly, the adjacent structure is provided with first positioning matching portions 311 corresponding to the number of the first positioning elements 150, so that the heat-conducting element 110 can be initially positioned by the more than two first positioning elements 150, thereby improving the positioning effect of the heat-conducting element 110.

[0093] In some embodiments of the present disclosure, Figures 1 to 6As shown, the heat dissipation module 100 can be provided with a second positioning element 160 connected to the heat dissipation element 120. The second positioning element 160 has a second positioning portion, which is connected to the adjacent structure of the heating element 320. Thus, the heat dissipation element 120 is initially positioned and fixed by the second positioning element 160, so that the relative position of the heat dissipation element 120 and the adjacent structure is fixed, ensuring that the heat dissipation module 100 does not shift or fall off during subsequent product assembly. At the same time, because the heat conductive element 110 is connected to the heat dissipation element 120 via the heat transfer element 130, when the heat dissipation element 120 is fixed relative to the adjacent structure, the relative position of the heat conductive element 110 and the heating element 320 is fixed, ensuring that the heat conductive element 110 does not shift relative to the heating element 320, and the heat conductive element 110 can be further pressed against the heating element 320 by the elastic pressing member 140. Accordingly, in order to connect the second positioning portion to the adjacent structure, the adjacent structure can be provided with a second positioning mating portion 311 for positioning and connecting with the second positioning portion. In the heat dissipation module 100, there are no strict requirements for the placement of the heat dissipation element 120, that is, there are no strict requirements for the placement of the second positioning and fitting portion 311. Therefore, the position of the second positioning and fitting portion 311 can be adaptively adjusted according to the design requirements of adjacent structures. For example, when the heat dissipation module 100 is used to dissipate heat from the heat-generating element 320 chip on the motherboard 300, the adjacent structure can be the circuit board 310 on which the chip is mounted, or it can be a backplane 200, a housing, or other structure used to mount the circuit board 310. To improve heat dissipation efficiency, the second positioning and fitting portion 311 can be positioned relatively far away from the heat-generating element 320 chip, that is, the second positioning and fitting portion 311 can be positioned on an adjacent structure such as the backplane 200 or the housing.

[0094] In some embodiments of the present disclosure, Figures 1 to 6 As shown, optionally, the second positioning element 160 can be connected to the heat dissipation element 120 by welding, riveting or other connection methods.

[0095] In some embodiments of the present disclosure, Figures 1 to 6 As shown, the second positioning portion and the second positioning and matching portion 311 can be connected in different ways to preliminarily position and fix the heat dissipation element 120 to the adjacent structure. The connection method between the second positioning portion and the second positioning and matching portion 311 can be the same as the connection method between the first positioning portion and the first positioning and matching portion 311 described above, and will not be repeated here.

[0096] In some embodiments of the present disclosure, Figures 1 to 6 As shown, optionally, the heat dissipation module 100 may be provided with only one second positioning element 160 ; correspondingly, only one second positioning matching portion 311 is provided on the adjacent structure.

[0097] In some embodiments of the present disclosure, Figures 1 to 6 As shown, the heat dissipation module 100 may also be provided with more than two second positioning elements 160. Accordingly, the adjacent structure is provided with second positioning matching portions 311 corresponding to the number of the second positioning elements 160, so that the heat dissipation element 120 can be initially positioned and fixed by more than two second positioning elements 160, thereby improving the fixing effect of the heat dissipation element 120.

[0098] In some embodiments of the present disclosure, Figures 1 to 6 As shown, the heat dissipation module 100 may be provided with a third positioning element 170 connected to the heat transfer element 130. The third positioning element 170 includes a third positioning portion, which is connected to the adjacent structure of the heating element 320. This allows the heat transfer element 130 to be initially positioned and fixed via the third positioning element 170, securing the relative position of the heat transfer element 130 to the adjacent structure and preventing the heat dissipation module 100 from shifting or falling off during subsequent product assembly. Simultaneously, since the heat conductive element 110 is connected to the heat transfer element 130, when the heat conductive element 130 is fixed relative to the adjacent structure, the relative position of the heat conductive element 110 to the heating element 320 is fixed, ensuring that the heat conductive element 110 does not shift relative to the heating element 320. Furthermore, the elastic pressing member 140 can be used to press the heat conductive element 110 against the heating element 320. Accordingly, to connect the third positioning portion to the adjacent structure, a third positioning mating portion 311 may be provided on the adjacent structure to engage with the third positioning portion for positioning. In the heat dissipation module 100, there are no strict requirements for the placement of the heat transfer element 130, specifically, the placement of the third positioning and fitting portion 311. Therefore, the position of the third positioning and fitting portion 311 can be adaptively adjusted based on the design requirements of adjacent structures. For example, when the heat dissipation module 100 is used to dissipate heat from a heat-generating component 320 chip on a motherboard 300, the adjacent structure can be the circuit board 310 where the chip is mounted, or a backplane 200, a housing, or other structure where the circuit board 310 is mounted. The third positioning and fitting portion 311 can be positioned on adjacent structures such as the backplane 200 or the housing, thereby avoiding the need for the third positioning portion to be positioned on the circuit board 310 and ensuring sufficient space for the layout of electronic components and wiring on the circuit board 310.

[0099] In some embodiments of the present disclosure, Figures 1 to 6 As shown, optionally, the third positioning element 170 can be connected to the heat transfer element 130 by welding, riveting or other connection methods.

[0100] In some embodiments of the present disclosure, Figures 1 to 6As shown, the third positioning portion and the third positioning and matching portion 311 can be connected in different ways to preliminarily position and secure the heat transfer element 130 to the adjacent structure. The connection method between the third positioning portion and the third positioning and matching portion 311 can be the same as the connection method between the first positioning portion and the first positioning and matching portion 311 described above, and will not be repeated here.

[0101] In some embodiments of the present disclosure, Figures 1 to 6 As shown, optionally, the heat dissipation module 100 may be provided with only one third positioning element 170 ; correspondingly, only one third positioning matching portion 311 is provided on the adjacent structure.

[0102] In some embodiments of the present disclosure, Figures 1 to 6 As shown, the heat dissipation module 100 may also be provided with more than two third positioning elements 170. Accordingly, the adjacent structure is provided with third positioning matching portions 311 corresponding to the number of the third positioning elements 170, so that the heat transfer element 130 can be initially positioned and fixed by more than two third positioning elements 170, thereby improving the fixing effect of the heat transfer element 130.

[0103] In some embodiments of the present disclosure, Figures 1 to 6 As shown, the heat dissipation module 100 may be provided with only one of the first positioning element 150, the second positioning element 160, and the third positioning element 170; the heat dissipation module 100 may also be provided with any two of the first positioning element 150, the second positioning element 160, and the third positioning element 170; the heat dissipation module 100 may also be provided with the first positioning element 150, the second positioning element 160, and the third positioning element 170 simultaneously. The heat dissipation module 100 can be appropriately adjusted and selected based on the installation position and installation space of the heat conductive element 110, the heat dissipation element 120, and the heat transfer element 130, and will not be further described here.

[0104] As an optional implementation, Figures 1 to 23 As shown, the elastic pressing member 140 includes any one of a compression spring, a spring sheet and an elastic member, the first pressing end 141 is connected to or abuts against the heat conducting element 110 ; the second pressing end 142 is connected to or abuts against the opposite structure.

[0105] In some embodiments of the present disclosure, the elastic pressure member 140 may include any one of a compression spring, a spring sheet, and an elastic member, so that the reaction force generated by the compression of the compression spring, spring sheet, elastic member, etc. generates pressure applied to the thermal conductive element 110.

[0106] In some embodiments of the present disclosure, the first pressing end 141 is connected to or abuts the heat-conducting element 110, and the second pressing end 142 is connected to or abuts the opposing structure. That is, the elastic pressing member 140 is disposed between the heat-conducting element 110 and the opposing structure. When the opposing structure is installed, the elastic pressing member 140 can be compressed by the opposing structure, so that the reaction force generated by the elastic pressing member 140 is applied as pressure to the heat-conducting element 110. Optionally, the elastic pressing member 140 can be disposed in a manner such that the first pressing end 141 abuts the heat-conducting element 110 and the second pressing end 142 is connected to the opposing structure; the elastic pressing member 140 can also be disposed in a manner such that the first pressing end 141 is connected to the heat-conducting element 110 and the second pressing end 142 abuts the opposing structure; the elastic pressing member 140 can also be disposed in a manner such that the first pressing end 141 abuts the heat-conducting element 110 and the second pressing end 142 abuts the opposing structure.

[0107] In some embodiments of the present disclosure, when the first heat transfer end of the heat transfer element 130 is connected to the heat conducting element 110 and has an overlapping area, the first pressing end 141 of the elastic pressing member 140 can abut or connect with the overlapping area of ​​the heat transfer element 130 and the heat conducting element 110, thereby achieving an indirect abutment or connection between the first pressing end 141 and the heat conducting element 110 through the heat transfer element 130. Alternatively, the first pressing end 141 can directly abut or connect with the overlapping area of ​​the heat transfer element 130 and the heat conducting element 110, or a flat plate can be directly provided between the overlapping area of ​​the heat transfer element 130 and the heat conducting element 110 and the first pressing end 141 to balance the pressure applied by the first pressing end 141. It should be noted that when the first pressing end 141 is indirectly abutted or connected to the heat transfer element 110 through the heat transfer element 130, it is necessary to ensure that the pressure generated by the elastic pressing piece 140 is relatively small to avoid deformation of the heat transfer element 130 due to the pressure generated by the elastic pressing piece 140.

[0108] In some embodiments of the present disclosure, Figures 1 to 4 As shown, the elastic pressure member 140 may include a compression spring, and the second compression end 142 of the compression spring may be connected to the relative structure. When the relative structure is installed, the first compression end 141 of the compression spring may be brought into contact with the heat-conducting element 110, thereby applying the pressure (elastic force) generated by the compression of the compression spring to the heat-conducting element 110. Optionally, the magnitude of the pressure (elastic force) generated by the compression of the compression spring may be adjusted by adjusting parameters such as the working height and required force of the compression spring.

[0109] In some embodiments of the present disclosure, Figure 5 and Figure 6As shown, the elastic pressure member 140 may include a spring, and the second pressing end 142 of the spring may be connected to the relative structure. The first pressing end 141 of the spring is freely tilted toward the heat-conducting element 110. When the relative structure is installed, the first pressing end 141 of the spring can be brought into contact with the heat-conducting element 110, thereby applying pressure (elastic force) generated by the deformation of the spring to the heat-conducting element 110. Optionally, the magnitude of the pressure (elastic force) generated by the deformation of the spring can be adjusted by adjusting parameters such as the size and elasticity of the spring.

[0110] As an optional implementation, Figures 1 to 23 As shown, the first pressing end 141 is provided with a pressure equalizing plate 1411 , and the first pressing end 141 is connected to or abuts against the heat conducting element 110 through the pressure equalizing plate 1411 .

[0111] In some embodiments of the present disclosure, Figure 2 As shown, a pressure equalizing plate 1411 can be provided at the first pressing end 141 of the elastic pressing member 140, so that the first pressing end 141 is connected or abutted against the heat conducting element 110 via the equalizing plate, thereby increasing the force-bearing area of ​​the elastic pressing member 140 and the heat conducting element 110, thereby more evenly applying force to the heat conducting element 110. The provision of the pressure equalizing plate 1411 can, to a certain extent, prevent the uneven local pressure on the heat conducting element 110 caused by the uneven end surface of a compression spring when the elastic pressing member 140 is used.

[0112] As an optional implementation, Figures 1 to 23 As shown, the heat-conducting element 110 includes a first heat-conducting surface and a second heat-conducting surface. The first heat-conducting surface is used to fit with the heating element 320, and the second heat-conducting surface is provided with a first compression limit portion 111, which is used to connect or abut with the first compression end 141.

[0113] In some embodiments of the present disclosure, Figure 4 As shown, the heat-conducting element 110 includes a first heat-conducting surface and a second heat-conducting surface. The first heat-conducting surface is used to fit with the heating element 320, so that heat conduction between the heat-conducting element 110 and the heating element 320 is achieved through the first heat-conducting surface; the second heat-conducting surface is provided with a first compression limiting portion 111, and the first compression limiting portion 111 is used to connect or abut with the first compression end 141. The first compression limiting portion 111 can be used to limit the first compression end 141 of the elastic pressing piece 140. On the one hand, when the relative structure is installed, the first compression end 141 can be accurately abutted or connected within the area defined by the first compression limiting portion 111; on the other hand, the elastic pressing piece 140 can transfer pressure to the heat-conducting element 110 and the heating element 320 fitted with the heat-conducting element 110 through the first compression limiting portion 111.

[0114] In some embodiments of the present disclosure, the first heat-conducting surface and the second heat-conducting surface are arranged opposite to each other. When the second heat-conducting surface is subjected to the force of the elastic pressing piece 140, the pressure can be vertically transferred to the first heat-conducting surface, so that the first heat-conducting surface is attached to the heating element 320.

[0115] In some embodiments of the present disclosure, optionally, the shape of the first heat conducting surface can be adaptively adjusted according to the structure of the heating element 320 .

[0116] In some embodiments of the present disclosure, the heat conducting element 110 may optionally have a reserved pressing area on the second heat conducting surface, in which a first pressing and retaining portion 111 is disposed. To ensure balanced force on the heat conducting element 110, the area where the first pressing and retaining portion 111 is located needs to have a certain structural strength and a sufficient surface area for contact with the first pressing end 141 needs to be reserved.

[0117] As an optional implementation, Figures 1 to 23 As shown, the second heat conducting surface is provided with first pressing and limiting portions 111 that match the number of the elastic pressing members 140 , and the first pressing and limiting portions 111 are evenly distributed on the second heat conducting surface.

[0118] In some disclosed embodiments, such as Figure 4 As shown, the second heat-conducting surface is provided with first pressing and limiting parts 111 that match the number of elastic pressing parts 140. The first pressing and limiting parts 111 are evenly distributed on the second heat-conducting surface, so that the pressure applied by the elastic pressing parts 140 to the second heat-conducting surface can be more balanced. Optionally, when the heat dissipation module 100 is provided with an elastic pressing part 140, the second heat-conducting surface is provided with a first pressing and limiting part 111, and the first pressing and limiting part 111 can be located at the center of the second heat-conducting surface. Optionally, as Figure 4 As shown, when the heat dissipation module 100 is provided with four elastic pressing members 140 , the second heat conducting surface is provided with four first pressing and limiting portions 111 , and the four first pressing and limiting portions 111 can be symmetrically located on the symmetry axis of the second heat conducting surface.

[0119] As an optional implementation, Figures 1 to 23 As shown, the first pressing and limiting portion 111 is a groove or a protrusion.

[0120] In some embodiments of the present disclosure, Figure 3 As shown, optionally, the first pressing and limiting portion 111 can be a groove provided on the heat conducting element 110 and recessed relative to the second heat conducting surface, thereby limiting the first pressing and limiting end 141 in the groove.

[0121] In some embodiments of the present disclosure, optionally, the first compression limiting portion 111 can be a protrusion provided on the heat-conducting element 110 and protruding relative to the second heat-conducting surface, so that the first compression end 141 can be limited around the protrusion by being sleeved on the protrusion.

[0122] Based on the same inventive concept, the present disclosure discloses a display device, such as Figures 7 to 23 As shown, the display device includes a back panel 200, a main board 300 arranged on the back panel 200, a rear shell 400 covering the main board 300, and the above-mentioned heat dissipation module 100, the main board 300 includes a circuit board 310 and a heating element 320 arranged on the circuit board 310, and the relative structure is selected from the rear shell 400.

[0123] Since the display device of the present disclosure includes the heat dissipation module 100 of the above technical solution, the display device of the present disclosure has all the beneficial effects of the above heat dissipation module 100, which will not be described in detail here.

[0124] In some embodiments of the present disclosure, Figures 7 to 23 As shown, in the display device, the main board 300 is arranged on the back plate 200, and the circuit board 310 of the main board 300 can be arranged on the back plate 200. Usually, the heating element 320 chip of the main board 300 can be located on the side of the circuit board 310 away from the back plate 200, and the main board 300 is covered by the rear shell 400 so that the main board 300 is located between the back plate 200 and the rear shell 400, that is, the rear shell 400 is located at a position opposite to and spaced apart from the heating element 320 chip. The heat dissipation module 100 includes a heat conducting element 110, a heat dissipation element 120, a heat transfer element 130 and at least one elastic pressing piece 140. The heat conducting element 110 is fitted with the heating element 320, and the first pressing end 141 of the elastic pressing piece 140 is abutted or connected to the heat conducting element 110. The second pressing end 142 of the elastic pressing piece 140 is used to connect or abut with the relative structures of the heating element 320 that are opposite and spaced apart. After the rear shell 400 is installed, the elastic pressing piece 140 can be compressed by the rear shell 400, causing the elastic pressing piece 140 to deform and apply pressure to the side of the heat conducting element 110 away from the heating element 320, so that the heat conducting element 110 can be pressed tightly against the chip of the heating element 320 to dissipate heat from the chip of the heating element 320.

[0125] In some embodiments of the present disclosure, Figures 7 to 23 As shown, the display device can be a display product such as a notebook computer, an all-in-one computer, or a tablet computer.

[0126] As an optional implementation, Figures 7 to 23As shown, the heat dissipation module 100 also includes: a first positioning element 150, the first positioning element 150 is connected to the heat conducting element 110, the first positioning element 150 is provided with a first positioning portion, and the first positioning portion is connected to the adjacent structure of the heating element 320; and / or, a second positioning element 160, the second positioning element 160 is connected to the heat dissipation element 120, the second positioning element 160 is provided with a second positioning portion, and the second positioning portion is connected to the adjacent structure; and / or, a third positioning element 170, the third positioning element 170 is connected to the heat conducting element 130, the third positioning element 170 is provided with a third positioning portion, and the third positioning portion is connected to the adjacent structure; the adjacent structure is selected from the back panel 200 and / or the circuit board 310.

[0127] In some embodiments of the present disclosure, Figures 7 to 23 As shown, in the display device, the adjacent structures can be selected from the back panel 200 and / or the circuit board 310, so that the first positioning unit, the second positioning unit, and the third positioning unit can be positioned through the back panel 200 and / or the circuit board 310, so as to position or fix any one, two, or three of the heat conducting element 110, the heat transfer element 130, and the heat dissipation element 120, to ensure that the heat dissipation module 100 will not be offset or fall off during the subsequent product assembly process.

[0128] As an optional implementation, Figures 7 to 23 As shown, a second compression-fixing limiting portion 410 is provided on the rear shell 400 , and the second compression-fixing limiting portion 410 is used to connect with or abut against the second compression end 142 .

[0129] In some embodiments of the present disclosure, Figures 7 to 23 As shown, a second compression limit portion 410 is provided on the rear shell 400, and the second compression limit portion 410 is used to connect or abut with the second compression end 142. The second compression limit portion 410 can be used to limit the second compression end 142 of the elastic compression piece 140, so that when the rear shell 400 is installed as a relative structure, the second compression end 142 can accurately abut or connect within the area defined by the second compression limit portion 410.

[0130] In some embodiments of the present disclosure, Figures 7 to 23 As shown, the second pressing limiter 410 can be connected to the second pressing end 142 to fix the elastic pressing member 140 on the rear housing 400 as an opposing structure to prevent the elastic pressing member 140 from falling off the rear housing 400. At this time, the first pressing end 141 can be brought into contact with the thermal conductive element 110. When the rear housing 400 is installed, the first pressing end 141 of the elastic pressing member 140 is brought into contact with the thermal conductive element 110.

[0131] In some embodiments of the present disclosure, Figures 7 to 23As shown, the second pressing limiter 410 can abut against the second pressing end 142. At this time, the first pressing end 141 can be connected to the heat conducting element 110 to fix the elastic pressing member 140 on the heat conducting element 110 and prevent the elastic pressing member 140 from falling off the heat conducting element 110. When the rear housing 400 is installed, the second pressing end 142 of the elastic pressing member 140 abuts against the rear housing 400.

[0132] In some embodiments of the present disclosure, Figures 7 to 23 As shown, when the second compression-fixing portion 410 abuts the second compression-fixing end 142, the second compression-fixing portion 410 is a groove or a protrusion. Alternatively, the second compression-fixing portion 410 can be a groove provided on the rear housing 400, thereby confining the second compression-fixing end 142 within the groove. Alternatively, the second compression-fixing portion 410 can be a protrusion provided on the rear housing 400, thereby confining the second compression-fixing end 142 around the protrusion by fitting the second compression-fixing end 142 around the protrusion.

[0133] As an optional implementation, Figures 7 to 23 As shown, the rear shell 400 is provided with a reinforcement connection portion 420 around the second compression limit portion 410, and the reinforcement connection portion 420 is used to connect with the back plate 200; and / or, the rear shell 400 is provided with a reinforcement buckle 430, and the reinforcement buckle 430 is used to connect with the back plate 200; and / or, the rear shell 400 is provided with reinforcement ribs.

[0134] In some embodiments of the present disclosure, Figure 20 As shown, by providing some reinforcement structures on the rear cover 400, deformation of the rear cover 400 under the reaction force of the elastic pressing member 140 can be avoided to a certain extent. After the display device is mounted on the rear cover 400, the elastic pressing member 140 is located between the thermal conductive element 110 and the rear cover 400, generating a reaction force not only on the thermal conductive element 110 but also on the rear cover 400 to a certain extent, causing the rear cover 400 to deform under the reaction force of the elastic pressing member 140.

[0135] In some embodiments of the present disclosure, Figure 20As shown, optionally, the rear shell 400 is provided with a reinforcing connection portion 420 around the second pressing limit portion 410, and the reinforcing connection portion 420 is used to connect with the back plate 200 to increase the connection strength between the rear shell 400 and the back plate 200, and limit the relative distance between the rear shell 400 and the back plate 200, so as to avoid deformation of the rear shell 400 around the second pressing limit portion 410 to a certain extent. For example, the reinforcing connection portion 420 can be provided with a screw hole, and connected to the back plate 200 through a connecting member such as a screw passing through the screw hole, so as to lock the rear shell 400 and the back plate 200 together by the screw. Optionally, the position and number of the reinforcing connection portion 420 can be adaptively adjusted according to the setting position and number of the elastic pressing member 140, which will not be repeated here. In some embodiments of the present disclosure, such as Figure 20 As shown, the rear housing 400 is optionally provided with a reinforcement buckle 430, which is used to connect to the back plate 200. The reinforcement buckle 430 thus enhances the connection strength between the rear housing 400 and the back plate 200, thereby preventing deformation of the rear housing 400 to a certain extent. Optionally, the position and number of the reinforcement buckles 430 can be adaptively adjusted according to the position and number of the elastic pressing members 140, and will not be further described here.

[0136] In some embodiments of the present disclosure, Figure 20 As shown, the rear shell 400 is optionally provided with reinforcing ribs, thereby increasing the structural strength of the rear shell 400 itself and preventing deformation of the rear shell 400 to a certain extent. Optionally, the position and number of the reinforcing ribs can be adaptively adjusted according to the position and number of the elastic pressing members 140, which will not be described in detail here.

[0137] As an optional implementation, Figures 7 to 23 As shown, the connection method between the second pressing end 142 and the second pressing limiter 410 is selected from snap connection, bolt connection, riveting, welding, plug-in connection and gluing; or, the elastic pressing member 140 is pre-embedded in the second pressing limiter 410.

[0138] In some embodiments of the present disclosure, Figures 7 to 23 As shown, the connection method between the second pressing end 142 and the second pressing limiter 410 is selected from snap connection, bolt connection, riveting, welding, plug connection and adhesive connection. The connection method between the second pressing end 142 and the second pressing limiter 410 can be appropriately selected according to design requirements. Figure 2 As shown, when the elastic pressing piece 140 includes a compression spring, the second compression limit portion 410 can be provided with an annular clip with an opening, so that the second compression end 142 of the compression spring is clipped into the annular clip through the opening, thereby connecting the compression spring to the second compression limit portion 410.

[0139] As an optional implementation, Figures 7 to 23 As shown, the second compression limit portion 410 is provided with a retractable pressing module 440, which passes through the rear shell 400. The retractable pressing module 440 includes a retractable end and a pressing end. The retractable end is connected or abutted with the second compression end 142, and the pressing end is located on the side of the rear shell 400 away from the main board 300.

[0140] In some embodiments of the present disclosure, Figures 7 to 23 As shown, the second pressing and limiting portion 410 is provided with a retractable pressing module 440, which penetrates the rear shell 400. The retractable pressing module 440 includes a retractable end and a pressing end. The pressing end can be arranged opposite to the retractable end. By connecting or abutting the retractable end with the second pressing end 142, and positioning the pressing end on the side of the rear shell 400 away from the mainboard 300, after the rear shell 400 as a relative structure is assembled, as shown in FIG. Figure 23 As shown, the retractable pressing module 440 can be in a contracted state, and the retractable pressing module 440 has no force on the elastic pressing member 140, so that the elastic pressing member 140 is in an uncompressed or slightly compressed state, and the elastic pressing member 140 has no or generates a small reaction force on the heat conducting element 110; when the heating element 320 needs to dissipate heat or the display device is working, as shown in FIG. Figure 22 As shown, by pressing the pressing end, the retractable pressing module 440 can be in an extended state and maintained in the extended state, and the retractable pressing module 440 generates a force on the elastic pressing member 140, so that the elastic pressing member 140 is in a compressed state and maintained in the compressed state, and the elastic pressing member 140 generates a reaction force acting on the heat-conducting element 110. In other words, by providing the retractable pressing module 440 at the second pressing limit end, the compression state of the elastic pressing member 140 can be adjusted by the retractable pressing module 440, thereby adjusting the working mode of the heat dissipation module 100. Based on the same inventive concept, the embodiment of the present disclosure discloses an electronic device, which includes a mainboard 300 and the above-mentioned heat dissipation module 100, and the mainboard 300 includes a circuit board 310 and a heating element 320 provided on the circuit board 310.

[0141] Since the electronic device of the present disclosure includes the heat dissipation module 100 of the above technical solution, the electronic device of the present disclosure has all the beneficial effects of the above heat dissipation module 100 , which will not be described in detail here.

[0142] In some embodiments of the present disclosure, the electronic device may be an electronic product such as a computer host having a heating element 320. Those skilled in the art may set the heat dissipation module 100 of the embodiment of the present disclosure according to the heat dissipation requirements of the heating element 320. The setting method of the heat dissipation module 100 has been described in detail in the previous text and will not be repeated here.

[0143] In the present disclosure, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0144] In this disclosure, unless otherwise expressly specified or limited, the terms "connect," "fix," etc. should be understood in a broad sense. For example, "fix" can mean a fixed connection, a detachable connection, or an integral connection; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean internal communication between two elements or an interaction between two elements, unless otherwise expressly specified. Those skilled in the art will understand the specific meanings of the above terms in this disclosure based on specific circumstances.

[0145] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this disclosure, "plurality" means two or more, unless otherwise specifically defined.

[0146] Although the embodiments of the present disclosure have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations may be made to the embodiments without departing from the principles and spirit of the present disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipation module, characterized in that: The heat dissipation module includes: A heat-conducting element, the heat-conducting element being adapted to be attached to the heating element; heat dissipation components; a heat transfer element, the heat transfer element comprising a first heat transfer end and a second heat transfer end, the first heat transfer end being connected to the heat conducting element, and the second heat transfer end being connected to the heat dissipating element; and At least one elastic pressing piece, the elastic pressing piece includes a first pressing end and a second pressing end, the first pressing end abuts or connects with the heat-conducting element, and the second pressing end is used to connect or abut with the relative structure opposite and spaced apart from the heating element to press the heat-conducting element onto the heating element.

2. The heat dissipation module according to claim 1, wherein: The heat dissipation module further includes: a first positioning element, the first positioning element being connected to the heat-conducting element, the first positioning element being provided with a first positioning portion, the first positioning portion being connected to an adjacent structure of the heating element; and / or A second positioning element, the second positioning element is connected to the heat dissipation element, the second positioning element is provided with a second positioning portion, and the second positioning portion is connected to the adjacent structure; and / or, A third positioning element is connected to the heat transfer element. The third positioning element is provided with a third positioning portion, and the third positioning portion is connected to the adjacent structure.

3. The heat dissipation module according to claim 1 or 2, wherein: The elastic pressing member includes any one of a compression spring, a spring sheet and an elastic member. The first pressing end is connected to or abuts against the heat conducting element; and the second pressing end is connected to or abuts against the relative structure.

4. The heat dissipation module according to claim 3, wherein: The first pressing end is provided with a pressure equalizing plate, and the first pressing end is connected to or abuts against the heat conducting element through the pressure equalizing plate.

5. The heat dissipation module according to claim 3, wherein: The heat-conducting element includes a first heat-conducting surface and a second heat-conducting surface. The first heat-conducting surface is used to fit the heating element. The second heat-conducting surface is provided with a first pressing limit portion. The first pressing limit portion is used to connect or abut against the first pressing end.

6. The heat dissipation module according to claim 5, wherein: The second heat-conducting surface is provided with first pressing and limiting parts whose number matches the elastic pressing parts, and the first pressing and limiting parts are evenly distributed on the second heat-conducting surface.

7. The heat dissipation module according to claim 6, wherein: The first pressing and limiting portion is a groove or a protrusion.

8. A display device, characterized in that: The display device includes a back panel, a main board arranged on the back panel, a rear shell covering the main board, and a heat dissipation module as described in any one of claims 1 to 7, the main board includes a circuit board and the heating element arranged on the circuit board, and the relative structure is selected from the rear shell.

9. The display device according to claim 8, wherein The heat dissipation module further includes: a first positioning element, the first positioning element being connected to the heat-conducting element, the first positioning element being provided with a first positioning portion, the first positioning portion being connected to an adjacent structure of the heating element; and / or A second positioning element, the second positioning element is connected to the heat dissipation element, the second positioning element is provided with a second positioning portion, and the second positioning portion is connected to the adjacent structure; and / or, a third positioning element, the third positioning element being connected to the heat transfer element, the third positioning element being provided with a third positioning portion, the third positioning portion being connected to the adjacent structure; The adjacent structure is selected from the back plate and / or the circuit board.

10. The display device according to claim 8, wherein The rear shell is provided with a second pressing and limiting portion, and the second pressing and limiting portion is used to connect with or abut against the second pressing end.

11. The display device according to claim 10, wherein The rear shell is provided with a reinforcement connection portion around the second compression limit portion, and the reinforcement connection portion is used to connect to the back plate; and / or the rear shell is provided with a reinforcement buckle, and the reinforcement buckle is used to connect to the back plate; and / or the rear shell is provided with reinforcement ribs.

12. The display device according to claim 10, wherein The connection method between the second pressing end and the second pressing limit part is selected from snap connection, bolt connection, riveting, welding, plug-in connection and adhesive connection; or, the second pressing end is pre-buried in the second pressing limit part.

13. The display device according to any one of claims 10 to 12, wherein: The second pressing limit portion is provided with a retractable pressing module, which passes through the rear shell. The retractable pressing module includes a retractable end and a pressing end. The retractable end is connected or abutted with the second pressing end, and the pressing end is located on the side of the rear shell away from the main board.

14. An electronic device, characterized in that: The electronic device includes a mainboard and the heat dissipation module according to any one of claims 1 to 7, wherein the mainboard includes a circuit board and the heating element arranged on the circuit board.

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