Electronic device

Abstract

The utility model provides an electronic device. The electronic device comprises a carrier; an electronic component disposed on the carrier; a clip having a first end connected to the carrier and a second end extending over the electronic component; and the stress release structure is arranged between the second end part of the clamping piece and the electronic element. The utility model aims to provide an electronic device so as to at least improve the yield of the electronic device.

Description

Technical Field

[0001] The utility model relates to an electronic device. Background Art

[0002] Figure 1 The power module of the prior art is shown. The power module uses a large current. In order to effectively transmit the current, the solder 1 is usually printed on a large area (for example, the top surface area of ​​the chip 2 is greater than 2mm*2mm). The area where the solder 1 is connected to the chip 2 and the clip 3 is quite considerable. Figure 2 Schematic diagram showing the thermal expansion and contraction of solids Figure 4 , Figure 3 The strain diagram of solder 1 (made of Al) and chip 2 (made of Si) is shown. Figure 5 ,in, represents the thermal strain of Al material, represents the elastic strain of Al material, represents the plastic strain of Al material, represents the thermal strain of Si material, The elastic strain of the Si material is represented by the larger printing area of ​​the solder 1. The corresponding problem caused by the mismatch of the coefficient of thermal expansion (CTE) will be more obvious and serious. The surface of the chip 2 usually has a metal coating. Figure 4 An electron microscope image of the interface 6 (i.e., the metal plating layer) between the chip 2 and the solder 1 is shown. Under the action of a large current, continuous temperature increase and decrease can easily cause cracks 7 to form at the edge of the joint between the solder 1 and the chip 2. Utility Model Content

[0003] In view of the problems existing in the related art, the purpose of the present invention is to provide an electronic device to at least improve the yield rate of the electronic device.

[0004] To achieve the above-mentioned objectives, the present invention provides an electronic device, comprising: a carrier; an electronic component, arranged on the carrier; a clip, having a first end connected to the carrier and a second end extending on the electronic component; and a stress relief structure, arranged between the second end of the clip and the electronic component.

[0005] In some embodiments, the electronic device further includes: an electrical connection structure disposed between the second end portion of the clip and the electronic component and electrically connecting the second end portion and the electronic component, wherein the electrical connection structure is separated by the stress relief structure.

[0006] In some embodiments, the material of the electrical connection structure is conductive paste.

[0007] In some embodiments, the thermal expansion coefficient of the electronic component and the thermal expansion coefficient of the electrical connection structure are different.

[0008] In some embodiments, the stress relief structure is a non-conductive structure.

[0009] In some embodiments, the material of the stress relief structure is a non-conductive paste.

[0010] In some embodiments, the stress relief structure bisects the top surface of the electronic component.

[0011] In some embodiments, a plurality of stress relief structures are disposed on the top surface of the electronic component.

[0012] In some embodiments, the stress relief structure extends from a first side of the electronic component to a second side opposite the first side.

[0013] In some embodiments, opposite ends of the stress relief structure are aligned with the first side and the second side, respectively.

[0014] In some embodiments, the clip extends in a direction from the first end to the second end.

[0015] In some embodiments, an extension direction of the stress relief structure is perpendicular to an extension direction of the clip.

[0016] In some embodiments, the carrier is a lead frame.

[0017] In some embodiments, the material of the clip is copper.

[0018] In some embodiments, the surface of the electronic component facing the clip is provided with a metal layer.

[0019] An embodiment of the present application also provides an electronic device, comprising: a carrier; an electronic component disposed on the carrier; a clip having a first end connected to the carrier and a second end extending on the electronic component; an electrical connection structure disposed between the second end of the clip and the electronic component and electrically connecting the second end and the electronic component; and a stress release structure disposed in the electrical connection structure and separating the electrical connection structure.

[0020] In some embodiments, opposite ends of the stress relief structure are respectively aligned with a first side and a second side opposite to the first side of the electrical connection structure.

[0021] In some embodiments, the first side and the second side of the electrical connection structure are aligned with corresponding side surfaces of the electronic component.

[0022] In some embodiments, an extension direction of the stress relief structure is perpendicular to a long side of the top surface of the electronic component.

[0023] In some embodiments, the stress relief structure bisects the electrical connection structure.

[0024] The beneficial technical effects of the present utility model are:

[0025] The stress release structure of the electronic device in the embodiment of the present application is arranged between the clip and the electronic component, so that the stress is discontinuous, reducing the stress concentration problem caused by CTE mismatch during continuous heating and cooling, avoiding the surface cracking of the electronic component, and improving the yield of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without inventive work. It is worth noting that, according to standard industry practices, the various components are not drawn to scale and are for illustrative purposes only. In fact, for the clarity of discussion, the sizes of the various components can be arbitrarily increased or decreased.

[0027] Figure 1 A prior art power supply module is shown.

[0028] Figure 2 A schematic diagram showing the thermal expansion and contraction of solids.

[0029] Figure 3 Schematic diagram showing the strain of solder and chip.

[0030] Figure 4 An electron microscope image of the interface between the chip and the solder is shown.

[0031] Figure 5 The formation of electronic components and stress relief structures on a carrier is shown.

[0032] Figure 6 The formation of electrical connections is shown.

[0033] Figure 7 An electronic device according to an embodiment of the present application is shown.

[0034] Figure 8 It shows a front view of the electronic device and a top view of part of its structure. DETAILED DESCRIPTION

[0035] In order to better understand the spirit of the embodiments of the present application, some preferred embodiments of the present application are further described below.

[0036] The embodiments of the present application will be described in detail below. Throughout this specification, identical or similar components and components having identical or similar functions are represented by similar reference numerals. The embodiments described herein with respect to the accompanying drawings are illustrative and diagrammatic and are intended to provide a basic understanding of the present application. The embodiments of the present application should not be construed as limiting the present application.

[0037] As used herein, the terms "substantially," "substantially," and "approximately" are used to describe and illustrate small variations. When used in conjunction with an event or circumstance, the terms may refer to instances where the event or circumstance occurred precisely as well as instances where the event or circumstance occurred very approximately.

[0038] In this specification, unless otherwise specified or limited, relative terms such as "central", "longitudinal", "lateral", "front", "rear", "right", "left", "inner", "outer", "lower", "higher", "horizontal", "vertical", "above", "below", "above", "below", "top", "bottom" and their derivatives (such as "horizontally", "downwardly", "upwardly", etc.) should be interpreted as referring to the directions described in the discussion or depicted in the drawings. These relative terms are only used for convenience of description and do not require that the present application be constructed or operated in a specific orientation.

[0039] For ease of description, “first,” “second,” “third,” etc. may be used herein to distinguish different components in a figure or a series of figures. “First,” “second,” “third,” etc. are not intended to describe the corresponding components.

[0040] Figures 5 to 7 The diagram shows a process of forming the electronic device 100 according to an embodiment of the present application.

[0041] Figure 5 The electronic component 20 is formed on a carrier 10, and the electronic component 20 is connected to the carrier 10 via a first conductive paste (solder) 92. A first half-etched steel plate 61 is used as a mask. The first half-etched mask 61 has an opening that exposes a portion of the top surface of the electronic component 20. A non-conductive paste is printed in the opening to form a stress relief structure 40. The stress relief structure 40 is a non-conductive structure. In some embodiments, the carrier 10 is a lead frame.

[0042] Figure 6The diagram shows the use of a second half-etched steel plate 62 as a mask, the second half-etched steel plate 62 having an opening exposing other portions of the top surface of the electronic component 20, a conductive paste being printed a second time in the opening to obtain an electrical connection structure 50, the electronic component 20 being a chip or die, the material being Si, and the surface of the electronic component 20 facing the clip 30 including an electroplated metal layer (the material being, for example, silver or gold), the thermal expansion coefficient of the electronic component 20 being different from the thermal expansion coefficient of the electrical connection structure 50.

[0043] Figure 7 The electronic device 100 according to an embodiment of the present application is formed by forming a clip 30 connecting a carrier 10 and an electrical connection structure 50 using surface mounting technology (SMT). A first end 31 of the clip 30 is connected to the carrier 10 via a second conductive paste (solder) 92, and a second end 32 is connected to the electronic component 20 via the electrical connection structure 50. In some embodiments, the clip 30 is made of copper, and the thermal expansion coefficient of the electronic component 20 is different from that of the clip 30.

[0044] Figure 8 A main view of the electronic device 100 and a top view of a partial structure are shown, wherein the clip 30 is shown as transparent to show the electrical connection structure 50 and the stress release structure 40 thereunder. The electronic device 100 of the embodiment of the present application includes: a carrier 10; an electronic component 20, which is arranged on the carrier 10; a clip 30, having a first end 31 connected to the carrier 10 and a second end 32 extending on the electronic component 20; and a stress release structure 40, which is arranged between the second end 32 of the clip 30 and the electronic component 20.

[0045] The electrical connection structure 50 is disposed between the second end portion 32 of the clip 30 and the electronic component 20 and electrically connects the second end portion 32 and the electronic component 20. The electrical connection structure 50 is separated by the stress relief structure 40. The electrical connection structure 50 is separated into a plurality of regions by the stress relief structure 40. Figure 8 Preferably, the stress release structure 40 divides the top surface of the electronic component 20 and the electrical connection structure 50 equally, and a plurality of stress release structures 40 are provided on the top surface of the electronic component 20, for example Figure 8 The two shown in FIG. 4 and the electrical connection structure 50 are divided into three equal parts. The stress relief structure 40 and the electrical connection structure 50 cover the top surface of the electronic component 20. The stress relief structure 40 is formed by the first side ( Figure 8 The upper side shown in the top view in FIG) extends to the second side opposite to the first side ( Figure 8The stress relief structure 40 is positioned on the lower side of the top view (shown in FIG. 1 ), and opposite ends of the stress relief structure 40 are aligned with the first side and the second side, respectively. The clip 30 extends from the first end 31 to the second end 32. The extension direction of the stress relief structure 40 is perpendicular to the extension direction of the clip 30. The extension direction of the stress relief structure 40 is also perpendicular to the long side of the top surface of the electronic component 20.

[0046] The embodiment of the present application further provides an electronic device 100, comprising: a carrier 10; an electronic component 20, disposed on the carrier 10; a clip 30, connected to a first end 31 of the carrier 10 and a second end 32 extending on the electronic component 20; an electrical connection structure 50, disposed between the second end 32 of the clip 30 and the electronic component 20 and electrically connecting the second end 32 and the electronic component 20; a stress relief structure 40, disposed in the electrical connection structure 50 and separating the electrical connection structure 50. The opposite ends of the stress relief structure 40 are respectively connected to the electronic component 20 and the first side ( Figure 8 The upper side shown in the top view), the second side opposite to the first side ( Figure 8 The first and second sides of the electrical connection structure 50 are aligned with the corresponding sides of the electronic component 20, and the lateral dimension of the second end 32 of the electrical connection structure 50 is greater than the lateral dimension of the electronic component 20.

[0047] The electronic device 100 of the embodiment of the present application is a power module, which can be used for system-level packaging (System In a Package, SIP), assembly and 3D stacking structure. It uses a two-step printing process (printing non-conductive paste once, and printing conductive paste twice). The stress release structure 40 is arranged between the clip 30 and the electronic component 20 to interrupt the stress transmitted from the electrical connection structure 50 and the clip 30 to the electronic component 20 due to CTE mismatch when the power module is continuously heated and cooled, making the stress discontinuous, thereby reducing the problem of stress concentration and avoiding the situation where the surface of the electronic component 20 in contact with the electrical connection structure 50 due to stress concentration is broken.

[0048] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that: include: carrier; an electronic component disposed on the carrier; a clip having a first end connected to the carrier and a second end extending over the electronic component; The stress release structure is arranged between the second end portion of the clip and the electronic component.

2. The electronic device according to claim 1, wherein Also includes: An electrical connection structure is provided between the second end portion of the clip and the electronic component and electrically connects the second end portion and the electronic component, wherein the electrical connection structure is separated by the stress relief structure.

3. The electronic device according to claim 2, wherein: The thermal expansion coefficient of the electronic component is different from the thermal expansion coefficient of the electrical connection structure.

4. The electronic device according to claim 1, wherein The stress relief structure is a non-conductive structure.

5. The electronic device according to claim 1, wherein The stress relief structure divides the top surface of the electronic component into equal parts.

6. The electronic device according to claim 5, characterized in that A plurality of stress release structures are disposed on the top surface of the electronic component.

7. The electronic device according to claim 1, wherein: The stress relief structure extends from a first side of the electronic component to a second side opposite to the first side.

8. The electronic device according to claim 7, wherein: Opposite ends of the stress relief structure are aligned with the first side and the second side respectively.

9. The electronic device according to claim 7, wherein: The clip extends in a direction from the first end to the second end.

10. The electronic device according to claim 9, characterized in that An extending direction of the stress release structure is perpendicular to an extending direction of the clip.

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