LED chip microspur display unit

Abstract

The utility model discloses an LED chip microspur display unit which is simple in structure and easy to realize, an upper end etching copper layer and a lower end etching copper layer which are provided with a plurality of copper foils are obtained by etching a PCB (printed circuit board), and the LED chip microspur display unit is convenient and fast to implement. In specific implementation, cutting can be carried out after operations such as etching are completed on a large circuit board so as to obtain small required PCBs, and the production efficiency can be improved; due to the arrangement of the insulation paste and the accommodating cavity at the upper end of the insulation paste, pixel cavities can be conveniently formed one by one, and the adjacent pixels are isolated to improve the display effect; according to the scheme, the flip LED chips are adopted, so that the flip LED chips can be directly mounted between the copper foils without additionally arranging leads in the same pixel and red, blue and green LED chips in the same upper end accommodating cavity, full-color LED pixels can be conveniently formed, and the practicability is good; besides, the insulation paste is made of a black PPA high-temperature-resistant nylon material, on one hand, the PPA material has good air tightness, so that the air tightness of a product coverage area is facilitated, and on the other hand, the black PPA material is convenient to prevent light crosstalk among different pixels, so that the display quality of the product is improved.

Description

Technical Field

[0001] The utility model relates to an LED chip macro display unit. Background Art

[0002] LED display screens are composed of many single-pixel LED lamp beads or many multi-pixel LED lamp beads spliced ​​at a certain distance.

[0003] The structure of the existing LED chip macro display unit is mainly to set a number of pads, a number of LED chips, etc. on the lamp bead holder. The pads are not only for mounting the LED chips, but also need to be connected to the outside as pins, so that the pads generally need to extend to the lower end of the lamp bead holder. In this way, the pads are three-dimensional rather than flat, and they need to be formed through stamping, punching and other processes. When the product is macro-displayed, the lamp bead size requirements are very small. At this time, the stamping process is difficult to meet the process requirements of the product's multiple pins. It is necessary to solve this problem and design a new structure of the LED chip macro display unit. Utility Model Content

[0004] The utility model overcomes the shortcomings of the above-mentioned technology and provides an LED chip macro display unit.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An LED chip macro display unit includes a PCB circuit board 1, an insulating glue 2 provided on the PCB circuit board 1 or an insulating glue 2 wrapped around the PCB circuit board 1, the PCB circuit board 1 includes an upper etched copper layer 3, an intermediate isolation layer / intermediate isolation layer group 4, and a lower etched copper layer 5 distributed in the upper, middle, and lower parts, the insulating glue 2 forms a plurality of neatly arranged upper end accommodating cavities 21 on the upper end etched copper layer 3, the upper end etched copper layer 3 in the same upper end accommodating cavity 21 is provided with a first upper end copper foil 31, a second upper end copper foil 32, a third upper end copper foil 33, and a fourth upper end copper foil 34, and a first flip-chip red light is mounted between the first upper end copper foil 31 and the second upper end copper foil 32 in the same upper end accommodating cavity 21. An LED chip 61 is provided. A second flip-chip blue LED chip 62 is mounted between the first upper copper foil 31 and the third upper copper foil 33 in the same upper accommodating cavity 21. A third flip-chip green LED chip 63 is mounted between the first upper copper foil 31 and the fourth upper copper foil 34 in the same upper accommodating cavity 21. The lower etched copper layer 5 is provided with a first lower copper foil 41 corresponding to and conductively connected to the first upper copper foil 31, a second lower copper foil 42 corresponding to and conductively connected to the second upper copper foil 32, a third lower copper foil 43 corresponding to and conductively connected to the third upper copper foil 33, and a fourth lower copper foil 143 corresponding to and conductively connected to the fourth upper copper foil 34.

[0007] Preferably, a connecting hole 7 is provided between the upper copper foil on the upper etched copper layer 3 and the corresponding lower copper foil on the lower etched copper layer 5 , and a conductive member is provided in the connecting hole 7 to facilitate conductive connection between the upper and lower copper foils.

[0008] Preferably, there are six upper accommodating cavities 21 on the PCB circuit board 1 distributed in three rows and two columns.

[0009] Preferably, the first upper copper foils 31 in the two adjacent upper accommodating cavities 21 on the left and right are connected as one.

[0010] Preferably, the intermediate isolation layer / intermediate isolation layer group 4 is a one-layer structure or the PCB circuit board 1 adopts a double-sided aluminum substrate.

[0011] Preferably, the opening of the upper end accommodating cavity 21 is square, or the opening of the upper end accommodating cavity 21 is square and rounded corners are provided between adjacent sides.

[0012] Preferably, the insulating adhesive 2 forms a plurality of lower end accommodating cavities 22 on the lower end etched copper layer 5 , and each lower end accommodating cavity 22 reveals a lower end copper foil or a part of a lower end copper foil.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] 1. The present invention has a simple and easy-to-implement structure. The PCB circuit board is etched to obtain an upper etched copper layer and a lower etched copper layer with some copper foils left. This makes it easy and quick to implement. In practice, etching and other operations can be completed on a large circuit board before cutting to obtain the required PCB circuit board, which helps improve production efficiency. The insulating adhesive and the upper end accommodating cavity facilitate the formation of individual pixel cavities, isolating adjacent pixels to improve the display effect. The present invention adopts the configuration of flip-chip LED chips, which facilitates direct mounting between copper foils without the need for additional wiring within the same pixel. The configuration of red, blue, and green LED chips in the same upper end accommodating cavity facilitates the formation of full-color LED pixels, which is highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is one of the structural diagrams of this case.

[0016] Figure 2 This is the second structural diagram of this case.

[0017] Figure 3 This is the third structural diagram of this case.

[0018] Figure 4 This is the fourth structural diagram of this case.

[0019] Figure 5 This is the fifth structural diagram of this case. DETAILED DESCRIPTION

[0020] The following examples further illustrate the features of the present invention and other related features to facilitate understanding by those skilled in the art:

[0021] like Figures 1 to 5As shown, an LED chip macro display unit includes a PCB circuit board 1, an insulating glue 2 provided on the PCB circuit board 1 or an insulating glue 2 wrapped around the PCB circuit board 1, the PCB circuit board 1 includes an upper etched copper layer 3, an intermediate isolation layer / intermediate isolation layer group 4, and a lower etched copper layer 5 distributed in the upper, middle, and lower parts, the insulating glue 2 forms a plurality of neatly arranged upper end accommodating cavities 21 on the upper end etched copper layer 3, the upper end etched copper layer 3 in the same upper end accommodating cavity 21 is provided with a first upper end copper foil 31, a second upper end copper foil 32, a third upper end copper foil 33, and a fourth upper end copper foil 34, and a first flip-chip red light emitting diode is mounted between the first upper end copper foil 31 and the second upper end copper foil 32 in the same upper end accommodating cavity 21. A blue LED chip 61 is mounted on the bottom of the lower end of the etched copper layer 5, and a second flip-chip blue LED chip 62 is mounted between the first upper copper foil 31 and the third upper copper foil 33 in the same upper end accommodating cavity 21. A third flip-chip green LED chip 63 is mounted between the first upper copper foil 31 and the fourth upper copper foil 34 in the same upper end accommodating cavity 21. The lower end etched copper layer 5 is provided with a first lower end copper foil 41 corresponding to and conductively connected to the first upper end copper foil 31, a second lower end copper foil 42 corresponding to and conductively connected to the second upper end copper foil 32, a third lower end copper foil 43 corresponding to and conductively connected to the third upper end copper foil 33, and a fourth lower end copper foil 143 corresponding to and conductively connected to the fourth upper end copper foil 34.

[0022] As described above, the upper copper foil of the LED chip macro display unit in this case is used for the mounting connection of the LED chip, and the lower copper foil is used as an electrode for the external connection of the LED chip macro display unit; in addition, a guide hole can be formed between the upper and lower copper foils in this case by drilling, copper plating, etc. to facilitate conductive connection between the upper and lower parts, or conductive connection between the upper and lower parts can be achieved by other existing methods; in addition, the upper end accommodating cavity 21 of the insulating glue 2 is set, and those positions where the insulating glue 2 does not need to be set, such as the upper end accommodating cavity 21, can be blocked by setting a mold on the PCB circuit board 1, and then the insulating glue 2 is injected and demolded after curing to obtain the insulating glue 2 with the upper end accommodating cavity 21.

[0023] As described above, the structure of this case is simple and easy to implement. The PCB circuit board 1 is etched to obtain an upper etched copper layer 3 and a lower etched copper layer 5 with some copper foils left. The implementation is convenient and quick. In specific implementation, etching and other operations can be completed on a large circuit board before cutting to obtain the required PCB circuit board 1, which is conducive to improving production efficiency. The setting of the insulating glue 2 and the upper end accommodating cavity 21 facilitates the formation of pixel cavities one by one, isolating adjacent pixels to improve the display effect. The present case adopts the setting of flip-chip LED chips, which is convenient for direct mounting between copper foils without the need for additional leads in the same pixel. The setting of red, blue and green LED chips in the same upper end accommodating cavity 21 facilitates the formation of full-color LED pixels, which is practical.

[0024] like Figure 3 、 Figure 5 As shown, in a specific implementation, a connecting hole 7 is provided between the upper copper foil on the upper etched copper layer 3 and the corresponding lower copper foil on the lower etched copper layer 5, and a conductive part is provided in the connecting hole 7 to facilitate conductive connection between the upper and lower copper foils.

[0025] like Figure 2 As shown, in a specific implementation, the upper end accommodating cavities 21 on the PCB circuit board 1 are 6 distributed in 3 rows and 2 columns. After consideration, such a layout is convenient for the subsequent splicing of screens with ratios of 1:1, 16:9, 9:16, etc. On the other hand, compared with the layout of 1 row and 2 columns with a total of 2 pixels or compared with the layout of 2 rows and 2 columns with a total of 4 pixels, one LED chip macro display unit in this case contains 6 pixels, which is convenient for reducing the number of LED chip macro display units when splicing screens of the same size in the subsequent splicing, and has good practicality.

[0026] like Figure 2 、 Figure 3 As shown, in a specific implementation, the first upper copper foils 31 in the two adjacent upper accommodating cavities 21 on the left and right are connected as a whole.

[0027] As described above, in a specific implementation, the intermediate isolation layer / intermediate isolation layer group 4 is a one-layer structure or the PCB circuit board 1 adopts a double-sided aluminum substrate. The use of a double-sided aluminum substrate facilitates some heat dissipation settings.

[0028] like Figure 2 As shown, the opening of the upper end accommodating cavity 21 is square, or the opening of the upper end accommodating cavity 21 is square and rounded corners are provided between adjacent sides.

[0029] like Figure 4As shown, in a specific implementation, the insulating glue 2 forms a plurality of lower end accommodating cavities 22 on the lower end etched copper layer 5, and each lower end accommodating cavity 22 reveals a lower end copper foil or a part of a lower end copper foil, so as to better separate the lower end copper foil.

[0030] As mentioned above, this case protects an LED chip macro display unit, and all technical solutions that are identical or similar to those in this case should be deemed to fall within the scope of protection of this case.

Claims

1. An LED chip macro display unit, characterized in that The invention comprises a PCB circuit board (1), an insulating adhesive (2) provided on the PCB circuit board (1) or an insulating adhesive (2) wrapped around the outside of the PCB circuit board (1); the PCB circuit board (1) comprises an upper etched copper layer (3), an intermediate isolation layer / intermediate isolation layer group (4), and a lower etched copper layer (5) distributed in the upper, middle, and lower parts; the insulating adhesive (2) forms a plurality of neatly arranged upper end accommodating cavities (21) on the upper end etched copper layer (3); the upper end etched copper layer (3) in the same upper end accommodating cavity (21) is provided with a first upper end copper foil (31), a second upper end copper foil (32), a third upper end copper foil (33), and a fourth upper end copper foil (34); a first flip-chip red light LED chip is mounted between the first upper end copper foil (31) and the second upper end copper foil (32) in the same upper end accommodating cavity (21); A sheet (61) is provided, a second flip-chip blue LED chip (62) is mounted between the first upper copper foil (31) and the third upper copper foil (33) in the same upper accommodating cavity (21), a third flip-chip green LED chip (63) is mounted between the first upper copper foil (31) and the fourth upper copper foil (34) in the same upper accommodating cavity (21), and the lower etched copper layer (5) is provided with a first lower copper foil (41) corresponding to and conductively connected to the first upper copper foil (31), a second lower copper foil (42) corresponding to and conductively connected to the second upper copper foil (32), a third lower copper foil (43) corresponding to and conductively connected to the third upper copper foil (33), and a fourth lower copper foil (143) corresponding to and conductively connected to the fourth upper copper foil (34).

2. The LED chip macro display unit according to claim 1, characterized in that A connecting hole (7) is provided between the upper copper foil on the upper etched copper layer (3) and the corresponding lower copper foil on the lower etched copper layer (5), and a conductive member is provided in the connecting hole (7) for facilitating conductive connection between the upper and lower copper foils.

3. The LED chip macro display unit according to claim 1, characterized in that The upper end accommodating cavities (21) on the PCB circuit board (1) are 6 in number and are distributed in 3 rows and 2 columns.

4. The LED chip macro display unit according to claim 3, characterized in that The first upper copper foils (31) in the two adjacent upper accommodating cavities (21) on the left and right are connected as a whole.

5. The LED chip macro display unit according to claim 1, characterized in that The intermediate isolation layer / intermediate isolation layer group (4) is a one-layer structure or the PCB circuit board (1) adopts a double-sided aluminum substrate.

6. The LED chip macro display unit according to claim 1, characterized in that The opening of the upper end accommodating cavity (21) is square, or the opening of the upper end accommodating cavity (21) is square and rounded corners are provided between adjacent sides.

7. The LED chip macro display unit according to any one of claims 1 to 6, characterized in that The insulating glue (2) forms a plurality of lower end accommodating cavities (22) on the lower end etched copper layer (5), and each lower end accommodating cavity (22) reveals a lower end copper foil or a part of a lower end copper foil.

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