Multi-chip integrated image processing chip mounting groove

Abstract

The utility model provides a multi-chip integrated image processing chip mounting groove, which relates to the technical field of chip mounting components, and comprises a mounting substrate and a chip main body, the top of the mounting substrate is provided with a chip standing groove, the inner wall of the mounting substrate is provided with a slip ring groove, and the inner wall of the slip ring groove is slidably connected with a pressure ring. The problem that when a plurality of image processing chips are integrated on a single circuit board, pins of the chips need to be connected with corresponding bonding pads on the circuit board through a tin soldering technology is solved by adopting a mode of installing the pressure rings, chip bodies can be directly pasted on the circuit board through adhesives, and when a certain image processing chip breaks down or needs to be maintained, the pins of the chips can be connected with the corresponding bonding pads on the circuit board through the pressure rings. The compact integration mode makes dismounting and replacing work difficult, because the chip is firmly fixed by the adhesive, any action of trying to remove the chip interferes with surrounding elements and even causes welding spots on the circuit board to be broken or a solder paste layer to be damaged, the repair difficulty is further increased, and the repair efficiency is improved. And the chip is very easy to damage in the dismounting process.

Description

Technical Field

[0001] The utility model relates to the technical field of chip mounting components, in particular to a multi-chip integrated image processing chip mounting slot. Background Art

[0002] Image processing chips are integrated circuits specifically designed to process image and video data. They are widely used in various electronic devices, such as digital cameras, smartphones, and security cameras. Their primary function is to process and optimize captured image signals to enhance image quality, extract feature information, or achieve specific visual effects. However, with technological advancements and evolving market demands, single-chip solutions are increasingly unable to meet the demands for high performance and multi-functionality. Consequently, multi-chip integration has become a trend.

[0003] In the prior art, when integrating multiple image processing chips onto a single circuit board, soldering technology is required to connect the chip pins to the corresponding pads on the circuit board, and adhesives are also used to directly adhere the chip body to the circuit board. When an image processing chip fails or requires maintenance, this tight integration makes removal and replacement extremely difficult. Because the chip is firmly fixed by the adhesive, any attempt to remove it interferes with surrounding components and may even cause the solder joints on the circuit board to break or the solder paste layer to be damaged, further increasing the difficulty of repair. Worse, if the operation is not done properly, the chip itself can easily suffer irreversible physical damage during the disassembly process, such as bent pins, scratches on the chip surface, or damage to the internal structure. All of these directly affect the chip's reuse or replacement cost. In addition, frequent disassembly and reinstallation not only increases maintenance time and reduces work efficiency, but also accelerates the aging of the circuit board and other intact chips due to repeated physical stress, thereby shortening the service life of the entire system. In the long run, this integration method limits the system's maintainability and upgrade flexibility, and is not conducive to quickly responding to market changes or technological iterations. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a multi-chip integrated image processing chip installation slot.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions: a multi-chip integrated image processing chip mounting slot, comprising a mounting substrate and a chip body, a chip retention slot is provided at the top of the mounting substrate, a slip ring groove is provided on the inner wall of the mounting substrate, a pressure ring is slidably connected to the inner wall of the slip ring groove, a pressure end frustum is provided at one end of the pressure ring, a rubber round head is fixed at the other end of the pressure ring, a tightening groove is provided on the circumferential surface of the pressure ring, a fixed column groove is provided on the top of the slip ring groove, an inner ring groove is provided on the inner wall of the fixed column groove, a side sliding column is slidably connected to the inner wall of the ring inner groove, an embedded column is fixed at one end of the side sliding column, and a screw disk is fixed on the top of the embedded column.

[0006] Preferably, the inner wall of the fixed column groove is rotatably connected to an auxiliary groove ring, and a return spring is fixed to the top of the auxiliary groove ring, and one end of the return spring is fixed to the bottom of the screw disk. In the prior art, during the operation of the screw disk, when it needs to be lowered, it is often difficult for the staff to accurately apply a pressure that is completely perpendicular to the ground, especially in an environment with a small space or limited vision. Due to this non-ideal force application method, the screw disk is easily subjected to a deflected force, resulting in unnecessary contact and friction with the inner wall of the fixed column groove during the descent process. This uneven force state not only increases the wear between the components, but also triggers a series of chain reactions. First, continuous friction will accelerate the surface of the screw disk. The wear of the surface and the inner wall of the fixed column groove will gradually accumulate over time, forming tiny scratches, pits or other forms of surface damage. Secondly, this wear will also affect the matching accuracy between components, making it more difficult for the screw disk to move smoothly in subsequent use, further aggravating the degree of wear. To solve this problem, the utility model adopts the method of installing a reset spring to solve it, so that the reset spring can evenly bear the pressure and feedback it to the screw disk and the staff, so that the staff can avoid it as much as possible, while preventing more obvious scratches between components, and the feedback provided by the spring can prompt the staff to press down the distance, so as to improve the user experience and increase the service life of the equipment.

[0007] Preferably, a limiting ring is fixed to the circumference of the embedded column. In the prior art, a potential risk point during the process of workers disassembling the chip body lies in the elastic potential energy stored in the reset spring component. This energy is accumulated during the previous compression or deformation process. If it is not properly handled, it will be rapidly released at the moment of disassembly. When the reset spring suddenly releases its elastic potential energy, it will produce a rapid upward movement. This speed is often beyond the expected and controllable range. Due to the direct or indirect connection between the embedded column and the reset spring, the rapid upward movement of the reset spring will directly drive the embedded column to move upward at the same speed. If the design of the embedded column does not take this sudden situation into account, or its structural strength is insufficient to withstand such impact, it is very likely to lose stability during movement, or even completely deviate from the predetermined track, causing it to pop out of the fixed column groove. To address this problem, the present invention adopts a method of installing a limiting ring. When the embedded column moves upward to the highest position, the top of the limiting ring abuts against the bottom of the auxiliary groove ring, preventing the embedded column from continuing to rise, preventing component damage, and achieving the effect of increasing the service life of the equipment.

[0008] Preferably, a positioning arc is fixed on the top of the mounting substrate, which makes it easier for workers to operate and position the substrate, thereby improving the yield rate.

[0009] Preferably, an arc triangle is fixed to the bottom end of one side of the positioning arc, and the bottom of the arc triangle is fixed to the top of the mounting base plate, thereby improving the fixing effect and achieving the effect of increasing the service life of the equipment.

[0010] Preferably, a groove end abutment circle is fixed to one end of the inner wall of the inner ring groove, thereby preventing the side sliding column from leaving the inner ring groove, thereby achieving the effect of improving the stability of the equipment.

[0011] Preferably, a slot bottom pad is fixed to the bottom of the inner wall of the chip slot to provide a buffer and achieve the effect of increasing the service life of the equipment.

[0012] Beneficial effects:

[0013] 1. In the prior art, when multiple image processing chips are integrated into a single circuit board, soldering technology is required to connect the chip pins to the corresponding pads on the circuit board, and adhesives are also used to directly adhere the chip body to the circuit board. When an image processing chip fails or requires maintenance, this tight integration makes disassembly and replacement extremely difficult. Because the chip is firmly fixed by the adhesive, any attempt to remove it will interfere with surrounding components and even cause the solder joints on the circuit board to break or the solder paste layer to be damaged, which further increases the difficulty of repair. Worse, if the operation is improper, the chip itself can easily be irreversibly damaged during the disassembly process, such as bent pins, scratches on the chip surface, or damage to the internal structure. All of these directly affect the cost of reusing or replacing the chip. In addition, frequent disassembly and reinstallation not only increases maintenance time and reduces work efficiency, but also accelerates the aging of the circuit board and other undamaged chips due to repeated physical stress, thereby shortening the service life of the entire system. In the long run, this integration method limits the maintainability and upgrade flexibility of the system, and is not conducive to quickly responding to market changes or technological iterations. To address such issues, this paper The utility model solves the problem by installing a pressure ring. When the staff needs to fix the chip body to the mounting substrate, they align the chip body with the chip groove, slide it into the chip groove and press it down. When the bottom of the chip body contacts the pressure end round table, the pressure ring is pushed to rotate in the slip ring groove, so that the pressure end round table is retracted into the slip ring groove. At the same time, the rubber round head is exposed from the slip ring groove and contacts the side of the chip body. The rubber round head undergoes elastic deformation and generates pressure on the side of the chip body, which greatly increases the friction between the two and fixes the chip body with pressure. At the same time, when the pressure ring rotates, the staff can use a screwdriver or other tool to insert the screw disk and rotate clockwise. The needle rotates 180 degrees, causing the embedded column to rotate accordingly, and the side sliding column slides on the inner wall of the ring groove, lowering the embedded column according to the established track so that the bottom of the embedded column contacts the right side of the tightening groove. When the embedded column is completely lowered, the pressure ring is further rotated clockwise, which greatly increases the fixing pressure and prevents the pressure ring from rotating counterclockwise, thereby greatly increasing the fixing effect. If the staff needs to disassemble the chip body, they only need to rotate the screw disk in the opposite direction to make the embedded column rise, and then pull the chip body upward to make the pressure ring rotate counterclockwise. It is easy to operate and can be reused, thereby improving user experience, reducing production costs, and improving work efficiency.

[0014] 2. In the prior art, during the operation of the screw disk, when it needs to be lowered, it is often difficult for the staff to accurately apply a pressure that is completely perpendicular to the ground, especially in an environment with a small space or limited vision. Due to this non-ideal force application method, the screw disk is easily subjected to a deflected force, resulting in unnecessary contact and friction with the inner wall of the fixed column groove during the descent process. This uneven force state not only increases the wear between components, but also triggers a series of chain reactions. First, continuous friction will accelerate the wear of the screw disk surface and the inner wall of the fixed column groove. Over time, these wears will gradually accumulate, forming tiny scratches, pits or other forms of surface damage. Secondly, this wear will also affect the matching accuracy between components, making it more difficult for the screw disk to move smoothly in subsequent use, further aggravating the degree of wear. To address such problems, the present invention adopts the method of installing a reset spring to solve it, so that the pressure is evenly borne and fed back to the staff, so that the staff can avoid it as much as possible, while preventing more obvious scratches between components. The feedback provided by the spring can prompt the staff to press down the distance, thereby improving the user experience and increasing the service life of the equipment.

[0015] 3. In the prior art, when workers are disassembling the chip body, a potential risk point is the elastic potential energy stored in the reset spring component. This energy is accumulated during the previous compression or deformation process. If it is not properly handled, it will be quickly released at the moment of disassembly. When the reset spring suddenly releases its elastic potential energy, it will produce a rapid upward movement. This speed is often beyond the expected and controllable range. Since there is a direct or indirect connection between the embedded column and the reset spring, the rapid upward movement of the reset spring will directly drive the embedded column to move upward at the same speed. If the design of the embedded column does not take this emergency into account, or its structural strength is not sufficient to withstand such impact force, then it is very likely to lose stability during the movement, or even completely deviate from the predetermined track, causing it to pop out of the fixed column groove. To address this problem, the present invention adopts the method of installing a limiting ring to solve it, so that when the embedded column moves upward to the highest position, the top of the limiting ring and the bottom of the auxiliary groove ring are pressed against each other to prevent the embedded column from continuing to rise, thereby preventing component damage and achieving the effect of increasing the service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the three-dimensional structure of the bottom pad of the utility model;

[0018] Figure 3 This is a schematic diagram of the three-dimensional structure of the arc triangle of the utility model;

[0019] Figure 4 This is a cross-sectional view of the chip-retention slot of the present invention;

[0020] Figure 5 This is a cross-sectional view of the pressure ring of the utility model;

[0021] Figure 6 It is a cross-sectional view of the groove end interference circle of the utility model.

[0022] Legend:

[0023] 1. Mounting substrate; 101. Chip body; 2. Chip retention groove; 201. Slip ring groove; 202. Pressure ring; 203. Pressure end cone; 204. Rubber round head; 205. Clamping groove; 206. Fixed column groove; 207. Ring inner groove; 208. Side sliding column; 209. Embedded column; 2010. Twist plate; 3. Auxiliary groove ring; 301. Return spring; 4. Limiting ring; 401. Groove end contact circle; 5. Positioning arc; 501. Arc triangle; 6. Groove bottom pad. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific embodiments and drawings. However, the following embodiments are only preferred embodiments of the present invention and are not exhaustive. Based on the embodiments in the implementation manner, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention.

[0025] The specific embodiments of the present utility model are described below with reference to the accompanying drawings. Specific embodiment:

[0027] Reference Figure 1-6A multi-chip integrated image processing chip mounting slot includes a mounting substrate 1 and a chip body 101. A chip retention slot 2 is provided on the top of the mounting substrate 1. A slip ring groove 201 is provided on the inner wall of the mounting substrate 1. A pressure ring 202 is slidably connected to the inner wall of the slip ring groove 201. A pressure end frustum 203 is provided at one end of the pressure ring 202. A rubber round head 204 is fixed to the other end of the pressure ring 202. A tightening groove 205 is provided on the circumference of the pressure ring 202. A fixed column groove 206 is provided on the top of the slip ring groove 201. An inner ring groove 207 is provided on the inner wall of the fixed column groove 206. A side sliding column 208 is slidably connected to the inner wall of the inner ring groove 207. An embedded column 209 is fixed at one end of the side sliding column 208, and a screw disk 2010 is fixed on the top of the embedded column 209. The inner wall of the fixed column groove 206 is rotatably connected with an auxiliary groove ring 3, and a return spring 301 is fixed on the top of the auxiliary groove ring 3. One end of the return spring 301 is fixed to the bottom of the screw disk 2010. During the operation of the screw disk 2010, when it needs to be lowered, it is often difficult for the staff to accurately apply a pressure that is completely perpendicular to the ground, especially in an environment with a small space or limited vision. Due to this non-ideal force application method, the screw disk 2010 is easily affected by a deflected force, resulting in unnecessary contact and friction with the inner wall of the fixed column groove 206 during the descent process. This uneven force state not only increases the wear between the components, but also triggers a series of chain reactions. First, continuous friction will accelerate the screw disk. The wear on the surface of 2010 and the inner wall of the fixed column groove 206 will gradually accumulate over time, forming tiny scratches, pits or other forms of surface damage. Secondly, this wear will also affect the matching accuracy between components, making it more difficult for the screw disk 2010 to move smoothly in subsequent use, further aggravating the degree of wear. This problem is solved by installing a reset spring 301, which achieves uniform pressure bearing through the reset spring 301 and feeds back to the screw disk 2010 and the staff, so that the staff can avoid it as much as possible, while preventing more obvious scratches between components, and the feedback provided by the spring can prompt the staff to press down the distance, thereby improving user experience and increasing the service life of the equipment.

[0028] A limiting ring 4 is fixed on the periphery of the embedded column 209. During the process of the staff disassembling the chip body 101, a potential risk point is the elastic potential energy stored in the reset spring 301 component. This energy is accumulated during the previous compression or deformation process. If it is not properly handled, it will be quickly released at the moment of disassembly. When the reset spring 301 suddenly releases its elastic potential energy, it will produce a rapid upward movement. This speed is often beyond the expected and control range. Due to the direct or indirect connection between the embedded column 209 and the reset spring 301, the reset spring 301 The rapid upward movement will directly drive the embedded column 209 to move upward at the same speed. If the design of the embedded column 209 does not take this sudden situation into consideration, or its structural strength is not enough to withstand such an impact force, it will easily lose stability during the movement, or even completely deviate from the predetermined track, causing it to pop out of the fixed column groove 206. The solution is to install a limiting ring 4. When the embedded column 209 moves upward to the highest position, the top of the limiting ring 4 abuts against the bottom of the auxiliary groove ring 3, preventing the embedded column 209 from continuing to rise, preventing component damage, and thus improving the service life of the equipment. A positioning arc 5 is fixed on the top of the mounting base 1, making it easier for staff to operate and position, thereby improving the yield rate. An arc triangle 501 is fixed to the bottom end of one side of the positioning arc 5. The bottom of the arc triangle 501 is fixed to the top of the mounting base 1, improving the fixing effect and improving the service life of the equipment. A groove end abutment circle 401 is fixed to one end of the inner wall of the ring inner groove 207, preventing the side sliding column 208 from leaving the ring inner groove 207, thereby improving the stability of the equipment. A slot bottom pad 6 is fixed to the bottom of the inner wall of the chip slot 2 to provide a buffer and thus increase the service life of the equipment.

[0029] The working principle of the present invention is as follows: when the staff needs to fix the chip body 101 to the mounting substrate 1, the chip body 101 is aligned with the chip slot 2, slides into the chip slot and presses downwards. When the bottom of the chip body 101 contacts the pressure end truncated cone 203, the pressure ring 202 is pushed to rotate in the slip ring groove 201, so that the pressure end truncated cone 203 is retracted into the slip ring groove 201. At the same time, the rubber round head 204 is exposed from the slip ring groove 201 and contacts the side of the chip body 101. The rubber round head 204 undergoes elastic deformation and generates pressure on the side of the chip body 101, which greatly increases the friction between the two, and the pressure fixes the chip body 101. At the same time, when the pressure ring 202 rotates, the staff can use a screwdriver or the like to fix the chip body 101. The tool is inserted into the screw disk 2010 and rotated 180 degrees clockwise, causing the embedded column 209 to rotate accordingly, and the side sliding column 208 slides on the inner wall of the ring inner groove 207, and the embedded column 209 is lowered according to the established track, so that the bottom of the embedded column 209 contacts the right side of the tightening groove 205. When the embedded column 209 is completely lowered, the pressure ring 202 is further rotated clockwise, which greatly increases the fixing pressure and prevents the pressure ring 202 from rotating counterclockwise, thereby greatly increasing the fixing effect. If the staff needs to remove the chip body 101, they only need to rotate the screw disk 2010 in the opposite direction to make the embedded column 209 rise, and then pull the chip body 101 upward to make the pressure ring 202 rotate counterclockwise. It is easy to operate and can be reused.

[0030] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0031] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-chip integrated image processing chip mounting slot, comprising a mounting substrate (1) and a chip body (101), characterized in that: A chip retention groove (2) is provided on the top of the mounting substrate (1), a slip ring groove (201) is provided on the inner wall of the mounting substrate (1), a pressure ring (202) is slidably connected to the inner wall of the slip ring groove (201), a pressure end truncated cone (203) is provided on one end of the pressure ring (202), a rubber round head (204) is fixed on the other end of the pressure ring (202), a tightening groove (205) is provided on the circumference of the pressure ring (202), a fixed column groove (206) is provided on the top of the slip ring groove (201), an inner ring groove (207) is provided on the inner wall of the fixed column groove (206), a side sliding column (208) is slidably connected to the inner wall of the inner ring groove (207), an embedded column (209) is fixed on one end of the side sliding column (208), and a screw disk (2010) is fixed on the top of the embedded column (209).

2. The multi-chip integrated image processing chip mounting slot according to claim 1, characterized in that: The inner wall of the fixed column groove (206) is rotatably connected to an auxiliary groove ring (3), a return spring (301) is fixed to the top of the auxiliary groove ring (3), and one end of the return spring (301) is fixed to the bottom of the screw disk (2010).

3. The multi-chip integrated image processing chip mounting slot according to claim 1, characterized in that: A limiting ring (4) is fixed on the circumferential surface of the embedded column (209).

4. The multi-chip integrated image processing chip mounting slot according to claim 1, characterized in that: A positioning arc (5) is fixed on the top of the mounting substrate (1).

5. The multi-chip integrated image processing chip mounting slot according to claim 4, characterized in that: An arc triangle (501) is fixed to the bottom end of one side of the positioning arc (5), and the bottom of the arc triangle (501) is fixed to the top of the mounting base plate (1).

6. The multi-chip integrated image processing chip mounting slot according to claim 1, characterized in that: A groove end abutting circle (401) is fixed to one end of the inner wall of the ring inner groove (207).

7. The multi-chip integrated image processing chip mounting slot according to claim 1, characterized in that: A slot bottom pad (6) is fixed to the bottom of the inner wall of the chip slot (2).

Images