Heat dissipation device for signal processing identification device

Abstract

The utility model discloses a radiating device for a signal processing identification device, which relates to the technical field of radiating devices and comprises a radiator substrate, turbine-shaped teeth are arranged in the middle of the top end of the radiator substrate, and a plurality of straight teeth distributed in parallel are arranged on two sides of the top end of the radiator substrate. An upper cover plate is installed at the top end of the radiator substrate, a circular air inlet avoiding position vertically penetrates through the interior of the upper cover plate, a turbo-type fan is installed at the top end of the upper cover plate, and the centers of turbine-shaped teeth, the air inlet avoiding position and the turbo-type fan are located on the same vertical line. According to the utility model, the turbine-shaped teeth and the right-angle teeth form an air duct, so that cold air can enter from two ends and is exhausted by the turbine-type fan after exchanging heat with the radiator, and the noise of the turbine-type fan is low, so that the noise of the radiating device is reduced while the radiating efficiency is ensured, and the service life of the radiating device is prolonged. And the whole equipment is made of a material with good heat conduction and electric conduction, and is low in processing cost and easy to install.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device for a signal processing and identification device. Background Art

[0002] With the rapid development of information technology and the continuous improvement of industrial automation levels, signal processing and recognition devices are increasingly used in various fields. These devices are not only used for data acquisition, analysis, and processing, but also involve complex signal recognition and analysis, playing a vital role in improving system performance, ensuring data security, and realizing intelligent control. In the fields of communications, radar, image recognition, speech processing, etc., signal processing and recognition devices have become indispensable core components;

[0003] As the performance and functionality of signal processing and recognition devices continue to improve, their power consumption also increases, resulting in significant heat generation during operation. If this heat cannot be dissipated promptly, it will severely impact the stability and reliability of the device, and may even cause damage. Traditional heat dissipation methods have numerous limitations in terms of efficiency, noise control, size, processing costs, installation and maintenance, and are unable to meet the heat dissipation requirements of high-performance signal processing and recognition devices. Consequently, in-depth research into these issues has led to the present case. Utility Model Content

[0004] The purpose of the present invention is to provide a heat dissipation device for a signal processing and recognition device, so as to solve the problems of low heat dissipation efficiency and high noise in the traditional heat dissipation method proposed in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a heat dissipation device for a signal processing and identification device, comprising a radiator substrate, a turbine-shaped tooth is provided at the middle position of the top end of the radiator substrate, and a plurality of parallel straight teeth are provided on both sides of the top end of the radiator substrate, an upper cover plate is installed at the top end of the radiator substrate, and a circular air inlet avoidance is vertically penetrated inside the upper cover plate, a turbine fan is installed at the top end of the upper cover plate, and the centers of the turbine-shaped tooth, the air inlet avoidance and the turbine fan are on the same vertical line, and a radiator boss I, a radiator boss II and a radiator boss III are installed at the bottom end of the radiator.

[0006] Preferably, the bottom end of the radiator substrate is provided with a cylindrical through hole and a mounting fixing hole for pressing with the signal processing and identification device board, and a thin wall is fixed on the outer side of the bottom end of the radiator substrate.

[0007] Preferably, a plurality of fan mounting holes are passed through the outer side of the turbine fan, and a fan air inlet is provided at the bottom end of the turbine fan.

[0008] Preferably, the bottom end of the upper cover plate is fitted with the top end of the radiator substrate, and the upper cover plate and the radiator substrate have the same shape and size.

[0009] Preferably, a plurality of fastener avoidances are vertically passed through the interior of the upper cover plate, and the plurality of fastener avoidances correspond one-to-one with a corresponding number of mounting and fixing holes.

[0010] Preferably, a high-position component avoidance is provided on one side of the top end of the radiator substrate, and the bottom end of the high-position component avoidance extends to the bottom end of the radiator substrate.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] The turbine-shaped teeth and right-angle teeth form an air duct, which is conducive to the entry of cold air from both ends. After the cold air exchanges heat with the radiator, it is discharged by the turbine fan. The turbine fan has low noise, so while ensuring the heat dissipation efficiency, it reduces the noise of the heat dissipation device. The overall equipment uses materials with good thermal conductivity and electrical conductivity, with low processing cost and easy installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the appearance structure of the utility model in the disassembled state;

[0014] Figure 2 This is a bottom view of the structure of the radiator base plate of the present invention;

[0015] Figure 3 This is a schematic diagram of the planar appearance structure of the utility model;

[0016] Figure 4 This is a schematic diagram of the appearance structure of the utility model in working state;

[0017] Figure 5 This is a schematic diagram of the top view of the radiator of the present invention.

[0018] In the figure: 1. Turbine fan; 2. Upper cover; 3. Air inlet avoidance; 4. Fastener avoidance; 5. Turbine-shaped teeth; 6. Cylindrical through hole; 7. High-position device avoidance; 8. Fan mounting hole; 9. Fan air inlet; 10. Radiator base plate; 11. Radiator boss I; 12. Mounting and fixing holes; 13. Radiator boss II; 14. Radiator boss III; 15. Thin wall. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] Example: See Figure 1-5 A heat dissipation device for a signal processing and identification device includes a heat sink substrate 10. A turbine-shaped tooth 5 is provided at the middle position of the top of the heat sink substrate 10, and a plurality of parallel straight teeth are provided on both sides of the top of the heat sink substrate 10. An upper cover plate 2 is installed at the top of the heat sink substrate 10, and a circular air inlet avoidance 3 is vertically penetrated inside the upper cover plate 2. A turbine fan 1 is installed at the top of the upper cover plate 2, and the centers of the turbine-shaped tooth 5, the air inlet avoidance 3, and the turbine fan 1 are on the same vertical line. A heat sink boss I 11, a heat sink boss II 13, and a heat sink boss III 14 are installed at the bottom of the heat sink.

[0021] The outer side of the turbine fan 1 is penetrated by a plurality of fan mounting holes 8, and the bottom end of the turbine fan 1 is provided with a fan air inlet 9;

[0022] Specifically, such as Figure 1 、 Figure 2 and Figure 5 As shown, silicone fillers are arranged between multiple radiator bosses and main heating devices. Silicon fillers can accommodate dimensional errors caused by processing, increase contact area, and improve heat dissipation performance. When locked, the radiator bosses and the board heating devices form close contact through the silicone fillers to ensure the heat dissipation effect. At this time, the turbine fan 1 is working, the turbine-shaped teeth 5 correspond to the air inlet position of the turbine fan 1, and the turbine-shaped teeth 5 and the right-angle teeth form an air duct. The radiator substrate 10 and the upper cover plate 2 are combined to form an overall distributed square hole-shaped air duct, which is conducive to the entry of cold air from both ends, and after heat exchange with the radiator substrate 10, it is discharged by the turbine fan 1, thereby improving the heat dissipation efficiency of the device.

[0023] In addition, the upper cover 2 is a thin sheet metal structure. The upper cover 2 and the radiator substrate 10 are combined to form an overall distributed square hole-shaped air duct to improve the heat dissipation efficiency. The use of high-performance conductive and thermally conductive materials can also improve electromagnetic protection after covering the avoidance holes of the radiator substrate 10, and avoidance holes are provided at the fixing position. The radiator substrate 10 can be removed without removing the upper cover 2, which is convenient for maintenance and installation.

[0024] The bottom end of the heat sink substrate 10 is provided with a cylindrical through hole 6 and a mounting hole 12 for pressing with the signal processing and identification device board, and a thin wall 15 is fixed to the outer side of the bottom end of the heat sink substrate 10;

[0025] The bottom end of the upper cover plate 2 is fitted with the top end of the radiator substrate 10, and the shape and size of the upper cover plate 2 and the radiator substrate 10 are consistent;

[0026] A plurality of fastener avoidances 4 are vertically passed through the interior of the upper cover plate 2, and the plurality of fastener avoidances 4 correspond one to one with a corresponding number of mounting holes 12;

[0027] Specifically, such as Figure 2 and Figure 4 As shown, when working, the radiator is installed on the signal processing and identification device board, and the thin wall 15 and the signal processing and identification device board form a closed cavity. This design can improve the conductive heat dissipation function, electromagnetic shielding function, and environmental protection function of the board.

[0028] A high-position component avoidance position 7 is provided on one side of the top of the radiator substrate 10, and the bottom end of the high-position component avoidance position 7 extends to the bottom end of the radiator substrate 10;

[0029] Specifically, such as Figure 1 As shown, the high-position component avoidance 7 can prevent the local height from affecting the overall height of the heat sink substrate 10.

[0030] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A heat dissipation device for a signal processing and recognition device, comprising a heat sink substrate (10), characterized in that: A turbine-shaped tooth (5) is provided at the middle position of the top of the radiator substrate (10), and a plurality of parallel straight teeth are provided on both sides of the top of the radiator substrate (10). An upper cover plate (2) is installed at the top of the radiator substrate (10), and a circular air inlet avoidance (3) is vertically penetrated inside the upper cover plate (2). A turbine fan (1) is installed at the top of the upper cover plate (2), and the centers of the turbine-shaped tooth (5), the air inlet avoidance (3) and the turbine fan (1) are on the same vertical line. A radiator boss I (11), a radiator boss II (13) and a radiator boss III (14) are installed at the bottom of the radiator.

2. The heat dissipation device for a signal processing and recognition device according to claim 1, characterized in that: The bottom end of the radiator substrate (10) is provided with a cylindrical through hole (6) and a mounting hole (12) for pressing with a signal processing and identification device board, and a thin wall (15) is fixed to the outer side of the bottom end of the radiator substrate (10).

3. The heat dissipation device for a signal processing and recognition device according to claim 1, characterized in that: A plurality of fan mounting holes (8) are passed through the outer side of the turbine fan (1), and a fan air inlet (9) is provided at the bottom end of the turbine fan (1).

4. The heat dissipation device for a signal processing and recognition device according to claim 2, characterized in that: The bottom end of the upper cover plate (2) is fitted with the top end of the radiator substrate (10), and the upper cover plate (2) and the radiator substrate (10) have the same shape and size.

5. The heat dissipation device for a signal processing and recognition device according to claim 4, characterized in that: A plurality of fastener avoidances (4) are vertically passed through the interior of the upper cover plate (2), and the plurality of fastener avoidances (4) correspond one to one with a corresponding number of mounting and fixing holes (12).

6. The heat dissipation device for a signal processing and recognition device according to claim 1, characterized in that: A high-position device avoidance (7) is provided on one side of the top of the radiator substrate (10), and the bottom end of the high-position device avoidance (7) extends to the bottom end of the radiator substrate (10).

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