Heater and heating non-combustion device
By arranging a hollow structure and staggered heating elements on the substrate of the heating-without-combustion device, the problems of large heat capacity, slow heating and high energy consumption of the heating element in the prior art are solved, and the effect of lightweight and efficient heating is achieved.
Patent Information
- Application Number
- CN202422331988.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-09-24
AI Technical Summary
The heating element of the existing heat-not-burn device uses stainless steel tubes as the base material, resulting in a large heat capacity, a long heating time, high energy consumption and insufficient strength. It is difficult to produce a lightweight thick-film heating tube product through the existing thick-film process.
A hollow structure is set on the substrate, and the heating elements are staggered to achieve a lightweight design of the substrate. At the same time, the hollow structure is used to increase the heating rate and reduce energy consumption. A mesh structure or a bent structure is used to relieve thermal stress, and a glass enamel insulation layer is used to enhance mechanical strength.
The lightweight design of the substrate is achieved while meeting the mechanical strength requirements, which increases the heating rate and reduces energy consumption, and reduces the probability of film failure or shedding of the heating element.
Smart Images
Figure CN223365019U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of heat-without-combustion technology, and in particular to a heater and a heat-without-combustion device. Background Art
[0002] In the existing heating without burning device, the heating element is the core component, which is used to heat the aerosol generating matrix to generate aerosol. Usually, the heating method of the heating element is divided into peripheral heating and central heating. Among them, the peripheral heating heating element is generally a thick film tube or a steel tube plus a heating film structure, both of which are in the form of a tubular component and its outer or inner surface covered with a circuit resistor. Stainless steel tube is used as the substrate, and the substrate is heavy, which means that the heat capacity of the heating element is large. To reach a specific working temperature, a longer heating time and greater energy consumption are required. Moreover, if the thickness of the substrate is reduced to reduce its mass, the strength of the substrate will also decrease, and thus it is impossible to produce a finished thick film heating tube through the existing thick film process. Utility Model Content
[0003] The present application provides a heater and a heating without burning device, in which the substrate in the heater meets the lightweight requirements while also meeting the strength requirements of use. At the same time, the heating rate of the substrate can be increased and the energy consumption of the heating element can be reduced.
[0004] According to the first aspect of the present application, a heater is provided in one embodiment, comprising: a substrate having an inner side surface and an outer side surface arranged opposite to each other, with a hollow structure distributed on the substrate; and a heating element arranged on the outer side surface and staggered with the hollow structure, the heating element generating heat which is conducted to the substrate so that the substrate heats the aerosol to generate a matrix.
[0005] In one embodiment, the heating element is a mesh structure, and the hollow structure is aligned with the mesh holes of the heating element in the thickness direction of the substrate.
[0006] In one embodiment, the heating element completely covers the area of the substrate where no hollow structure is arranged, or the heating element covers a part of the area of the substrate where no hollow structure is arranged.
[0007] In one embodiment, the heating element includes at least one bending structure, which is bent to form an interval space. When the bending structure includes two or more, the bending structures are connected in sequence, and each interval space encloses at least one hollow structure.
[0008] In one embodiment, the hollow structure is a blind hole, and the opening of the blind hole is arranged toward the outer side.
[0009] In one embodiment, the hollow structure is a through hole.
[0010] In one embodiment, the hollow structure is at least one of a regular hexagon, a circle, and a rectangle. When the substrate is unfolded, the hollow structure is distributed in a honeycomb shape on the substrate.
[0011] In one embodiment, the heating elements include two or more to independently heat different parts of the aerosol matrix.
[0012] In one embodiment, when the substrate is a conductive material, the heater further includes an insulating layer, which is disposed between the substrate and the heating element, and is a glass enamel insulating layer.
[0013] According to one aspect of the present application, an embodiment provides a heat-not-burn device, comprising the heater of the first aspect.
[0014] The present application provides a heater, comprising a substrate and a heating element. By arranging a hollow structure on the substrate and covering the heating element on the outer side, it is convenient for the heating element to conduct heat to the substrate, thereby heating the aerosol generating matrix. In this way, the design of the hollow structure can achieve a lightweight design while meeting the mechanical strength requirements of the substrate. When the heating element conducts heat to the substrate, the heating rate of the substrate can be increased and the energy consumption of the heating element can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 Schematic diagram of the structure of the substrate in the embodiment of the present application;
[0016] Figure 2 This is a schematic diagram of the structure of the unfolded substrate in an embodiment of the present application;
[0017] Figure 3 Schematic diagram of the heater in Example 1;
[0018] Figure 4 Schematic diagram of the heater in Example 2;
[0019] Figure 5 Schematic diagram of the heater in Example 3;
[0020] Figure 6 is a cross-sectional view of the expanded substrate of Example 1-3;
[0021] Figure 7 is a cross-sectional view of the expanded substrate of Example 4-6;
[0022] Figure 8 This is a schematic structural diagram of the heating without combustion device of Example 7.
[0023] Figure numerals: heater-100, substrate-110, outer side-111, inner side-112, hollow structure-113, heating element-120, mesh-121, blind hole-1211, through hole-1212, bending structure-122, spacing space-1221, electrode-123, heating without burning device-200. DETAILED DESCRIPTION
[0024] The present application is further described in detail below by means of specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are numbered with associated similar elements. In the following embodiments, many detailed descriptions are provided to enable the present application to be better understood. However, those skilled in the art will readily appreciate that some of the features may be omitted in different circumstances, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid the core portion of the present application being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail. They can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.
[0025] In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various implementations, and the operational steps involved in each embodiment may be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for the purpose of clearly describing a particular embodiment and do not imply a required composition and / or sequence.
[0026] The serial numbers assigned to components herein, such as "first," "second," etc., are used solely to distinguish the objects being described and do not convey any sequential or technical meaning. References to "connection" and "coupling" herein, unless otherwise specified, include both direct and indirect connections (couplings).
[0027] Example 1
[0028] This embodiment provides a heater 100, which can be used in a heat-not-burn device 200, wherein, please refer to Figure 1-3 and Figure 6 The heater 100 includes a substrate 110 and a heating element 120 .
[0029] Please refer to Figure 1 and Figure 3The substrate 110 has an outer side surface 111 and an inner side surface 112 that are oppositely disposed. A hollow structure 113 is distributed on the substrate 110. A heating element 120 is disposed on the outer side surface 111 and staggered with the hollow structure 113. The heating element 120 generates heat that is transferred to the substrate 110, causing the substrate 110 to heat the aerosol to generate a matrix.
[0030] In this embodiment, please refer to Figure 1 , the substrate 110 is a tubular structure. In other embodiments, the shape of the substrate 110 is not limited to a tubular structure, and can be other shapes depending on the usage scenario, which is not specifically limited.
[0031] The present application achieves lightweighting of the substrate 110 by providing a hollow structure 113 on the substrate 110. The presence of the hollow structure 113 still ensures that the mechanical strength of the substrate 110 meets the requirements for use, and a thick-film heating tube can still be produced using existing thick-film processes. Furthermore, due to the lightweight design of the substrate 110, when the heating element 120 transfers heat to the substrate 110, the heating rate of the substrate 110 itself can be increased and energy consumption can be reduced. The hollow structure 113 also helps to alleviate thermal stress between the substrate 110 and the heating element 120, reducing the probability of film failure or detachment when the heating element 120 is a thick-film heating layer.
[0032] In the present application, the hollow structure 113 and the heating element 120 are staggered, and heat can be directly conducted from the heating element 120 to the substrate 110, thereby shortening the heat conduction time.
[0033] Please refer to Figure 3 The heating element 120 is a mesh structure, and the hollow structure 113 is aligned with the mesh holes of the heating element 120 in the thickness direction of the substrate 110 .
[0034] The mesh structure design can facilitate the heating element 120 to completely wrap the substrate 110, thereby facilitating heat transfer to the substrate 110.
[0035] Please refer to Figure 3 More specifically, the heating element 120 completely covers the area of the substrate 110 where the hollow structure 113 is not arranged. An electrode 123 is provided at each end of the heating element 120, one electrode 123 is used to connect to the positive electrode of the power supply component, and the other electrode 123 is used to connect to the negative electrode of the power supply component.
[0036] The heating element 120 completely covers the area of the substrate 110 where the hollow structure 113 is not arranged, so as to increase the heating rate of the substrate 110 .
[0037] Please refer to Figure 6 The hollow structure 113 is a blind hole 1211 , and the opening of the blind hole 1211 is set toward the outer side surface 111 .
[0038] Providing the blind holes 1211 on the substrate 110 can reduce the weight of the substrate 110 to a certain extent while preventing the quality of the substrate 110 from being excessively reduced, thereby ensuring the mechanical strength of the substrate 110 .
[0039] Please refer to Figure 1 , the hollow structure 113 is a regular hexagon, and the substrate 110 is a hollow tube structure. When the substrate 110 is unfolded, please refer to Figure 2 The hollow structures 113 are distributed in a honeycomb shape on the substrate 110. In other embodiments, the hollow structures 113 may also be circular or rectangular, or a combination of at least two of regular hexagons, circular or rectangular, which is not specifically limited.
[0040] When the substrate 110 is made of a conductive material, the heater 100 further includes an insulating layer (not shown). The insulating layer is disposed between the substrate 110 and the heating element 120 , and the insulating layer is a glass enamel insulating layer.
[0041] In this embodiment, the substrate 110 is a stainless steel substrate 110, which includes stainless steel SUS430, stainless steel SUS444, and stainless steel SUS340. In other embodiments, the substrate 110 may also be a copper substrate 110, an aluminum substrate 110, a copper-aluminum alloy substrate 110, a titanium alloy substrate 110, a titanium-aluminum alloy substrate 110, or a ceramic substrate 110. Furthermore, in this embodiment, the heating element 120 is a thick film heating layer, or it may be a resistive mesh.
[0042] In addition, the blind holes 1211 on the substrate 110 can be formed during the preparation process of the substrate 110. For example, when the preparation process of the circular tube substrate 110 adopts a strip welding and further shaping process, the blind holes 1211 are prefabricated in the strip. Alternatively, the blind holes 1211 can be formed after the substrate 110 is manufactured by processing, for example, by laser processing, stamping, or etching.
[0043] Example 2
[0044] This embodiment provides a heater 100, which can be used in a heat-not-burn device 200, wherein, please refer to Figure 1-2 、 Figure 4 and Figure 6 The heater 100 includes a substrate 110 and a heating element 120 .
[0045] Please refer to Figure 1 and Figure 4The substrate 110 has an outer side surface 111 and an inner side surface 112 that are oppositely disposed. A hollow structure 113 is distributed on the substrate 110. A heating element 120 is disposed on the outer side surface 111 and staggered with the hollow structure. The heating element 120 generates heat that is transferred to the substrate 110, causing the substrate 110 to heat the aerosol to generate a matrix.
[0046] In this embodiment, please refer to Figure 1 , the substrate 110 is a tubular structure. In other embodiments, the shape of the substrate 110 is not limited to a tubular structure, and can be other shapes depending on the usage scenario, which is not specifically limited.
[0047] The present application achieves lightweighting of the substrate 110 by providing a hollow structure 113 on the substrate 110. The presence of the hollow structure 113 still ensures that the mechanical strength of the substrate 110 meets the requirements for use, and a thick-film heating tube can still be produced using existing thick-film processes. Furthermore, due to the lightweight design of the substrate 110, when the heating element 120 transfers heat to the substrate 110, the heating rate of the substrate 110 itself can be increased and energy consumption can be reduced. The hollow structure 113 also helps to alleviate thermal stress between the substrate 110 and the heating element 120, reducing the probability of film failure or detachment when the heating element 120 is a thick-film heating layer.
[0048] In the present application, the hollow structure 113 and the heating element 120 are staggered, and heat can be directly conducted from the heating element 120 to the substrate 110, thereby shortening the heat conduction time.
[0049] Please refer to Figure 4 The heating element 120 is a mesh structure, and the hollow structure 113 is aligned with the mesh holes of the heating element 120 in the thickness direction of the substrate 110 .
[0050] The mesh structure design can facilitate the heating element 120 to completely wrap the substrate 110, thereby facilitating heat conduction to the substrate 110.
[0051] In this embodiment, please refer to Figure 4 The heating element 120 covers the portion of the substrate 110 where the hollow structure 113 is not arranged. An electrode 123 is provided at each end of the heating element 120, one electrode 123 is used to connect to the positive electrode of the power supply component, and the other electrode 123 is used to connect to the negative electrode of the power supply component.
[0052] On the premise that the heating rate of the substrate 110 does not affect the use, the area of the heating element 120 covering the substrate 110 can be appropriately reduced. When the heating element 120 is a thick film heating layer, it helps to relieve the thermal stress between the substrate 110 and the heating element 120 and reduce the probability of film failure or falling off.
[0053] Please refer to Figure 6The hollow structure 113 is a blind hole 1211 , and the opening of the blind hole 1211 is set toward the outer side surface 111 .
[0054] Providing the blind holes 1211 on the substrate 110 can reduce the weight of the substrate 110 to a certain extent while preventing the quality of the substrate 110 from being excessively reduced, thereby ensuring the mechanical strength of the substrate 110 .
[0055] Please refer to Figure 1 , the hollow structure 113 is a regular hexagon, and the substrate 110 is a hollow tube structure. When the substrate 110 is unfolded, please refer to Figure 2 The hollow structures 113 are distributed in a honeycomb shape on the substrate 110. In other embodiments, the hollow structures 113 may also be circular or rectangular, or a combination of at least two of regular hexagons, circular or rectangular, which is not specifically limited.
[0056] When the substrate 110 is made of a conductive material, the heater 100 further includes an insulating layer disposed between the substrate 110 and the heating element 120 . The insulating layer is a glass enamel insulating layer.
[0057] In the present embodiment, the substrate 110 is a stainless steel substrate 110, and the stainless steel substrate 110 includes stainless steel SUS430, stainless steel SUS444 and stainless steel SUS340. In other embodiments, the substrate 110 can also be a copper substrate 110, an aluminum substrate 110, a copper-aluminum alloy substrate 110, a titanium alloy substrate 110, a titanium-aluminum alloy substrate 110 or a ceramic substrate 110. In addition, in the present embodiment, the heating element 120 is a thick film heating layer, and can also be a resistor mesh. In addition, the blind holes 1211 on the substrate 110 can be formed during the preparation process of the substrate 110. For example, when the preparation process of the round tube substrate 110 adopts a process of strip welding and further shaping, the blind holes 1211 are prefabricated on the strip. It can also be formed by processing after the substrate 110 is made, for example, by laser processing, stamping or etching.
[0058] Example 3
[0059] This embodiment provides a heater 100, which can be used in a heat-not-burn device 200, wherein, please refer to Figure 1-2 、 Figure 5 and Figure 6 The heater 100 includes a substrate 110 and a heating element 120 .
[0060] Please refer to Figure 1 and Figure 5The substrate 110 has an outer side surface 111 and an inner side surface 112 that are oppositely disposed. A hollow structure 113 is distributed on the substrate 110. A heating element 120 is disposed on the outer side surface 111 and staggered with the hollow structure 113. The heating element 120 is used to conduct heat to the substrate 110, so that the substrate 110 heats the aerosol to generate a matrix.
[0061] In this embodiment, please refer to Figure 1 , the substrate 110 is a tubular structure. In other embodiments, the shape of the substrate 110 is not limited to a tubular structure, and can be other shapes depending on the usage scenario, which is not specifically limited.
[0062] This application achieves lightweighting of the substrate 110 by providing a hollow structure 113 on the substrate 110. The presence of the hollow structure 113 still ensures that the mechanical strength of the substrate 110 meets the required performance, and a thick-film heating tube can still be produced using existing thick-film processes. Furthermore, due to the lightweight design of the substrate 110, when the heating element 120 transfers heat to the substrate 110, the heating rate of the substrate 110 itself can be increased and energy consumption can be reduced. The hollow structure 113 also helps to alleviate thermal stress between the substrate 110 and the heating element 120, reducing the probability of film failure or shedding.
[0063] In the present application, the hollow structure 113 and the heating element 120 are staggered, and heat can be directly conducted from the heating element 120 to the substrate 110, thereby shortening the heat conduction time.
[0064] Please refer to Figure 5 The heating element 120 includes a plurality of bending structures 122, the bending structures 122 are bent to form intervals, the plurality of bending structures 122 are connected in sequence, and each interval encloses a plurality of hollow structures 113. Specifically, in the present embodiment, there is only one heating element 120, and an electrode 123 is provided at each end of the heating element 120, wherein one electrode 123 is connected to the positive electrode of the power supply component, and the other electrode 123 is connected to the negative electrode of the power supply component. The power supply component is used to supply power to the heating element 120. In other embodiments, the heating element 120 includes at least two or more, so that different parts of the aerosol generating matrix can be heated.
[0065] Please refer to Figure 6 The hollow structure 113 is a blind hole 1211 , and the opening of the blind hole 1211 is set toward the outer side surface 111 .
[0066] Providing the blind holes 1211 on the substrate 110 can reduce the weight of the substrate 110 to a certain extent while preventing the quality of the substrate 110 from being excessively reduced, thereby ensuring the mechanical strength of the substrate 110 .
[0067] Please refer to Figure 1, the hollow structure 113 is a regular hexagon, and the substrate 110 is a hollow tube structure. When the substrate 110 is unfolded, please refer to Figure 2 The hollow structures 113 are distributed in a honeycomb shape on the substrate 110. In other embodiments, the hollow structures 113 may also be circular or rectangular, or a combination of at least two of a regular hexagon, a circle, or a rectangle, which is not specifically limited.
[0068] When the substrate 110 is made of a conductive material, the heater 100 further includes an insulating layer disposed between the substrate 110 and the heating element 120 . The insulating layer is a glass enamel insulating layer.
[0069] In this embodiment, the substrate 110 is a stainless steel substrate 110, which includes stainless steel SUS430, stainless steel SUS444, and stainless steel SUS340. In other embodiments, the substrate 110 may also be a copper substrate 110, an aluminum substrate 110, a copper-aluminum alloy substrate 110, a titanium alloy substrate 110, a titanium-aluminum alloy substrate 110, or a ceramic substrate 110. Furthermore, in this embodiment, the heating element 120 is a thick film heating layer, or it may be a resistance wire.
[0070] In addition, the blind holes 1211 on the substrate 110 can be formed during the preparation process of the substrate 110. For example, when the preparation process of the circular tube substrate 110 adopts a strip welding and further shaping process, the blind holes 1211 are prefabricated in the strip. Alternatively, the blind holes 1211 can be formed after the substrate 110 is manufactured by processing, for example, by laser processing, stamping, or etching.
[0071] Example 4
[0072] Please refer to Figure 7 , which differs from Example 1 in that the hollow structure 113 is a through hole 1212. The through hole 1212 on the substrate 110 can be formed during the preparation process of the substrate 110. For example, when the preparation process of the circular tube substrate 110 adopts a strip welding and further shaping process, the through hole 1212 is prefabricated in the strip. Alternatively, the through hole 1212 can be formed after the substrate 110 is manufactured by processing, for example, by laser processing, stamping, or etching.
[0073] Example 5
[0074] Please refer to Figure 7 , which differs from Example 2 in that the hollow structure 113 is a through hole 1212. The through hole 1212 on the substrate 110 can be formed during the preparation of the substrate 110. For example, when the preparation process of the circular tube substrate 110 adopts a strip welding and further shaping process, the through hole 1212 is preformed in the strip. Alternatively, the through hole 1212 can be formed after the substrate 110 is manufactured by processing, for example, by laser processing, stamping, or etching.
[0075] Example 6
[0076] Please refer to Figure 7 , which differs from Example 3 in that the hollow structure 113 is a through hole 1212. The through hole 1212 on the substrate 110 can be formed during the preparation process of the substrate 110. For example, when the preparation process of the circular tube substrate 110 adopts a strip welding and further shaping process, the through hole 1212 is prefabricated in the strip. Alternatively, the through hole 1212 can be formed after the substrate 110 is manufactured by processing, for example, by laser processing, stamping, or etching.
[0077] Example 7
[0078] This embodiment provides a heating without burning device 200, please refer to Figure 8 The heating without burning device 200 includes a shell (not shown), a heater 100 and a power supply component (not shown), etc. The shell has a receiving cavity, and the heater 100 and the power supply component are both arranged in the receiving cavity. The heater 100 can use any one of Examples 1-6.
[0079] The above examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. Those skilled in the art of the present invention can make some simple deductions, modifications or substitutions based on the concept of the present invention.
Claims
1. A heater, characterized in that: include: A substrate having an inner side surface and an outer side surface opposite to each other, wherein a hollow structure is distributed on the substrate; and a heating element, which is arranged on the outer surface and staggered with the hollow structure. The heating element generates heat and conducts it to the substrate, so that the substrate heats the aerosol to generate a matrix.
2. The heater according to claim 1, wherein The heating element is a mesh structure, and the hollow structure and the mesh holes of the heating element are aligned in the thickness direction of the substrate.
3. The heater according to claim 2, wherein The heating element completely covers the area of the substrate where no hollow structure is arranged, or the heating element covers a part of the area of the substrate where no hollow structure is arranged.
4. The heater according to claim 1, wherein The heating element includes at least one bending structure, and the bending structure is bent to form a separation space. When the bending structure includes two or more, the bending structures are connected in sequence, and each of the separation spaces encloses at least one hollow structure.
5. The heater according to claim 1, wherein The hollow structure is a blind hole, and the opening of the blind hole is arranged toward the outer side.
6. The heater according to claim 1, wherein The hollow structure is a through hole.
7. The heater according to claim 5 or 6, characterized in that The hollow structure is at least one of a regular hexagon, a circle and a rectangle. When the substrate is unfolded, the hollow structure is distributed in a honeycomb shape on the substrate.
8. The heater according to claim 1, wherein The heating elements include two or more heating elements so as to independently heat different parts of the aerosol matrix.
9. The heater according to claim 1, wherein When the substrate is made of a conductive material, the heater further includes an insulating layer, which is disposed between the substrate and the heating element, and is a glass enamel insulating layer.
10. A heat-not-burn device, characterized in that: Comprising the heater according to any one of claims 1-9.