High-temperature-resistant storage device for epoxy resin adhesive

Abstract

The utility model discloses a high-temperature-resistant epoxy resin adhesive storage device, which belongs to the technical field of material storage and is characterized by comprising an inner container, a temperature control mechanism is arranged on the inner side of the bottom of the inner container, a heat insulation plate is fixedly connected to the surface of the top of the temperature control mechanism, and a shell is fixedly connected to the surface of the inner container. A circulation mechanism is fixedly connected to the left side of the surface of the shell, the inner container is in direct contact with epoxy resin adhesive, a storage space is provided for the adhesive, it is ensured that the adhesive is safely stored in a specific environment and prevented from being polluted by external impurities, and the heat insulation plate is located at the top of the temperature control mechanism, so that heat of the water storage layer can be effectively prevented from being transmitted upwards; the heat loss is reduced, the energy utilization efficiency is improved, meanwhile, when the external environment temperature is high, external heat can be prevented from being transmitted into the inner container, the stability of the internal temperature of the storage device is kept, and the shell provides firm external protection for the storage device.

Description

Technical Field

[0001] The utility model relates to the technical field of material storage, in particular to a high-temperature resistant storage device for epoxy resin adhesive. Background Art

[0002] Epoxy adhesives are known as all-purpose glue and super glue. They are mainly composed of two parts: epoxy resin and curing agent. They have been widely and successfully used in aviation, construction, machinery, electrical appliances, chemicals, petroleum, railways, light industry, agricultural machinery, arts and crafts, cultural relics restoration, daily life and other fields.

[0003] Conventional epoxy resin adhesives are usually stored in storage tanks. Under normal circumstances, the storage tanks can effectively store the epoxy resin adhesives. However, when the external temperature is high, the storage tanks are not sufficiently insulated, which makes the epoxy resin adhesives stored inside easily deteriorate due to the heat, thereby affecting the quality of the epoxy resin adhesives.

[0004] The existing patent (Announcement No.: CN215874522U) is a high-temperature resistant epoxy resin adhesive storage tank, which relates to the technical field of storage tanks. The utility model includes a tank body, the interior of which is provided with a fan-shaped storage cavity, and the fan-shaped storage cavity inside the tank body is provided with three locations in a circular array. A heat insulation layer is fixedly provided on the inner wall of the tank body, and a sealing cover is screwed on the top of the tank body. The utility model can improve the heat insulation effect of the tank body by providing a heat insulation layer, thereby achieving high-temperature resistant storage of epoxy resin adhesive, and has stronger applicability. By providing three fan-shaped storage cavities inside the tank body, the epoxy resin adhesive can be used in sections during the use of the epoxy resin adhesive inside the tank body, thereby improving the preservation quality of the epoxy resin adhesive. The cooperation of the octagonal groove and the octagonal annular protrusion makes the stacked tank body more stable, preventing the tank body from rotating.

[0005] In response to the above problems, existing patents have provided solutions, but they lack a structure for controlling the temperature of the storage device, which makes it difficult to stabilize the temperature during the storage of the adhesive. This may cause the epoxy resin adhesive to deteriorate, deteriorate, or even fail due to temperature fluctuations, reducing the effectiveness of the adhesive.

[0006] To this end, a high temperature resistant storage device for epoxy resin adhesive is proposed. Utility Model Content

[0007] The purpose of the utility model is to provide a high-temperature resistant storage device for epoxy resin adhesive, which can solve the problem that the existing material storage lacks a structure for controlling the temperature of the storage device, resulting in difficulty in stabilizing the temperature during the storage of the adhesive, which may cause the epoxy resin adhesive to deteriorate, deteriorate or even fail due to temperature fluctuations, thereby reducing the use effect of the adhesive.

[0008] To achieve the above objectives, the present invention provides the following technical solutions: a high-temperature resistant storage device for epoxy resin adhesive, comprising an inner liner, a temperature control mechanism provided on the inner side of the bottom of the inner liner, a heat insulation board fixedly connected to the top surface of the temperature control mechanism, an outer shell fixedly connected to the surface of the inner liner, and a circulation mechanism fixedly connected to the left side of the outer shell surface;

[0009] The temperature control mechanism includes a water storage layer, a heat conduction plate, a ceramic heating plate, a heat conduction pipe, a temperature sensor and a microcontroller. The water storage layer is opened on the inner side of the bottom of the inner tank, the heat conduction plate is fixedly connected to the bottom of the water storage layer, the ceramic heating plate is fixedly connected to the bottom of the heat conduction plate, the heat conduction pipe is fixedly connected to the bottom of the left side of the inner tank, the right side of the temperature sensor is fixedly connected to the inner side of the heat conduction pipe, the left side of the temperature sensor passes through the inner tank and the outer shell respectively and is fixedly connected to the outer shell, and the microcontroller is fixedly connected to the bottom of the left side of the outer shell.

[0010] Preferably, the circulation mechanism includes a circulation pump, a connecting port, a water inlet pipe, a three-way solenoid valve, a water outlet pipe, two connecting pipes, a one-way solenoid valve and a water outlet pipe, and the circulation pump is fixedly connected to the left side of the shell surface.

[0011] Preferably, the connection port is opened at the top of the circulation pump, the water inlet pipe is fixedly connected to the bottom of the circulation pump, the side of the water inlet pipe away from the circulation pump is fixedly connected to the left side of the three-way solenoid valve, the three-way solenoid valve passes through the bottom of the left side of the inner tank and is fixedly connected to the left side of the water storage layer, the water pipe is connected to the rear side of the three-way solenoid valve, the inner side of the water pipe is fixedly connected to the surface of the inner tank, and the bottom of the left connecting pipe is fixedly connected to the bottom of the left side of the water pipe.

[0012] Preferably, the top of the left connecting pipe is fixedly connected to the top of the left side of the water pipe, the top of the right connecting pipe is fixedly connected to the top of the right side of the water pipe, the bottom of the right connecting pipe is fixedly connected to the bottom of the right side of the water pipe, the one-way solenoid valve is fixedly connected to the bottom of the right side of the water pipe, the outlet pipe is fixedly connected to the right side of the water storage layer, the outlet pipe passes through the water storage layer and is fixedly connected to the bottom of the right side of the water pipe, and the circulation pump, connecting port, water inlet pipe, three-way solenoid valve, water pipe, two connecting pipes, one-way solenoid valve and outlet pipe are connected.

[0013] Preferably, a sealing ring is fixedly connected to the right side of the water inlet pipe, and the side of the sealing ring away from the water inlet pipe is bolted to the left side of the three-way solenoid valve.

[0014] Preferably, a reinforcement seat is bolted to the surface of the circulation pump, and a side of the reinforcement seat away from the circulation pump is bolted to the left side of the housing.

[0015] Preferably, a protective shell is snapped onto the surface of the microcontroller, and the protective shell is coated with anti-corrosion paint.

[0016] Preferably, the heat conducting plate is made of tin bronze material, and the surface of the heat conducting plate is coated with thermal grease.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. The inner liner of the present application is in direct contact with the epoxy resin adhesive, providing storage space for the adhesive, ensuring that the adhesive is safely stored in a specific environment and preventing it from being contaminated by external impurities. The heat insulation board is located on the top of the temperature control mechanism, which can effectively prevent the heat of the water storage layer from transferring upward, reducing heat loss and improving energy utilization efficiency. At the same time, when the external ambient temperature is high, it can also prevent external heat from entering the inner liner and maintain the internal temperature of the storage device stable. The outer shell provides a solid external protection for the storage device to prevent the inner liner from being impacted and damaged by external forces. At the same time, it can also play a certain role in heat insulation and sealing, reducing the impact of the external environment on the internal temperature of the storage device. The water storage layer acts as a medium for heat transfer. The large specific heat capacity of water can effectively absorb and release heat, achieve the regulation of the adhesive storage environment temperature, and ensure that the temperature is stable within an appropriate range. The heat conducting plate is made of tin bronze material with good thermal conductivity. It can quickly transfer the heat generated by the ceramic heating plate to the water storage layer, thereby improving the heat transfer efficiency. The ceramic heating plate can heat up quickly, providing a stable heat source for the water storage layer, ensuring that the temperature of the water inside the water storage layer can be effectively increased in a timely manner when the temperature needs to be increased, meeting the requirements of epoxy resin adhesives for high-temperature storage environments. The heat pipe facilitates the installation of the temperature sensor and helps the temperature sensor to more accurately sense the temperature changes inside the storage device, thereby improving the accuracy of temperature monitoring. The temperature sensor monitors the temperature inside the storage device in real time and provides accurate temperature data to the microcontroller so that the heating or cooling measures can be adjusted in time to ensure that the adhesive is always at an appropriate storage temperature. The microcontroller automatically controls the working status of the ceramic heating plate, three-way solenoid valve, circulation pump and one-way valve based on the data fed back by the temperature sensor to achieve precise control of the temperature of the storage device and improve the intelligence and reliability of the storage device. The circulation pump provides circulation power for the water in the water storage layer, so that the water flows continuously inside the storage device to ensure a more uniform temperature distribution and avoid the occurrence of local over-high or over-low temperatures. The connection port is convenient for connection to an external water source or other equipment. The circulation pump provides a water inlet channel. The water inlet pipe transports water from the circulation pump to the three-way solenoid valve to ensure that the water can smoothly enter the water storage layer for circulation. The three-way solenoid valve controls the flow direction of the water, realizing the switching of water between different pipes to meet the needs of heating and cooling. The water pipe provides a channel for the circulation of water on the surface of the inner tank, allowing water to flow through the surface of the inner tank to achieve indirect heating or cooling of the adhesive. The connecting pipe connects different parts of the water pipe to ensure that the water can flow smoothly in the water pipe and improve the circulation efficiency. The one-way solenoid valve controls the speed and flow of water out of the water storage layer to ensure that the water can circulate according to the predetermined path. The water outlet pipe discharges the heated water in the water storage layer to the water pipe to achieve the circulation of hot water.

[0019] 2. Compared with the existing high-temperature resistant storage device for epoxy resin adhesive, the present application achieves the effect of temperature control of the storage device through the cooperation of the temperature control mechanism and the circulation mechanism, thereby improving the temperature stability during the storage of the adhesive, thereby reducing the probability of performance degradation, deterioration or even failure of the epoxy resin adhesive due to temperature fluctuations, and improving the use effect of the adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is the overall structure diagram of the high-temperature resistant storage device for epoxy resin adhesive of the present utility model;

[0021] Figure 2 This is the overall structural diagram of the temperature control mechanism of the utility model;

[0022] Figure 3 This is the overall structural diagram of the circulation mechanism of the utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the sealing ring of the utility model;

[0024] Figure 5 This is a schematic structural diagram of the protective shell of the utility model.

[0025] In the figure, 1. Inner tank; 2. Temperature control mechanism; 21. Water storage layer; 22. Heat conduction plate; 23. Ceramic heating plate; 24. Heat conduction pipe; 25. Temperature sensor; 26. Microcontroller; 3. Heat insulation board; 4. Outer shell; 5. Circulation mechanism; 51. Circulation pump; 52. Connecting port; 53. Water inlet pipe; 54. Three-way solenoid valve; 55. Water outlet pipe; 56. Connecting pipe; 57. One-way solenoid valve; 58. Water outlet pipe; 6. Sealing ring; 7. Reinforcement seat; 8. Protective shell. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] See also Figure 1-5 , this utility model provides a technical solution:

[0028] A high-temperature resistant storage device for epoxy resin adhesive includes an inner liner 1, a temperature control mechanism 2 is provided on the inner side of the bottom of the inner liner 1, a heat insulation board 3 is fixedly connected to the top surface of the temperature control mechanism 2, an outer shell 4 is fixedly connected to the surface of the inner liner 1, and a circulation mechanism 5 is fixedly connected to the left side of the surface of the outer shell 4;

[0029] The temperature control mechanism 2 includes a water storage layer 21, a heat conducting plate 22, a ceramic heating plate 23, a heat conducting pipe 24, a temperature sensor 25 and a microcontroller 26. The water storage layer 21 is opened on the inner side of the bottom of the inner tank 1, the heat conducting plate 22 is fixedly connected to the bottom of the water storage layer 21, the ceramic heating plate 23 is fixedly connected to the bottom of the heat conducting plate 22, the heat conducting pipe 24 is fixedly connected to the bottom of the left side of the inner tank 1, the right side of the temperature sensor 25 is fixedly connected to the inner side of the heat conducting pipe 24, the left side of the temperature sensor 25 passes through the inner tank 1 and the outer shell 4 respectively and is fixedly connected to the outer shell 4, and the microcontroller 26 is fixedly connected to the bottom of the left side of the outer shell 4.

[0030] In this embodiment: by setting the inner liner 1 in direct contact with the epoxy resin adhesive, a storage space is provided for the adhesive, ensuring that the adhesive is safely stored in a specific environment and preventing it from being contaminated by external impurities. The heat insulation plate 3 is located on the top of the temperature control mechanism 2, which can effectively prevent the heat of the water storage layer 21 from transferring upward, reducing heat loss and improving energy utilization efficiency. At the same time, when the external environment temperature is high, it can also prevent external heat from entering the inner liner 1, maintaining the internal temperature of the storage device stable. The outer shell 4 provides a solid external protection for the storage device to prevent the inner liner 1 from being impacted and damaged by external forces. At the same time, it can also play a certain role in heat insulation and sealing, reducing the impact of the external environment on the internal temperature of the storage device. The water storage layer 21 acts as a heat transfer medium. Through the large specific heat capacity of water, it can effectively absorb and release heat, realize the regulation of the adhesive storage environment temperature, and ensure that the temperature is stable within an appropriate range. The heat conduction plate 22 is made of tin bronze material, has good thermal conductivity, and can quickly The heat generated by the ceramic heater 23 is transferred to the water storage layer 21, thereby improving the heat transfer efficiency. The ceramic heater 23 can heat up quickly, providing a stable heat source for the water storage layer 21, ensuring that the temperature of the water inside the water storage layer 21 can be timely and effectively increased when the temperature needs to be increased, thereby meeting the requirements of the epoxy resin adhesive for a high-temperature storage environment. The heat pipe 24 facilitates the installation of the temperature sensor 25, and at the same time helps the temperature sensor 25 to more accurately sense the temperature changes inside the storage device, thereby improving the accuracy and timeliness of temperature monitoring. The temperature sensor 25 monitors the temperature inside the storage device in real time and provides accurate temperature data to the microcontroller 26 so that heating or cooling measures can be adjusted in time to ensure that the adhesive is always at an appropriate storage temperature. The microcontroller 26 automatically controls the working status of the ceramic heater 23, the three-way solenoid valve 54, the circulation pump 51 and the one-way valve based on the data fed back by the temperature sensor 25, thereby achieving precise control of the temperature of the storage device and improving the intelligence and reliability of the storage device.

[0031] Specifically, such as Figure 3As shown, the circulation mechanism 5 includes a circulation pump 51, a connecting port 52, a water inlet pipe 53, a three-way solenoid valve 54, a water outlet pipe 55, two connecting pipes 56, a one-way solenoid valve 57 and a water outlet pipe 58, and the circulation pump 51 is fixedly connected to the left side of the surface of the shell 4.

[0032] Specifically, such as Figure 3 As shown, the connection port 52 is opened at the top of the circulation pump 51, the water inlet pipe 53 is fixedly connected to the bottom of the circulation pump 51, and the side of the water inlet pipe 53 away from the circulation pump 51 is fixedly connected to the left side of the three-way solenoid valve 54. The three-way solenoid valve 54 passes through the bottom of the left side of the inner tank 1 and is fixedly connected to the left side of the water storage layer 21. The water pipe 55 is connected to the rear side of the three-way solenoid valve 54, and the inner side of the water pipe 55 is fixedly connected to the surface of the inner tank 1. The bottom of the left connecting pipe 56 is fixedly connected to the bottom of the left side of the water pipe 55.

[0033] Specifically, such as Figure 3 As shown, the top of the left connecting pipe 56 is fixedly connected to the top of the left side of the water pipe 55, the top of the right connecting pipe 56 is fixedly connected to the top of the right side of the water pipe 55, the bottom of the right connecting pipe 56 is fixedly connected to the bottom of the right side of the water pipe 55, the one-way solenoid valve 57 is fixedly connected to the bottom of the right side of the water pipe 55, the outlet pipe 58 is fixedly connected to the right side of the water storage layer 21, the outlet pipe 58 passes through the water storage layer 21 and is fixedly connected to the bottom of the right side of the water pipe 55, the circulation pump 51, the connecting port 52, the water inlet pipe 53, the three-way solenoid valve 54, the water pipe 55, the two connecting pipes 56, the one-way solenoid valve 57 and the outlet pipe 58 are connected.

[0034] In this embodiment, a circulation pump 51 is provided to provide circulation power for the water in the water storage layer 21, so that the water continuously flows inside the storage device, ensuring a more uniform temperature distribution and avoiding the occurrence of local excessively high or low temperatures. The connection port 52 is convenient for connection with an external water source or other equipment, providing a water inlet channel for the circulation pump 51. The water inlet pipe 53 transports water from the circulation pump 51 to the three-way solenoid valve 54, ensuring that the water can smoothly enter the water storage layer 21 for circulation. The three-way solenoid valve 54 controls the flow direction of the water and realizes the switching of water between different pipelines. To meet the needs of heating and cooling, the water pipe 55 provides a channel for the circulation of water on the surface of the inner tank 1, allowing water to flow through the surface of the inner tank 1 to achieve indirect heating or cooling of the adhesive. The connecting pipe 56 connects different parts of the water pipe 55 to ensure that water can flow smoothly in the water pipe 55 and improve the circulation efficiency. The one-way solenoid valve 57 controls the speed and flow rate of water flowing out of the water storage layer 21 to ensure that the water can circulate along a predetermined path. The outlet pipe 58 discharges the heated water in the water storage layer 21 to the water pipe 55 to achieve the circulation of hot water.

[0035] Specifically, such as Figure 4As shown, a sealing ring 6 is fixedly connected to the right side of the water inlet pipe 53 , and a side of the sealing ring 6 away from the water inlet pipe 53 is bolted to the left side of the three-way solenoid valve 54 .

[0036] Specifically, such as Figure 5 As shown, a reinforcement seat 7 is bolted to the surface of the circulation pump 51 , and a side of the reinforcement seat 7 away from the circulation pump 51 is bolted to the left side of the housing 4 .

[0037] In this embodiment: by providing a sealing ring 6 and installing it between the water inlet pipe 53 and the three-way solenoid valve 54, water leakage can be effectively prevented, the sealing of the circulation mechanism 5 can be ensured, and the reliability and stability of the mechanism can be improved. By providing a reinforcement seat 7, the circulation pump 51 is reinforced to prevent the circulation pump 51 from loosening or being damaged due to vibration during operation, thereby improving the installation stability and reliability of the circulation pump 51.

[0038] Specifically, such as Figure 5 As shown, a protective shell 8 is snapped onto the surface of the microcontroller 26 , and the protective shell 8 is coated with anti-corrosion paint.

[0039] Specifically, such as Figure 2 As shown, the heat conducting plate 22 is made of tin bronze material, and the surface of the heat conducting plate 22 is coated with thermal grease.

[0040] In this embodiment: by providing a protective shell 8, the microcontroller 26 is protected from the influence of the external environment, such as dust, moisture, electromagnetic interference, etc., by providing an anti-corrosion coating, the protective shell 8 can be effectively prevented from being corroded, and the service life of the microcontroller 26 is extended. By providing the heat conducting plate 22 to be made of tin bronze material, which has good thermal conductivity, the heat generated by the ceramic heating plate 23 can be quickly transferred to the water storage layer 21, thereby improving the heat transfer efficiency. By providing thermal grease, the contact thermal resistance is further reduced and the thermal conductivity effect is enhanced.

[0041] Working principle: First, the user places the shell 4 in a suitable working position. Then, when the epoxy resin adhesive needs to be stored, the user opens the twist cover on the top of the shell 4 and slowly pours the epoxy resin adhesive into the inner liner 1. After adding the adhesive, the user tightly closes the twist cover and the top of the shell 4. Then, the user connects the external water source to the connection port 52 and powers on the temperature sensor 25 and the microcontroller 26. When the temperature sensor 25 detects that the temperature of the adhesive inside the inner liner 1 is too high, the microcontroller 26 will control the circulation pump 51 to operate, so that it draws water through the external water source and allows the water to enter the water inlet pipe 53. After the water inlet pipe 53 transports the water from the circulation pump 51 to the three-way solenoid valve 54, the microcontroller 26 controls the outlet on the rear side of the three-way solenoid valve 54 to open, and the water then flows directly into the water pipe 55 through the three-way solenoid valve 54. The water pipe 55 surrounds the inner liner 1 and dissipates heat to the inner liner 1 through the water flow, thereby reducing the temperature of the adhesive inside the inner liner 1. When the temperature sensor 25 senses that the temperature is too low, the microcontroller 26 will control the circulation pump 51 to continue working again, and at the same time close the outlet on the rear side of the three-way solenoid valve 54 and open the outlet on the right side of the three-way solenoid valve 54 to allow water to flow into the water storage layer 21. At the same time, the microcontroller 26 controls the ceramic heating plate 23 to start heating. The heat generated by the ceramic heating plate 23 is transferred to the heat conducting plate 22, and the heat conducting plate 22 then heats the water flow inside the water storage layer 21. At this time, the microcontroller 26 controls the one-way solenoid valve 57 to open, and the heated water flows into the inside of the one-way solenoid valve 57 through the outlet pipe 58. The one-way solenoid valve 57 guides the hot water to the bottom of the right side of the water pipe 55 and flows along the surface of the inner tank 1 to heat the inner tank 1. The inner tank 1 then transfers the heat to the adhesive inside. Finally, when the storage device needs to be maintained or adjusted, the user turns off the temperature sensor 25 and the microcontroller 26, opens the twist cover, and then can access the adhesive.

[0042] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-temperature resistant storage device for epoxy resin adhesive, comprising an inner liner (1), characterized in that: A temperature control mechanism (2) is provided on the inner side of the bottom of the inner container (1); a heat insulation plate (3) is fixedly connected to the surface of the top of the temperature control mechanism (2); an outer shell (4) is fixedly connected to the surface of the inner container (1); and a circulation mechanism (5) is fixedly connected to the left side of the surface of the outer shell (4); The temperature control mechanism (2) comprises a water storage layer (21), a heat conducting plate (22), a ceramic heating plate (23), a heat conducting pipe (24), a temperature sensor (25) and a microcontroller (26); the water storage layer (21) is opened on the inner side of the bottom of the inner container (1); the heat conducting plate (22) is fixedly connected to the bottom of the water storage layer (21); the ceramic heating plate (23) is fixedly connected to the bottom of the heat conducting plate (22); the heat conducting pipe (24) is fixedly connected to the bottom of the left side of the inner container (1); the right side of the temperature sensor (25) is fixedly connected to the inner side of the heat conducting pipe (24); the left side of the temperature sensor (25) respectively penetrates the inner container (1) and the outer shell (4) and is fixedly connected to the outer shell (4); and the microcontroller (26) is fixedly connected to the bottom of the left side of the outer shell (4).

2. The high-temperature resistant storage device for epoxy resin adhesive according to claim 1, characterized in that: The circulation mechanism (5) comprises a circulation pump (51), a connecting port (52), a water inlet pipe (53), a three-way solenoid valve (54), a water outlet pipe (55), two connecting pipes (56), a one-way solenoid valve (57) and a water outlet pipe (58). The circulation pump (51) is fixedly connected to the left side of the surface of the housing (4).

3. The high temperature resistant storage device for epoxy resin adhesive according to claim 2, characterized in that: The connection port (52) is opened at the top of the circulation pump (51), the water inlet pipe (53) is fixedly connected to the bottom of the circulation pump (51), the side of the water inlet pipe (53) away from the circulation pump (51) is fixedly connected to the left side of the three-way solenoid valve (54), the three-way solenoid valve (54) passes through the bottom of the left side of the inner tank (1) and is fixedly connected to the left side of the water storage layer (21), the water outlet pipe (55) is connected to the rear side of the three-way solenoid valve (54), the inner side of the water outlet pipe (55) is fixedly connected to the surface of the inner tank (1), and the bottom of the left connecting pipe (56) is fixedly connected to the bottom of the left side of the water outlet pipe (55).

4. The high temperature resistant storage device for epoxy resin adhesive according to claim 3, characterized in that: The top of the left connecting pipe (56) is fixedly connected to the top of the left side of the water pipe (55), the top of the right connecting pipe (56) is fixedly connected to the top of the right side of the water pipe (55), the bottom of the right connecting pipe (56) is fixedly connected to the bottom of the right side of the water pipe (55), the one-way solenoid valve (57) is fixedly connected to the bottom of the right side of the water pipe (55), the outlet pipe (58) is fixedly connected to the right side of the water storage layer (21), the outlet pipe (58) passes through the water storage layer (21) and is fixedly connected to the bottom of the right side of the water pipe (55), the circulating pump (51), the connecting port (52), the water inlet pipe (53), the three-way solenoid valve (54), the water pipe (55), the two connecting pipes (56), the one-way solenoid valve (57) and the outlet pipe are connected.

5. The high temperature resistant storage device for epoxy resin adhesive according to claim 4, characterized in that: The right side of the water inlet pipe (53) is fixedly connected with a sealing ring (6), and the side of the sealing ring (6) away from the water inlet pipe (53) is bolted to the left side of the three-way solenoid valve (54).

6. The high temperature resistant storage device for epoxy resin adhesive according to claim 5, characterized in that: A reinforcement seat (7) is bolted to the surface of the circulation pump (51), and the side of the reinforcement seat (7) away from the circulation pump (51) is bolted to the left side of the housing (4).

7. The high temperature resistant storage device for epoxy resin adhesive according to claim 1, characterized in that: A protective shell (8) is snap-fitted onto the surface of the microcontroller (26), and the protective shell (8) is coated with anti-corrosion paint.

8. The high temperature resistant storage device for epoxy resin adhesive according to claim 1, characterized in that: The heat conducting plate (22) is made of tin bronze material, and the surface of the heat conducting plate (22) is coated with thermal silicone grease.

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