Spraying device for water cooling wall of gasification furnace

Abstract

The utility model relates to a water-cooled wall spraying device of a gasification furnace, which comprises a gasification furnace tube, a semiconductor chilling plate is started to work, the refrigeration surface of the semiconductor chilling plate faces the inside of a water tank to refrigerate the inside of the water tank, and a driving motor is started to drive a spiral stirring paddle to rotate to continuously stir water in the water tank. The water pump is started to enable the cooled water in the water tank to flow into the annular pipe through the water pipe, then the cooled water enters the liquid spraying pipe set through the annular pipe and finally conducts spraying cooling treatment on the inner wall of the gasification furnace pipe, and due to the fact that the sprayed water is cooled water, the cooling effect is better, and loss of cold air in the transfer process is reduced; meanwhile, the heat dissipation fin plate is fixedly installed on the heating surface of the top of the semiconductor chilling plate and absorbs heat of the heating surface of the semiconductor chilling plate, the contact area with air is increased, meanwhile, the heat on the surface of the heat dissipation fin plate is taken away in cooperation with the fan, and it is ensured that the semiconductor chilling plate can work normally.

Description

Technical Field

[0001] The utility model relates to the technical field of gasification furnace equipment, in particular to a water-cooled wall spraying device for a gasification furnace. Background Art

[0002] In the gasifier, the principle of central jet is adopted, and the central tube is placed in the slag discharge channel. In the existing technology, the outer surface of the central tube is always in contact with high-temperature ash during operation. The long-term high temperature shortens the service life of the gasifier wall. At the same time, there is no function to refrigerate the spray liquid, resulting in a poor cooling effect of the spray liquid.

[0003] For example, the authorized patent document with application number CN202320581003.3 discloses a gasifier, which has a connected hydrogen preheating zone and a hydrogenation gasification zone formed inside. The gasifier is provided with a combustion nozzle, the outlet of the combustion nozzle is connected to the hydrogen preheating zone, and a combustion inner tube is provided in the hydrogen preheating zone. The combustion inner tube is connected to the outlet of the combustion nozzle. The combustion nozzle is used to pass combustible gas into the combustion inner tube, and a combustion zone is formed inside the combustion inner tube; the gasifier is provided with a hydrogen inlet, which is connected to the hydrogen preheating zone and is used to pass hydrogen into the hydrogen preheating zone. After the combustible gas is burned in the combustion zone, it is mixed with the hydrogen passed through the hydrogen inlet for heat exchange. By heat exchange heating of the hydrogen in the hydrogen preheating zone, the temperature requirements of the coal hydrogasification reaction for hydrogen are met, ensuring the effective progress of the coal hydrogasification reaction, avoiding the equipment investment of an external hydrogen heating furnace and its connected high-temperature hydrogen pipeline, and saving equipment costs.

[0004] The above patent has the function of cooling the spray liquid, which results in a poor cooling effect of the spray liquid. Therefore, we need to provide a gasifier water-cooled wall spray device. Utility Model Content

[0005] The purpose of the utility model is to provide a water-cooled wall spray device for a gasifier, which starts the operation of a semiconductor refrigeration plate, wherein the cooling surface of the semiconductor refrigeration plate faces the inside of the water tank to cool the water tank, and starts the driving motor to drive the spiral stirring paddle to rotate, and continuously stirs the water in the water tank, so that the water in the water tank is cooled as much as possible and the cooling is uniform, and starts the water pump to let the cooled water in the water tank flow into the annular pipe through the water pipe, and then enters the spray pipe group from the annular pipe, and finally sprays the inner wall of the gasifier tube for cooling. Since the sprayed water is cooled water, it has a better cooling effect and reduces the loss of cold air during the transfer process. An insulation ring and an insulation guard plate are provided to reduce the heat transferred from the gasifier tube to the water tank. At the same time, a heat dissipation fin is fixedly installed on the heating surface of the top of the semiconductor refrigeration plate. The heat dissipation fin absorbs the heat of the heating surface of the semiconductor refrigeration plate, increases the contact area with the air, and cooperates with the fan to take away the heat from the surface of the heat dissipation fin, ensuring that the semiconductor refrigeration plate can work normally, and solving the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a gasifier water-cooled wall spraying device, comprising:

[0007] A gasification furnace tube, and three liquid spraying pipe groups connected to the surface of the gasification furnace tube;

[0008] The tops of the three liquid spraying pipe groups are connected with an annular pipe;

[0009] A liquid supply spraying member for infusing liquid into the annular tube is provided on one side of the annular tube;

[0010] The liquid supply spray component includes a base plate arranged on one side of the gasification furnace tube, a water tank is fixedly installed on the top of the base plate, one side of the water tank is connected to a water pipe, one end of the water pipe is connected to the interior of the annular tube, the interior of the water pipe is connected to a water pump, one side of the water pump is fixedly installed on the surface of the water tank, and a refrigeration component is arranged inside the water tank.

[0011] Preferably, the refrigeration element includes a semiconductor refrigeration plate embedded in the top of the water tank, the cooling surface of the semiconductor refrigeration plate faces the inside of the water tank, and a heat dissipation fin is fixedly installed on the heating surface of the top of the semiconductor refrigeration plate.

[0012] Preferably, two fans are installed on one side of the water tank through a plate body, and the air outlet direction of the fans is toward the heat dissipation fins.

[0013] Preferably, a spiral stirring paddle is rotatably installed inside the water tank, a driving motor is installed at one end of the spiral stirring paddle, an auxiliary bracket is rotatably installed on one side of the spiral stirring paddle, and the bottom of the auxiliary bracket is fixedly installed on the inner wall of the water tank.

[0014] Preferably, a heat-insulating ring is provided inside the annular tube, and a heat-insulating protective plate is fixedly mounted on one side of the heat-insulating ring.

[0015] Preferably, two reinforcement plates are fixedly installed between the heat insulation guard plate and one side adjacent to the water tank, and the interiors of the two reinforcement plates are fixedly installed to the surface of the water pipe.

[0016] Preferably, the three liquid spray pipe groups are evenly distributed on the surface of the gasification furnace tube.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] The utility model starts the semiconductor refrigeration plate to work, wherein the cooling surface of the semiconductor refrigeration plate faces the inside of the water tank to cool the water tank, starts the water pump to let the cooled water in the water tank flow into the annular pipe through the water pipe, and then enters the liquid spray pipe group from the annular pipe, and finally sprays the inner wall of the gasification furnace tube for cooling. Since the sprayed water is cooled water, it has a better cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the utility model;

[0020] Figure 2 This is a three-dimensional top view of the gasification furnace tube of the present utility model;

[0021] Figure 3 It is a three-dimensional diagram of the refrigeration component of the present utility model.

[0022] In the figure: 1. Gasification furnace tube; 2. Liquid spray pipe group; 3. Annular pipe; 4. Liquid supply spray part; 41. Bottom plate; 42. Water tank; 43. Water pump; 44. Water pipe; 40. Refrigeration part; 401. Semiconductor refrigeration plate; 402. Heat dissipation fin; 5. Plate body; 6. Fan; 7. Spiral stirring paddle; 8. Drive motor; 9. Auxiliary bracket; 10. Thermal insulation ring; 11. Thermal insulation guard plate; 12. Reinforcement plate. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] See also Figure 1-3 The utility model provides a technical solution: a gasifier water-cooled wall spray device, comprising: a gasifier tube 1, and three liquid spray pipe groups 2 connected to the surface of the gasifier tube 1; the tops of the three liquid spray pipe groups 2 are connected to an annular tube 3; a liquid supply spray member 4 for injecting liquid into the annular tube 3 is provided on one side of the annular tube 3;

[0025] In a further preferred embodiment, the liquid supply spray component 4 includes a base plate 41 arranged on one side of the gasification furnace tube 1, a water tank 42 is fixedly installed on the top of the base plate 41, one side of the water tank 42 is connected to a water pipe 44, one end of the water pipe 44 is connected to the interior of the annular tube 3, the interior of the water pipe 44 is connected to a water pump 43, one side of the water pump 43 is fixedly installed on the surface of the water tank 42, and a refrigeration component 40 is provided inside the water tank 42.

[0026] In a further preferred embodiment, the refrigeration element 40 includes a semiconductor refrigeration sheet 401 embedded in the top of the water tank 42, the cooling surface of the semiconductor refrigeration sheet 401 faces the interior of the water tank 42, and a heat dissipation fin 402 is fixedly installed on the heating surface of the top of the semiconductor refrigeration sheet 401;

[0027] In this embodiment, the semiconductor refrigeration sheet 401 is started, wherein the cooling surface of the semiconductor refrigeration sheet 401 faces the inside of the water tank 42 to cool the water tank 42, and the driving motor 8 is started to drive the spiral stirring blade 7 to rotate, and the water in the water tank 42 is continuously stirred to cool the water in the water tank 42 as much as possible and to cool it evenly. The water pump 43 is started to flow the cooled water in the water tank 42 into the annular pipe 3 through the water pipe 44, and then enters the liquid spraying pipe group 2 from the annular pipe 3, and finally sprays the inner wall of the gasification furnace tube 1 for cooling. Since the sprayed water is cooled water, it has a better cooling effect and reduces the loss of cold air during the transfer process. An insulation ring 10 and an insulation guard plate 11 are provided to reduce the heat transferred from the gasification furnace tube 1 to the water tank 42. At the same time, a heat dissipation fin 402 is fixedly installed on the heating surface of the top of the semiconductor refrigeration plate 401. The heat dissipation fin 402 absorbs the heat of the heating surface of the semiconductor refrigeration plate 401, increases the contact area with the air, and cooperates with the fan 6 to take away the heat from the surface of the heat dissipation fin 402, ensuring that the semiconductor refrigeration plate 401 can work normally.

[0028] In a further preferred embodiment, two fans 6 are installed on one side of the water tank 42 through the plate 5, and the air outlet direction of the fans 6 is toward the heat dissipation fins 402;

[0029] Specifically, a heat dissipation fin 402 is fixedly installed on the heating surface of the top of the semiconductor refrigeration plate 401. The heat dissipation fin 402 absorbs the heat from the heating surface of the semiconductor refrigeration plate 401, increases the contact area with the air, and cooperates with the fan 6 to take away the heat from the surface of the heat dissipation fin 402, ensuring that the semiconductor refrigeration plate 401 can work normally.

[0030] In a further preferred embodiment, a propeller 7 is rotatably mounted inside the water tank 42, a drive motor 8 is mounted on one end of the propeller 7, an auxiliary bracket 9 is rotatably mounted on one side of the propeller 7, and the bottom of the auxiliary bracket 9 is fixedly mounted on the inner wall of the water tank 42;

[0031] Furthermore, the driving motor 8 is started to drive the spiral stirring paddle 7 to rotate, and the water in the water tank 42 is continuously stirred so that the water in the water tank 42 is cooled as much as possible and cooled evenly. An auxiliary bracket 9 is provided to play an auxiliary supporting role for the spiral stirring paddle 7.

[0032] In a further preferred embodiment, a heat-insulating ring 10 is provided inside the annular tube 3, and a heat-insulating guard plate 11 is fixedly mounted on one side of the heat-insulating ring 10;

[0033] The heat insulation ring 10 and the heat insulation shield 11 are provided to reduce the heat transfer from the gasification furnace tube 1 to the water tank 42 .

[0034] Two reinforcing plates 12 are fixedly installed between the heat-insulating guard plate 11 and one side adjacent to the water tank 42 , and the interiors of the two reinforcing plates 12 are fixedly installed to the surface of the water pipe 44 ;

[0035] Furthermore, a reinforcement plate 12 is provided between the water tank 42 and the heat-insulating protective plate 11 , wherein the two reinforcement plates 12 are used to support and fix the water pipe 44 .

[0036] Three liquid spray pipe groups 2 are evenly distributed on the surface of the gasification furnace tube 1;

[0037] Specifically, the three liquid spray pipe groups 2 are evenly distributed on the surface of the gasification furnace tube 1 , so that the spraying area of ​​the inner wall of the gasification furnace tube 1 is wider, thereby improving the cooling performance.

[0038] The device starts the semiconductor refrigeration plate 401, wherein the cooling surface of the semiconductor refrigeration plate 401 faces the inside of the water tank 42 to cool the water tank 42, and starts the driving motor 8 to drive the spiral stirring paddle 7 to rotate, continuously stirring the water in the water tank 42, so that the water in the water tank 42 is cooled as much as possible and cooled evenly;

[0039] Start the water pump 43 to let the cooled water in the water tank 42 flow into the annular pipe 3 through the water pipe 44, and then enter the spray pipe group 2 from the annular pipe 3, and finally spray the inner wall of the gasification furnace tube 1 for cooling treatment. Since the sprayed water is cooled water, it has a better cooling effect and reduces the loss of cold air during the transfer process. An insulation ring 10 and an insulation guard plate 11 are provided to reduce the heat transferred from the gasification furnace tube 1 to the water tank 42. At the same time, a heat dissipation fin 402 is fixedly installed on the heating surface of the top of the semiconductor refrigeration plate 401. The heat dissipation fin 402 absorbs the heat from the heating surface of the semiconductor refrigeration plate 401, increases the contact area with the air, and cooperates with the fan 6 to take away the heat from the surface of the heat dissipation fin 402 to ensure that the semiconductor refrigeration plate 401 can work normally.

[0040] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A gasifier water-cooled wall spraying device, characterized in that: include: A gasification furnace tube (1), and three liquid spraying tube groups (2) connected to the surface of the gasification furnace tube (1); The tops of the three liquid spraying pipe groups (2) are connected to an annular pipe (3); A liquid supply spraying component (4) for injecting liquid into the annular tube (3) is provided on one side of the annular tube (3).

2. The gasifier water-cooled wall spraying device according to claim 1, characterized in that: The liquid supply spraying member (4) comprises a bottom plate (41) arranged on one side of the gasification furnace tube (1); A water tank (42) is fixedly mounted on the top of the bottom plate (41), one side of the water tank (42) is connected to a water pipe (44), and one end of the water pipe (44) is connected to the inside of the annular tube (3); The interior of the water pipe (44) is connected to a water pump (43), one side of the water pump (43) is fixedly mounted on the surface of the water tank (42), and a refrigeration component (40) is provided inside the water tank (42).

3. The gasifier water wall spraying device according to claim 2, characterized in that: The refrigeration element (40) comprises a semiconductor refrigeration plate (401) embedded in the top of the water tank (42), the cooling surface of the semiconductor refrigeration plate (401) faces the interior of the water tank (42), and a heat dissipation fin (402) is fixedly installed on the heating surface of the top of the semiconductor refrigeration plate (401).

4. The gasifier water wall spraying device according to claim 3, characterized in that: Two fans (6) are installed on one side of the water tank (42) through a plate body (5), and the air outlet direction of the fans (6) is toward the heat dissipation fin plate (402).

5. The gasifier water wall spraying device according to claim 4, characterized in that: A spiral stirring paddle (7) is rotatably mounted inside the water tank (42), a driving motor (8) is mounted on one end of the spiral stirring paddle (7), an auxiliary bracket (9) is rotatably mounted on one side of the spiral stirring paddle (7), and the bottom of the auxiliary bracket (9) is fixedly mounted on the inner wall of the water tank (42).

6. The gasifier water wall spraying device according to claim 5, characterized in that: A heat-insulating ring (10) is provided inside the annular tube (3), and a heat-insulating protective plate (11) is fixedly mounted on one side of the heat-insulating ring (10).

7. The gasifier water wall spraying device according to claim 6, characterized in that: Two reinforcing plates (12) are fixedly installed between the heat-insulating protective plate (11) and a side adjacent to the water tank (42), and the interiors of the two reinforcing plates (12) are fixedly installed on the surface of the water pipe (44).

8. The gasifier water wall spraying device according to claim 7, characterized in that: The three liquid spray pipe groups (2) are evenly distributed on the surface of the gasification furnace tube (1).

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