Miniaturized semiconductor laser gas sensor

Abstract

The utility model discloses a miniaturized semiconductor laser gas sensor. The miniaturized semiconductor laser gas sensor comprises an optical chip, an all-optical sheet, a temperature sensor, a thermosensitive resistor, a substrate and a tube socket, the substrate is fixed on the upper surface of the tube socket, the optical chip, the all-optical sheet, the temperature sensor and the thermosensitive resistor are fixed on the upper surface of the substrate, the all-optical sheet and the optical chip are located in the middle of the substrate, the thermosensitive resistor is located on one side of the substrate, and the temperature sensor is located on the other side of the substrate. The laser gas sensor is assembled by using a TO type packaging mode, the design process is simple and clear, the process and raw material cost is greatly reduced, the use performance is incomparable to that of previous deep cavity packaging, and the input cost of subsequent aging test equipment of a device is greatly reduced. The gas sensor has stable and reliable performance, can continuously work for a long time, can efficiently test devices, saves energy as much as possible, and ensures the accuracy and reliability of test results.

Description

Technical Field

[0001] The utility model relates to the technical field of gas sensors, in particular to a miniaturized semiconductor laser gas sensor. Background Art

[0002] Miniaturized semiconductor laser gas sensors are high-precision devices that use semiconductor laser technology to detect specific gas concentrations. They primarily utilize the wavelength tuning properties of semiconductor lasers and the selective absorption of the gas being measured to determine its concentration by measuring the attenuation of the gas's absorption of the laser.

[0003] Traditional gas laser detectors are box-shaped deep-cavity packages. The product itself is large in size, high in cost, inflexible to use, and has high requirements for product packaging process, complex optical path design, and high threshold for production technology. Therefore, it is necessary to provide a miniaturized semiconductor laser gas sensor that can save energy while ensuring the accuracy and reliability of test results. Utility Model Content

[0004] The purpose of the present utility model is to provide a miniaturized semiconductor laser gas sensor to solve the problems raised in the above background technology, that is, the traditional gas laser detector is a box-type deep cavity package, the product itself is large in size, high in cost, inflexible in use, and has high requirements for product packaging process, complex optical path design, and high threshold for production technology.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The utility model is a miniaturized semiconductor laser gas sensor, comprising:

[0007] Optical chips, all-optical chips, temperature sensors, thermistors, substrates and sockets;

[0008] Among them, the substrate is fixed on the upper surface of the tube holder, the optical chip, the full optical chip, the temperature sensor and the thermistor are fixed on the upper surface of the substrate, the full optical chip and the optical chip are located in the middle of the substrate, the thermistor is located on one side of the substrate, and the temperature sensor is located on the other side of the substrate.

[0009] Furthermore, a fourth connection end and a fifth connection end are fixed inside one side of the tube base, and a third connection end is fixed inside the other side of the tube base;

[0010] The positive electrode of the thermistor is connected to the fifth connection terminal, and the positive and negative electrodes of the temperature sensor are connected to the third connection terminal and the fourth connection terminal.

[0011] Furthermore, a first connecting end and a second connecting end are fixed inside the other side of the tube base.

[0012] The positive electrode of the optical chip is connected to the first connection end, and the negative electrode of the optical chip is connected to the second connection end.

[0013] Furthermore, a tube cap is fixed on the outer surface of the tube seat, and a circuit board is fixed on the outer surface of the tube cap.

[0014] Furthermore, a connecting buckle is fixed on the outer surface of the tube seat, a connecting column is movably connected inside the connecting buckle, a connecting plate is fixed on the outer surface of the connecting column, a protective frame is fixed on the outer surface of the connecting plate, and the circuit board is located inside the protective frame.

[0015] Furthermore, a support frame is fixed on the outer surface of the connecting buckle, a limiting column is movably connected inside the connecting column, a spring is fixed inside the limiting column and the support frame, a guide column is fixed on the outer surface of the limiting column, and the guide column is movably connected to the inside of the support frame.

[0016] Compared with the prior art, the advantages of the present invention are:

[0017] 1. The utility model assembles a laser gas sensor by using a TO-type package. The design process is simple and clear, the process and raw material costs are greatly reduced, and the performance is comparable to that of the previous deep cavity package. In addition, the investment cost of the subsequent aging test equipment for the device has a great advantage, so that the gas sensor has stable and reliable performance, can work continuously for a long time, can achieve efficient testing of the device, and ensure the accuracy and reliability of the test results while saving energy as much as possible.

[0018] 2. Based on the first beneficial effect, when the gas sensor needs to be moved to the required position with the use of the connecting buckle, first stick the connecting buckle to the outer surface of the tube holder, place the protective frame on the outside of the circuit board, apply a pushing force to the connecting column, insert the connecting column into the connecting buckle, and then apply a pulling force to the guide column to compress the spring, and then apply a pushing force to the connecting column to make the protective frame fit with the surface of one side of the circuit board. Then, cancel the force applied to the guide column, and the limit column bounces back to the inside of the connecting column. This solution can effectively protect the circuit board when transporting the equipment without affecting the subsequent normal use of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0021] Figure 2 This is the internal structure diagram of the tube seat of the utility model;

[0022] Figure 3 This is a structural diagram of the transport component of the present utility model.

[0023] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0024] 1. Optical chip; 2. All-optical chip; 3. Temperature sensor; 4. Thermistor; 5. Substrate; 6. Tube socket; 61. First connection end; 62. Second connection end; 63. Third connection end; 64. Fourth connection end; 65. Fifth connection end; 7. Tube cap; 8. Circuit board; 9. Connecting buckle; 10. Connecting column; 11. Connecting plate; 12. Protective frame; 13. Support frame; 14. Limiting column; 15. Spring; 16. Guide column. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0026] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0027] In order to make the purpose, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0028] See also Figure 1 and Figure 2 As shown, this embodiment is a miniaturized semiconductor laser gas sensor, comprising:

[0029] Optical chip 1, all-optical chip 2, temperature sensor 3, thermal resistor 4, substrate 5 and socket 6;

[0030] The substrate 5 is fixed to the upper surface of the tube base 6. The optical chip 1, the plenoptical chip 2, the temperature sensor 3, and the thermistor 4 are fixed to the upper surface of the substrate 5. The plenoptical chip 2 and the optical chip 1 are located in the middle of the substrate 5. The thermistor 4 is located on one side of the substrate 5, and the temperature sensor 3 is located on the other side of the substrate 5. A fourth connection terminal 64 and a fifth connection terminal 65 are fixed inside one side of the tube base 6, and a third connection terminal 63 is fixed inside the other side of the tube base 6.

[0031] The positive electrode of the thermistor 4 is connected to the fifth connection terminal 65, and the positive and negative electrodes of the temperature sensor 3 are connected to the third connection terminal 63 and the fourth connection terminal 64. The first connection terminal 61 and the second connection terminal 62 are fixed inside the other side of the pipe socket 6;

[0032] The positive electrode of the optical chip 1 is connected to the first connection end 61, and the negative electrode of the optical chip 1 is connected to the second connection end 62. A cap 7 is fixed to the outer surface of the pipe socket 6, and a circuit board 8 is fixed to the outer surface of the cap 7;

[0033] When selecting the optical chip 1, an optical chip 1 with a suitable wavelength can be selected according to the different gases to be detected. The optical chip 1 is connected to the first connection end 61 and the second connection end 62 of the tube holder 6 by gold wire bonding. The thermistor 4 is bonded to the temperature sensor 3 by gold wire bonding. This allows the product to maintain a stable temperature inside the device under different external working environments, ensuring stable light output (wavelength and optical power) of the laser and achieving low power consumption and reducing the cost of the product. The tube cap 7 is an optical tube cap that serves to output light.

[0034] When the device is in use, the plenoptical sheet 2 fully reflects the light emitted by the optical chip 1 along the optical path, and the substrate 5 and the tube holder 6 connect and transmit the signal. The working principle of the product is to energize the positive and negative poles of the optical chip 1 through an external circuit, causing the chip to emit light and sense the temperature of the chip through the thermistor 4. The temperature sensor 3 is used to maintain the set temperature inside the device (to ensure that the wavelength of the emitted light is the required wavelength). The light then passes through the plenoptical sheet 2 and is emitted through the tube cap 7 along the designed optical path.

[0035] See also Figure 1 and Figure 3 As shown, this embodiment is based on the above-mentioned embodiment 1, and further includes a connecting buckle 9 fixed on the outer surface of the tube base 6, a connecting column 10 movably connected inside the connecting buckle 9, a connecting plate 11 fixed on the outer surface of the connecting column 10, a protective frame 12 fixed on the outer surface of the connecting plate 11, and a circuit board 8 located inside the protective frame 12;

[0036] The connecting buckle 9 is used to connect the column 10 to move inside it, and the connecting plate 11 is used to receive and install the connecting column 10, and then receive and install the protection frame 12, which is used to protect the circuit board 8;

[0037] A support frame 13 is fixed to the outer surface of the connecting buckle 9, and a limit column 14 is movably connected to the interior of the connecting column 10. A spring 15 is fixed to the limit column 14 and the interior of the support frame 13. A guide column 16 is fixed to the outer surface of the limit column 14, and the guide column 16 is movably connected to the interior of the support frame 13:

[0038] The support frame 13 is used to receive and install the spring 15. The limiting column 14 is used to limit the connecting column 10 inside the connecting buckle 9. The guide column 16 facilitates the application of pulling force to the limiting column 14. The spring 15 is used to change the position of the limiting column 14.

[0039] When the gas sensor needs to be moved to the desired location, first stick the connecting buckle 9 to the outer surface of the tube seat 6, place the protective frame 12 on the outside of the circuit board 8, apply a pushing force to the connecting post 10, insert the connecting post 10 into the connecting buckle 9, then apply a pulling force to the guide post 16 to compress the spring 15, and then apply a pushing force to the connecting post 10 to make the protective frame 12 fit the surface of one side of the circuit board 8. Then, remove the force applied to the guide post 16, and the limit post 14 rebounds to the inside of the connecting post 10.

[0040] This step can effectively protect the circuit board 8 when transporting the device without affecting the subsequent normal use of the device.

[0041] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0042] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A miniaturized semiconductor laser gas sensor, characterized in that: include: Optical chip (1), all-optical chip (2), temperature sensor (3), thermal resistor (4), substrate (5) and tube base (6); The substrate (5) is fixed on the upper surface of the tube seat (6); the optical chip (1), the full optical chip (2), the temperature sensor (3) and the thermal resistor (4) are fixed on the upper surface of the substrate (5); the full optical chip (2) and the optical chip (1) are located in the middle of the substrate (5); the thermal resistor (4) is located on one side of the substrate (5); and the temperature sensor (3) is located on the other side of the substrate (5).

2. A miniaturized semiconductor laser gas sensor according to claim 1, characterized in that: A fourth connecting end (64) and a fifth connecting end (65) are fixed inside one side of the tube base (6), and a third connecting end (63) is fixed inside the other side of the tube base (6); The positive electrode of the thermal resistor (4) is connected to the fifth connection terminal (65), and the positive and negative electrodes of the temperature sensor (3) are connected to the third connection terminal (63) and the fourth connection terminal (64).

3. The miniaturized semiconductor laser gas sensor according to claim 1, characterized in that: A first connecting end (61) and a second connecting end (62) are fixed inside the other side of the tube seat (6). The positive electrode of the optical chip (1) is connected to the first connection end (61), and the negative electrode of the optical chip (1) is connected to the second connection end (62).

4. The miniaturized semiconductor laser gas sensor according to claim 1, characterized in that: A tube cap (7) is fixed on the outer surface of the tube seat (6), and a circuit board (8) is fixed on the outer surface of the tube cap (7).

5. The miniaturized semiconductor laser gas sensor according to claim 1, characterized in that: A connecting buckle (9) is fixed on the outer surface of the tube seat (6), a connecting column (10) is movably connected inside the connecting buckle (9), a connecting plate (11) is fixed on the outer surface of the connecting column (10), a protective frame (12) is fixed on the outer surface of the connecting plate (11), and the circuit board (8) is located inside the protective frame (12).

6. The miniaturized semiconductor laser gas sensor according to claim 5, characterized in that: A support frame (13) is fixed on the outer surface of the connecting buckle (9), a limiting column (14) is movably connected inside the connecting column (10), a spring (15) is fixed inside the limiting column (14) and the support frame (13), a guide column (16) is fixed on the outer surface of the limiting column (14), and the guide column (16) is movably connected to the inside of the support frame (13).

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