Detection table for semiconductor

Abstract

The utility model relates to a detection table for a semiconductor. Comprising a base, a bending supporting plate arranged on the base, a supporting block used for supporting a semiconductor, a positioning mechanism used for fixing the semiconductor and a sliding assembly used for driving the positioning mechanism to move. The base is provided with two sets of sliding assemblies which are symmetrically placed. The sliding ends of the two sliding assemblies slide on the bending supporting plate. Positioning mechanisms are arranged at the sliding ends of the two groups of sliding assemblies; the supporting block is arranged on the bending supporting plate; and the two groups of positioning mechanisms are symmetrically arranged relative to the supporting block. The technical problem that the detection table in the prior art is limited when detecting the semiconductors due to the fact that the detection table is simple in structure and cannot fix the semiconductors of different sizes, and operation of workers is affected is solved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor testing equipment, in particular to a testing platform for semiconductors. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are widely used in radios, televisions, and temperature measurement. Whether from the perspective of scientific and technological development or economic development, the importance of semiconductors is enormous, and semiconductor parameters need to be tested during the production process.

[0003] Semiconductor parameter testing requires that the semiconductor board be fixed on a testing table. However, the testing table in the existing technical solution has a relatively simple structure and cannot fix semiconductors of different sizes. This leads to limitations in the testing table when testing semiconductors, which in turn affects the operation of the staff. Utility Model Content

[0004] The embodiment of the present application provides a semiconductor testing platform, which solves the technical problem that the testing platform in the existing technical solution cannot fix semiconductors of different sizes due to its relatively simple structure. This leads to limitations in the testing platform when testing semiconductors, which in turn affects the operation of the staff.

[0005] The technical solutions adopted in the embodiments of this application are as follows:

[0006] A semiconductor inspection platform comprises a base, a bent support plate arranged on the base, a support block for supporting the semiconductor, a positioning mechanism for fixing the semiconductor, and a sliding assembly for driving the positioning mechanism to move; two groups of symmetrically placed sliding assemblies are arranged on the base; the sliding ends of the two groups of sliding assemblies both slide on the bent support plate; the positioning mechanism is arranged on the sliding ends of the two groups of sliding assemblies; the support block is arranged on the bent support plate; the two groups of positioning mechanisms are symmetrically placed with respect to the support block.

[0007] A further technical solution is: the positioning mechanism includes a support plate, a baffle for abutting against the semiconductor, a spring for buffering the baffle, and a telescopic rod for limiting the spring; the support plate is arranged on the sliding end of the sliding assembly; the spring is arranged around the telescopic rod; the telescopic end of the telescopic rod is connected to the baffle; the other end of the telescopic rod is connected to the support plate.

[0008] A further technical solution is: the sliding assembly includes a rack, a bent support rod arranged on the base, a slider sliding on the bent support plate, a driving device for driving the slider to slide, and a gear arranged on the output shaft of the driving device; the rack is arranged on the support rod; the driving device is installed on the slider; the gear is meshed and connected to the rack; and the support plate is arranged on the slider.

[0009] A further technical solution is: the positioning mechanism further includes rubber pads; and the baffle is provided with a plurality of groups of the rubber pads arranged in a linear array.

[0010] A further technical solution is: the driving device is a motor.

[0011] A further technical solution is: the support block is made of silicone material.

[0012] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0013] 1. Due to the use of the base, bent support plate, support block, positioning mechanism and sliding assembly, when a semiconductor needs to be fixed and repaired, the semiconductor to be inspected is first placed on top of the support block, and then the two sets of sliding assemblies work simultaneously, so that the sliding ends of the two sets of sliding assemblies simultaneously drive the two sets of positioning mechanisms to slide close to the semiconductor. When the two sets of positioning mechanisms are against both sides of the semiconductor at the same time, the semiconductor placed on the support block can be fixed. Since the spacing between the two sets of positioning mechanisms can be adjusted according to the operation of the corresponding sliding assemblies, semiconductors of different sizes can be fixed between the two sets of positioning mechanisms, and thus the semiconductor inspection platform can be used to inspect semiconductors of different sizes, which greatly improves the practicality of the semiconductor inspection platform to a certain extent.

[0014] 2. Due to the configuration of the support plate, baffle, spring, and telescopic rod, when the two sets of positioning mechanisms move toward the semiconductor and rest against both sides of the semiconductor, the semiconductor will exert a certain squeezing force on the baffle, causing the baffle to compress the spring and telescopic rod. The spring in a compressed state will then produce a reaction force on the baffle, thereby enabling the two sets of baffles to rest firmly against the semiconductor, thereby securing the semiconductor. When the baffle rests against the semiconductor, the spring can produce a certain elastic buffering effect, thereby providing a certain degree of protection for the semiconductor itself. When the spring is in a compressed state, the telescopic rod can prevent the spring from deforming, thereby providing a certain degree of protection for the spring.

[0015] 3. Due to the arrangement of a rack, a bent support rod, a slider, a drive device, and a gear, the gear is driven to rotate by the output shaft of the drive device. Since the rack disposed on the bent support rod is meshedly connected to the gear, and the slider, fixedly connected to the drive device, is slidably connected to the bent support plate, when the gear rotates, the slider can slide back and forth along the bent support plate. Since the support plate is fixedly connected to the slider, when the slider slides back and forth along the bent support plate, it can drive the positioning mechanism to move, thereby causing the positioning mechanism to move toward or away from the support block.

[0016] 4. Due to the setting of the rubber pad, when the baffle is against the semiconductor, the rubber pad on the baffle will contact the semiconductor, thereby being able to provide a certain degree of protection for the semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of a semiconductor testing platform in an embodiment of the present utility model.

[0018] Figure 2 It is a partial structural diagram for reflecting the positioning mechanism in an embodiment of the present utility model.

[0019] Figure 3 It is a partial structural diagram for reflecting the sliding assembly in an embodiment of the present utility model.

[0020] In the figure: 1. base; 2. bending support plate; 3. support block; 4. positioning mechanism; 41. support plate; 42. baffle; 43. spring; 44. telescopic rod; 45. rubber pad; 5. sliding assembly; 51. rack; 52. support rod; 53. slider; 54. driving device; 55. gear. DETAILED DESCRIPTION

[0021] The embodiment of the present application provides a semiconductor testing platform, which solves the technical problem that the testing platform in the existing technical solution cannot fix semiconductors of different sizes due to its relatively simple structure. This leads to limitations in the testing platform when testing semiconductors, which in turn affects the operation of the staff.

[0022] The technical solution in the embodiments of the present application is to solve the above problems, and the overall idea is as follows:

[0023] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0024] A semiconductor test bench, such as Figure 1As shown, the device comprises a base 1, a curved support plate 2 mounted on the base 1, a support block 3 for supporting the semiconductor, a positioning mechanism 4 for securing the semiconductor, and a sliding assembly 5 for driving the positioning mechanism 4. Two sets of sliding assemblies 5 are symmetrically arranged on the base 1. The sliding ends of both sets of sliding assemblies 5 slide on the curved support plate 2. Positioning mechanisms 4 are mounted on the sliding ends of both sets of sliding assemblies 5. The support block 3 is mounted on the curved support plate 2. The two sets of positioning mechanisms 4 are symmetrically arranged with respect to the support block 3.

[0025] The curved support plate 2 is fixedly connected to the top of the base 1. Two symmetrically arranged sliding assemblies 5 are fixedly connected to the top of the base 1, and both sliding assemblies 5 are located below the curved support plate 2. Positioning mechanisms 4 are fixedly connected to the sliding ends of both sliding assemblies 5. A support block 3 is fixedly connected to the center of the top of the curved support plate 2. The support block 3 is preferably made of silicone.

[0026] Due to the arrangement of the base 1, the bent support plate 2, the support block 3, the positioning mechanism 4 and the sliding assembly 5, when the semiconductor needs to be fixed and repaired, the semiconductor to be inspected is first placed on top of the support block 3, and then the two sets of sliding assemblies 5 work simultaneously, so that the sliding ends of the two sets of sliding assemblies 5 simultaneously drive the two sets of positioning mechanisms 4 to slide close to the semiconductor. When the two sets of positioning mechanisms 4 are simultaneously against both sides of the semiconductor, the semiconductor placed on the support block 3 can be fixed. Since the spacing between the two sets of positioning mechanisms 4 can be adjusted according to the operation of the corresponding sliding assembly 5, semiconductors of different sizes can be fixed between the two sets of positioning mechanisms 4, and thus the semiconductor inspection platform can be used to inspect semiconductors of different sizes, which greatly improves the practicality of the semiconductor inspection platform to a certain extent.

[0027] like Figure 2 As shown, positioning mechanism 4 includes a support plate 41, a baffle 42 for contacting the semiconductor, a spring 43 for buffering baffle 42, and a telescopic rod 44 for retaining spring 43. Support plate 41 is mounted on the sliding end of slide assembly 5. Spring 43 surrounds telescopic rod 44. The telescopic end of telescopic rod 44 is connected to baffle 42. The other end of telescopic rod 44 is connected to support plate 41.

[0028] A support plate 41 is fixedly connected to the sliding end of the sliding assembly 5. Several sets of telescopic rods 44 are arranged in a linear array on the support plate 41. The telescopic end of each set of telescopic rods 44 is fixedly connected to the baffle 42. The other end of each set of telescopic rods 44 is fixedly connected to the support plate 41. Springs 43 surround the outer side of each set of telescopic rods 44. One end of each set of springs 43 is fixedly connected to the baffle 42. The other end of each set of springs 43 is fixedly connected to the support plate 41.

[0029] Due to the arrangement of the support plate 41, baffle 42, spring 43, and telescopic rod 44, when the two sets of positioning mechanisms 4 move toward the semiconductor and rest against both sides of the semiconductor, the semiconductor will exert a certain squeezing force on the baffle 42, causing the baffle 42 to compress the spring 43 and telescopic rod 44. At this time, the spring 43 in a compressed state will produce a reaction force on the baffle 42, thereby enabling the two sets of baffles 42 to rest firmly against the semiconductor, thereby fixing the semiconductor. Since the spring 43 can produce a certain elastic buffering effect when the baffle 42 rests against the semiconductor, it can provide a certain degree of protection for the semiconductor itself. When the spring 43 is in a compressed state, the telescopic rod 44 can prevent the spring 43 from deforming, thereby providing a certain degree of protection for the spring 43.

[0030] like Figure 3 As shown, the sliding assembly 5 includes a rack 51, a curved support rod 52 mounted on the base 1, a slider 53 that slides on the curved support plate 2, a drive device 54 for driving the slider 53, and a gear 55 mounted on the output shaft of the drive device 54. The rack 51 is mounted on the support rod 52. The drive device 54 is mounted on the slider 53. The gear 55 is meshedly connected to the rack 51. The support plate 41 is mounted on the slider 53.

[0031] A curved support rod 52 is fixedly connected to the top of the base 1. A rack 51 is fixedly connected to the curved support rod 52. A drive device 54 is fixedly mounted on the bottom of the slider 53. The drive device 54 is preferably a motor. A gear 55 is fixedly connected to the output shaft of the drive device 54. The support plate 41 is fixedly connected to the top of the slider 53.

[0032] Due to the arrangement of the rack 51, the bent support rod 52, the slider 53, the driving device 54, and the gear 55, the gear 55 is driven to rotate by the output shaft of the driving device 54. Since the rack 51 provided on the bent support rod 52 is meshedly connected to the gear 55, and the slider 53, which is fixedly connected to the driving device 54, is slidably connected to the bent support plate 2, when the gear 55 rotates, the slider 53 can slide back and forth along the bent support plate 2. Since the support plate 41 is fixedly connected to the slider 53, when the slider 53 slides back and forth along the bent support plate 2, it can drive the positioning mechanism 4 to move, thereby enabling the positioning mechanism 4 to move toward or away from the support block 3.

[0033] like Figure 2 As shown, the positioning mechanism 4 further includes rubber pads 45. The baffle 42 is provided with a plurality of groups of rubber pads 45 arranged in a linear array.

[0034] A plurality of rubber pads 45 arranged in a linear array are fixedly connected to the baffle 42 .

[0035] Due to the provision of the rubber pad 45 , when the baffle 42 abuts against the semiconductor, the rubber pad 45 on the baffle 42 will come into contact with the semiconductor, thereby providing a certain degree of protection for the semiconductor.

[0036] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0037] Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.

Claims

1. A semiconductor testing station, characterized in that , comprising a base (1), a bent support plate (2) arranged on the base (1), a support block (3) for supporting a semiconductor, a positioning mechanism (4) for fixing the semiconductor, and a sliding assembly (5) for driving the positioning mechanism (4) to move; two groups of sliding assemblies (5) are arranged on the base (1) and are symmetrically placed; the sliding ends of the two groups of sliding assemblies (5) both slide on the bent support plate (2); the sliding ends of the two groups of sliding assemblies (5) are both provided with the positioning mechanism (4); the support block (3) is arranged on the bent support plate (2); the two groups of positioning mechanisms (4) are symmetrically placed with respect to the support block (3).

2. A semiconductor inspection station according to claim 1, characterized in that: The positioning mechanism (4) comprises a support plate (41), a baffle (42) for abutting against the semiconductor, a spring (43) for buffering the baffle (42), and a telescopic rod (44) for limiting the spring (43); the support plate (41) is arranged on the sliding end of the sliding assembly (5); the spring (43) is arranged around the telescopic rod (44); the telescopic end of the telescopic rod (44) is connected to the baffle (42); and the other end of the telescopic rod (44) is connected to the support plate (41).

3. A semiconductor testing station as claimed in claim 2, characterized in that: The sliding assembly (5) comprises a rack (51), a bent support rod (52) arranged on the base (1), a slider (53) sliding on the bent support plate (2), a driving device (54) for driving the slider (53) to slide, and a gear (55) arranged on the output shaft of the driving device (54); the rack (51) is arranged on the support rod (52); the driving device (54) is installed on the slider (53); the gear (55) is meshed and connected to the rack (51); and the support plate (41) is arranged on the slider (53).

4. A semiconductor inspection station as claimed in claim 2, characterized in that: The positioning mechanism (4) further comprises rubber pads (45); a plurality of groups of the rubber pads (45) arranged in a linear array are provided on the baffle (42).

5. A semiconductor inspection station as claimed in claim 3, characterized in that: The driving device (54) is a motor.

6. The semiconductor inspection station according to claim 1, wherein: The support block (3) is made of silica gel.

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