Substrate special for Saw filter film coating process

Abstract

The utility model relates to a special substrate for a Saw filter film coating process. A pasting film is arranged on the substrate body, a plurality of chips are installed between the substrate body and the pasting film, a plurality of gold balls are arranged between the chips and the substrate body, a plurality of salient points are arranged on the periphery between the substrate body and the pasting film to form a salient point enclosure frame, and the chips are located in the salient point enclosure frame. The problem of board edge slope existing in a saw fall film coating process is solved, the flatness of a chip is improved, the slope phenomenon is avoided, the test failure caused by the uneven surface of a product is reduced, and the test yield is improved; the risk of product failure caused by excessive invasion of the epoxy film is reduced; and product layering quality abnormity is avoided.

Description

Technical Field

[0001] The utility model relates to a special substrate for Saw filter laminating technology. Background Art

[0002] Sawfilter coating technology generally refers to a surface protection treatment performed on devices during the manufacturing process of surface acoustic wave (SAW) filters. This process can improve the reliability and durability of devices, especially in applications in harsh environments.

[0003] like Figures 1-2 As shown in the figure, there is a height difference between the outermost circle of the existing substrate and the chip-attached area. After the lamination operation, the two outermost rows and two columns of the substrate have a slope phenomenon, which causes the epoxy film on the slope surface to invade too much and invade the IDT area, causing product failure. In addition, as Figure 3 As shown in the figure, if the edge is compacted during film application, air cannot circulate between the film and the substrate, causing product delamination and serious quality problems.

[0004] Existing solutions mainly focus on the packaging process, which requires adding a support block made of epoxy resin adhesive to the substrate. The production of this support block requires additional packaging steps and equipment, which prolongs the operation time and increases costs. It is easy to contaminate the chip and substrate during the production process, and the shape consistency of the support block is poor. Summary of the Invention

[0005] The technical problem to be solved by the present invention is: in order to solve the problems existing in the prior art in the above-mentioned background technology, a method is provided to solve the problem of plate edge slope in the saw faliter coating process, and the problems of delamination, excessive intrusion of epoxy film, etc. are also solved.

[0006] The technical solution adopted by the utility model to solve the technical problem is: a special substrate for Saw filter coating process, which includes a substrate body, a film is provided on the substrate body, a plurality of chips are installed between the substrate body and the film, a plurality of gold balls are provided between the chips and the substrate body, and a plurality of bumps are provided around the substrate body and the film to form a bump frame, and the chips are located in the bump frame.

[0007] Furthermore, there is a gap between the bump and the chip.

[0008] Furthermore, the diameter of the bump is 0.5-1.5 mm, and the height is 0.1-0.2 mm.

[0009] Furthermore, the surface of the substrate body is electroplated by electroplating.

[0010] Furthermore, the convex points are cylindrical convex points, and the center distance between each convex point is 0.85 to 2.65 mm.

[0011] Furthermore, the film is an epoxy resin film.

[0012] Furthermore, the number of gold balls is ≥4.

[0013] The beneficial effects of the utility model are as follows: the utility model solves the problem of board edge slope in the saw faliter coating process, improves chip flatness, eliminates slope phenomenon, reduces test failures caused by uneven product surface, and improves test yield; reduces the risk of product failure caused by excessive epoxy film intrusion; and avoids product delamination and quality abnormalities. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0015] Figure 1 This is a schematic diagram of the structure in which a slope appears on the chip side of the existing ordinary substrate after plastic sealing, and the epoxy film on the slope side invades;

[0016] Figure 2 yes Figure 1 's directional view;

[0017] Figure 3 This is a schematic diagram of the structure of an existing ordinary substrate where air cannot be discharged after plastic sealing, resulting in delamination;

[0018] Figure 4 It is a structural diagram of the utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the utility model after plastic sealing;

[0020] Figure 6 This is a schematic diagram of the structure of the utility model after the film is removed;

[0021] In the picture: 1. Substrate, 2. Bump, 3. Film, 4. Chip, 5. Gold ball. DETAILED DESCRIPTION

[0022] The present invention will now be described in further detail with reference to the accompanying drawings, which are simplified schematic diagrams that illustrate the basic structure of the present invention in a schematic manner.

[0023] like Figures 4-6The illustrated substrate is a substrate specifically designed for a Saw filter coating process, comprising a substrate body 1, on which a film 3 is provided, the film 3 being an epoxy resin film. A plurality of chips 4 are mounted between the substrate body 1 and the film 3, and a plurality of gold balls 5 are provided between the chips 4 and the substrate body 1. A plurality of bumps 2 are provided around the area between the substrate body 1 and the film 3, forming a bump frame, and the chips 4 are located within the bump frame.

[0024] like Figure 4 As shown, there is a gap between bump 2 and chip 4; bump 2 has a diameter of 0.5 to 1.5 mm and a height of 0.1 to 0.2 mm; bump 2 is cylindrical, and the center-to-center spacing between each bump 2 is 0.85 to 2.65 mm, depending on the product size. The size and spacing of the cylindrical bumps are set, and the actual size and spacing of the cylindrical bumps vary according to different product sizes.

[0025] The surface of the substrate body 1 is electroplated by electroplating. The electroplating layer can increase the hardness and wear resistance of the substrate surface, reduce wear, and extend the service life of the device; enhance corrosion resistance to prevent the substrate body 1 from being corroded, especially in applications in harsh environments; at the same time, improve the conductivity of the substrate, improve adhesion, and help improve the overall stability and reliability of the device; it also improves production efficiency and quickly forms a uniform metal film on the substrate surface, which is suitable for large-scale production and can significantly improve the performance and reliability of the device.

[0026] Gold balls 5 are welded on the substrate body 1 , and the number of the gold balls 5 is ≥4.

[0027] Working process:

[0028] Step 1: Mount the chip 4 with the gold balls 5 on the substrate body 1 to form a chip area;

[0029] Step 2: Install cylindrical bumps 2 around the chip area and surround the chip area, as shown in Figure 6 As shown;

[0030] Step 3: Cover the substrate obtained in step 2 with film 3 to obtain Figure 4 As shown, then, plastic sealing is performed. After plastic sealing, Figure 5 As shown, chip 4 does not have a slope phenomenon, nor does it cause the epoxy film to invade the IDT, and there is no delamination phenomenon.

[0031] Based on the above-mentioned ideal embodiment of the present invention, and in accordance with the above description, relevant personnel can make various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, but must be determined according to the scope of the claims.

Claims

1. A substrate specifically designed for Saw filter lamination technology, characterized by: The invention comprises a substrate body (1), a film (3) is provided on the substrate body (1), a plurality of chips (4) are installed between the substrate body (1) and the film (3), a plurality of gold balls (5) are provided between the chips (4) and the substrate body (1), and a plurality of bumps (2) are provided around the substrate body (1) and the film (3) to form a bump frame, and the chips (4) are located in the bump frame.

2. The substrate for Saw filter lamination process according to claim 1, characterized in that: There is a gap between the bump (2) and the chip (4).

3. The substrate for Saw filter lamination process according to claim 1, characterized in that: The diameter of the protrusion (2) is 0.5-1.5 mm, and the height is 0.1-0.2 mm.

4. The substrate for Saw filter lamination process according to claim 1, characterized in that: The surface of the substrate body (1) is electroplated by electroplating.

5. The substrate for Saw filter lamination process according to claim 1, characterized in that: The convex points (2) are cylindrical convex points, and the center distance between each convex point (2) is 0.85 to 2.65 mm.

6. The substrate for Saw filter lamination process according to claim 1, characterized in that: The film (3) is an epoxy resin film.

7. The substrate for Saw filter lamination process according to claim 1, characterized in that: The number of the gold balls (5) is ≥4.

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