Bridging circuit layer and connector socket

Abstract

The utility model discloses a bridging line layer and a connector socket, which are respectively a first communication line layer, a first ground wire layer, a second ground wire layer and a second communication line layer, the four line layers are in a symmetrical structure, communication lines are arranged in the first communication line layer and the second communication line layer, and the first communication line layer and the second communication line layer are in a symmetrical structure. A plurality of golden fingers are arranged at the upper ends and the lower ends of the first communication line layer and the second communication line layer, and connecting lines are connected among the golden fingers; according to the technical scheme provided by the utility model, the inter-board connector is designed by adopting a symmetrical design method, and a design scheme is provided for an even-number pin connector or an odd-number pin connector, so that the use of the connector cannot be influenced when the connector is plugged in any direction, the communication capability and the anti-interference capability of high-speed signals are provided, and the reliability of the connector is improved. The communication frequency is high, 10 GHZ high-speed communication can be realized, the crosstalk is less than or equal to 5%, the left and right sides and the front and back sides are symmetrically designed, the connector can be plugged in any direction, and the cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of connectors, in particular to a bridge circuit layer and a connector socket. Background Art

[0002] In the design of high-speed communication products, due to the constraints of product appearance and structure, it is usually necessary to perform a stacking design of multiple PCB boards. If ordinary connectors are used for the high-speed communication lines between these PCBs, the communication signals are easily affected by external interference, resulting in communication errors. If high-speed connectors are used, the communication distance between the boards on the market is short and the cost is very high.

[0003] Traditional connectors have low communication rates over long transmission distances, while high communication rates have too short transmission distances and are expensive:

[0004] Traditional long-distance connectors (20mm-100mm) have low communication rates due to poor impedance and shielding. High-speed connectors generally have a link distance of less than 20mm and are very expensive. Utility Model Content

[0005] Technical problems to be solved by utility models

[0006] The technical problem to be solved by the utility model is to provide a bridge circuit layer and a connector socket, which solves the problem that traditional connectors are easily affected by external interference and have high costs.

[0007] Technical Solution

[0008] In order to solve the above problems, the technical solution provided by the present invention is as follows:

[0009] A bridging circuit layer includes four circuit layers, namely a first communication circuit layer, a first ground wire layer, a second ground wire layer, and a second communication circuit layer. The four circuit layers are symmetrically structured. Communication lines are provided in the first communication circuit layer and the second communication circuit layer. A plurality of gold fingers are provided at the upper and lower ends of the first communication circuit layer and the second communication circuit layer, and connecting lines are connected between the gold fingers.

[0010] Furthermore, the differential line impedance of the first communication line layer and the second communication line layer is designed to be 100Ω±10Ω, and the crosstalk is ≤5%.

[0011] Furthermore, the gold fingers at the upper and lower ends are symmetrical structures, and connecting lines are connected between the corresponding gold fingers.

[0012] Furthermore, the gold fingers located at the left and right ends of the first communication circuit layer and the second communication circuit layer are positive power pins, and at least one positive power pin is arranged inwardly at both ends of the first communication circuit layer and the second communication circuit layer.

[0013] Furthermore, the plurality of gold fingers located in the positive power supply pins of the first communication circuit layer and the second communication circuit layer are ground pins, independent signal line pins and differential signal pins respectively.

[0014] Furthermore, the first communication circuit layer and the second communication circuit layer are divided into an odd-numbered pin structure and an even-numbered pin structure.

[0015] Furthermore, the first communication circuit layer and the second communication circuit layer are divided into an odd-numbered pin structure, and the number of the independent signal line pins is odd.

[0016] Furthermore, the first communication line layer and the second communication line layer are divided into an even-numbered pin structure, the number of the independent signal line pins is even, the first communication line layer and the second communication line layer have an odd-numbered pin structure and an even-numbered pin structure, and the ground pins and the differential signal pins are both even.

[0017] Furthermore, the circuit layer is made of a PCB board.

[0018] Also disclosed is a connector socket for plugging into the above-mentioned bridge circuit layer. The number of socket pins and socket springs corresponds to the number of gold fingers of the first communication circuit layer and the second communication circuit layer. The socket pins and the socket springs are processed by gold plating process.

[0019] Beneficial effects

[0020] Compared with the prior art, the technical solution provided by this utility model has the following beneficial effects:

[0021] The inter-board connector of the technical solution provided by the utility model is designed by a symmetrical design method, and a design scheme is given for both an even-numbered pin connector and an odd-numbered pin connector, so that the connector can be plugged in in any direction without affecting its use. By using PCB design communication lines, the differential communication lines can be well controlled in equal length and impedance, providing high-speed signal communication capability and anti-interference capability, high communication frequency, and 10GHZ high-speed communication can be achieved, with crosstalk ≤5%. The left-right and front-back symmetrical design of the connector can be plugged in in any direction and has a low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic structural diagram of the singular design of the first embodiment of the present utility model;

[0023] Figure 2 This is a schematic structural diagram of the even-number design of the second embodiment of the present utility model;

[0024] Figure 3 This is a structural diagram of embodiment 3 of the present utility model. DETAILED DESCRIPTION

[0025] In order to further understand the content of the present invention, the present invention is described in detail with reference to the accompanying drawings and embodiments.

[0026] The present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific examples described herein are intended solely to illustrate the relevant utility model and are not intended to limit the utility model. It should also be noted that, for ease of description, only the relevant portions of the utility model are shown in the accompanying drawings. Terms such as "first," "second," and so on, used in the present utility model are provided for the convenience of describing the technical solution of the present utility model and do not have a specific limiting effect. They are general references and do not constitute a limitation on the technical solution of the present utility model. It should be noted that, unless conflicting, the embodiments and features within the embodiments of the present application may be combined with one another. In the description of the present utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating positions or locations, are based on the positions or locations shown in the accompanying drawings and are intended solely to facilitate the description of the present utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a communication between the internal parts of two components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to the specific circumstances. Multiple technical solutions in the same embodiment, as well as multiple technical solutions in different embodiments, can be arranged and combined to form new technical solutions that do not contain contradictions or conflicts, and all of these are within the scope of protection claimed by this utility model.

[0027] A bridge circuit layer has a four-layer structural design, wherein the four circuit layers are respectively a first communication circuit layer, a first ground layer, a second ground layer, and a second communication circuit layer. Two pieces of the first communication circuit layer and the second communication circuit layer are respectively located on the outermost sides, and the first ground layer and the second ground layer are wrapped between the two pieces of the first communication circuit layer and the second communication circuit layer.

[0028] The four-layer circuit layer has a symmetrical structure. The four-layer circuit layer is completely symmetrical left and right, front and back, and the structure formed by the symmetry is exactly the same. The differential line impedance of the first communication circuit layer and the second communication circuit layer is designed to be 100Ω±10Ω, the crosstalk is ≤5%, and the differential line pairs are shielded by a ground plane. The circuit layer is made of a PCB board, which can better control the impedance and equal length.

[0029] Communication lines are provided in the first communication line layer and the second communication line layer. Several gold fingers are provided at the upper and lower ends of the first communication line layer and the second communication line layer. The gold fingers are used to plug into the connector socket. The gold fingers have the same function as the pins. A connecting wire is connected between the gold fingers at the upper and lower ends. The connecting wire is used to transmit signals. The gold fingers on the upper and lower parts are contacts that contact the connector socket spring after being inserted into the connector socket.

[0030] The gold finger contacts are processed with immersion gold technology to prevent oxidation of the contacts due to long-term exposure to air, which may lead to increased contact impedance.

[0031] The gold fingers at both ends are symmetrical structures, and the connecting wires are arranged between the corresponding gold fingers at the upper and lower ends. The connecting wires correspond one-to-one to the gold fingers at the upper and lower ends. A gold finger located on the upper side, a connecting wire and a gold finger located on the lower side form a complete signal transmission structure.

[0032] The gold fingers located at the left and right ends of the first communication circuit layer and the second communication circuit layer are positive power pins, and at least one positive power pin is arranged inwardly at both ends of the first communication circuit layer and the second communication circuit layer.

[0033] The several gold fingers located in the positive power pin of the first communication line layer and the second communication line layer are respectively ground pins, independent signal line pins and differential signal pins. The positions of the ground pins, independent signal line pins and differential signal pins are not limited, but they need to be located on the inner side of the positive power pins at the left and right ends.

[0034] The first communication line layer and the second communication line layer are divided into an odd-numbered pin structure and an even-numbered pin structure. Regardless of whether the first communication line layer and the second communication line layer are an odd-numbered pin structure or an even-numbered pin structure, the ground pins and the differential signal pins are both even numbers, and the number of independent signal line pins serves as an important basis for distinguishing whether the communication line layer is an odd-numbered pin structure or an even-numbered pin structure.

[0035] The first communication circuit layer and the second communication circuit layer are divided into an odd-number pin structure, and the number of the independent signal line pins is odd.

[0036] The first communication circuit layer and the second communication circuit layer are divided into an even-numbered pin structure, and the number of the independent signal line pins is an even number.

[0037] Example 1

[0038] like Figure 1-2 As shown, the pins of the communication line layer are an odd number of design structure examples. The communication line layer is designed with 23 pins. The number of gold fingers (pins) of the communication line layer is not limited. Here, only the 23-pin design is used as an example to explain the design structure of the odd-number pin connector.

[0039] The odd-number pin connector adopts a symmetrical design with pin 12 as the center of symmetry. Pins 1-11 and pins 13-23 are completely symmetrically designed to prevent the connector from being installed reversely during use.

[0040] The 1st and 2nd pins and the symmetrical 22nd and 23rd pins of the odd-numbered pin connector are designed to connect to the positive overcurrent of the power supply. Due to the overcurrent function, the connecting wire needs to be widened.

[0041] Pins 3, 5, 8, 11, 13, 16, 19, and 21 of the odd-numbered pin connector are ground pins, serving as loops for communication and power lines.

[0042] Pins 4, 12, and 20 of the odd-numbered pin connector are independent signal line pins and can be used to connect non-differential communication lines such as clock lines, I / O control lines, and I2C communication.

[0043] Pins 6, 7, 9, 10, 14, 15, 17, and 18 of the odd-numbered pin connector are differential signal pins for differential communication line connections.

[0044] The communication line layer on the back side of the connector adopts a completely symmetrical design.

[0045] Example 2

[0046] like Figure 2As shown, the pins of the communication line layer are an even-numbered design structure example. The communication line layer is designed with 22 pins. The number of gold fingers (pins) of the communication line layer is not limited. Here, only the 22-pin design is used as an example to explain the design structure of the even-numbered pin connector.

[0047] Even-number pin connectors adopt a symmetrical design, with pins 1-11 and 12-22 completely symmetrical, which can prevent the connector from being installed reversely during use.

[0048] The 1st and 2nd pins and the symmetrical 21st and 22nd pins of the even-numbered pin connector are designed to connect to the positive pole of the power supply for overcurrent. Due to the overcurrent function, the connecting wire needs to be widened.

[0049] Pins 3, 5, 8, 11, 12, 15, 18, and 20 of the even-numbered pin connector are ground pins, serving as loops for communication and power lines.

[0050] Pins 4 and 19 of the even-numbered pin connector are independent signal line pins and can be used to connect non-differential communication lines such as clock lines, I / O control lines, and I2C communication.

[0051] Pins 6, 7, 9, 10, 13, 14, 16, and 17 of the even-numbered pin connector are differential signal pins for differential communication line connections.

[0052] The reverse side of the connector is designed to be completely symmetrical.

[0053] The number and arrangement order of the circuits in the above-mentioned embodiment 1 and embodiment 2 can be changed. The design of the gold fingers at both ends is not limited, and the material and shape of the gold fingers can be changed.

[0054] Example 3

[0055] Combined with attachment Figure 3 A connector socket is used to plug into the communication line layer of embodiment one or embodiment two. The connector socket includes socket pins and socket shrapnel. The positions and quantities of the socket pins and socket shrapnel correspond to the gold fingers in the communication line layer.

[0056] The socket pins and springs are gold-plated to prevent oxidation from increasing contact resistance.

[0057] Example 4

[0058] A circuit layer connector includes a connector socket formed by combining any one of the above-mentioned embodiments 1 or 2 with the embodiment 3. Since the circuit layer connector is designed using a PCB board, the impedance and equal length can be well controlled. Therefore, the board connector formed by the above-mentioned technical solution can reach a communication frequency of 10GHz.

[0059] In other implementations, the gold fingers in Example 1 or Example 2 are not connected to the connector socket, but the gold fingers are directly used as soldering pins, which can achieve the same function as the connector socket.

[0060] In other embodiments, the number of circuit layers of the PCB forming the bridge circuit layer is not limited to 4 layers, and various layer combination designs such as 2 layers, 6 layers, and 8 layers should all fall within the scope of protection of the present utility model.

[0061] The above is a schematic description of the present invention and its embodiments, which is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. Therefore, if a person skilled in the art is inspired by this and, without departing from the inventive purpose of the present invention, designs a structure and embodiment similar to the technical solution without inventiveness, they shall fall within the scope of protection of the present invention.

Claims

1. A bridge circuit layer, characterized in that: It includes four circuit layers, namely the first communication circuit layer, the first ground wire layer, the second ground wire layer, and the second communication circuit layer. The four circuit layers are symmetrical structures. Communication lines are provided in the first communication circuit layer and the second communication circuit layer. Several gold fingers are provided at the upper and lower ends of the first communication circuit layer and the second communication circuit layer, and connecting lines are connected between the gold fingers.

2. A bridge circuit layer according to claim 1, characterized in that: The differential line impedance of the first communication line layer and the second communication line layer is designed to be 100Ω±10Ω, and the crosstalk is ≤5%.

3. The bridge circuit layer according to claim 1, characterized in that: The gold fingers at the upper and lower ends are symmetrical structures, and connecting lines are connected between the corresponding gold fingers.

4. The bridge circuit layer according to claim 1, characterized in that: The gold fingers located at the left and right ends of the first communication circuit layer and the second communication circuit layer are positive power pins, and at least one positive power pin is arranged inwardly at both ends of the first communication circuit layer and the second communication circuit layer.

5. The bridge circuit layer according to claim 4, characterized in that: The gold fingers of the first communication circuit layer and the second communication circuit layer located in the positive power supply pin are respectively a ground pin, an independent signal line pin and a differential signal pin.

6. The bridge circuit layer according to claim 5, characterized in that: The first communication circuit layer and the second communication circuit layer are divided into an odd-number pin structure or an even-number pin structure; the ground pins and the differential signal pins are both even-numbered.

7. The bridge circuit layer according to claim 6, characterized in that: The first communication circuit layer and the second communication circuit layer are divided into an odd-number pin structure, and the number of the independent signal line pins is odd.

8. The bridge circuit layer according to claim 6, characterized in that: The first communication circuit layer and the second communication circuit layer are divided into an even-numbered pin structure, and the number of the independent signal line pins is an even number.

9. The bridge circuit layer according to claim 1, characterized in that: The circuit layer is made of PCB board.

10. A connector socket for plugging into the bridge circuit layer according to any one of claims 1 to 9, characterized in that: The number of the socket pins and the socket shrapnel corresponds to the number of gold fingers of the first communication circuit layer and the second communication circuit layer, and the socket pins and the socket shrapnel are processed by a gold plating process.

Images