DS18B20-based temperature acquisition device

Abstract

The utility model discloses a DS18B20-based temperature acquisition device, and belongs to the technical field of temperature measurement. The DS18B20-based temperature acquisition device is composed of a DS18B20 module, a microcontroller, a P1 terminal and a power supply module. The DS18B20 module is provided with a GND pin, a DQ pin and a VDD pin, and the DS18B20 module is used for collecting temperature data. The microcontroller is provided with a PD0 pin, a PD5 pin and a PD6 pin, and the PD0 pin is in communication connection with the DQ pin through a lead NET to obtain temperature data. The P1 terminal is provided with a pin 1, a pin 2, a pin 3 and a pin 4, the pin 2 of the P1 terminal is connected with the pin PD6 through a lead USART2RX, and the pin 3 of the P1 terminal is connected with the pin PD5 through a lead USART2TX so as to print and output temperature data. And the power supply module is respectively connected with the DS18B20 module, the microcontroller and the P1 terminal so as to provide a working power supply. The DS18B20-based temperature acquisition device provided by the utility model has the advantages of simple structure, low cost, small volume and high practical application value.

Description

Technical Field

[0001] The utility model belongs to the technical field of temperature measurement, and in particular relates to a temperature acquisition device based on DS18B20. Background Art

[0002] Temperature is a basic physical quantity. Accurately measuring temperature values ​​can guide industrial and agricultural production, scientific experiments, and can promptly respond to changes caused by temperature. Constant temperature chambers, as a carrier of temperature control, are widely used in laboratories, medical care, industry and other fields. Their temperature control accuracy and stability have an important impact on experimental results, product quality, etc. In order to be able to measure the temperature changes of the constant temperature chamber in real time and monitor whether the storage environment of items or devices in the constant temperature chamber meets the standards, a temperature acquisition device is generally set. However, in the prior art, the temperature chip used in the temperature acquisition device has complex functions, which increases the cost and volume of the temperature acquisition device, resulting in it not having strong practical application value. Summary of the Invention

[0003] In view of the shortcomings in the related art, the purpose of the present invention is to provide a temperature acquisition device based on DS18B20 to solve the problems raised in the above background technology.

[0004] To achieve the above objectives, the present invention provides the following technical solutions:

[0005] A temperature acquisition device based on DS18B20, comprising:

[0006] DS18B20 module, the DS18B20 module has a GND pin, a DQ pin, and a VDD pin. The DS18B20 module is used to collect temperature data;

[0007] The microcontroller has a PD0 pin, a PD5 pin, and a PD6 pin. The PD0 pin is connected to the DQ pin via a NET lead to obtain temperature data.

[0008] P1 terminal, the P1 terminal has pins 1, 2, 3, and 4. Pin 2 of the P1 terminal is connected to the PD6 pin through the lead USART2_RX, and pin 3 of the P1 terminal is connected to the PD5 pin through the lead USART2_TX to print out temperature data;

[0009] The power supply module is connected to the DS18B20 module, the microcontroller and the P1 terminal to provide working power.

[0010] In some embodiments, the power supply module includes:

[0011] A first step-down module, the first step-down module having an input end and an output end, the input end of the first step-down module being connected to the positive side of the power supply, the output end of the first step-down module being connected to the DS18B20 module, and the first step-down module being used to reduce the power supply voltage to 5V for operation of the DS18B20 module;

[0012] The second step-down module has an input end and an output end. The input end of the second step-down module is connected to the output end of the first step-down module, and the output end of the second step-down module is connected to the microcontroller. The second step-down module is used to reduce the 5V voltage to 3.3V for the microcontroller to work.

[0013] In some embodiments, the power supply module further includes a P2 terminal having pin 1, pin 2, pin 3 and pin 4, pin 1 and pin 2 of the P2 terminal are connected to the positive power supply, and pin 3 and pin 4 of the P2 terminal are connected to the negative power supply.

[0014] In some embodiments, the first power supply module is LM2596S-5.0, and the second power supply module is REF3033AIDBZR.

[0015] In some embodiments, the temperature acquisition device based on DS18B20 further includes a resistor R1 having a first end and a second end. The first end of the resistor R1 is connected to the DQ pin, and the second end of the resistor R1 is connected to the parasitic power supply circuit.

[0016] In some embodiments, the resistance of the resistor R1 is 4.7 kΩ.

[0017] In some embodiments, the microcontroller is an STM32L475 microcontroller.

[0018] In some embodiments, pin 1 of the P1 terminal is grounded.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] 1. The temperature acquisition device based on DS18B20 provided by the utility model is composed of a DS18B20 module, a microcontroller, a P1 terminal and a power supply module. It has a simple structure, low cost, small size and strong practical application value.

[0021] 2. The temperature acquisition device based on DS18B20 provided by the present invention has its P1 terminal connected to a microcontroller to print out temperature data. This device can display temperature data on-site, store historical records, output data analysis charts, or perform corresponding calculations, thereby adjusting and controlling the temperature as needed. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0023] Figure 1 This is a schematic diagram of the overall circuit of an embodiment of the temperature acquisition device based on DS18B20 of the present invention;

[0024] Figure 2 This is a schematic diagram of a DS18B20 module in one embodiment of a temperature acquisition device based on DS18B20 according to the present invention;

[0025] Figure 3 This is a schematic diagram of the microcontroller and P1 terminal of an embodiment of the temperature acquisition device based on DS18B20 of the present invention;

[0026] Figure 4 This is a schematic diagram of a power supply module of an embodiment of a temperature acquisition device based on DS18B20 of the present invention. DETAILED DESCRIPTION

[0027] The following will be combined with the accompanying drawings of the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0028] In the description of the present invention, it should be understood that the terms "center", "lateral", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0030] See attached Figures 1 to 4 , gives an illustrative embodiment of the temperature acquisition device based on DS18B20 proposed in the present invention, which includes a DS18B20 module, a microcontroller, a P1 terminal and a power supply module.

[0031] The DS18B20 module has GND, DQ, and VDD pins. GND is the power ground, DQ is the digital signal input / output, and VDD is the external power supply input. The DS18B20 module is used to collect temperature data. The microcontroller has PD0, PD5, and PD6 pins. PD0 is connected to the DQ pins via the NET wire to acquire temperature data. The P1 terminal has pins 1, 2, 3, and 4. Pin 1 of the P1 terminal is grounded, pin 2 of the P1 terminal is connected to the PD6 pin via the USART2_RX wire, and pin 3 of the P1 terminal is connected to the PD5 pin via the USART2_TX wire to print out the temperature data. The power supply module is connected to the DS18B20 module, the microcontroller, and the P1 terminal to provide operating power.

[0032] The DS18B20 module provides temperature measurement with 9 to 12-bit resolution and can implement lower and upper temperature limit alarms via programmable non-volatile memory cells. The DS18B20 module communicates with a microcontroller using a single bus protocol, requiring only a single signal line and a ground line. The DS18B20 module has a temperature measurement range of -55°C to +125°C (-67°F to +257°F), with a test accuracy of ±0.5°C within the -10°C to 70°C range. Each DS18B20 module has a globally unique 64-bit serial number, allowing multiple DS18B20 modules to be connected in series on the same single bus for networking. A single processor can control multiple DS18B20 modules distributed over a large area.

[0033] The power supply module includes a first step-down module and a second step-down module. The first step-down module has an input and an output. The input of the first step-down module is connected to the positive voltage of the power supply, and the output of the first step-down module is connected to the DS18B20 module. The first step-down module is used to reduce the power supply voltage to 5V for operation of the DS18B20 module. The second step-down module has an input and an output. The input of the second step-down module is connected to the output of the first step-down module, and the output of the second step-down module is connected to the microcontroller. The second step-down module is used to reduce the 5V voltage to 3.3V for operation of the microcontroller.

[0034] The power supply module also includes a P2 terminal, which is a power supply plug-in. The P2 terminal has pins 1, 2, 3 and 4. Pins 1 and 2 of the P2 terminal are connected to the positive power supply, and pins 3 and 4 of the P2 terminal are connected to the negative power supply.

[0035] Taking practical applications into consideration, in this embodiment, the first power supply module is LM2596S-5.0, and the second power supply module is REF3033AIDBZR.

[0036] In this embodiment, the DS18B20 module can operate in parasitic mode. In this mode, the chip is powered directly through the signal line, eliminating the need for an additional power supply. Specifically, the DS18B20-based temperature acquisition device also includes a resistor R1, which has a first end and a second end. The first end of resistor R1 is connected to the DQ pin, and the second end of resistor R1 is connected to the parasitic power supply circuit. The operating current of the DS18B20 module is approximately 1mA, and the power supply is 5V. Therefore, resistor R1 = 5V / 1mA = 5kΩ. Therefore, the resistance value of resistor R1 should be selected to be close to 5kΩ. In this embodiment, the resistance value of resistor R1 is 4.7kΩ. In parasitic mode, the VDD pin must be grounded.

[0037] In this embodiment, the microcontroller is an STM32L475 single-chip microcomputer. The STM32L475 single-chip microcomputer has the advantages of high performance, low power consumption, high compatibility and easy development.

[0038] In the above exemplary embodiment, the DS18B20-based temperature acquisition device consists of a DS18B20 module, a microcontroller, a P1 terminal, and a power supply module. It features a simple structure, low cost, and compact size, offering strong practical application value. The P1 terminal connects to the microcontroller to print out temperature data, enabling on-site display of temperature data, storage of historical records, output of data analysis charts, and the performance of corresponding calculations, allowing for customized temperature control.

[0039] Finally, it should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0040] The above embodiments are only used to illustrate the technical solution of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the specific implementation methods of the present invention can still be modified or some technical features can be replaced by equivalents without departing from the spirit of the technical solution of the present invention. They should all be included in the scope of the technical solution for which protection is requested in the present invention.

Claims

1. A temperature acquisition device based on DS18B20, characterized in that: include: A DS18B20 module, wherein the DS18B20 module has a GND pin, a DQ pin, and a VDD pin, and is used to collect temperature data; A microcontroller having a PD0 pin, a PD5 pin, and a PD6 pin, wherein the PD0 pin is communicatively connected to the DQ pin via a lead NET to obtain temperature data; A P1 terminal having pins 1, 2, 3, and 4, wherein pin 2 of the P1 terminal is connected to the PD6 pin via a lead USART2_RX, and pin 3 of the P1 terminal is connected to the PD5 pin via a lead USART2_TX, so as to print out temperature data; A power supply module is connected to the DS18B20 module, the microcontroller and the P1 terminal to provide working power.

2. The temperature acquisition device based on DS18B20 according to claim 1 is characterized in that: The power supply module includes: a first step-down module, the first step-down module having an input end and an output end, the input end of the first step-down module being connected to a positive voltage of a power supply, the output end of the first step-down module being connected to the DS18B20 module, and the first step-down module being used to reduce the power supply voltage to 5V for operation of the DS18B20 module; A second step-down module, wherein the second step-down module has an input end and an output end, the input end of the second step-down module is connected to the output end of the first step-down module, the output end of the second step-down module is connected to the microcontroller, and the second step-down module is used to reduce the 5V voltage to 3.3V for the microcontroller to operate.

3. The temperature acquisition device based on DS18B20 according to claim 2 is characterized in that: The power supply module also includes a P2 terminal, which has pins 1, 2, 3 and 4. Pins 1 and 2 of the P2 terminal are connected to the positive power supply, and pins 3 and 4 of the P2 terminal are connected to the negative power supply.

4. The temperature acquisition device based on DS18B20 according to claim 2, characterized in that: The first power supply module is LM2596S-5.0, and the second power supply module is REF3033AIDBZR.

5. The temperature acquisition device based on DS18B20 according to claim 1 is characterized in that: The device further includes a resistor R1 having a first end and a second end. The first end of the resistor R1 is connected to the DQ pin, and the second end of the resistor R1 is connected to the parasitic power supply circuit.

6. The temperature acquisition device based on DS18B20 according to claim 5, characterized in that: The resistance of the resistor R1 is 4.7 kΩ.

7. The temperature acquisition device based on DS18B20 according to any one of claims 1 to 6, characterized in that: The microcontroller is an STM32L475 single chip microcomputer.

8. The temperature acquisition device based on DS18B20 according to any one of claims 1 to 6, characterized in that: Pin 1 of the P1 terminal is grounded.

Images