Dustproof heat dissipation case of computer

Abstract

The utility model discloses a computer dustproof heat dissipation case which is characterized in that when the computer dustproof heat dissipation case is used, a semiconductor chilling plate, a heat dissipation fan and a driving fan work, refrigeration of the semiconductor chilling plate is transmitted to the side wall of a second cavity through heat conduction fins, and the driving fan conveys airflow refrigerated by the heat conduction fins to a third cavity and a first cavity; through heat conduction of the inner wall of the cavity, cooling of the interior of the box body is achieved, heat dissipation and cooling of working components installed in the box body are achieved, heat generated by working of the semiconductor chilling plate is transmitted out of the box body through the cooling fan, cooling of the case is achieved, normal working of the components in the box body is guaranteed, the box body is covered with the box cover, and the cooling effect is good. The internal sealing of the box body is realized, external dust is prevented from entering the box body, devices in the box body are protected from being attached by the dust, and the drying agent box in the box body adsorbs moisture in the box body, so that dryness in the box body is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of computer chassis, in particular to a computer dust-proof and heat-dissipating chassis. Background Art

[0002] With the development of science and technology, computers have become a commonly used tool in people's daily work and life. The computer case is a box structure used to support the various components inside the computer. The case is an essential carrier for most desktop computers, and it is equipped with components such as the motherboard, graphics card, fan, and central processing unit.

[0003] However, when a computer case is currently in use, a fan is usually used to cool and dissipate heat from the components installed inside. However, airflow from the outside enters the case through the through holes, and dust from the outside enters the case with the airflow. The dust remains inside the case, which is not conducive to protecting the components inside the case. To address the above problems, a computer dust-proof and heat-dissipating case has been proposed. Utility Model Content

[0004] The purpose of the present invention is to provide a computer dust-proof and heat-dissipating chassis to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A computer dustproof heat dissipation chassis includes a chassis, a chassis cover is fixedly installed at the opening of the chassis by bolts, a first cavity is provided at the top of the chassis, a second cavity is provided on one side of the chassis, and a third cavity is provided on the back of the chassis, the third cavity is connected to the first cavity and the second cavity, the side walls of the first cavity, the second cavity and the third cavity close to the chassis are all heat conduction plates, a mounting groove is provided in the second cavity of the chassis, a mounting frame is fixedly installed in the mounting groove by bolts, a semiconductor refrigeration plate is embedded in the mounting frame, one end of the mounting frame at the cooling surface of the semiconductor refrigeration plate extends into the second cavity, and a heat conducting fin is fixedly installed at one end of the mounting frame in the second cavity, one end of the heat conducting fin is in contact with the cold surface of the semiconductor refrigeration plate, and the other end of the heat conducting fin is in contact with the inner wall of the second cavity, a driving fan is installed on the side of the heat conducting fin close to the third cavity, and a cooling fan is fixedly installed at one end of the mounting frame in the mounting groove.

[0007] As a further solution of the present invention: an inspection cover is fixedly installed at an inspection opening arranged above the second cavity on the top of the box body by bolts.

[0008] As a further solution of the present invention: the box body is fixed with a dustproof net at the installation groove by bolts.

[0009] As a further solution of the present invention: lifting grooves are symmetrically provided on the top of the box body.

[0010] As a further solution of the present invention: one end of the box cover is fixedly connected to a connecting plate, and the other edges of the box cover are fixedly installed with a U-shaped plug-in plate, both ends of the U-shaped plug-in plate are fixedly connected to the connecting plate, and a U-shaped slot adapted for the U-shaped plug-in plate is provided at the opening of the box body, the U-shaped plug-in plate is inserted into the U-shaped slot, the connecting plate is built into the groove of the box body, and the connecting plate is fixedly connected to the box body by hand-tightening bolts.

[0011] As a further solution of the present invention: an observation port is provided on the box cover, and the observation port is made of light-transmitting acrylic.

[0012] As a further solution of the present invention: bases are fixedly installed at the four corners of the bottom of the box body, screws are threadedly connected in the bases, and anti-sliding blocks are fixedly connected to the bottom ends of the screws.

[0013] As a further solution of the present invention: a desiccant box is fixedly installed on the bottom of the inner wall of the box.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. When the utility model is in use, the semiconductor refrigeration sheet, the heat dissipation fan and the driving fan are in operation, and the cooling of the semiconductor refrigeration sheet is transferred to the side wall of the second cavity through the heat-conducting fins, and the driving fan delivers the airflow cooled by the heat-conducting fins to the third cavity and the first cavity. The heat conduction through the inner wall of the cavity realizes the cooling of the box body, and the heat dissipation and cooling of the components installed in the box body are realized. The heat dissipation fan transfers the heat generated by the operation of the semiconductor refrigeration sheet out of the box body, thereby realizing the cooling of the chassis, which is beneficial to ensuring the normal operation of the components in the box body, and the box body is covered by a box cover to realize the sealing of the box body, prevent external dust from entering the box body, and is beneficial to protecting the components in the box body from being adhered to dust.

[0016] 2. The utility model rotates the screw through the anti-sliding block so that the four corners of the box are fully supported, thereby preventing the box from shaking during use and increasing the stability of the box.

[0017] 3. The utility model ensures the dryness of the box by absorbing moisture in the box through the desiccant box in the box. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a structural diagram of a computer dust-proof and heat-dissipating chassis.

[0019] Figure 2 This is the front view of the computer's dust-proof and heat-dissipating chassis.

[0020] Figure 3 This is a cross-sectional view of the computer's dust-proof and heat-dissipating chassis.

[0021] Figure 4 This is a horizontal cross-sectional view of the case in a computer dust-proof and heat-dissipating chassis.

[0022] Figure 5 This is a structural diagram of the case cover in a computer dust-proof and heat-dissipating case.

[0023] In the figure: 1. Box body; 2. Box cover; 3. Observation port; 4. Lifting slot; 5. Dust screen; 6. Inspection cover; 7. Base; 8. Screw; 9. Anti-sliding block; 10. First cavity; 11. Second cavity; 12. Mounting slot; 13. Cooling fan; 14. Mounting frame; 15. Semiconductor cooling plate; 16. Thermal fin; 17. Desiccant box; 18. Third cavity; 19. Drive fan; 20. U-shaped slot; 21. U-shaped plug-in board; 22. Connecting plate. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] See also Figures 1 to 5 In the embodiment of the present invention, a computer dustproof heat dissipation case includes a case body 1, a case cover 2 is fixedly installed at the opening of the case body 1 by bolts, a first cavity 10 is provided at the top of the case body 1, a second cavity 11 is provided on one side of the case body 1, and a third cavity 18 is provided on the back of the case body 1. The third cavity 18 is connected to the first cavity 10 and the second cavity 11. The side walls of the first cavity 10, the second cavity 11 and the third cavity 18 close to the case body 1 are all heat conducting plates. The case body 1 is provided with a mounting groove 12 in the second cavity 11, and the mounting groove 12 is fixed by bolts. A mounting frame 14 is fixedly installed, in which a semiconductor refrigeration plate 15 is embedded. The mounting frame 14 extends into the second cavity 11 at one end of the cooling surface of the semiconductor refrigeration plate 15, and a heat-conducting fin 16 is fixedly installed at one end of the mounting frame 14 in the second cavity 11. One end of the heat-conducting fin 16 is in contact with the cold surface of the semiconductor refrigeration plate 15, and the other end of the heat-conducting fin 16 is in contact with the inner wall of the second cavity 11. A driving fan 19 is installed on the side of the heat-conducting fin 16 close to the third cavity 18, and a cooling fan 13 is fixedly installed at one end of the mounting frame 14 in the mounting groove 12.

[0026] During use, the semiconductor refrigeration plate 15, the heat dissipation fan 13 and the driving fan 19 are working, and the cooling of the semiconductor refrigeration plate 15 is transferred to the side wall of the second cavity 11 through the heat-conducting fins 16, and the driving fan 19 delivers the airflow cooled by the heat-conducting fins 16 to the third cavity 18 and the first cavity 10. Through the heat conduction of the inner wall of the cavity, the temperature inside the box body 1 is cooled, and the components installed in the box body 1 are cooled and cooled. The heat dissipation fan 13 transfers the heat generated by the operation of the semiconductor refrigeration plate 15 out of the box body 1 to cool the chassis, and the box body 1 is covered by the box cover 2 to achieve sealing of the box body 1 to prevent external dust from entering the box body 1, which is beneficial to protecting the components in the box body 1 from being adhered to dust.

[0027] An inspection cover 6 is fixedly installed with bolts at the inspection port provided above the second cavity 11 on the top of the box body 1. By removing the inspection cover 6 on the top of the box body 1, the staff can clean the first cavity 10, the second cavity 11 and the third cavity 18 in the box body 1 through the opened inspection port and the opening in the installation groove 12.

[0028] The box body 1 is fixed with a dustproof net 5 at the installation groove 12 by bolts, and the installed dustproof net 5 reduces dust from entering the installation groove 12.

[0029] The top of the box body 1 is symmetrically provided with lifting grooves 4, which facilitate the transportation of the box body 1.

[0030] The box cover 2 is fixedly connected to a connecting plate 22 at one end, and a U-shaped plugging plate 21 is fixedly installed on the other edges of the box cover 2. Both ends of the U-shaped plugging plate 21 are fixedly connected to the connecting plate 22. A U-shaped slot 20 adapted to the U-shaped plugging plate 21 is opened at the opening of the box body 1. The U-shaped plugging plate 21 is inserted into the U-shaped slot 20, and the connecting plate 22 is built into the groove of the box body 1. The connecting plate 22 is fixedly connected to the box body 1 by hand screws. The U-shaped plugging plate 21 fixedly connected to the edge of the box cover 2 is inserted into the U-shaped slot 20 opened in the box body 1. The box cover 2 is pushed to move by pushing the connecting plate 22 so that the U-shaped plugging plate 21 is fully inserted into the U-shaped slot 20. The box cover 2 covers the opening of the box body 1, and the hand screw bolts pass through the connecting plate 22 and are threadedly connected to the box body 1 to achieve a fixed connection between the box cover 2 and the box body 1. On the contrary, it is convenient to remove the box cover 2, which is convenient for the inspection and maintenance of the internal components of the box body 1.

[0031] The box cover 2 is provided with an observation port 3 , which is made of light-transmitting acrylic. Through the observation port 3 provided on the box cover 2 , users can conveniently observe the working status of the components installed in the box body 1 .

[0032] The four corners of the bottom of the box body 1 are fixedly installed with a base 7, a screw 8 is threadedly connected to the base 7, and an anti-sliding block 9 is fixedly connected to the bottom end of the screw 8. When the box body 1 is placed in the work place, the screw 8 is rotated through the anti-sliding block 9 so that the four corners of the box body 1 are fully supported to prevent the box body 1 from shaking during use.

[0033] A desiccant box 17 is fixedly mounted on the bottom of the inner wall of the box body 1 . The desiccant box 17 contains desiccant for absorbing moisture in the box body 1 , thereby ensuring dryness in the box body 1 .

[0034] Although the present invention has been described in detail above using general descriptions and specific embodiments, it will be apparent to those skilled in the art that modifications or improvements may be made to the present invention. Therefore, such modifications or improvements, without departing from the spirit of the present invention, are within the scope of protection claimed herein.

[0035] The terms "upper", "lower", "left", "right", "middle", etc. used in this specification are only for the convenience of description and are not intended to limit the scope of implementation of the present invention. Changes or adjustments to their relative relationships should be considered as the scope of implementation of the present invention without substantially changing the technical content.

Claims

1. A computer dustproof and heat dissipating case, comprising a case body (1), characterized in that: The box body (1) is provided with a box cover (2) fixedly mounted at the opening thereof by means of bolts, a first cavity (10) is provided at the top of the box body (1), a second cavity (11) is provided at one side of the box body (1), a third cavity (18) is provided at the back of the box body (1), the third cavity (18) is communicated with the first cavity (10) and the second cavity (11), the side walls of the first cavity (10), the second cavity (11) and the third cavity (18) close to the box body (1) are all heat conducting plates, a mounting groove (12) is provided in the second cavity (11) of the box body (1), a mounting frame (14) is fixedly mounted in the mounting groove (12) by means of bolts, and the mounting frame (14) is installed. A semiconductor cooling fin (15) is embedded in the mounting frame (14), and one end of the mounting frame (14) on the cooling surface of the semiconductor cooling fin (15) extends into the second cavity (11). A heat conducting fin (16) is fixedly mounted on one end of the mounting frame (14) in the second cavity (11), one end of the heat conducting fin (16) is in contact with the cooling surface of the semiconductor cooling fin (15), and the other end of the heat conducting fin (16) is in contact with the inner wall of the second cavity (11). A driving fan (19) is mounted on one side of the heat conducting fin (16) close to the third cavity (18), and a heat dissipation fan (13) is fixedly mounted on one end of the mounting frame (14) in the mounting groove (12).

2. The computer dust-proof and heat-dissipating chassis according to claim 1, characterized in that: An inspection cover (6) is fixedly mounted on the top of the box body (1) at an inspection opening arranged above the second cavity (11) by means of bolts.

3. The computer dust-proof and heat-dissipating chassis according to claim 1, characterized in that: The box body (1) is fixed with a dustproof net (5) at the installation groove (12) by means of bolts.

4. The computer dust-proof and heat-dissipating chassis according to claim 1, characterized in that: The top of the box body (1) is symmetrically provided with lifting grooves (4).

5. The computer dust-proof and heat-dissipating chassis according to claim 1, characterized in that: One end of the box cover (2) is fixedly connected to a connecting plate (22), and the other edges of the box cover (2) are fixedly installed with a U-shaped plugging plate (21), both ends of the U-shaped plugging plate (21) are fixedly connected to the connecting plate (22), and a U-shaped slot (20) adapted to the U-shaped plugging plate (21) is provided at the opening of the box body (1), the U-shaped plugging plate (21) is inserted into the U-shaped slot (20), and the connecting plate (22) is built into a groove of the box body (1), and the connecting plate (22) is fixedly connected to the box body (1) by means of hand-tightening bolts.

6. The computer dust-proof and heat-dissipating chassis according to claim 1, characterized in that: The box cover (2) is provided with an observation port (3), which is made of light-transmitting acrylic.

7. The computer dust-proof and heat-dissipating chassis according to claim 1, characterized in that: The four corners of the bottom of the box body (1) are fixedly mounted with a base (7), a screw rod (8) is threadedly connected in the base (7), and an anti-sliding block (9) is fixedly connected to the bottom end of the screw rod (8).

8. The computer dust-proof and heat-dissipating chassis according to claim 1, characterized in that: A desiccant box (17) is fixedly mounted on the bottom of the inner wall of the box body (1).

Images