Frame structure

Abstract

The utility model discloses a frame structure. The frame structure comprises at least four base islands and an outer frame, the base island is arranged in the outer frame; the at least four base islands are used for integrating at least four different chips on one integrated circuit. According to the utility model, integration of at least four different chips can be realized, and the performance and the integration level of the integrated circuit can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to a frame structure. Background Art

[0002] In existing integrated circuit designs, a single or double pad (pad) structure is usually used, which limits the integration and functional diversity of the integrated circuit. In order to improve the performance and integration of the integrated circuit, a framework structure is needed to solve the above problems. Utility Model Content

[0003] The purpose of the utility model is to provide a framework structure that can realize the integration of at least four different chips and can also improve the performance and integration of integrated circuits.

[0004] To solve the above technical problems, the present invention provides a frame structure, comprising: at least four base islands and an outer frame; the base islands are arranged in the outer frame; and the at least four base islands are used to integrate at least four different chips on an integrated circuit.

[0005] Furthermore, the four base islands are arranged in a square shape on the outer frame.

[0006] Furthermore, one side of the base island is connected to the inner side of the outer frame, and the other side is connected to the adjacent base island; one side and the other side of the base island are arranged opposite to each other.

[0007] Furthermore, the adjacent base islands are symmetrically arranged.

[0008] Furthermore, the at least four base islands include: a first base island, a second base island, a third base island and a fourth base island; the first base island, the second base island and the third base island are arranged in sequence in the first direction; the fourth base island is arranged on one side of the width direction of the first base island and the second base island in the second direction; one side of the third base island in the length direction is arranged on one side of the width direction of the fourth base island in the first direction; the first direction is perpendicular to the second direction.

[0009] Furthermore, the length of the third base island is greater than or equal to the sum of the length of the second base island and the width of the third base island, or the length of the third base island is greater than or equal to the sum of the length of the first base island and the width of the third base island.

[0010] Furthermore, the length of the fourth base island is greater than or equal to the sum of the width of the first base island and the width of the second base island.

[0011] Furthermore, it also includes connecting lines for connecting the chip located in the base island with the chip in the adjacent base island.

[0012] Furthermore, the connecting wire includes a metal wire.

[0013] Furthermore, the outer frame includes a rectangular structure.

[0014] Through the above technical solution, the utility model has the following beneficial effects:

[0015] By arranging at least four base islands and an outer frame, and arranging the base islands within the outer frame, and integrating at least four different chips into an integrated circuit, the device can achieve the integration of at least four different chips and improve the performance and integration of the integrated circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a front view of the frame structure in one embodiment of the present utility model;

[0017] Figure 2 This is a rear view of the frame structure in one embodiment of the present utility model;

[0018] Figure 3 This is a front view of a frame structure in another embodiment of the present invention;

[0019] Figure 4 It is a rear view of the frame structure in another embodiment of the present invention.

[0020] In the figure, 1, base island; 11, first base island; 12, second base island; 13, third base island; 14, fourth base island; 2, outer frame. DETAILED DESCRIPTION

[0021] The following is a more detailed description of a frame structure of the present invention in conjunction with the accompanying drawings, which shows a preferred embodiment of the present invention. It should be understood that those skilled in the art can modify the present invention described herein while still achieving the beneficial effects of the present invention. Therefore, the following description should be understood as a general knowledge for those skilled in the art and not as a limitation of the present invention.

[0022] The following paragraphs describe the present invention in more detail by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are greatly simplified and not to exact scale, and are intended solely to facilitate and clearly illustrate the embodiments of the present invention.

[0023] like Figure 1-Figure 2As shown, an embodiment of the utility model proposes a simple and practical frame structure, including: at least four base islands 1 and an outer frame 2. Specifically, the base island 1 is arranged in the outer frame 2; at least four base islands 1 are used to integrate at least four different chips on an integrated circuit. By setting at least four base islands 1, at least four different chips can be integrated on the same integrated circuit, thereby significantly improving the integration and functionality of the integrated circuit. The frame structure of this embodiment facilitates the production of four or more chips. Due to the independence of the base island 1, it can reduce interference in the production process and improve production efficiency and yield. By integrating multiple chips, the need for external components is reduced, thereby reducing overall costs while maintaining or improving performance.

[0024] Those skilled in the art will appreciate that the specific dimensions of the base island 1 and the outer frame 2 can be set according to actual needs so as to accommodate the required chips.

[0025] In one embodiment, the four base islands 1 are arranged in a square shape on the outer frame 2. The square-arranged base islands 1 make the layout of the integrated circuit more uniform, which helps to achieve a more uniform current and signal distribution, thereby improving the overall performance of the circuit. The square arrangement helps to more effectively manage the heat generated by the integrated circuit because the heat can be evenly dispersed from the center to the four corners, reducing the formation of hot spots. The square-arranged base islands 1 can maximize the use of the space within the outer frame 2, making the size of the integrated circuit more compact and easy to integrate into smaller devices. The square arrangement helps to reduce electromagnetic interference between the base islands 1 because the distance between each base island 1 is equal, and shielding and isolation measures can be more effectively applied.

[0026] In this embodiment, one side of the base island 1 is connected to the inner side of the outer frame 2 , and the other side is connected to the adjacent base island 1 ; one side and the other side of the base island 1 are arranged opposite to each other.

[0027] In this embodiment, adjacent base islands 1 are symmetrically arranged. This symmetry helps simplify circuit design and wiring, while also improving circuit stability and reliability. The symmetrical arrangement of the base islands 1 helps optimize signal transmission paths, reduce interference and delays during signal transmission, and improve signal transmission efficiency.

[0028] In another embodiment, Figure 3 and Figure 4As shown, the at least four base islands 1 include: a first base island 11, a second base island 12, a third base island 13 and a fourth base island 14. Specifically, the first base island 11, the second base island 12 and the third base island 13 are arranged in sequence in the first direction; the fourth base island 14 is arranged on one side of the first base island 11 and the second base island 12 in the second direction, that is, the first base island 11 and the second base island 12 are arranged on one side of the fourth base island 14 in the length direction; the side of the third base island 13 in the length direction is arranged on one side of the fourth base island 14 in the width direction in the first direction; the first direction is perpendicular to the second direction.

[0029] By arranging the first base island 11, the second base island 12 and the third base island 13 in sequence in the first direction, and setting the fourth base island 14 in the second direction, effective use of space is achieved and the occupied area of ​​the integrated circuit is reduced. It allows different chips to be integrated in different directions, providing more flexibility to adapt to the functions and size requirements of different chips. The nonlinear arrangement of the base island 1 helps to optimize the signal path, reduce signal crossing and interference, and improve the clarity and reliability of signal transmission. The arrangement of the base island 1 helps to disperse the heat flow, so that the heat can be more evenly distributed and dissipated, thereby improving the thermal stability of the entire integrated circuit.

[0030] In this embodiment, the length dimension of the third base island 13 is greater than or equal to the sum of the length dimension of the second base island 12 and the width dimension of the third base island 13, or the length dimension of the third base island 13 is greater than or equal to the sum of the length dimension of the first base island 11 and the width dimension of the third base island 13.

[0031] Furthermore, the length of the fourth base island 14 is greater than or equal to the sum of the width of the first base island 11 and the width of the second base island 12 .

[0032] By adjusting the size relationship of the islands 1, the layout of each island 1 can be flexibly adjusted to suit the size and functional requirements of different chips. This ensures that there is sufficient space between the islands 1 to accommodate larger chips or more circuit components, thereby improving space utilization efficiency.

[0033] Furthermore, this embodiment includes connecting wires for connecting a chip located in one base island 1 to a chip located in an adjacent base island 1. These connecting wires effectively connect chips located on different base islands 1, enabling rapid data and signal transmission. These connecting wires enable the close integration of multiple chips into a single integrated circuit, increasing the integrated circuit's density and functional complexity. These connecting wires can be customized based on the specific location and functional requirements of the chips, providing greater design flexibility.

[0034] Preferably, the connecting wire comprises a metal wire. Due to its excellent electrical conductivity, the metal wire can ensure fast and efficient transmission of signals and currents and reduce energy loss.

[0035] In this embodiment, the outer frame 2 comprises a rectangular structure. This rectangular structure provides stable support for the outer frame 2, helping to protect the base island 1 and chip within. This rectangular structure helps maximize internal space utilization, resulting in a more compact layout of the base island 1 and chip. The rectangular outer frame 2 facilitates integration with other electronic components or systems, improving the product's applicability.

[0036] In this embodiment, it is only necessary to place multiple chips on multiple base islands 1 respectively and connect them through connecting wires to integrate at least multiple different chips into one integrated circuit, thereby effectively saving space and reducing costs.

[0037] In summary, the frame structure proposed in this utility model has the following advantages:

[0038] By arranging at least four base islands and an outer frame, and arranging the base islands within the outer frame, and integrating at least four different chips into an integrated circuit, the device can achieve the integration of at least four different chips and improve the performance and integration of the integrated circuit.

[0039] Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.

Claims

1. A frame structure, characterized in that: include: At least four base islands and outer frames; The base island is arranged in the outer frame; At least four base islands are used to integrate at least four different chips on one integrated circuit; The at least four base islands include: a first base island, a second base island, a third base island and a fourth base island; The first base island, the second base island and the third base island are arranged in sequence in the first direction; the fourth base island is arranged on one side of the width direction of the first base island and the second base island in the second direction; one side of the length direction of the third base island is arranged on one side of the width direction of the fourth base island in the first direction; the first direction is perpendicular to the second direction.

2. The frame structure according to claim 1, wherein: The four base islands are arranged in a square shape on the outer frame.

3. The frame structure according to claim 2, wherein: One side of the base island is connected to the inner side of the outer frame, and the other side is connected to the adjacent base island; one side and the other side of the base island are arranged opposite to each other.

4. The frame structure according to claim 2, wherein: The adjacent base islands are symmetrically arranged.

5. The frame structure according to claim 1, wherein: The length of the third base island is greater than or equal to the sum of the length of the second base island and the width of the third base island, or the length of the third base island is greater than or equal to the sum of the length of the first base island and the width of the third base island.

6. The frame structure according to claim 1, wherein: The length of the fourth base island is greater than or equal to the sum of the width of the first base island and the width of the second base island.

7. The frame structure according to claim 1, wherein: It also includes connecting lines for connecting the chip in the base island with the chip in the adjacent base island.

8. The frame structure according to claim 7, wherein: The connecting wire includes a metal wire.

9. The frame structure according to claim 1, wherein: The outer frame comprises a rectangular structure.

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